JPH11203475A - Method for inspecting cream soldered print by beam slit illumination - Google Patents

Method for inspecting cream soldered print by beam slit illumination

Info

Publication number
JPH11203475A
JPH11203475A JP10007341A JP734198A JPH11203475A JP H11203475 A JPH11203475 A JP H11203475A JP 10007341 A JP10007341 A JP 10007341A JP 734198 A JP734198 A JP 734198A JP H11203475 A JPH11203475 A JP H11203475A
Authority
JP
Japan
Prior art keywords
cream solder
bright line
solder printing
beam slit
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10007341A
Other languages
Japanese (ja)
Inventor
Yasufumi Uchiki
康文 打木
Taro Matsuoka
太郎 松岡
Tatsuo Hata
龍雄 畑
Koichi Miyazaki
浩一 宮崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Furukawa Electric Co Ltd
Original Assignee
Furukawa Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd
Priority to JP10007341A priority Critical patent/JPH11203475A/en
Publication of JPH11203475A publication Critical patent/JPH11203475A/en
Pending legal-status Critical Current

Links

Landscapes

  • Screen Printers (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Image Processing (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Image Analysis (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a cream soldered print inspection method using beam slit illumination, capable of clearly photographing luminescent lines on a printed board and also luminescent lines on a cream soldered print part. SOLUTION: A beam slit illuminator 4 is arranged so that luminescent lines 3 are applied to the surface of a cream soldered print part 2 and of a printed board 1 at a prescribed angle. Under such a state, photographing based on light quantity suitable for the photography of luminescent lines 3 on the printed board 1 and photographing based on light quantity suitable for photography on the cream soldered print part 2 are executed to inspect the print part 2.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、プリント基板上に
印刷されたクリーム半田印刷部とプリント基板との表面
にビームスリット照明体から輝線を当てて撮影してクリ
ーム半田印刷部を検査するビームスリット照明によるク
リーム半田印刷検査方法に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a beam slit for inspecting a cream solder printed portion by applying a bright line from a beam slit illuminator to a surface of the cream solder printed portion printed on a printed circuit board and the surface of the printed board. The present invention relates to a method for inspecting cream solder printing by illumination.

【0002】[0002]

【従来の技術】図2〜図4に示すように、プリント基板
1上の半田付けランド部に印刷された長方形のクリーム
半田印刷部2の幅や高さを検査する場合は、所要の角度
(45度)で輝線3がクリーム半田印刷部2とプリント
基板1の表面に当たるようにビームスリット照明体4を
設置した状態で、これらクリーム半田印刷部2とプリン
ト基板1との表面にレーザ光源を用いたビームスリット
照明体4から輝線3を当ててCCDカメラ等のカメラ5
で撮影することにより行っている。
2. Description of the Related Art As shown in FIGS. 2 to 4, when inspecting the width and height of a rectangular cream solder printing portion 2 printed on a soldering land portion on a printed circuit board 1, a required angle ( A laser light source is used on the surfaces of the cream solder printing unit 2 and the printed circuit board 1 with the beam slit illuminator 4 installed so that the bright line 3 hits the surfaces of the cream solder printing unit 2 and the printed circuit board 1 at 45 degrees. Camera 5 such as a CCD camera by applying a bright line 3 from the beam slit illuminator 4
It is done by shooting at.

【0003】この場合、クリーム半田印刷部2の表面上
の輝線3の位置は、クリーム半田印刷部2の高さに応じ
て図4に示すようにプリント基板1の表面の輝線3の位
置からずれる。
In this case, the position of the bright line 3 on the surface of the cream solder printing unit 2 is shifted from the position of the bright line 3 on the surface of the printed circuit board 1 as shown in FIG. .

【0004】このためクリーム半田印刷部2の表面上の
輝線3の長さを測定することによりクリーム半田印刷部
2の幅が求まり、プリント基板1の表面の輝線3の位置
からクリーム半田印刷部2の表面上の輝線3の位置まで
の距離よりクリーム半田印刷部2の高さが求まる。ま
た、 (クリーム半田印刷の前の半田付けランド部の面積)−
(クリーム半田印刷の後の半田付けランド部のクリーム
半田印刷部が設けられていない面積)=(クリーム半田
印刷部の面積) なる計算からクリーム半田印刷部2の面積を求めること
ができる。
For this reason, by measuring the length of the bright line 3 on the surface of the cream solder printing unit 2, the width of the cream solder printing unit 2 is determined, and the position of the bright line 3 on the surface of the printed circuit board 1 is determined. The height of the cream solder printed portion 2 is determined from the distance to the position of the bright line 3 on the surface of the solder paste. Also, (Area of soldering land before cream solder printing)-
(Area of soldering land after cream solder printing where no cream solder printing portion is provided) = (Area of cream solder printing portion) The area of cream solder printing portion 2 can be obtained from the following calculation.

【0005】更に、 (クリーム半田印刷部の面積)×(クリーム半田印刷部
の高さ)=(クリーム半田印刷部の体積) なる計算からクリーム半田印刷部2の体積を求めること
ができる。
Further, the volume of the cream solder printing section 2 can be obtained from the following calculation: (area of the cream solder printing section) × (height of the cream solder printing section) = (volume of the cream solder printing section).

【0006】このためクリーム半田印刷部2が適正か否
かを判定することができる。
For this reason, it is possible to determine whether or not the cream solder printing unit 2 is appropriate.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、プリン
ト基板1とクリーム半田印刷部2とは、光の反射や散乱
の度合いが異なり、このためプリント基板1上での輝線
3の撮影に適する光量で撮影を行うと、クリーム半田印
刷部2上の輝線3が不鮮明になり、また、クリーム半田
印刷部1上での輝線3の撮影に適する光量で撮影を行う
と、クリーム半田印刷部2上の輝線3が不鮮明になり、
輝線3の撮影が適正に行えない問題点があった。
However, the printed circuit board 1 and the cream solder printing section 2 have different degrees of light reflection and scattering, and therefore, are photographed with a light amount suitable for photographing the bright line 3 on the printed circuit board 1. Is performed, the bright line 3 on the cream solder printing unit 2 becomes unclear, and when photographing is performed with an amount of light suitable for photographing the bright line 3 on the cream solder printing unit 1, the bright line 3 on the cream solder printing unit 2 Becomes blurred,
There was a problem that the photographing of the bright line 3 could not be performed properly.

【0008】本発明の目的は、プリント基板上での輝線
もクリーム半田印刷部上の輝線も鮮明に撮影できるビー
ムスリット照明によるクリーム半田印刷検査方法を提供
することにある。
It is an object of the present invention to provide a cream solder printing inspection method by beam slit illumination capable of clearly photographing a bright line on a printed board and a bright line on a cream solder printing portion.

【0009】[0009]

【課題を解決するための手段】本発明は、プリント基板
上に印刷されたクリーム半田印刷部とプリント基板との
表面にビームスリット照明体から輝線を当てて撮影して
クリーム半田印刷部を検査するビームスリット照明によ
るクリーム半田印刷検査方法を改良するものである。
According to the present invention, a cream solder printed portion printed on a printed circuit board and a surface of the printed circuit board are inspected by applying a bright line from a beam slit illuminator to the surface of the cream solder printed portion. An object of the present invention is to improve a cream solder printing inspection method using beam slit illumination.

【0010】本発明に係るビームスリット照明によるク
リーム半田印刷検査方法においては、所要の角度で輝線
がクリーム半田印刷部とプリント基板の表面に当たるよ
うにビームスリット照明体を設置する。かかる状態で、
プリント基板上での輝線の撮影に適する光量での撮影
と、クリーム半田印刷部上での輝線の撮影に適する光量
での撮影とを行って、クリーム半田印刷部の検査をす
る。
In the cream solder printing inspection method using the beam slit illumination according to the present invention, the beam slit illuminator is installed so that the bright line hits the cream solder printing portion and the surface of the printed board at a required angle. In such a state,
Inspection of the cream solder printing portion is performed by performing shooting with the light amount suitable for shooting the bright line on the printed circuit board and shooting with the light amount suitable for shooting the bright line on the cream solder printing portion.

【0011】このようにすると、プリント基板上での輝
線もクリーム半田印刷部上の輝線も鮮明に撮影でき、輝
線の撮影を適正に行うことができる。
With this configuration, the bright line on the printed circuit board and the bright line on the cream solder printed portion can be clearly photographed, and the bright line can be properly photographed.

【0012】[0012]

【発明の実施の形態】図1は、ビームスリット照明によ
るクリーム半田印刷検査方法を実施するビームスリット
照明によるクリーム半田印刷検査装置の構成を示したも
のである。なお、前述した図2と対応する部分には、同
一符号を付けて示している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows a configuration of a cream solder print inspection apparatus using beam slit illumination for implementing a cream solder print inspection method using beam slit illumination. Parts corresponding to those in FIG. 2 described above are denoted by the same reference numerals.

【0013】このビームスリット照明によるクリーム半
田印刷検査装置は、前述したビームスリット照明体4と
カメラ5の他に、ビームスリット照明体4の光量の設定
が行えると共にカメラ5からの入力を行ってクリーム半
田印刷部2の検査処理を行うマイクロコンピュータ6
と、カメラ5からの撮影画像を表示するモニタ7とを備
えている。
In the cream solder printing inspection apparatus using the beam slit illumination, in addition to the beam slit illumination body 4 and the camera 5, the amount of light of the beam slit illumination body 4 can be set and an input from the camera 5 is performed. Microcomputer 6 for performing inspection processing of solder printing unit 2
And a monitor 7 for displaying a captured image from the camera 5.

【0014】次に、このようなビームスリット照明によ
るクリーム半田印刷検査装置を用いての本例のビームス
リット照明によるクリーム半田印刷検査方法について説
明する。
Next, a description will be given of a cream solder print inspection method using beam slit illumination of this embodiment using such a cream solder print inspection apparatus using beam slit illumination.

【0015】本例では、まず、所要の角度(45度)で
輝線3がクリーム半田印刷部2とプリント基板1の表面
に当たるようにビームスリット照明体4を設置し、また
クリーム半田印刷部2の真上にCCDカメラ等のカメラ
5を設置する。
In this embodiment, first, the beam slit illuminator 4 is installed so that the bright line 3 hits the cream solder printing section 2 and the surface of the printed circuit board 1 at a required angle (45 degrees). A camera 5 such as a CCD camera is installed right above.

【0016】次に、マイクロコンピュータ6の指令で、
ビームスリット照明体4から出す輝線3の光量を順次変
えて、プリント基板1上での輝線3の撮影に適する光量
を求め、その値をマイクロコンピュータ6に記憶させ
る。
Next, according to a command from the microcomputer 6,
The amount of light of the bright line 3 emitted from the beam slit illuminator 4 is sequentially changed to obtain a light amount suitable for photographing the bright line 3 on the printed circuit board 1, and the value is stored in the microcomputer 6.

【0017】また、マイクロコンピュータ6の指令で、
ビームスリット照明体4から出す輝線3の光量を順次変
えて、クリーム半田印刷部2上での輝線3の撮影に適す
る光量を求め、その値をマイクロコンピュータ6に記憶
させる。
Further, according to a command from the microcomputer 6,
The light amount of the bright line 3 emitted from the beam slit illuminator 4 is sequentially changed to obtain a light amount suitable for photographing the bright line 3 on the cream solder printing unit 2, and the value is stored in the microcomputer 6.

【0018】かかる状態で、プリント基板1上での輝線
3の撮影に適する光量の輝線3をビームスリット照明体
4からプリント基板1とクリーム半田印刷部2との表面
に当てて、輝線3が当たっているプリント基板1とクリ
ーム半田印刷部2とをカメラ5で撮影する。
In this state, the bright line 3 having a light amount suitable for photographing the bright line 3 on the printed circuit board 1 is applied from the beam slit illuminator 4 to the surface of the printed circuit board 1 and the cream solder printing section 2, and the bright line 3 hits. The printed circuit board 1 and the cream solder printing unit 2 are photographed by the camera 5.

【0019】次に、クリーム半田印刷部2上での輝線3
の撮影に適する光量の輝線3をビームスリット照明体4
からプリント基板1とクリーム半田印刷部2との表面に
当てて、輝線3が当たっているプリント基板1とクリー
ム半田印刷部2とをカメラ5で撮影する。
Next, the bright line 3 on the cream solder printing section 2
A beam slit illuminator 4 that emits a bright line 3 having an amount of light suitable for photographing
Then, the printed circuit board 1 and the cream solder printing section 2 on which the bright lines 3 are applied are photographed by the camera 5 by contacting the surfaces of the printed circuit board 1 and the cream solder printing section 2.

【0020】このような撮影データを合成する。例え
ば、クリーム半田印刷部2に適する光量で採取した撮影
データのうち、輝線3が見えない部分を、プリント基板
1に適する光量で採取した撮影データと置き換えるとい
った合成方法等で合成する。かくすると、プリント基板
1とクリーム半田印刷部2とに輝線3が鮮明に表示され
た図4に示すような画像を得て、モニタ7に表示するこ
とができる。即ち、プリント基板1とクリーム半田印刷
部2との輝線3の撮影を適正に行うことができる。この
ためクリーム半田印刷部2の検査を容易に行うことがで
きる。
Such photographing data is synthesized. For example, of the photographing data collected at a light amount suitable for the cream solder printing unit 2, a portion in which the bright line 3 is not visible is synthesized by a synthesizing method or the like in which the photographing data collected at a light amount suitable for the printed circuit board 1 is replaced. Thus, an image as shown in FIG. 4 in which the bright lines 3 are clearly displayed on the printed board 1 and the cream solder printing section 2 can be obtained and displayed on the monitor 7. That is, it is possible to appropriately photograph the bright line 3 between the printed board 1 and the cream solder printing unit 2. Therefore, the inspection of the cream solder printing unit 2 can be easily performed.

【0021】上記例では、クリーム半田印刷部2の横断
面形状が長方形の場合について示したが、クリーム半田
印刷部2の横断面形状はこれに限定されるものではな
く、円形等であってもよい。
In the above example, the case where the cross-sectional shape of the cream solder printing unit 2 is rectangular is shown. However, the cross-sectional shape of the cream solder printing unit 2 is not limited to this. Good.

【0022】[0022]

【発明の効果】本発明に係るビームスリット照明による
クリーム半田印刷検査方法においては、所要の角度で輝
線がクリーム半田印刷部とプリント基板の表面に当たる
ようにビームスリット照明体を設置した状態で、プリン
ト基板上での輝線の撮影に適する光量での撮影と、クリ
ーム半田印刷部上での輝線の撮影に適する光量での撮影
とを行って、クリーム半田印刷部の検査をするので、プ
リント基板上での輝線もクリーム半田印刷部上の輝線も
鮮明に撮影でき、輝線の撮影を適正に行うことができ
る。このためクリーム半田印刷部の検査を容易に行うこ
とができる。
According to the cream solder printing inspection method using the beam slit illumination according to the present invention, the printing is performed in a state where the beam slit illuminator is installed so that the bright line hits the cream solder printing portion and the surface of the printed board at a required angle. Since the inspection is performed on the cream solder printing section by performing shooting with the light quantity suitable for shooting the bright line on the board and shooting with the light quantity suitable for shooting the bright line on the cream solder printing section, The bright line and the bright line on the cream solder printing portion can be clearly photographed, and the bright line can be properly photographed. For this reason, the inspection of the cream solder printing portion can be easily performed.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係るビームスリット照明によるクリー
ム半田印刷検査方法を実施するビームスリット照明によ
るクリーム半田印刷検査装置の構成の実施の形態の一例
を示した正面図である。
FIG. 1 is a front view showing an example of an embodiment of a configuration of a cream solder print inspection apparatus by beam slit illumination that implements a cream solder print inspection method by beam slit illumination according to the present invention.

【図2】従来のビームスリット照明によるクリーム半田
印刷検査装置の構成を示した正面図である。
FIG. 2 is a front view showing the configuration of a conventional cream solder printing inspection apparatus using beam slit illumination.

【図3】図2の右側面図である。FIG. 3 is a right side view of FIG. 2;

【図4】輝線がクリーム半田印刷部とプリント基板の表
面に当た時の状態を示す平面図である。
FIG. 4 is a plan view showing a state where a bright line hits a cream solder printing portion and the surface of a printed circuit board.

【符号の説明】[Explanation of symbols]

1 プリント基板 2 クリーム半田印刷部 3 輝線 4 ビームスリット照明体 5 カメラ 6 マイクロコンピュータ 7 モニタ DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Cream solder printing part 3 Bright line 4 Beam slit illuminator 5 Camera 6 Microcomputer 7 Monitor

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI // G01N 21/88 G01N 21/88 F (72)発明者 宮崎 浩一 東京都千代田区丸の内2丁目6番1号 古 河電気工業株式会社内──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification symbol FI // G01N 21/88 G01N 21/88 F (72) Inventor Koichi Miyazaki 2-6-1 Marunouchi, Chiyoda-ku, Tokyo Furukawa Electric Industrial Co., Ltd.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 プリント基板上に印刷されたクリーム半
田印刷部と前記プリント基板との表面にビームスリット
照明体から輝線を当てて撮影して前記クリーム半田印刷
部を検査するビームスリット照明によるクリーム半田印
刷検査方法において、 所要の角度で前記輝線が前記クリーム半田印刷部と前記
プリント基板の表面に当たるように前記ビームスリット
照明体を設置した状態で、前記プリント基板上での前記
輝線の撮影に適する光量での撮影と、前記クリーム半田
印刷部上での前記輝線の撮影に適する光量での撮影とを
行って、前記クリーム半田印刷部の検査をすることを特
徴とするビームスリット照明によるクリーム半田印刷検
査方法。
1. A cream solder printed part printed on a printed circuit board and a cream solder by beam slit lighting for inspecting the cream solder printed part by photographing the surface of the printed circuit board by irradiating bright lines from a beam slit illuminator. In the printing inspection method, in a state where the beam slit illuminator is installed so that the bright line hits the cream solder printing portion and the surface of the printed board at a required angle, a light amount suitable for photographing the bright line on the printed board. A solder slit printing inspection by beam slit illumination, wherein the photographing is performed with a light amount suitable for photographing the bright line on the cream solder printing unit, and the cream solder printing unit is inspected. Method.
JP10007341A 1998-01-19 1998-01-19 Method for inspecting cream soldered print by beam slit illumination Pending JPH11203475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10007341A JPH11203475A (en) 1998-01-19 1998-01-19 Method for inspecting cream soldered print by beam slit illumination

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10007341A JPH11203475A (en) 1998-01-19 1998-01-19 Method for inspecting cream soldered print by beam slit illumination

Publications (1)

Publication Number Publication Date
JPH11203475A true JPH11203475A (en) 1999-07-30

Family

ID=11663249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10007341A Pending JPH11203475A (en) 1998-01-19 1998-01-19 Method for inspecting cream soldered print by beam slit illumination

Country Status (1)

Country Link
JP (1) JPH11203475A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113172990A (en) * 2021-04-02 2021-07-27 广州诚鼎机器人有限公司 Paste pattern recognition method, screen frame nesting method and elliptical printing machine

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113172990A (en) * 2021-04-02 2021-07-27 广州诚鼎机器人有限公司 Paste pattern recognition method, screen frame nesting method and elliptical printing machine
CN113172990B (en) * 2021-04-02 2022-08-19 广州诚鼎机器人有限公司 Sizing agent pattern recognition method, screen frame nesting method and elliptical printing machine

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