JPH11201729A - Optical measuring device - Google Patents
Optical measuring deviceInfo
- Publication number
- JPH11201729A JPH11201729A JP1633398A JP1633398A JPH11201729A JP H11201729 A JPH11201729 A JP H11201729A JP 1633398 A JP1633398 A JP 1633398A JP 1633398 A JP1633398 A JP 1633398A JP H11201729 A JPH11201729 A JP H11201729A
- Authority
- JP
- Japan
- Prior art keywords
- measuring
- light receiving
- receiving element
- measurement
- light source
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は光学式測定装置に関
し、特に、レーザビーム等の複数の光学系を用いる測定
装置の改良に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical measuring device, and more particularly to an improvement of a measuring device using a plurality of optical systems such as a laser beam.
【０００２】[0002]
【背景技術】周知のように、例えば集積回路素子のリー
ドフレームＷの厚み測定を行う２位置測定装置において
は、図３に示すように、２つの測定光学系Ａ，Ｂを用い
てリードフレームＷの表面及び裏面の任意の２点の位置
を測定し、水平方向に通過されるリードフレームＷの厚
みを測定する場合がある。2. Description of the Related Art As is well known, in a two-position measuring apparatus for measuring the thickness of a lead frame W of an integrated circuit device, for example, as shown in FIG. In some cases, the positions of arbitrary two points on the front surface and the back surface are measured, and the thickness of the lead frame W passed in the horizontal direction is measured.
【０００３】即ち、この２位置測定装置にあっては、第
１レーザ光源Ｒ1 からのレーザビームを被測定物である
リードフレームＷの表面に標準する第１集光レンズＣＬ
1 及び同表面からの反射ビームを第１受光素子ＨＤ1 の
受光面に入射させる第１受光部レンズＲＬ1 をもつ第１
測定光学系Ａと、第２レーザ光源Ｒ2 からのレーザビー
ムを前記リードフレームＷの裏面に照準する第２集光レ
ンズＣＬ1 及び同裏面からの反射ビームを第２受光素子
ＨＤ2 の受光面に入射させる第２受光部レンズＲＬ2 を
もつ第２測定光学系Ｂとを備えており、これらの第１測
定光学系Ａ及び第２測定光学系Ｂは略同じ平面内に位置
されている。That is, in this two-position measuring device, a first condenser lens CL for standardizing a laser beam from a first laser light source R 1 on the surface of a lead frame W as an object to be measured.
1 and the first with the first light receiving portion lens RL 1 the reflected beam is incident on the first light receiving surface of the light receiving element HD 1 from the surface
A measuring optical system A, the second light receiving surface of the light receiving element HD 2 the reflected beam of the laser beam from the second condenser lens CL 1 and the back surface of sight on the rear surface of the lead frame W from the second laser light source R 2 and a second measuring optical system B having a second light receiving portion lens RL 2 to be incident, these first measuring optical system a and the second measuring optical system B are located substantially in the same plane.
【０００４】[0004]
【発明が解決しようとする課題】ところで、このような
２つの測定光学系Ａ，Ｂをもつ２位置測定装置において
は、被測定物からの乱反射等で使用レーザ光が一方の測
定光学系Ａ，Ｂの受光素子ＨＤ1 ，ＨＤ2 に入射する
と、同受光素子ＨＤ1 ，ＨＤ2 が誤って感応し、測定ミ
スの原因となるおそれがある。In a two-position measuring apparatus having such two measuring optical systems A and B, a laser beam to be used is emitted from one of the measuring optical systems A and B due to irregular reflection from an object to be measured. When the light enters the light receiving elements HD 1 and HD 2 of B, the light receiving elements HD 1 and HD 2 may erroneously sense and cause a measurement error.
【０００５】このため、従来では、各測定光学系Ａ，Ｂ
の光路中に光学的シャッタを配置し、交互に開閉される
同シャッタにより各測定光学系に用いるレーザビームを
時間的に切り替えて、他方の測定光学系からのレーザビ
ームの誤った受光を防止する対策を行っている。しかし
ながら、このような誤動作防止対策構造では、高速度で
レーザビームを切り換える高価なシャッタの使用で、装
置の製造原価が割高となるばかりでなく、レーザビーム
を時間的に切り換えるため、移動体の測定の場合に、厳
密な意味での２点間の位置の測定はできなくなる問題が
あった。Therefore, conventionally, each of the measuring optical systems A and B
An optical shutter is arranged in the optical path of the optical system, and the shutters that are alternately opened and closed switch the laser beam used for each measuring optical system with time, thereby preventing erroneous reception of the laser beam from the other measuring optical system. We are taking measures. However, in such a structure for preventing malfunction, the use of an expensive shutter for switching the laser beam at a high speed not only increases the manufacturing cost of the device, but also switches the laser beam over time, so that the measurement of the moving object is not possible. In the case of, there is a problem that the position between two points in a strict sense cannot be measured.
【０００６】本発明の目的は、以上に述べたような従来
の光学式測定装置の問題に鑑み、複数の測定光学系を同
一平面内に位置して、被測定物の複数位置または直線の
長さを測定する光学式測定装置であって、高価な高速度
シャッタを用いなく共、測定光学系相互の誤動作を確実
に防止できる、比較的安価な構造の光学式測定装置を得
るにある。In view of the above-mentioned problems of the conventional optical measuring apparatus, the object of the present invention is to arrange a plurality of measuring optical systems in the same plane and to set a plurality of positions or straight lines of an object to be measured. An object of the present invention is to provide an optical measuring device having a relatively inexpensive structure that can reliably prevent malfunctions of the measuring optical systems without using an expensive high-speed shutter.
【０００７】[0007]
【課題を解決するための手段】この目的を達成するた
め、本発明は、光源及び受光素子を有する複数の測定光
学系を同一平面内に位置して、被測定物の複数位置また
は直線の長さを測定する光学式測定装置において、前記
光源は異なった波長の測定光を出射できると共に、対応
する光源の測定光以外の波長の光を遮断するフィルタを
少なくとも一部の受光素子の直前に位置した光学式測定
装置を提案するものである。In order to achieve the above object, the present invention provides a method for measuring a plurality of measurement optical systems having a light source and a light receiving element in the same plane, and a plurality of measurement optical systems having a plurality of positions or straight lines on an object to be measured. In the optical measuring device for measuring the height, the light source can emit measurement light of different wavelengths, and a filter for blocking light having a wavelength other than the measurement light of the corresponding light source is located immediately before at least some of the light receiving elements. The present invention proposes an optical measuring device.
【０００８】後述する本発明の好ましい実施例の説明に
おいては、1)被測定物の一点に照準されるレーザビーム
を出射する光源及び同測定点からの反射レーザビームを
受光する前記受光素子をもつ前記第１測定光学系と、前
記レーザビームが含まれる平面内に略位置されかつ前記
測定点とは異なる前記被測定物の他の点に照準されるレ
ーザビームを出射する光源及び同レーザビームを受光す
る受光素子をもつ前記第２測定光学系とを備える２位置
測定装置、2)被測定物を挟んで対向されて測定用平行走
査ビームを出射するレーザ光源及び受光素子を含んだ第
１測定光学系と、前記被測定物を挟んだ状態で同第１測
定光学系と略同一の平面内におかれて前記レーザ光源と
は別の波長の測定用平行走査ビームを出射するレーザ光
源及びこれを受光する受光素子とを含んだ第２測定光学
系とを備える長さ測定装置が説明される。In the following description of a preferred embodiment of the present invention, 1) a light source for emitting a laser beam aimed at one point of an object to be measured and the light receiving element for receiving a reflected laser beam from the same measurement point are provided. The first measurement optical system, a light source that emits a laser beam that is positioned substantially in a plane including the laser beam and is aimed at another point of the object to be measured that is different from the measurement point, and the same laser beam. A two-position measuring device including the second measuring optical system having a light receiving element for receiving light; 2) a first measurement including a laser light source which emits a parallel scanning beam for measurement and is opposed to the object to be measured, and a light receiving element An optical system, a laser light source for emitting a parallel scanning beam for measurement having a wavelength different from that of the laser light source, the laser light source being located in substantially the same plane as the first measurement optical system with the object to be measured interposed therebetween; Receive And a second measuring optical system including a light receiving element.
【０００９】[0009]
【発明の実施の形態】以下、図１及び図２について本発
明の実施例の詳細を説明する。図１は図３について前述
した集積回路素子のリードフレームの厚み測定を行う２
位置測定装置に施した第１実施例を示している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of the present invention will be described in detail with reference to FIGS. FIG. 1 illustrates the measurement of the thickness of the lead frame of the integrated circuit device described with reference to FIG.
1 shows a first embodiment applied to a position measuring device.
【００１０】即ち、この２位置測定装置は、異なった被
測定物の位置を検出する２つの測定光学系ＲＳ1 ，ＲＳ
2 を備えている。つまり、リードフレームＷ1 の表面の
位置を検出する第１測定光学系ＲＳ1 は、第１レーザ光
源１ａからのレーザビームを被測定物であるリードフレ
ームＷ1 の表面に照準する第１集光レンズ２ａと、同表
面からの反射ビームを第１受光素子３ａの受光面に入射
させる第１受光部レンズ４ａとを備えている。また、リ
ードフレームＷ1 の裏面の位置を検出する第２測定光学
系ＲＳ2 は、前記第１レーザ光源１ａとは異なった第２
レーザ光源５ａからのレーザビームを前記リードフレー
ムＷ1 の裏面に照準する第２集光レンズ６ａと、同裏面
からの反射ビームを第２受光素子７ａの受光面に入射さ
せる第２受光部レンズ８ａとを備えており、これらの第
１測定光学系ＲＳ1 及び第２測定光学系ＲＳ2 は略同じ
平面内に位置されている。That is, the two-position measuring device includes two measuring optical systems RS 1 and RS for detecting the positions of different objects to be measured.
It has two . That is, the first measuring optical system RS 1 for detecting the position of the surface of the lead frame W 1 is first focus for aiming the laser beam from the first laser light source 1a on the surface of the lead frame W 1, which is the object to be measured The lens includes a lens 2a and a first light receiving unit lens 4a for making a reflected beam from the surface incident on the light receiving surface of the first light receiving element 3a. The lead frame W second measuring optical system RS 2 for detecting the position of the rear surface of the 1, second that is different from the first laser source 1a
A second condenser lens 6a for aiming the laser beam from the laser light source 5a to the rear surface of the lead frame W 1, the second light receiving portion lens 8a for entering the reflected beam from the back surface to the light receiving surface of the second light receiving element 7a includes bets, these first measuring optical system RS 1 and the second measuring optical system RS 2 is positioned substantially in the same plane.
【００１１】第１実施例の場合、第１レーザ光源１ａは
例えば６７０nmの波長のレーザを、また、第２レーザ光
源５ａはこの第１レーザ光源１ａとは異なった７８０nm
の波長のレーザ光をそれぞれ出射できるが、第１受光素
子３ａの直前には６７０nm以外の波長のレーザ光をカッ
トできる第１フィルタ９ａが配置される。また、同様の
目的から第２受光素子７ａの直前には７８０nmの波長の
レーザ光をカットできる第２フィルタ１０ａが位置さ
れ、この第２フィルタ１０ａによって第１レーザ光源１
ａからの過ったレーザ光の第２受光素子７ａへの入射が
防止される。In the case of the first embodiment, the first laser light source 1a is, for example, a laser having a wavelength of 670 nm, and the second laser light source 5a is 780 nm, which is different from the first laser light source 1a.
A first filter 9a capable of cutting laser light having a wavelength other than 670 nm is disposed immediately before the first light receiving element 3a. In addition, for the same purpose, a second filter 10a capable of cutting laser light having a wavelength of 780 nm is located immediately before the second light receiving element 7a.
Excess laser light from a is prevented from entering the second light receiving element 7a.
【００１２】第１実施例によるリードフレームＷ1 の厚
み測定装置は、以上のような構成であるから、第１測定
光学系ＲＳ1 の第１受光素子３ａ及び第２測定光学系Ｒ
Ｓ2の第２受光素子７ａへのレーザビームの入射によっ
てリードフレームＷ1 の表面及び裏面の位置が所謂ナイ
フエッジ法に基づき算定され、この算定結果からリード
フレームＷ1 の厚みが算出される。この測定の場合、第
１レーザ光源１ａ及び第２レーザ光源５ａの射出レーザ
ビームの波長が相互に異ならせてあり、第１受光素子３
ａ及び第２受光素子７ａの直前には第１フィルタ９ａ及
び第２フィルタ１０ａがそれぞれ配置してあるため、乱
反射または乱屈折した他方の測定光学系ＲＳ1 ，ＲＳ2
のレーザ光の第１受光素子３ａまたは第２受光素子７ａ
への入射により誤動作が生じるのを防止できる。The apparatus for measuring the thickness of the lead frame W 1 according to the first embodiment has the above-described configuration. Therefore, the first light receiving element 3a of the first measuring optical system RS 1 and the second measuring optical system R
Laser beam surface and the back surface of the position of the lead frame W 1 by the incidence of to the second light receiving element 7a of S 2 is calculated based on the so-called knife-edge method, the thickness of the lead frame W 1 is calculated from the calculation results. In the case of this measurement, the wavelengths of the emission laser beams of the first laser light source 1a and the second laser light source 5a are different from each other.
Since the first filter 9a and the second filter 10a are respectively arranged immediately before a and the second light receiving element 7a, the other measurement optical systems RS 1 and RS 2 that have undergone diffuse reflection or diffuse refraction.
First light receiving element 3a or second light receiving element 7a
A malfunction can be prevented from being caused by the incident light.
【００１３】図２は本発明の第２実施例による線径測定
装置を示し、この線径測定装置においては通過される電
線Ｗ2 に対して直角な同一平面内で直交される一対の平
行走査ビームが用いられる。即ち、第１測定光学系ＲＳ
1 は図示を省略するコリメータレンズを内蔵する第１レ
ーザ光源及び同電線Ｗ2 を挟んで第１レーザ光源１ｂに
対向された第１受光素子３ｂを備え、前記電線Ｗ2 を周
囲を通過した平行走査ビームを収束させる第１集光レン
ズ１１ａを介して前記第１受光素子３ｂにレーザ光が入
射される。前記第１レーザ光源１ｂとは異なった波長の
レーザ発光素子及びコリメータレンズを内蔵する第２測
定光学系ＲＳ2 の第２レーザ光源５ｂは、前記電線Ｗ2
を挟んだ状態で、前記第１測定光学系ＲＳ1 の光軸に直
角な方向に対向される第２受光素子７ｂに対向される
が、前記第１受光素子３ｂと同様に、同第２受光素子７
ｂに対しては電線Ｗ2 の周囲を通過した平行走査ビーム
が第２集光レンズ１２ａを介して入射される。[0013] Figure 2 shows a wire diameter measuring device according to a second embodiment of the present invention, a pair of parallel scans are orthogonal in the orthogonal flush against the wire W 2 being passed in this diameter measuring device A beam is used. That is, the first measuring optical system RS
1 comprises a first light receiving element 3b which is opposed to the first laser light source 1b sandwiching the first laser light source and the wire W 2 having a built-in collimator lens not shown, parallel to the electric wire W 2 passes around Laser light is incident on the first light receiving element 3b via the first condenser lens 11a for converging the scanning beam. The second second laser source 5b of the measuring optical system RS 2 having a built-in laser light emitting element and a collimator lens different wavelength from the first laser light source 1b, the wire W 2
While sandwiching, the first second, but is opposed to the light receiving element 7b, which is opposite to a direction perpendicular to the optical axis of the measuring optical system RS 1, similarly to the first light receiving element 3b, the second receiving Element 7
For b the parallel scanning beam passing through the periphery of the wire W 2 are incident through the second condenser lens 12a.
【００１４】第２実施例による線径測定装置の場合、前
記第１受光素子３ｂ及び前記第２受光素子７ｂの直前に
は、第１レーザ光源１ｂからの波長のレーザ光のみを第
１受光素子３ｂに入射させる第１フィルタ９ｂ、及び、
第２レーザ光源５ｂからの波長のレーザ光のみを第２受
光素子７ｂに入射させる第２フィルタ１０ｂが位置され
ている。In the case of the wire diameter measuring apparatus according to the second embodiment, just before the first light receiving element 3b and the second light receiving element 7b, only the laser light of the wavelength from the first laser light source 1b is used as the first light receiving element. A first filter 9b for incidence on 3b, and
A second filter 10b that allows only the laser light of the wavelength from the second laser light source 5b to enter the second light receiving element 7b is located.
【００１５】したがって、第２実施例による線径測定装
置においては、第１受光素子３ｂ及び第２受光素子７ｂ
の受光量により電線Ｗ2 の互いに直角な方向の直径を知
ることができるから、両第１受光素子３ｂ及び第２受光
素子７ｂの出力信号の分析により電線Ｗ2 の外径を測定
できる。Therefore, in the wire diameter measuring device according to the second embodiment, the first light receiving element 3b and the second light receiving element 7b
Since it is possible to know the mutually perpendicular diameters of the wire W 2 by the light receiving amount, it can measure the outer diameter of the wire W 2 Analysis of the output signals of both the first light receiving element 3b and the second light receiving element 7b.
【００１６】なお、前述した本発明の各実施例において
は、同一平面内に複数の測定光学系を位置した測定装置
につき例示したけれども、例えば溝の深さを測定する段
差測定装置等のように、非常に近接した異なった平面内
に複数の測定光学系を配置する装置にも、本発明を適用
できるのは、改めて指摘するまでもない。In each of the above-described embodiments of the present invention, a measuring apparatus in which a plurality of measuring optical systems are located on the same plane is exemplified. However, for example, a step measuring apparatus for measuring the depth of a groove, etc. It goes without saying that the present invention can be applied to an apparatus in which a plurality of measurement optical systems are arranged in different planes very close to each other.
【００１７】[0017]
【発明の効果】以上の説明から明らかなように、本発明
によれば、複数の測定光学系の光源の出射波長を異なら
せると共に、各測定光学系の受光素子の少なくとも一部
の直前に、フィルタを位置するだけの安価な構造により
複数の測定光学系の混信による測定ミスをなくすことが
できる。As is apparent from the above description, according to the present invention, the emission wavelengths of the light sources of the plurality of measurement optical systems are made different, and at least a part of the light receiving element of each measurement optical system is provided immediately before the light-receiving element. With an inexpensive structure in which only the filter is located, measurement errors due to interference of a plurality of measurement optical systems can be eliminated.
【図１】本発明の第１実施例によるリードフレームの厚
み測定装置の光学系の概念図である。FIG. 1 is a conceptual diagram of an optical system of a lead frame thickness measuring device according to a first embodiment of the present invention.
【図２】本発明の第２実施例による線径測定装置の光学
系の概念図である。FIG. 2 is a conceptual diagram of an optical system of a wire diameter measuring device according to a second embodiment of the present invention.
【図３】従来のリードフレームの厚み測定装置の光学系
の概念図である。FIG. 3 is a conceptual diagram of an optical system of a conventional lead frame thickness measuring device.
Ｗ1 リードフレーム Ｗ2 電線 ＲＳ1 ，ＲＳ2 測定光学系 １ａ〜１ｃ 第１第１レーザ光源 ３ａ〜３ｃ 第１受光素子 ７ａ〜７ｃ 第２受光素子 ９ａ〜９ｃ 第１フィルタ １０ａ〜１０ｃ 第２フィルタW 1 leadframe W 2 wire RS 1, RS 2 measuring optical system 1a~1c first first laser light source 3a~3c first light receiving element 7a~7c second light receiving element 9a~9c first filter 10a~10c second filter
Claims (3)
学系を同一平面内に位置して、被測定物の複数位置また
は直線の長さを測定する光学式測定装置において、前記
光源は異なった波長の測定光を出射できると共に、対応
する光源の測定光以外の波長の光を遮断するフィルタを
少なくとも一部の受光素子の直前に位置したことを特徴
とする光学式測定装置。1. An optical measuring device for measuring a plurality of positions or a straight line length of an object to be measured by locating a plurality of measuring optical systems having a light source and a light receiving element in the same plane, wherein the light sources are different. An optical measuring device, wherein a filter capable of emitting measurement light of a wavelength and blocking light of a wavelength other than the measurement light of the corresponding light source is located immediately before at least some of the light receiving elements.
ムを出射する光源及び同測定点からの反射レーザビーム
を受光する前記受光素子をもつ第１測定光学系と、前記
レーザビームが含まれる平面内に略位置されかつ前記測
定点とは異なる前記被測定物の他の点に照準されるレー
ザビームを出射する光源及び同レーザビームを受光する
受光素子をもつ第２測定光学系とを備えることを特徴と
する請求項１記載の２位置測定装置。2. A first measuring optical system having a light source for emitting a laser beam aimed at one point of an object to be measured and the light receiving element for receiving a reflected laser beam from the same measuring point, and the laser beam is included. A second measurement optical system having a light source that emits a laser beam that is positioned substantially in a plane and is aimed at another point of the object to be measured that is different from the measurement point, and a light receiving element that receives the laser beam; The two-position measuring device according to claim 1, wherein:
走査ビームを出射するレーザ光源及び受光素子を含んだ
前記第１測定光学系と、前記被測定物を挟んだ状態で同
第１測定光学系と略同一の平面内におかれて前記レーザ
光源とは別の波長の測定用平行走査ビームを出射するレ
ーザ光源及びこれを受光する受光素子とを含んだ前記第
２測定光学系とを備えることを特徴とする請求項１記載
の長さ測定装置。3. The first measuring optical system including a laser light source and a light receiving element which emits a parallel scanning beam for measurement opposed to each other with an object to be measured interposed therebetween, and the first measurement optical system including the light receiving element with the first object being interposed therebetween. The second measurement optical system including a laser light source that emits a parallel scanning beam for measurement having a wavelength different from that of the laser light source and that is located in substantially the same plane as the measurement optical system, and a light receiving element that receives the laser light source; The length measuring device according to claim 1, further comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1633398A JPH11201729A (en) | 1998-01-12 | 1998-01-12 | Optical measuring device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1633398A JPH11201729A (en) | 1998-01-12 | 1998-01-12 | Optical measuring device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11201729A true JPH11201729A (en) | 1999-07-30 |
Family
ID=11913518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1633398A Pending JPH11201729A (en) | 1998-01-12 | 1998-01-12 | Optical measuring device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11201729A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010507089A (en) * | 2006-10-18 | 2010-03-04 | バルティオン テクニリーネン トゥトキムスケスクス | Determination of surface and thickness |
| JP2011106896A (en) * | 2009-11-16 | 2011-06-02 | Mitsutoyo Corp | Non-contact probe and measuring machine |
| JP2017173148A (en) * | 2016-03-24 | 2017-09-28 | 住友電気工業株式会社 | Optical fiber inspection apparatus and optical fiber manufacturing apparatus |
-
1998
- 1998-01-12 JP JP1633398A patent/JPH11201729A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010507089A (en) * | 2006-10-18 | 2010-03-04 | バルティオン テクニリーネン トゥトキムスケスクス | Determination of surface and thickness |
| JP2011106896A (en) * | 2009-11-16 | 2011-06-02 | Mitsutoyo Corp | Non-contact probe and measuring machine |
| US8704154B2 (en) | 2009-11-16 | 2014-04-22 | Mitutoyo Corporation | Non-contact probe with an optical filter and measuring machine including the same |
| JP2017173148A (en) * | 2016-03-24 | 2017-09-28 | 住友電気工業株式会社 | Optical fiber inspection apparatus and optical fiber manufacturing apparatus |
| WO2017164402A1 (en) * | 2016-03-24 | 2017-09-28 | 住友電気工業株式会社 | Optical fiber testing device, optical fiber manufacturing device, optical fiber testing method, and optical fiber manufacturing method |
| CN108885182A (en) * | 2016-03-24 | 2018-11-23 | 住友电气工业株式会社 | The manufacturing method of optical fiber inspection device, fiber fabrication apparatus, the inspection method of optical fiber and optical fiber |
| US10551307B2 (en) | 2016-03-24 | 2020-02-04 | Sumitomo Electric Industries, Ltd. | Optical fiber inspecting device, optical fiber manufacturing apparatus, method for inspecting optical fiber, and method for manufacturing optical fiber |
| US11022549B2 (en) | 2016-03-24 | 2021-06-01 | Sumitomo Electric Industries, Ltd. | Optical fiber inspecting device, optical fiber manufacturing apparatus, method for inspecting optical fiber, and method for manufacturing optical fiber |
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