JPH11193493A - Nickel-less plated product - Google Patents

Nickel-less plated product

Info

Publication number
JPH11193493A
JPH11193493A JP36877297A JP36877297A JPH11193493A JP H11193493 A JPH11193493 A JP H11193493A JP 36877297 A JP36877297 A JP 36877297A JP 36877297 A JP36877297 A JP 36877297A JP H11193493 A JPH11193493 A JP H11193493A
Authority
JP
Japan
Prior art keywords
plating
thickness
plating layer
nickel
layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP36877297A
Other languages
Japanese (ja)
Inventor
Eizo Takamatsu
英三 高松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TAKAMATSU MEKKI KOGYO KK
Original Assignee
TAKAMATSU MEKKI KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by TAKAMATSU MEKKI KOGYO KK filed Critical TAKAMATSU MEKKI KOGYO KK
Priority to JP36877297A priority Critical patent/JPH11193493A/en
Publication of JPH11193493A publication Critical patent/JPH11193493A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To cover the defects such as flaws of the ground and to prevent the cracking of a finish plating and the corrosion of a substrate plating by forming an Ag plating layer of specified thickness as the substrate plating of the ground. SOLUTION: The thickness of the Ag plating layer is controlled to 0.1-30 μm, and an intermediate plating layer consisting of a platinum-group metal selected from Ru, Rh, Pd, Os, Ir and Pt and a finish plating layer are formed thereon to prevent the corrosion and discoloration of the Ag plating layer due to sulfidization, etc. A plating having 0-5 μm thickness and consisting of Au, Au alloy, Cr or Cr alloy is applied as the finish plating layer, however the thickness is increased to >=5 μm in the case of a high-grade article. When the intermediate layer of a platinum-group metal having 1 to 2 μm thickness is formed, a highly corrosion-resistant white plating is used, and the finish plating layer can be omitted. Since the substrate-layer plating is free of nickel, allergy to nickel is not caused by the trinkets, etc.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はニッケルレスメッキ
製品におけるメッキ層構成に係り、特に生地のキズやく
もりなどの欠点を防止し、さらに仕上げメッキ層にクラ
ックや変色がなく、かつ腐食等を生じない下地メッキ層
を有するニッケルレスメッキ製品に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plating layer structure in a nickel-less plated product, and more particularly, to prevent defects such as scratches and clouding of the fabric, and furthermore, there is no crack or discoloration in the finished plating layer and corrosion is generated. Nickel-less plated product having no underlying plating layer.

【0002】[0002]

【従来の技術および発明の解決すべき課題】従来、腕時
計、イヤリング、眼鏡、ネックレス、ペンダント、指輪
などの各種装身具においては、生地のキズ等の欠点を解
消しかつメッキのつきまわりを良好にするために、通常
Cuメッキを施した後、ニッケルを含む下地メッキ層が
施されていたが、近年ニッケルアレルギ防止の見地から
ニッケルに代わる下地メッキ層が用いられており、たと
えばCu−SnやCu−Sn−Zn合金メッキが使用さ
れている。しかしCu−Sn、あるいはCu−Sn−Z
nメッキは内部応力が高いメッキであり、これらを下地
メッキすると仕上げメッキにしばしばクラックが生じ
た。
2. Description of the Related Art Conventionally, in various accessories such as wristwatches, earrings, glasses, necklaces, pendants, rings, etc., it is possible to eliminate defects such as scratches on the fabric and to improve plating coverage. For this reason, an undercoating layer containing nickel is usually applied after Cu plating, but an undercoating layer instead of nickel has been used in recent years from the viewpoint of preventing nickel allergy. For example, Cu-Sn or Cu- Sn-Zn alloy plating is used. However, Cu-Sn or Cu-Sn-Z
The n-plating is a plating having a high internal stress, and when these are base-plated, cracks often occur in the finish plating.

【0003】本発明は、前記の課題を解決するもので、
その目的とするところはニッケルレスメッキ製品におけ
る、生地のキズ等欠点をカバーし、かつ仕上げメッキに
クラックを生じさせない下地メッキを提供すると共に、
かゝる下地メッキの腐食を防止することにある。
[0003] The present invention solves the above problems,
The purpose is to provide a base plating that covers defects such as scratches on the fabric in nickel-less plated products and that does not cause cracks in the finish plating,
An object of the present invention is to prevent the corrosion of the undercoat.

【0004】[0004]

【課題を解決するための手段】前記本発明の課題は指
輪、ネックレス、イヤリング、ペンダント、ブローチ、
腕時計、バンド、眼鏡の如き各種装身具等のメッキ生地
に対して、請求項1記載のAgメッキ層0.1〜30μ
mを下地メッキとして施すことによって達成される。
The object of the present invention is to provide a ring, a necklace, an earring, a pendant, a broach,
An Ag plating layer according to claim 1 for a plating cloth of various accessories such as a wrist watch, a band, and glasses.
This is achieved by applying m as a base plating.

【0005】Agメッキは生地(素材)のキズ等の欠点
をカバ−する下地メッキ層として設けられるが、0.1
μm以下ではその目的が達成されず、またこの下地メッ
キ層に白金族のメッキ等を形成する場合にはこのメッキ
層との密着も悪い。一方Agメッキ層は30μm程度迄
で充分でありこれ以上増大させても効果はそれほど向上
せずコストが高くなる。
[0005] Ag plating is provided as a base plating layer that covers defects such as scratches on the cloth (material).
If the thickness is less than μm, the object cannot be achieved, and when a platinum group plating or the like is formed on the underlying plating layer, adhesion to the plating layer is poor. On the other hand, the thickness of the Ag plating layer is sufficient up to about 30 μm. Even if the thickness is further increased, the effect is not improved so much and the cost increases.

【0006】Agメッキ層は硫化等による腐食により変
性、変色しやすいが、これを防止するために請求項2記
載の本発明においては、請求項1記載の発明においてさ
らにRu、Rh、Pd、Os、IrおよびPtからなる
群より選ばれた白金族金属の0.01〜5μmの白金族
金属の0.01〜5μmの中間メッキ層および仕上げメ
ッキ層が設けられる。
The Ag plating layer is liable to be denatured or discolored by corrosion due to sulfurization or the like, but in order to prevent this, in the present invention according to claim 2, Ru, Rh, Pd, and Os are further added to the invention according to claim 1. , Ir and Pt are provided with an intermediate plating layer and a final plating layer of 0.01 to 5 μm of a platinum group metal of 0.01 to 5 μm of a platinum group metal selected from the group consisting of Ir and Pt.

【0007】前記のように、白金族金属による中間メッ
キはAgメッキ部分の腐食や変色を防止する目的で設け
られるが、0.1μm以下では目的とする効果が充分に
得られない。一方5μm以上では白金族メッキの内部応
力によってメッキが割れやすくなりコストも増大する。
As described above, the intermediate plating of the platinum group metal is provided for the purpose of preventing corrosion and discoloration of the Ag plating portion. However, if the thickness is less than 0.1 μm, the intended effect cannot be sufficiently obtained. On the other hand, when the thickness is 5 μm or more, the plating is easily broken due to the internal stress of the platinum group plating, and the cost increases.

【0008】さらに請求項3記載の本発明においては、
前記請求項2記載の発明において仕上げメッキ層として
0〜5μmのAu、Au合金、CrまたはCr合金から
なるメッキ層が施される。
[0008] Further, in the present invention according to claim 3,
In the invention according to the second aspect, a plating layer made of Au, an Au alloy, Cr or a Cr alloy having a thickness of 0 to 5 μm is applied as a finish plating layer.

【0009】仕上げメッキは耐蝕性や外観の向上のため
に施され、通常は5μm以下で十分な効果が得られる
が、高級品の場合には5μmもしくはそれ以上の厚さと
することもある。尚白金族金属の中間メッキ層を1〜2
μm以上メッキすることによって耐蝕性のよい白色メッ
キで仕上げることもでき、この場合には仕上げメッキ層
を省略することもできる。
The finish plating is applied for the purpose of improving corrosion resistance and appearance, and usually a sufficient effect can be obtained at 5 μm or less. However, in the case of a high-grade product, the thickness may be 5 μm or more. In addition, the intermediate plating layer of platinum group metal is
By plating with a thickness of at least μm, it is possible to finish with white plating having good corrosion resistance. In this case, the finish plating layer can be omitted.

【0010】本発明は前記のような各種装身具の他、リ
ードフレーム等の電子パーツにも用いられ、任意の材料
の生地に適用することができる。生地にピンホールや巣
などがある場合またはプラスチックメッキなどの場合に
は生地に予め銅メッキを施しておくことが好ましい。こ
の場合、銅は生地の程度によって3μm〜50μmメッ
キする。銅メッキを数十μmメッキし、バフ研磨した
後、銀メッキをするとさらにきれいな外観が得られる。
The present invention can be applied to electronic parts such as lead frames in addition to the various accessories described above, and can be applied to fabrics of arbitrary materials. In the case where the cloth has pinholes or nests or in the case of plastic plating, it is preferable that the cloth be plated in advance with copper. In this case, copper is plated at 3 μm to 50 μm depending on the degree of the material. A more beautiful appearance can be obtained by silver plating after tens of μm of copper plating and buffing.

【0011】[0011]

【実施例1】ABS樹脂からなるプラスチック時計ケー
スに常法により銅メッキを15μmの厚さで施した。こ
の銅メッキ層の上に下記組成の銀メッキを5μmの厚さ
でメッキしさらにパラジウムメッキを0.5μmの厚さ
およびクロムメッキを0.25μmの厚さで夫々メッキ
した。
EXAMPLE 1 A plastic watch case made of ABS resin was plated with copper by a conventional method to a thickness of 15 μm. On this copper plating layer, silver plating having the following composition was plated at a thickness of 5 μm, and further, palladium plating was plated at a thickness of 0.5 μm, and chromium plating was plated at a thickness of 0.25 μm.

【0012】 銀メッキ組成 青化銀 40 g/l 青化ソーダ 120 ” 炭酸ソーダ 15 ” 市販光沢剤 4 cc/l 市販硬化剤 10 cc/l 温度 25℃ 電流密度 1 A/dm2 Silver plating composition Silver bluing 40 g / l Sodium bluing 120 “Sodium carbonate 15” Commercial brightener 4 cc / l Commercial curing agent 10 cc / l Temperature 25 ° C. Current density 1 A / dm 2

【0013】このケースは下記組成による24時間の人
工汗テスト、24時間のアンモニア曝気テスト、80℃
の水への30分の浸漬および20℃の水による10分の
急冷テストで変色、クラック等の不良を発生しなかっ
た。
In this case, a 24-hour artificial sweat test, a 24-hour ammonia aeration test, and 80 ° C.
No discoloration, cracks, and other defects were found in a 30 minute immersion in water and a 10 minute quenching test with 20 ° C. water.

【0014】 人工汗組成 食塩 9.9 g/l 硫化ソーダ 0.8 g/l 尿素 1.7 g/l アンモニア水 0.18 cc/l 蔗糖 0.2 g/l 乳酸 1.1 cc/l 蒸留水 全容量 1リットル アンモニアテスト 市販のアンモニア水と水の2:1の混合液を含むデシケ
ータに供試品を入れて曝気した。
Artificial sweat composition Salt 9.9 g / l Sodium sulfide 0.8 g / l Urea 1.7 g / l Ammonia water 0.18 cc / l Sucrose 0.2 g / l Lactic acid 1.1 cc / l Distilled water Total volume 1 liter Ammonia test The test sample was put into a commercially available desiccator containing a 2: 1 mixture of ammonia water and water and aerated.

【0015】[0015]

【実施例2】Znダイキャストによる時計ケースに常法
により銅メッキを20μmの厚さで施した。実施例1で
示した組成の銀メッキを10μmの厚さで施し、さらに
パラジウムをメッキ3μmの厚さでメッキした。この時
計ケースを24時間の人工汗テスト、アンモニア曝気テ
ストを行ったところ、変色、クラックなどの異常はなか
った。
Example 2 A watch case made of Zn die-cast was plated with copper by a conventional method to a thickness of 20 μm. Silver plating having the composition shown in Example 1 was applied to a thickness of 10 μm, and palladium was further applied to a thickness of 3 μm. When the watch case was subjected to a 24-hour artificial sweat test and an ammonia aeration test, no abnormalities such as discoloration and cracks were found.

【0016】[0016]

【比較テスト】実施例2と同様の時計ケースに銀メッキ
の代わりにCu−Snメッキを5μmの厚さで施し、同
様のテストを行ったところ、クラックが発生し、クラッ
ク部分から変色、緑青が発生していた。
[Comparative test] A watch case similar to that in Example 2 was coated with Cu-Sn plating at a thickness of 5 µm instead of silver plating, and a similar test was performed. As a result, cracks were generated. Had occurred.

【0017】[0017]

【実施例3】真鍮からなるネックチェーンに銅メッキを
3μmの厚さ、実施例1と同様な組成による銀メッキを
3μmの厚さで施し、さらに白金メッキを0.5μmお
よび金メッキを3μmの厚さで順次形成した。人工汗テ
スト、アンモニア曝気テストでいずれも異常は発見され
なかった。
EXAMPLE 3 A neck chain made of brass was plated with copper to a thickness of 3 μm, silver plating having the same composition as in Example 1 was applied to a thickness of 3 μm, platinum was plated to a thickness of 0.5 μm, and gold was plated to a thickness of 3 μm. Then, they were sequentially formed. No abnormalities were found in either the artificial sweat test or the ammonia aeration test.

【0018】[0018]

【実施例4】リン青銅でできたリードフレームに前処理
をした後、実施例1で使用した組成で硬化剤を入れない
ものを使用して銀メッキ3μmの厚さで施し、次いで純
パラジウムメッキを0.02μmの厚さでメッキした。
Example 4 After pretreatment of a lead frame made of phosphor bronze, silver plating was applied to a thickness of 3 μm using the same composition as used in Example 1 but without a hardener, followed by pure palladium plating. Was plated with a thickness of 0.02 μm.

【0019】純パラジウムメッキ組成 塩化アンモニウム 50 g/l リン酸二カリ 50 g/l 塩化パラジウム 3 g/l アンモニア水 pH 8.0 このリードフレームを500℃、10分加熱したが、フ
クレ、変色はなかった。ハンダヌレ性も良好であった。
Pure palladium plating composition Ammonium chloride 50 g / l Dipotassium phosphate 50 g / l Palladium chloride 3 g / l Aqueous ammonia pH 8.0 The lead frame was heated at 500 ° C. for 10 minutes. Did not. The solderability was also good.

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 Agメッキ層0.1〜30μmを生地の
下地メッキとして有するニッケルレスメッキ製品
1. A nickel-less plated product having an Ag plating layer of 0.1 to 30 μm as a base plating for a fabric.
【請求項2】 0.1〜30μmのAgメッキ層からな
る下地メッキ層、Ru、Rh、Pd、Os、Irおよび
Ptからなる群より選ばれた白金族金属の0.01〜5
μmの中間メッキ層および仕上げメッキ層よりなるニッ
ケルレスメッキ製品。
2. An underlying plating layer comprising an Ag plating layer having a thickness of 0.1 to 30 μm, and 0.01 to 5 of a platinum group metal selected from the group consisting of Ru, Rh, Pd, Os, Ir and Pt.
Nickel-less plated product consisting of a μm intermediate plating layer and a finish plating layer.
【請求項3】 仕上げメッキ層が0〜5μmのAu、A
u合金、CrまたはCr合金からなる請求項2記載のメ
ッキ層構成。
3. A method according to claim 1, wherein the finish plating layer has a thickness of 0 to 5 μm.
3. The plating layer structure according to claim 2, comprising a u alloy, Cr or a Cr alloy.
JP36877297A 1997-12-29 1997-12-29 Nickel-less plated product Pending JPH11193493A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36877297A JPH11193493A (en) 1997-12-29 1997-12-29 Nickel-less plated product

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36877297A JPH11193493A (en) 1997-12-29 1997-12-29 Nickel-less plated product

Publications (1)

Publication Number Publication Date
JPH11193493A true JPH11193493A (en) 1999-07-21

Family

ID=18492713

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36877297A Pending JPH11193493A (en) 1997-12-29 1997-12-29 Nickel-less plated product

Country Status (1)

Country Link
JP (1) JPH11193493A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303069A (en) * 2005-04-19 2006-11-02 Sumitomo Metal Electronics Devices Inc Package for mounting light emitting element
JP2008231540A (en) * 2007-03-22 2008-10-02 Nikko Kinzoku Kk Metastable austenitic stainless steel strip superior in sulfidization resistance
CN102453932A (en) * 2010-10-25 2012-05-16 北京卫星环境工程研究所 Method for preparing osmium membrane through electroplating

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006303069A (en) * 2005-04-19 2006-11-02 Sumitomo Metal Electronics Devices Inc Package for mounting light emitting element
JP2008231540A (en) * 2007-03-22 2008-10-02 Nikko Kinzoku Kk Metastable austenitic stainless steel strip superior in sulfidization resistance
CN102453932A (en) * 2010-10-25 2012-05-16 北京卫星环境工程研究所 Method for preparing osmium membrane through electroplating

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