JPH11186715A - Semiconductor device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the probability of failure occurrence in a first board, such as short circuit between wirings and wire breaking by providing a second board to be mounted on at least a portion of the first board to prevent outputs of circuit elements on the first board from being processed. SOLUTION: A mother board 1 has FPGA 3 and IC 4 both having output terminals for taking outputs thereof, wirings 3a, 4a led from these terminals to two sets of connector pairs 7a from which outputs can be taken from the circuit elements, but not processed. A sub-board 2a has connectors 8a connected to holes 6 for pins at the lower face, and provides wirings of a conductive ink, etc., for processing outputs as desired to form a wiring circuit net 5 of various resistors, etc. This constitution reduces the failure probability of the mother board such as short circuit between wirings and wire breaking.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor device. More specifically, the present invention relates to a semiconductor device capable of reducing wiring on a motherboard having a circuit element group such as an FPGA.

[0002]

2. Description of the Related Art Conventionally, microprocessors and FPGAs
A printed circuit board on which various circuit elements such as a (field programmable gate array) are mounted is generally used to improve the processing performance of various semiconductor devices. Such a semiconductor device includes a printed board on which a main circuit element group is mounted, a so-called mother board, and a printed board (sub board) provided with circuit elements and mounted on the mother board in order to have various functions. I have it. A desired function can be obtained by selecting a circuit element mounted on the sub-board.

[0003]

However, in the above-mentioned conventional semiconductor device, since the circuit element is provided on the motherboard and the wiring is previously provided from the circuit element, the user changes the wiring. Therefore, there is a problem that there is no versatility such as performing a desired wiring.

[0004] Further, such a motherboard is designed and created because a user performs verification and the like in advance in a development stage and confirms that a desired operation of the user is performed.
The motherboard requires a large number of wirings. However, when the number of wirings increases, the distance between the wirings becomes very short, and there is a problem that a malfunction such as a short circuit occurs.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems, and has as its object to provide a semiconductor device having a versatile motherboard.

Another object of the present invention is to provide a semiconductor device having a reduced probability of malfunction.

[0007]

According to a first aspect of the present invention, which has been made to solve the above-mentioned problems, a first substrate 1 having a circuit element and an output from the circuit element can be taken out. And a second circuit board 2a, 2b mounted on at least a part of the first substrate 1 and a wiring circuit network 5 capable of processing the output to a desired output. 1 is characterized in that the output from the circuit element cannot be processed. As described above, the wiring circuit network capable of processing the output from the first substrate 1 is provided on the second substrates 2a and 2b and not provided on the first substrate, so that the output from the circuit element is extracted on the first substrate. Therefore, it is only necessary to provide a minimum number of wirings necessary for this purpose, so that the distance between the wirings of the first substrate can be kept constant.

[0008] A first substrate 1 having circuit elements, and a wiring network 5 from which outputs from the circuit elements can be taken out, and a second substrate to be mounted on at least a part of the first substrate 1 The second substrate 2a, 2b has a pin hole 6 so that the wiring network of the second substrate 2a, 2b can be selected.
Is formed. Since the pin holes 6 are formed in the second substrate so that the wiring network of the second substrate can be selected as described above, the user can appropriately select the wiring network and change the circuit.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is an exploded perspective view showing one embodiment of the semiconductor device of the present invention. In FIG. 1, reference numeral 1 denotes a first printed circuit board (hereinafter, referred to as a motherboard) as a first substrate on which various circuit elements such as FPGA3 and IC4 are provided, and 2a and 2b denote motherboards 1 and 2, respectively.
2 shows a second printed circuit board (hereinafter, referred to as a sub-board) as a second board that can be connected. FPGA3, I
A circuit element group A is formed from various circuit elements such as C4.

The FPGA provided on the motherboard 1
The output terminals 3 and IC4 are provided with output terminals for extracting their outputs, respectively, and the wirings 3a and 4a are drawn out onto the motherboard 1 from the output terminals.

The wires 3a and 4a have a pair of connectors.
7a, 7a are connected in two sets, so that the output from the circuit element can be taken out from the connectors 7a, 7a. It should be noted that the connectors 7a, 7a are paired with those located on the left and right in FIG. That is, the motherboard 1 is configured so that the output from the circuit element can be extracted but cannot be processed.

A pin hole 6 for inserting a pin (not shown) is formed through the sub board 2a in the thickness direction of the sub board 2a, and the pin hole 6 is formed on the lower surface of the sub board 2a. A connector 8a is formed. Also, a wiring of conductive ink or the like is provided so as to connect a desired pin hole 6 and process the output to a user's desired one via a resistor or the like, and process the wiring and the output. A wiring network 5 is formed from various resistors and the like as components. Then, the motherboard 1 and the sub-board 2a connect the connectors 7a, 7a,
They are detachably connected to each other via 8a, 8a.

In this embodiment, the connector is mounted vertically so that the motherboard 1 and the sub-board 2 can be connected vertically in FIG. 1, but the connector connects the motherboard 1 and the sub-board 2a in the horizontal direction. It may be attached so that it can be done.

If the connector is mounted so that the motherboard and the sub-board are connected in the vertical direction, the required distance between the wiring network of the sub-board and the motherboard is shortened. Therefore, there is an advantage that the effect of reducing the electric loss can be obtained and the semiconductor device including the motherboard and the sub-board can be formed relatively small.

On the other hand, if the connector is connected in the horizontal direction,
Although the semiconductor device including the motherboard and the sub-board becomes large in size, the thickness in the vertical direction can be reduced.

In the above description, only the sub-board 2a has been described. However, similarly to the sub-board 2a, the sub-board 2b is formed with the pin holes 6 and the wiring, and processes the wiring and the output from the motherboard 1. A wiring circuit network 5 is formed from various resistors and the like as components. Further, on the lower surface of the sub board 2b, two pairs of connectors 8a, 8a are provided,
The connectors 2a, 2a are connected to the pin holes 6.

The motherboard 1 has a circuit element group A
Similarly, a circuit element group B composed of an FPGA, an IC, and the like is provided, and a pair of connectors 7b, 7b connected to the circuit elements of the circuit element group are provided on the upper side of the motherboard 1, that is, on the front side. A set is provided. Two sets of the connector
The motherboard 1 and the sub-board 2b are connected to each other via connectors 7b and 7b and connectors 8b and 8b provided on the sub-board 2b.

As described above, on the motherboard, only the wiring for drawing out the output from the circuit elements constituting the circuit element groups A and B is formed with conductive ink or the like so that the output cannot be processed. By forming a wiring circuit network having various resistors and wirings so that the output can be processed, a large number of wirings are not required on the motherboard. Therefore, the probability of occurrence of a failure of the motherboard such as a short circuit between the wirings due to a short distance between the wirings or a disconnection caused by the thinning of the wirings can be significantly reduced.

Further, by forming the wiring forming the circuit network on the sub-board, the sub-board and the mother board are connected without changing the mother board only by changing the circuit network on the sub-board. The whole semiconductor device can be changed. Therefore, unlike the case where a circuit network is mounted on a motherboard, the entire circuit of the semiconductor device can be easily changed at low cost without incurring a high cost due to the change of the circuit network.

Further, by forming the pin holes on the sub-board, the user can appropriately select the pin holes and connect the wires with the pins, thereby increasing the versatility of performing the desired wiring. The effect that can be provided is also obtained.

In the above embodiment, the sub-board as the second substrate is connected to the motherboard as the first substrate. However, the motherboard as the first substrate is connected to the sub-board as the second substrate. It may be configured as follows. In short, the arrangement of the first substrate and the second substrate is not limited as long as the semiconductor device has a first substrate on which an IC or the like can be mounted and a second substrate having only wiring.

However, if the first substrate and the second substrate are arranged in the up and down direction (whichever substrate may be on the upper side) as in the above-described embodiment, the distance between the substrates is small, so that the connection This is preferable because the resistance is small.

In the above-described embodiment, the number of the second substrates is two and the number of the first substrates is one. However, the numbers of the first substrates and the second substrates are not limited. It can be changed as appropriate.

[0024]

According to the semiconductor device of the present invention, a wiring network capable of processing the output from the first substrate is provided on the second substrate and not provided on the first substrate. It is only necessary to provide a minimum number of wires necessary for taking out the output from the element, and therefore, the distance between the wires on the first substrate can be kept constant. As a result, it is possible to reduce the probability of occurrence of a failure of the first substrate, such as short-circuiting due to the distance between the wirings being too short or disconnection due to thinning of the wirings.

Further, since the pin holes are formed in the second substrate so that the wiring network of the second substrate can be selected, the user can appropriately select the wiring network and change the circuit. . Therefore, versatility can be given to the semiconductor device.

[Brief description of the drawings]

FIG. 1 is a perspective view showing one embodiment of a semiconductor device of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Motherboard 2a, 2b Sub-board 5 Wiring circuit network 6 Pin hole

Claims (2)

[Claims] A first substrate provided with a circuit element, and a wiring network capable of extracting an output from the circuit element and processing the output into a desired output; The second substrate (2a, 2a) mounted on at least a part of the first substrate (1)
b) wherein the first substrate (1) cannot process the output from the circuit element. 2. A first substrate (1) having circuit elements, and a wiring network (5) capable of extracting an output from the circuit elements.
And a second substrate is provided to be mounted on at least a part of the first substrate (1), and the second substrate (2a, 2b)
2nd board (2a, 2b) so that the wiring network (5) of
A semiconductor device characterized in that a pin hole (6) is formed in the semiconductor device.