JPH11186484A - Optical link device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress influence of noise electromagnetically induced between transmission and reception sides of an optical link device. SOLUTION: An optical module Rx for reception is constituted by connecting a first molded resin section 40 molding a light receiving element to a second molded resin section 42 molding an electronic element through inner lead pins 28a-28d, which are bent in hook-like shapes projecting downward, and an optical module Tx for transmission is constituted by connecting a first molded resin section 68 molding a light emitting element to a second molded resin section 70 molding an electronic element through inner lead pins 56a and 56b, which are bent in hook-like shapes projecting upward. An optical link device is completed when the modules Rx and Tx are mounted on an alignment substrate 96 and the substrate 96 is incorporated in an enclosure. Since the lead pins 28a-28d and 56a and 56b are not faced oppositely to each other in the enclosure, the influence of electromagnetically induced noise can be suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical link apparatus for transmitting and receiving an optical signal, and more particularly, to an optical link apparatus which enables high-quality transmission and reception while suppressing the influence of electromagnetic induction noise between the transmission and reception. It is about.

[0002]

2. Description of the Related Art As shown in FIG. 13, a conventional optical link device has a metal connector 2a in which a light emitting element is sealed, a metal connector 2b in which a light receiving element is sealed, and an electronic circuit mounted in advance. The hybrid IC substrates 4 and 6 are mounted on the same lead frame LF, and the light emitting element, the light receiving element, and the lead frame LF are molded with the opaque resin 8 so that the transmitting unit Tx and the receiving unit Rx are integrated. Is known.

[0003] At the bottom of the metal connector 2a,
A metal projection 10a electrically connected to the light emitting element and a metal projection 10b electrically connected to the light receiving element are provided on the bottom of the metal connector 2b. These metal projections 1
A plurality of bonding wires 12a, 12b are connected between the electronic circuits 0a, 10b and the electronic circuits on the hybrid IC substrates 4, 6.
Further, the electronic circuit and the plurality of external lead pins 14 of the lead frame LF are connected by bonding wires 16a and 16b, and are molded with the resin. The metal connectors 2a and 2b have a function as a so-called sleeve for receiving a communication optical fiber.

[0004]

However, the conventional optical link device has the following problems. That is, since the transmitting unit Tx switches a large current for driving the light emitting element, the electromagnetic induction noise generated due to the switching is reduced by the receiving unit Rx that handles a small signal.
And lowers the minimum input sensitivity.

In a typical optical link device, the input signal strength is as small as several mV in terms of voltage. If the transmitting unit and the receiving unit are arranged close to each other for downsizing the optical link device, the influence of the electromagnetic induction noise has become a more serious problem.

In order to suppress the influence of the electromagnetic induction noise,
In the above-described conventional optical link device, the bonding pads of the bonding wires 12a and 12b are surrounded by the one ends 18a and 18b of the lead frame LF set to the ground potential, and furthermore, the shield for the bridge extended between the one ends 18a and 18b. A structure is adopted in which the bonding wires 12a and 12b are shielded by surrounding the bonding wires 12a and 12b with the bonding wires 20a and 20b.

However, in order to obtain a good shielding effect, it is necessary to extend a large number (for example, five or more) of the bonding wires 20a and 20b for shielding. In particular, a metal connector 2a on the transmitting unit Tx side that generates electromagnetic induction noise, and a metal protrusion 10a provided on the metal connector 2a,
It was necessary to stretch the entire area of the bonding wire 12a so as to surround it with the shielding bonding wire 20a. In addition, bonding a large number of shield bonding wires 12a over such a complicated range has the problem of inefficiency in the manufacturing process without manual intervention.

The present invention has been made in view of such a problem of the conventional optical link device, and suppresses the influence of electromagnetic induction noise between transmission and reception by a simple structure, thereby enabling high-quality transmission and reception. An object of the present invention is to provide an optical link device.

[0009]

According to the present invention, there is provided a first optical module having a light receiving element for receiving an optical signal, converting the electrical signal into an electrical signal, and outputting the electrical signal. An optical link device comprising a second optical module having a light-emitting element for inputting, converting the optical signal into an optical signal, and transmitting the optical signal, wherein the first optical module and the second optical module are configured independently. Each module has an optical element mounting section for mounting each of the optical elements, an electronic element mounting section for mounting an electric circuit, and an internal lead pin for electrically connecting the optical element mounting section and the electronic element mounting section. A lead frame having an external lead pin electrically connected to the electronic element mounting portion, wherein the internal lead pin of the first optical module and the internal lead pin of the second optical module are substantially hooked in opposite directions to each other. By bending the Jo, and a shape which does not face each other in the housing body.

Further, each of the external lead pins of the first and second optical modules is bent in a direction substantially perpendicular to an electronic element mounting surface of each electronic element mounting portion and in directions opposite to each other. .

[0011]

In the optical link device according to the present invention, the internal lead pins of the first optical module and the second optical module are bent in a substantially hook shape in directions opposite to each other. For this reason, when the first and second optical modules are arranged side by side in the housing with the respective optical element mounting portions oriented in the same direction, the internal lead pins do not face each other and are separated from each other. . As described above, since the internal lead pins do not face each other and are spaced apart from each other, even when the first and second optical modules are arranged close to each other in the housing, the electromagnetic induction noise between these optical modules is reduced. Is suppressed.

Further, each of the external lead pins of the first and second optical modules is bent in the opposite direction to the respective electronic element mounting portions. Therefore, when the external lead pins are mounted in the housing with the same orientation, the electronic lead mounted on the electronic element mounting part of the first optical module and the electronic element mounted on the electronic element mounting part of the second optical module are mounted. The electronic element is located on the opposite side via the respective electronic element mounting portions, so that a part of the lead frame set to the ground potential is interposed between the electronic elements of each optical module. Thus, a shielding effect is exhibited.

[0013] The first and second optical modules independent of each other are incorporated in the housing. As a result, the power supply line and the ground line of each lead frame are electrically separated from each other, and the influence of noise such as surge and ripple between both optical modules can be avoided.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS (First Embodiment) A first embodiment of the optical link device according to the present invention will be described with reference to FIGS. First, the structures of the receiving optical module and the transmitting optical module, which are the components of the optical link device, will be described together with the manufacturing process.

FIG. 1 shows the shape of a lead frame for manufacturing a receiving optical module Rx. The lead frame 22 is formed by etching a copper thin plate having a thickness of about 0.2 mm to form an optical element mounting part 24 for mounting a light receiving element and an electronic element mounting part for mounting an electronic circuit. 26, four internal lead pins 28a to 28d for electrically and mechanically connecting the optical element mounting part 24 and the electronic element mounting part 26, and seven internal lead pins 28 provided on both sides of the electronic element mounting part 26. External lead pins 30a-10
g, 32a to 32g are formed, and the surfaces of the optical element mounting part 24 and the electronic element mounting part 26 are silver-plated.
At a predetermined position of the lead frame 22, a plurality of fitting holes 34a for aligning a resin molding die described later are provided.
~ 34d are drilled.

FIG. 1 shows a lead frame corresponding to one receiving optical module as a representative, but in practice, a lead frame of the shape shown in the figure is formed continuously on a strip-shaped copper thin plate. And are automatically transported on the production line.

The lead frame 22 is conveyed to a predetermined position on a production line, and a submount member 36 as an auxiliary member is fixed substantially at the center of the optical element mounting portion 24. Then, a bare chip is formed on the submount member 36. The light receiving element 38 as it is is fixed. As the submount member 36,
A light receiving element 38 is used in which a metal wiring pattern is formed on the front and back surfaces of an insulating material such as aluminum nitride (AlN) or a parallel-type capacitor (die cap).
Is mounted on the metal wiring pattern on the front surface side or on one electrode of the die cap, whereby the optical element mounting portion 2 is mounted.
4 is capacitively coupled.

A bonding wire (not shown) is provided between the light receiving element 38 and the internal lead pins 28b-28c.
Connect with. The internal lead pins 28a and 28d are used for power and ground lines, and the internal lead pins 28b and 28c are used for signal lines, thereby shielding the signal lines and improving noise resistance.

As the light receiving element 38, an InGaAs photodiode or the like having a sensitivity to a wavelength in the 1.3 μm band is used. A simple condenser lens LN is formed. Further, the electronic element mounting section 26
Above, as an electronic element, a preamplifier and a May amplifier for amplifying a photoelectric conversion signal output from the light receiving element 38, a coupling capacitor for coupling between stages,
Equipped with power supply bypass capacitor, resistor, etc. And
Predetermined electronic devices and external lead pins 30a to 30g, 32
a to 32g bonding wire (not shown)
To make an electrical connection.

The light receiving element 38 is mounted on the optical element mounting section 24.
In addition, the preamplifier may be mounted together. In this case, the electronic element excluding the preamplifier is mounted on the electronic element mounting unit 26. As described above, when the light receiving element 38 and the preamplifier are mounted on the optical element mounting section 24, the path of the small signal output from the light receiving element 38 to the preamplifier can be shortened. The effect of electromagnetic induction noise can be reduced.

The lead frame 22 on which the light receiving element 38 and the electronic element are mounted is transported to a resin molding die having a predetermined shape, and is positioned through the fitting holes 34a to 34d. Then, the optical element mounting section 24 and the electronic element mounting section 36 are individually resin-sealed (transfer molded). Thereby, the first resin molded part 40 for integrally sealing the optical element mounting part 24, the submount member 36, and the light receiving element 38, and the second resin for integrally sealing the electronic element mounting part 36 and the electronic element. The molding part 42 is molded (see FIG. 2).

In order to improve the production efficiency, it is preferable to mold the first and second resin molded portions 40 and 42 with the same transparent resin. However, the first resin molded portion 40 is made of a transparent resin. The second resin mounting portion 42 may be molded with an opaque resin.

In FIG. 2, the first resin molded part 40 is
It has a base 44, a truncated cone-shaped base 46, and an aspheric lens 48 integrally formed on the top of the base 46, and the optical main surface (light receiving surface) of the aspheric lens 48 and the light receiving element 38. )
And the optical axes of the condenser lens LN coincide with each other.

The base 46 is concentric with the optical axis of the aspherical lens 48, the light receiving element 38 and the condenser lens LN, and gradually becomes thinner toward the top.
It has a tapered side surface having a predetermined inclination angle and a truncated cone having a predetermined height.

FIG. 2 shows a case where the outer shape of the base 44 is a rectangular parallelepiped. However, the outer shape of the base 44 may be a conical shape or a cylindrical shape connected to the base 46. As described above, when the outer shape of the base 44 is a conical shape or a cylindrical shape, when the base portion 46 and the sleeve 82 are fixed by the UV curable resin RS described later, the UV curable resin RS is uniformly solidified. The effect that it can be performed is obtained.

After molding the first and second resin molded portions 40 and 42, unnecessary parts of the lead frame 22 are cut and removed to form an intermediate part as shown in FIG. Further, by bending the inner lead pins 28a to 28d and the outer lead pins 30a to 30g and 32a to 32g, as shown in FIGS.
In addition, a DIP (dual in-line package) type receiving optical module Rx in which the aspheric lens 48 is directed to the opposite side to the second resin molded portion 42 is formed.

FIG. 3A is a perspective view of the completed receiving optical module Rx viewed obliquely from the first resin mounting portion 40, and FIG. 3B is a view of the receiving optical module Rx. It is a side view.

Here, as shown in FIG. 3 (b), the portion of the internal lead pins 28a to 28d, which is in the immediate vicinity of the second resin molded portion 42, is bent downward (inward) at approximately 95 °, and the approximately central portion is approximately 95%. Bend to the opposite side (outside) at 1 °
The inner lead pins 28a to 28d are formed in a hook shape by bending the portion immediately near the upper portion 0 upward at about 90 °. The external lead pins 30a to 30g and 32a to 32g are bent so as to be substantially perpendicular to the mounting surface of the electronic element mounting portion 26 and to substantially hang down on the side on which the electronic element is mounted.

As described above, the internal lead pins 28a to 28d
When the external lead pins 30a to 30g and 32a to 32g are subjected to bending processing, when the external lead pins 30a to 30g and 32a to 32g are
The electronic element mounted on the electronic element mounting portion 26 is located below the lead frame. Further, an intermediate portion between the internal lead pins 28a to 28d is horizontal.

The receiving optical module Rx operates by supplying power to a predetermined one of the external lead pins 30a to 30g and 32a to 32g, and the light receiving element 38 in the first resin molded part 40 is operated. The electric signal output from the second through the internal lead pins 28b and 28c
The signal is input to an electronic circuit in the resin molding section 42 for signal processing and output from another external lead pin.

Next, with reference to FIGS. 4 to 6, the structure of a transmitting optical module that converts an electric signal into an optical signal and sends it out into an optical fiber will be described together with the manufacturing process.

FIG. 4 shows the shape of a lead frame for manufacturing the transmitting optical module Tx. The lead frame 50 is formed by etching a copper thin plate having a thickness of about 0.2 mm to form an optical element mounting portion 52 for mounting a light emitting element, which is an optical device, and an electronic device for mounting an electronic circuit. Device mounting portion 54 and optical device mounting portion 5
Two internal lead pins 56a and 56b for electrically and mechanically connecting the electronic device mounting portion 54 to the electronic device mounting portion 54, and seven external lead pins 58a to 58g and 60a provided on both sides of the electronic device mounting portion 54, respectively. Ｇ60 g are formed, and the surfaces of the optical element mounting portion 52 and the electronic element mounting portion 54 are plated with silver. At a predetermined position of the lead frame 50,
A plurality of fitting holes 62a to 62d are provided for alignment with a resin molding die described later.

Although FIG. 4 shows a lead frame corresponding to one transmission optical module as a representative, in actuality, a lead frame having the shape shown in the drawing is formed on a strip-shaped copper thin plate. And are automatically conveyed on the production line.

The lead frame 50 is conveyed to a predetermined position on the production line, and a sub-mount member 64 is fixed on the optical element mounting portion 52 in the same manner as the receiving optical module Rx. The light emitting element 66 in the form described above is fixed.

The light emitting element 66 is a surface emitting type InGaAsP light emitting diode that emits an optical signal in the 1.3 μm band,
A surface-emitting type InGaAs laser diode is used, and an etching process or the like is performed on an insulating layer on a light-emitting surface in a semiconductor manufacturing process, so that a minute condenser lens L is previously formed.
N ′ is formed.

Further, on the electronic element mounting portion 54, a buffer formed as an IC for supplying an electric signal to the light emitting element 66 as an electronic element, a coupling capacitor for coupling between stages, a power supply bypass capacitor, a resistor, and the like are mounted. After doing
Electronic device and external lead pins 58a to 58g, 60a to 6
0 g is electrically connected by a bonding wire.

The lead frame 50 on which the light emitting element 66 and the electronic element are mounted is transported to a mold for resin molding, and the mold having a predetermined shape and the lead frame 50 are fitted into the fitting holes 62a to 62a.
After positioning via 2d, the optical element mounting portion 52 and the electronic element mounting portion 54 are individually resin-sealed (transfer molded) with a resin transparent to an optical signal. This allows
A first resin molded part 68 that integrally seals the optical element mounting part 52, the submount member 64, and the light emitting element 66, and a second resin molded part 70 that integrally seals the electronic element mounting part 54 and the electronic element. Mold (see FIG. 5). In order to improve the manufacturing efficiency, it is preferable to mold the first and second resin molded portions 68 and 70 with the same transparent resin. However, the first resin molded portion 68 is molded with a transparent resin. The second resin mounting section 70 may be molded with an opaque resin.

In FIG. 5, the first resin molded part 68
It has a base 72, a truncated cone-shaped base 74, and an aspheric lens 76 integrally formed on the top of the base 74, and the optical axes of the aspheric lens 76, the light emitting element 66, and the condenser lens LN ′ are Match. The base 74 is concentric with the optical axis of the aspheric lens 76, the light emitting element 66, and the condensing lens LN ', and has a tapered side surface having a predetermined inclination angle that gradually becomes thinner toward the apex and a predetermined surface. It is a truncated cone with a height.

Although FIG. 5 shows a case where the outer shape of the base 72 is a rectangular parallelepiped, the outer shape may be a conical shape or a cylindrical shape connected to the pedestal 74. As described above, when the outer shape of the base 72 is formed into a conical shape or a cylindrical shape, when the base portion 46 and the sleeve 82 are fixed to each other with the UV curable resin RS described later, the UV curable resin RS is uniformly solidified. The effect that it can be performed is obtained.

Further, a concave portion 7 exposing a predetermined region of the electronic element mounting portion 54 is formed at an upper end portion of the second resin molded portion 70.
8,80 are provided. A small variable resistor or the like connected to the mounted electronic element and finely adjusting the drive current to the light emitting element 66 is accommodated in the concave portion 78.
0 is provided for measuring the potential of a predetermined pattern of the lead frame with a probe pin at the time of this fine adjustment.

As described above, the first and second resin molded portions 68,
After molding 70 and mounting a variable resistor or the like in the concave portion 78 and electrically connecting it to the electronic element, unnecessary portions of the lead frame 50 are cut and removed, so that an intermediate portion as shown in FIG. Form the part.

Further, by bending the internal lead pins 56a and 56b and the external lead pins 58a to 58g and 60a to 60g, as shown in FIG. A transmission optical module Tx of a DIP (dual in-line package) type facing the opposite side to 70 is formed. FIG.
FIG. 6A is a perspective view of the completed transmission optical module Tx viewed obliquely from the front of the first resin mounting portion 68, FIG.
(B) is a side view of the optical module for transmission Tx.

Here, as shown in FIG. 6B, the portions of the internal lead pins 56a and 56b immediately adjacent to the second resin molded portion 70 are bent upward at approximately 95 °, and the substantially central portions are approximately 95 °.
Then, the inner lead pins 56a and 56b are formed in a hook shape by bending the first resin molded portion 68 in the opposite direction (outside) downward at about 90 °. The external lead pins 58a to 58g and 60a to 60g are bent so as to be substantially perpendicular to the mounting surface of the electronic element mounting portion 54 and to hang down substantially to the side where the electronic element is not mounted.

As described above, the internal lead pins 56a, 56b
When the external lead pins 58a to 58g and 60a to 60g are subjected to bending processing, when the external lead pins 58a to 58g and 60a to 60g
The electronic element mounted on the electronic element mounting portion 54 is located above the lead frame. Further, an intermediate portion between the internal lead pins 56a and 56b becomes horizontal.

The transmission optical module Tx operates by supplying power to a predetermined one of the external lead pins 58a to 58g and 60a to 60g. When an electric signal is applied to another external lead pin, the transmission optical module Tx is activated. The power is amplified by an electronic element mounted in the second resin molded part 70 and supplied to the light emitting element 66 in the first resin molded part 68 through the internal lead pins 56a and 56b,
An optical signal corresponding to the electric signal is emitted.

As described above, the receiving optical module Rx and the transmitting optical module Tx are formed by the first resin molded portions 40 and 68.
And the second resin molded portions 42 and 70 are separated from each other, and internal lead pins 28a to 28d and 56
Since it has an integrated structure connected by a and 56b, it has excellent mechanical strength, good optical accuracy, excellent applicability when applied to various communication devices, and has excellent effects such as low cost. I do.

Next, the structure of an optical link device using these receiving optical module Rx and transmitting optical module Tx will be described with reference to FIGS.

In FIGS. 7A and 7B, the first optical module Rx and the first optical module Tx provided in the transmission optical module Tx are provided.
A sleeve 82 for fitting a ferrule receiving an optical fiber is fixed to each of the resin molded portions 40 and 68 using an ultraviolet curable resin RS.

The sleeve 82 is a cylindrical member molded of an opaque resin, and is used to fit the fitting hole 84 for fitting the ferrule from the front end side and the bases 46 and 74 from the rear end side. And a communication hole 88 communicating between the fitting insertion hole 84 and the fitting hole 86, and a flange portion 90 is formed at a predetermined position on the outer peripheral portion.

The inner peripheral surfaces of these holes 84, 86, 88
When the ferrule receiving the multimode optical fiber is inserted into the insertion hole 84, the optical axis Q of the multimode optical fiber is designed in advance.
The fitting hole 86 has a frusto-conical inner peripheral surface matched with the tapered surfaces of the pedestals 46 and 74, an annular convex portion 86a, and a concave annular resin reservoir 86b. Further, the large diameter through hole 84 and the smaller diameter communication hole 88 form a stepped portion 92 for bringing the tip of the ferrule into contact with the boundary between them.

Next, the base 46 of the receiving optical module Rx
The ultraviolet curable resin RS is applied to the tapered surface of the transmission optical module Tx and the tapered surface of the base 74 of the transmission optical module Tx, and the bases 46 and 74 are fitted into the fitting holes 86 to irradiate the ultraviolet curable resin RS with ultraviolet rays. Thus, the sleeve 82 is fixed to each of the first resin molded portions 40 and 68. Further, in this fixing step,
The adjusting ferrule 94 receiving the multi-mode optical fiber is inserted into the insertion hole 84 of the sleeve 82, and the optical modules Rx and Tx are actually operated. The alignment of the optical axes with Rx and Tx and the adjustment of the distance between the axes are also performed simultaneously.

Here, when the pedestals 46 and 74 are fitted into the fitting holes 86, the ultraviolet curable resin RS is turned into the annular convex portions 86a.
Is stopped by the resin pool 86b, and therefore does not adhere to the aspheric lenses 48 and 76. Further, in order to cope with a change in the shape of the aspherical lenses 48 and 76 due to a variation in shrinkage during molding of the first resin molded portions 40 and 68, three-axis alignment is performed. Furthermore, after the sleeve 82 is once fixed, it is reinforced with a thermosetting resin, so that the optimum alignment state is maintained as it is. Therefore, during the subsequent manufacturing process and the like, there is no occurrence of optical axis shift and the like, and an extremely high-precision optical coupling structure free of maintenance is realized.

Next, in FIG. 8, a plurality of rows of through-hole groups 96a to 96d provided at predetermined positions on a rectangular alignment substrate 96 molded of glass epoxy resin or the like are shown.
External lead pins 30a to 30 of receiving optical module Rx
g, 32a to 32g, and external lead pins 58a to 58g, 60a to 60g of the optical module for transmission Tx, which are integrated by inserting them, and as shown in FIG.
Inside a shell-shaped housing 98 molded of opaque resin,
The alignment board 96 is assembled so as to house the receiving optical module Rx and the transmitting optical module Tx.

Here, the housing 98 has a plurality of engaging projections 100 projecting inward, and these engaging projections 10.
A plurality of steps (not shown) provided slightly deeper than 0
The receiving optical module Rx and the transmitting optical module Tx can be mounted in the housing 98 simply by fitting the side end of the alignment board 96 between the engagement protrusion 100 and the step. The structure is such that it can be automatically accommodated in the rear position and the alignment board 96 can be integrated with the housing 98.

Further, the housing 98 has openings 102 and 104 for inserting a ferrule provided at a front position, and a sleeve mounting chamber 10 extending rearward from the openings 102 and 104.
6, 108 are formed, and the sleeves 82, 82 are automatically turned toward the openings 102, 104 by simply assembling the alignment substrate 96.
108.

Next, the two sleeves 82 sandwiching the respective sleeves 82
A resin-molded engaging member 112 having a pair of sandwiching pieces 110a and 110b is assembled on the sleeve mounting chambers 106 and 108 in connection with the alignment substrate 96, so that the respective sleeves 82 and 82 are more firmly attached to the casing 98. Fix inside.
In addition, by fitting a pair of engagement protrusions 114 and 116 protruding from both side ends of the engagement member 112 into a pair of engagement holes 118 and 118 formed in the side wall of the housing 98, the engagement member 112 is configured to be automatically assembled to the housing 98.

Next, the rectangular flat plate 120 is
The optical link device is completed by assembling the housing 98 so as to cover the a and 110b and the respective sleeves 82, 82. The rectangular flat plate 120 can be formed simply by fitting a pair of engaging projections 122, 122 protruding from both side ends of the rectangular flat plate 120 into a pair of engaging holes 124, 124 formed in the side wall of the housing 98. Can be automatically assembled to the housing 98. The alignment board 96, the engagement member 112, and the rectangular flat plate 120 are attached to the housing 9
8 also functions as a bottom plate that covers the back side.

As described above, in the optical link device of this embodiment, the receiving optical module Rx and the transmitting optical module Tx
Each of the internal lead pins x is bent in a substantially hook shape in the opposite direction to each other. For this reason, when the respective optical element mounting portions are oriented in the same direction and arranged side by side in the housing, the internal lead pins do not face each other and are separated from each other.
As described above, since the internal lead pins do not face each other and are separated from each other, even if electromagnetic induction noise is generated due to a switching current for driving the light emitting element in the optical module for transmission Tx, even if the electromagnetic induction noise is generated, the signal is not received. The influence on the optical module Rx can be suppressed. Conversely, it is possible to suppress the influence of electromagnetic induction noise from the receiving optical module Rx to the transmitting optical module Tx. Furthermore, even when the receiving optical module Rx and the transmitting optical module Tx are arranged close to each other in a housing, the influence of electromagnetic induction noise between them can be suppressed.

In the receiving optical module Rx, FIG.
As shown in (b), the electronic element is located below the electronic element mounting portion 26, and the external lead pins 30a to 30g, 32a
6B, the electronic element is located above the electronic element mounting portion 54 in the optical module for transmission Tx, as shown in FIG. 6B, and the external lead pins 30a to 30g are bent. , 32a to 32g are bent downward, so that the external lead pins of the receiving optical module Rx and the transmitting optical module Tx are connected to the respective electronic element mounting portions 26, based on the mounting positions of the respective electronic elements. 54 is bent in the opposite direction.

For this reason, when the respective external lead pins are mounted in the housing 98 in the same direction, the electronic elements of the optical modules Rx and Tx are mounted on the respective electronic element mounting sections 2.
6 and 54, the lead frame portion set to the ground potential is interposed between the electronic elements of the optical modules Rx and Tx, thereby providing good shielding. The effect is exhibited.

Further, since the transmitting optical module Rx and the receiving optical module Tx which are independent from each other are incorporated in the housing 98, the power supply line and the ground line of each lead frame are electrically separated from each other. The influence of noise such as surge and ripple between Tx can be avoided.

(Second Embodiment) Next, FIGS.
The second embodiment of the optical module and the optical transceiver will be described with reference to FIG. Note that mainly differences and features from the first embodiment will be described.

First, the structure of the receiving optical module will be described with reference to FIG. In FIG. 1A, a lead frame 200 for manufacturing the receiving optical module Rx includes an optical element mounting section 202 for mounting a light receiving element and an electronic element mounting section for mounting an electronic element. 204 and four internal lead pins 2 electrically and mechanically connecting the mounting portions 202 and 204 to each other.
06, and 5 provided behind the electronic element mounting portion 204.
The external lead pins 208 are formed, and the optical element mounting portion 2 is formed.
02 and the surface of the electronic element mounting portion 204 are silver-plated. Then, the light receiving element 210 is fixed to the optical element mounting section 202 via a submount member, and the electronic element is fixed to the electronic element mounting section 204.

Next, as shown in FIG. 6B, a first resin molded part for integrally sealing the optical element mounting part 202 and the light receiving element 210 using a resin transparent to the optical signal. 212
By molding a second resin molded part 214 for integrally sealing the electronic element mounting part 204 and the electronic element, and cutting and removing an unnecessary part of the lead frame 200, as shown in FIG. Form the intermediate part as shown. Note that the first resin molded part 212 is the first resin molded part 20 shown in FIG.
Similarly to the above, the base 216 in which the light receiving element 210 is embedded, the truncated cone-shaped base 218 and the aspherical lens 220 are integrated.

Then, as shown in FIG. 9D, the internal lead pin 206 and the external lead pin 208 are bent to form an SI in which the external lead pins 208 are arranged in a line.
The P (single in-line package) type receiving optical module Rx is completed.

Incidentally, the internal lead pins 206 correspond to those shown in FIG.
Similarly to the receiving optical module shown in (1), the optical module is bent into a hook shape convex downward. Also, external lead pins 208
Is bent substantially in the vertical direction with respect to the electronic element mounting section 204 so as to substantially hang down on the side on which the electronic element is mounted. That is, the electronic element mounted on the electronic element mounting section 204 is positioned below the lead frame.

Next, with reference to FIG. 11, the structure of the transmitting optical module will be described together with the manufacturing process. In FIG. 1A, a lead frame 300 for manufacturing the transmission optical module includes an optical element mounting section 302 for mounting a light emitting element, and an electronic element mounting section 304 for mounting an electronic element. , Two internal lead pins 306 for electrically and mechanically connecting the mounting portions 302 and 304,
Also, four external lead pins 308 provided behind the electronic element mounting section 304 are formed, and the surfaces of the optical element mounting section 302 and the electronic element mounting section 304 are silver-plated. Then, the light emitting element 310 is fixed to the optical element mounting section 302, and the electronic element is fixed to the electronic element mounting section 304.

Next, as shown in FIG. 6B, a first resin molded part 312 for integrally sealing the optical element mounting part 302 and the light emitting element 310 using a resin transparent to an optical signal.
By molding a second resin molded portion 314 for integrally sealing the electronic element mounting portion 204 and the electronic circuit, and cutting and removing unnecessary portions of the lead frame 300, as shown in FIG. Form the intermediate part as shown.

The first resin molded part 312 is formed by the method shown in FIGS.
Similar to the first resin molded portions 40 and 212 shown in FIG. 0 (c), the base 316, the truncated cone-shaped base 318, and the aspheric lens 320 are integrated.

Then, as shown in FIG. 7D, the internal lead pin 306 and the external lead pin 308 are bent to form an SI in which the external lead pins 308 are arranged in a line.
A P (single in-line package) type transmission optical module Tx is completed.

Incidentally, the internal lead pin 306 of the transmitting optical module Tx is bent into a hook shape convex upward, similarly to the transmitting optical module shown in FIG. 6B. The external lead pins 308 are bent so as to be substantially perpendicular to the electronic element mounting portion 304 and to hang down substantially to the side where the electronic element is not mounted. That is,
The electronic element mounted on the electronic element mounting section 304 is located above the lead frame.

Next, the structure of an optical transceiver using the optical module for reception Rx and the optical module for transmission Tx will be described together with the manufacturing process.

First, as shown in FIGS. 10 (d) and 11 (d), each of the first optical modules Rx and Tx
A sleeve 400 for fitting a ferrule receiving a multi-mode optical fiber is fixed to the resin molded portions 212 and 312 of FIG. That is, this sleeve 400 is
This is a tubular resin molded member similar to that described above, and the sleeve 400 is fixed to each of the first resin molded portions 212 and 312 using an ultraviolet curable resin and a thermosetting resin.

Next, in FIG. 12, the receiving optical module Rx is placed in the through-hole groups 500a and 500b formed in a row at predetermined positions of the rectangular alignment substrate 500.
The external lead pin 208 of the optical module for transmission Tx and the external lead pin 308 of the optical module for transmission Tx are fitted together to integrate them. Then, the alignment board 500 is assembled so as to house the optical module for reception Rx and the optical module for transmission Tx in the housing 98 shown in FIG.
The optical link device of the present embodiment is completed by assembling 12 and the rectangular flat plate 120 to the housing 98.

In the optical link device of this embodiment, the respective internal lead pins of the optical module for reception Rx and the optical module for transmission Tx are bent in a substantially hook shape in directions opposite to each other. For this reason, even if the optical module Rx and the transmitting optical module Tx are juxtaposed in the housing 98, the internal lead pins do not face each other and are separated from each other, and these optical modules Rx and Tx are separated from each other. It is possible to suppress the influence of electromagnetic induction noise between them.

Further, since the external lead pins of the receiving optical module Rx and the transmitting optical module Tx are bent in the opposite directions with respect to the respective electronic element mounting portions 204 and 304, each of the optical modules Rx, A portion of the lead frame set to the ground potential is interposed between the electronic elements of Tx, and a shielding effect is exhibited.

Since the receiving optical module Rx and the transmitting optical module Tx, which are independent from each other, are incorporated in the housing 98, the power supply line and the ground line of the lead frame are electrically separated from each other, so that the two optical modules Rx, The influence of noise such as surge and ripple between Tx can be avoided.

In the first and second embodiments, as shown in FIGS. 8 and 12, the internal lead pins 28a to 28d and 206 of the receiving optical module Rx are bent into a hook shape which is convex downward. The case where the internal lead pins 56a, 56b, and 306 of the optical module for transmission Tx are bent into a hook shape that is convex upward has been described. Conversely, the internal lead pins 28a to 28d and 206 are placed upward. The internal lead pins 56a, 56b, and 306 of the transmitting optical module Tx may be bent into a hook shape that is convex downward. Even in this case, in the housing 98, the internal lead pins 28a to 28d, 206 and the internal lead pins 56a, 56b, 306 do not face each other and are separated from each other. Even when the transmitting optical module Tx is disposed in the housing 98 in close proximity, these optical modules Rx, Tx
It is possible to suppress the influence of electromagnetic induction noise between them.

[0079]

As described above, according to the optical link device of the present invention, the internal lead pins of the first optical module and the second optical module are bent into substantially hook shapes in directions opposite to each other, thereby forming the housing. When incorporated into the body, the internal lead pins do not face each other and are separated from each other, so that the influence of electromagnetic induction noise between these optical modules can be suppressed.

Also, when the external lead pins of the first and second optical modules are bent in the opposite directions with respect to the respective electronic element mounting portions, and are incorporated in the housing, the external lead pins are located between the electronic elements of the respective optical modules. Since the lead frame portion set to the ground potential is interposed, a further shielding effect can be obtained.

Further, since the first and second optical modules independent of each other are incorporated in the housing, the power supply line and the ground line of the lead frame are electrically separated from each other, and surge and ripple between the two optical modules can be achieved. And the like, can be avoided.

As described above, by suppressing the influence of electromagnetic induction noise between transmission and reception, it is possible to provide an optical link device that enables high-quality transmission and reception.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a shape of a lead frame of a receiving optical module according to a first embodiment.

FIG. 2 is a perspective view showing a shape of an intermediate component of the optical module for reception.

FIGS. 3A and 3B are a perspective view and a side view showing the shape of the completed receiving optical module.

FIG. 4 is a perspective view illustrating a shape of a lead frame of the optical module for transmission according to the first embodiment.

FIG. 5 is a perspective view showing a shape of an intermediate component of the optical module for transmission.

FIGS. 6A and 6B are a perspective view and a side view showing a shape of a completed transmission optical module.

FIG. 7 is an explanatory diagram showing a connection structure of a sleeve, a receiving optical module, and a transmitting optical module.

FIG. 8 is a perspective view for explaining the optical link device according to the first embodiment.

FIG. 9 is a perspective view for further explaining the structure of the optical link device.

FIG. 10 is an explanatory diagram showing a structure of a receiving optical module according to a second embodiment together with manufacturing steps.

FIG. 11 is an explanatory diagram showing a structure of a transmission optical module according to a second embodiment together with manufacturing steps.

FIG. 12 is a perspective view illustrating a structure of an optical link device according to a second embodiment.

FIG. 13 is an explanatory diagram for explaining the structure of a conventional optical link device.

[Explanation of symbols]

22, 50, 200, 300 ... lead frame, 24,
52, 202, 302 ... optical element mounting part, 26, 54, 2
04, 304: electronic element mounting portion, 28a to 28d, 56
a, 56b, 206, 306 ... internal lead pin, 30a
~ 30g, 32a ~ 32g, 58a ~ 58g, 60a ~
60 g, 208, 308: external lead pins, 38, 21
0 ... light receiving element, 66,310 ... light emitting element, 96,50
0: alignment board, 98: housing.

Claims (4)

[Claims] 1. A first optical module having a light receiving element for inputting an optical signal, converting the signal to an electric signal, and outputting the same, and a second optical module having a light emitting element for inputting the electric signal, converting the signal to an optical signal, and transmitting the signal An optical link device configured by independently incorporating an optical module in a housing, wherein the first optical module and the second optical module are respectively:
An optical element mounting section for mounting each of the optical elements, an electronic element mounting section for mounting an electronic circuit, and an internal lead pin for electrically and mechanically connecting the optical element mounting section and the electronic element mounting section; A lead frame having an external lead pin electrically connected to the electronic element mounting portion, wherein the internal lead pin of the first optical module and the internal lead pin of the second optical module are bent into substantially hook shapes in directions opposite to each other. An optical link device, wherein the optical link devices are shaped so as not to face each other in the housing. 2. An external lead pin of each of the first and second optical modules is bent in a direction substantially perpendicular to an electronic element mounting surface of each electronic element mounting part and in directions opposite to each other. The optical link device according to claim 1, wherein: 3. The optical link device according to claim 1, wherein the external lead pins of the first and second optical modules have a DIP shape. 4. The optical link device according to claim 1, wherein the external lead pins of the first and second optical modules have a SIP shape.