JPH11186091A - Manufacture of case jacket type electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the manufacture of a case jacket type electronic component for enabling a conventional case jacket type of electronic part to cope with a surface mounting system. SOLUTION: The lead terminal of a case jacket type of electronic component 10 in which a capacitor element 14 is accommodated in a case 12 and the lead terminal of the capacitor element is led out of the case 12 from the bottom of the case 12, and also a plurality of projections 22 are provided at the bottom 12a of the case 12 is cut into proper lengths, and next it is crushed and plananized, and further the lead terminal in flat form is bent at a roughly right angle toward the flank of the case, so that the bottom face is roughly flush with the tip case of the projection 22, and then it is bent at a roughly right angle toward the flank of the case 12 so that the tip part is parallel to the flanks 12a and 12a of the case, so that the lead terminals are made into flat bent terminals 20 and 20 for surface mounting.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an electronic component having a case, and more particularly to a method of housing an electronic element such as a capacitor in a case and leading a lead terminal of the electronic element out of the case. The present invention relates to a method of manufacturing a case exterior electronic component for enabling the case exterior electronic component to be compatible with a surface mounting method.

[0002]

2. Description of the Related Art Heretofore, a case exterior type electronic component having a structure in which an electronic element such as a capacitor is housed in a case and lead terminals of the electronic element are led out of the case has been widely used. The case exterior type electronic component shown in FIG. 9 is an example of the case. A capacitor element 14 is housed in a substantially rectangular parallelepiped case 12, and lead terminals 18 and 16 are connected to metallikon electrodes 16 and 16 of the capacitor element 14. 18 and connect the lead terminal 1
8 and 18 are led out of the case 12 and the resin 19 is filled around the capacitor element 14. As shown in FIG. 10, the case exterior type electronic component 50 has lead terminals 1 thereof.
8 and 18 are inserted into the through holes of the substrate 24, and solder 2
They are connected to the printed wirings 26 and 26 via 8, 28. Since the projections 22 are provided on the bottom surface of the case 12, a gap is formed between the bottom surface of the case 12 and the surface of the substrate 24. This gap is for facilitating flux cleaning after the soldering operation.

On the other hand, recently, with the demand for miniaturization of electronic equipment, a surface mounting technique using chip-type electronic components has been spreading. 11 and 12 show an example of such a chip-type electronic component. FIG. 11 shows a front view thereof, and FIG. 12 shows a side view thereof. The chip-type electronic component 52 is formed by bending flat terminals 56, 56 from both side surfaces 54a, 54a of a main body 54 having a substantially rectangular parallelepiped shape. The distal end portions 56a, 56a of the terminals 56, 56
Is just entered into the gaps 58 on the bottom side of the main body 54, so that the lower end surface of the chip-type electronic component 52 is substantially flush. This chip-type electronic component 52 is mounted on the substrate 24 as shown in FIG.
56b and the printed wiring 26 located on the substrate are connected.

[0004]

Indeed, the chip-type electronic component 52 is superior in the space factor as compared with the case exterior type electronic component 50, and can be mounted on both sides of the substrate 24. Therefore, it can be said that the surface mounting method using the chip-type electronic component 52 contributes to downsizing of the electronic device. Further, the surface mounting method has an advantage that the mounting is easier to automate. Therefore, it can be said that it is ideal to form all the electronic components into chips and surface mount the chip-type electronic components.

[0005] However, in making an electronic component into a chip, it is necessary to manufacture a new die for each individual component and adjust the production line again, which increases the initial cost. Also, various safety standards required for individual electronic components need to be re-applied and certified. Furthermore, the case exterior type electronic components that are already produced and stocked are wasted.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-described problems, and has been made in order to realize a method of manufacturing a case-mounted electronic component that enables a conventional case-mounted electronic component to be compatible with a surface mounting method. Aim.

[0007]

In order to achieve the above object, a method of manufacturing a case exterior electronic component according to the present invention comprises:
The electronic device is housed in a case, and lead terminals of the electronic device are led out of the case from the bottom surface of the case, and a plurality of protrusions are provided on the bottom surface of the case. The lead terminal, which has been cut into an appropriate length and then crushed and flattened, is further placed on the side surface of the case so that the lower end surface thereof is substantially flush with the tip end surface of the projection. After being bent at a right angle, the front end portion is bent at a substantially right angle to the side surface of the case so as to be along the side surface of the case, thereby forming the lead terminal as a flat bent terminal for surface mounting. .

[0008] The case exterior electronic component manufactured by the above method is mounted on a substrate, and the side surface of the flattened and bent terminal and the printed wiring on the surface of the substrate are connected via solder or the like. Components can be surface mounted. That is, in the present invention, the lead terminals of the existing case exterior type electronic component are cut, and then crushed and flattened. The existing case is bent at a right angle to the side surface of the case so as to be substantially flush with the tip surface of the projection, and then bent at a substantially right angle to the side surface of the case so that the tip portion is along the side surface of the case. The exterior electronic component can be a case exterior electronic component compatible with the surface mounting method.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, a case exterior type electronic component according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a front view of a case exterior type electronic component 10, FIG. 2 is a side view thereof, and FIG. 3 is a partial sectional view showing an internal configuration. The case exterior type electronic component 10 houses a capacitor element 14 formed by laminating and winding a metallized film in a substantially rectangular parallelepiped case 12 made of an insulating material such as ceramic or plastic. Connect the lead terminals 18, 18 to the metallikon electrodes 16, 16, and connect the lead terminals 18, 18 to the case.
12 and resin around the capacitor element 14
It consists of filling 19. The lead terminals 18, 18 are subjected to predetermined deformation outside the case 12 to form flat bent terminals 20, 20. That is, the flattened and bent terminals 20, 20 are:
It has a shape in which a flat member is bent at substantially two right angles at two places, and its tip portion is a side surface 12a of the case 12,
It is arranged along 12a. Projections 22, 22 are formed on the bottom surface of the case 12, and the tip surfaces 22a, 22a of the projections 22, 22, and the bottom surface 20a,
20a is configured to be substantially flush.

The case exterior type electronic component 10 is surface-mounted on the substrate 24, similarly to the chip type electronic component 52 shown in FIG. That is, as shown in FIG. 4, the case exterior type electronic component 10 is placed on the substrate 24 such that the tip surfaces 22a, 22a of the projections and the bottom surface 20a of the flattened terminal are in close contact with the surface of the substrate 24. The side surfaces 20b, 20b of the flattened and bent terminals and the printed wirings 26, 26 attached to the surface of the substrate 24 are electrically connected via solders 28, 28.

Next, a method of manufacturing this case-exterior type electronic component will be described with reference to FIGS. First, a conventional case exterior type electronic component 50, that is, an electronic component 50 in which the lead terminals 18, 18 of the electronic elements in the case 12 are simply led out (FIG. 5), is prepared. 18 and 18 are cut leaving an appropriate length (FIG. 6). Next, the remaining portions of the lead terminals 18, 18 are crushed by pressing to flatten them (FIG. 7). FIG. 8 shows the bottom surface of the electronic component 50 at this stage. Finally,
By bending the flat lead terminals 18, 18 in two directions in the direction of the arrow, the lead terminals constitute flat bent terminals 20, 20, and the case exterior type electronic component shown in FIG.
10 is completed.

The electronic elements housed in the case 12 are not limited to the above-described capacitor elements 14, but include all electronic elements having lead terminals, such as surge absorbing elements and resistors.

[0013]

According to the method of manufacturing a case-covered electronic component according to the present invention, as described above, the lead terminals of the existing case-covered electronic component are cut, and then crushed and flattened. Furthermore, after the flattened lead terminal is bent at a substantially right angle to the side surface of the case so that the lower end surface thereof is substantially flush with the front end surface of the projection on the bottom surface of the case, the front end portion is formed on the side surface of the case. By bending the case-extending type electronic component at a substantially right angle to the side surface of the case so as to follow, the existing case-extending type electronic component can be made a case-extending type electronic component compatible with the surface mounting method. Therefore, there is no need to newly design and manufacture a chip-type electronic element compatible with the surface mounting method, and existing equipment and stock can be effectively used, which is extremely economical.

[Brief description of the drawings]

FIG. 1 is a front view showing an embodiment of a case exterior electronic component according to the present invention.

FIG. 2 is a side view of the embodiment.

FIG. 3 is a partial cross-sectional view showing an internal configuration of the embodiment.

FIG. 4 is an explanatory diagram showing a usage example of the embodiment.

FIG. 5 is an explanatory diagram showing a manufacturing process of the embodiment.

FIG. 6 is an explanatory diagram showing a manufacturing process of the embodiment.

FIG. 7 is an explanatory diagram showing a manufacturing process of the embodiment.

FIG. 8 is an explanatory diagram showing a manufacturing process of the embodiment.

FIG. 9 is a partial cross-sectional view showing a conventional case exterior electronic component.

FIG. 10 is an explanatory diagram showing an example of use of a conventional case exterior type electronic component.

FIG. 11 is an explanatory view showing a usage example of a conventional chip-type electronic component.

FIG. 12 is a side view of the chip-type electronic component.

[Explanation of symbols]

 10 Case exterior electronic component 12 Case 12a Side surface of case 14 Capacitor element 18 Lead terminal 20 Flat bent terminal 20a Bottom of flat bent terminal 20b Side surface of flat bent terminal 22 Projection 22a Tip surface of projection 24 Board

Claims (1)

[Claims] 1. A case exterior electronic component comprising an electronic element housed in a case, a lead terminal of the electronic element being led out of the case from the bottom of the case, and a plurality of projections provided on the bottom of the case. The lead terminal is cut into an appropriate length, then crushed and flattened, and the flattened lead terminal is placed in the case so that the lower end surface is substantially flush with the tip end surface of the projection. After being bent at a substantially right angle to the side surface of the case, the tip portion was bent at a substantially right angle to the side surface of the case so that the tip portion was along the side surface of the case, thereby forming the lead terminal as a flat bent terminal for surface mounting. A method of manufacturing a case exterior type electronic component, comprising: