JPH11176871A - Optoelectric transducer and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simplify a manufacturing process, and to reduce cost largely by forming a junction film bonding a shading plate and an insulating base material and forming a spacer forming a gap filled with the junction film shaped between the shading plate and the insulating base material. SOLUTION: An electrode pattern 15 and a bump 19 corresponding to the electrode pattern 15 are connected electrically through conductive particles contained in an anisotropic conductive film 17. Micro-lenses 20 and a color filter 20a are formed on the light-receiving surface of the optoelectric transducer 13. A circular spacer 21 is projected to a section just under a site, where the bump 19 on a surface, to which the electrode pattern 15 of an insulating base material 14 is not formed, is joined. Accordingly, since a gap corresponding to the spacer 21 is formed between the insulating base material 14 and an optical glass plate 11 and the anisotropic conductive film 17 is penetrated into the gap, the insulating base material 14 and the optical glass plate 11 are bonded firmly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a CCD ( C
harge C oupled D evice) photoelectric conversion device and a manufacturing method thereof and an element related.

[0002]

2. Description of the Related Art Electronic components in which an electric element is housed in a small package are widely used for industrial purposes. In particular, photoelectric conversion elements using CCD elements are, for example, ITV
Wide range of applications such as cameras. Such a CCD device is
The demand for miniaturization is particularly strong for industrial use, and the development of lighter, thinner and more compact is compelling. The mounting of this photoelectric conversion element is described in Japanese Patent Application No. 6-1115 filed earlier by the present applicant.
No. 34, which is hereinafter referred to as FIG. 17 and FIG.
8 and will be described.

FIG. 17 is an exploded perspective view showing a manufacturing process of a package, which comprises a CCD element 1, a flexible substrate 2, and an optical glass plate 3. When these are connected by a process described later, a package having the cross-sectional structure of FIG. 18 is completed.

Next, a manufacturing process of the package shown in FIG. 18 will be described with reference to FIG. First, the optical glass plate 3 and the wiring board 2 are adhered with an adhesive 3a applied in advance (see FIGS. 17A, 17B and 18). In the wiring board 2, an opening 2c is formed in the center of a flexible insulating base material 2a in advance. The adhesive 3a is, for example, an ultraviolet-curable adhesive, and is applied to the back surface of the insulating substrate 2a by, for example, a dispensing method or a screen printing method. Next, an anisotropic conductive film 4 is formed around the electrode pattern 2b (see FIG. 17C). And CCD
The element 1 is connected to the electrode pattern 2b from above the anisotropic conductive film 4 by thermocompression (see FIG. 17D).

At this time, the space 2c is provided in the package.
Are formed, and the light converging effect of the microlens 5 formed in the CCD element 1 is enhanced by the space 2c.

[0006]

However, according to the conventional method, the connection between the optical glass plate 3 and the wiring board 2 is made by the adhesive 3a, but the connection area between the optical glass plate 3 and the wiring board 2 is increased. Has a disadvantage that it is difficult to apply the adhesive 3a to the wiring board 2 stably.

When an ultraviolet-curable adhesive is used as the adhesive 3a, it is necessary to separate the step of bonding the optical glass plate 3 from the step of irradiating ultraviolet rays, which is one of the causes of a decrease in productivity. Was.

Further, in the conventional method for manufacturing a photoelectric conversion device, it is necessary to separate the step of bonding the wiring substrate 2 and the optical glass plate 3 from the step of connecting the wiring substrate 2 and the CCD element 1 to each other. A manufacturing facility that required two steps had to be used. In addition, it was necessary to take a great deal of trouble in setting up the two steps.

The present invention has been made in view of the above circumstances, and by solving the above technical problems, a photoelectric conversion device capable of simplifying a manufacturing process and greatly reducing a manufacturing cost. It is an object of the present invention to provide a manufacturing method thereof.

[0010]

According to a first aspect of the present invention, there is provided a photoelectric conversion device having a plate-like shape having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface. A conversion element, an insulating base material having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the other main part of the insulating base material. A light-transmitting plate adhered to a position of the surface covering the opening and transmitting light received on the light-receiving surface through the opening; and a light-transmitting plate connecting the projecting electrode and the electrode pattern. And a spacer provided between the light-transmitting plate and the insulating base to form a gap filled with the bonding film.

According to a second aspect of the present invention, there is provided a photoelectric conversion device having a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a protruding electrode protruding along a periphery of the light receiving surface. Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material. A light-transmitting plate that is adhered to a covering position and transmits light received on the light-receiving surface through the opening, and that connects the protruding electrode and the electrode pattern and that the light-transmitting plate and the insulating base material And an anisotropic conductive film for adhering the insulating film, and the light transmitting plate is provided with a step for forming a gap between the insulating substrate and the insulating substrate, the gap being filled with the bonding film.

According to a third aspect of the present invention, there is provided a photoelectric conversion device having a plate-like photoelectric conversion element having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface. Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material. A light-transmitting plate that is adhered to a covering position and transmits light received on the light-receiving surface through the opening, and that connects the protruding electrode and the electrode pattern and that the light-transmitting plate and the insulating base material And a bonding film for bonding the insulating base material to the light-transmitting plate, and a through-hole forming a gap filled with the bonding film between the insulating substrate and the light-transmitting plate is formed. ing.

According to a fourth aspect of the present invention, there is provided a photoelectric conversion device having a plate-like photoelectric conversion element having a light receiving surface formed on one main surface and having a protruding electrode protruding along a periphery of the light receiving surface. Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material. A light-transmitting plate adhered to the covering position and transmitting light received on the light-receiving surface through the opening, a bonding film connecting the protruding electrode and the electrode pattern, the light-transmitting plate and the insulation And a sheet-shaped translucent adhesive film interposed between the base material and the entire one main surface of the translucent plate.

According to a fifth aspect of the present invention, in the photoelectric conversion device of the first to fourth aspects, the bonding film is an anisotropic conductive film. According to a sixth aspect of the present invention, in the photoelectric conversion device according to the fourth aspect, the light transmitting plate has a film shape.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a photoelectric conversion device, comprising: a plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light-receiving surface; An insulating base having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base and connected to the protruding electrode, and the other main surface of the insulating base. A light-transmitting plate adhered to a position covering the opening and transmitting light received on the light-receiving surface through the opening; connecting the protruding electrode to the electrode pattern; In a method for manufacturing a photoelectric conversion device, comprising: a bonding film for bonding a base material; and connecting the projecting electrodes to the corresponding electrode patterns via the bonding film, and simultaneously connecting the insulating base material to the light-transmitting plate. Glue.

According to a eighth aspect of the present invention, there is provided a method for manufacturing a photoelectric conversion device, comprising: a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface; An insulating base having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base and connected to the protruding electrode, and the other main surface of the insulating base. A light-transmitting plate adhered to a position covering the opening and transmitting light received on the light-receiving surface through the opening, a bonding film connecting the protruding electrode and the electrode pattern, and the light-transmitting plate And a sheet-shaped light-transmitting adhesive film interposed between the light-transmitting plate and one of the main surfaces of the light-transmitting plate. The light-transmitting plate to which the adhesive film is adhered is provided on the insulating base material through the light-transmitting adhesive film. Chakusuru. According to a ninth aspect of the present invention, in the method of the seventh or eighth aspect, the bonding film is an anisotropic conductive film.

[0017]

An embodiment of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows a photoelectric conversion device according to the embodiment. This photoelectric conversion device has, for example, a thickness of 0.1 mm in which the main surface is substantially rectangular (for example, 5 mm × 5 mm).
An optical glass plate 11 of about to 5 mm, TAB bonded to one main surface of the optical glass plate 11 (T ape A u
tomated B onding) and the wiring board 12 made of a tape, connected to the wiring board 12 has been example CC
And a photoelectric conversion element 13 such as a D element.

Thus, the optical glass plate 11 is translucent, and its thickness is determined by optical design. In addition, an optical low-pass filter may be used as the optical glass plate 11, and this function may be used in combination. Further, glass in which an infrared cut filter or the like and the low-pass filter are laminated may be used. Further, a light-transmitting substrate in which a vapor-deposited film of an infrared cut filter is formed on general-purpose glass may be used. Also,
The optical glass plate 11 may be made of an inorganic material such as quartz or silicon or an organic material such as polyethylene as long as it is a translucent member.

On the other hand, the wiring board 12 is composed of a black and flexible insulating base material 14 and an electrode pattern 15 made of copper leads formed on the insulating base material 14. The insulating substrate 14 is made of a composite substrate of a polyimide, a polyamide, a polyester, a phenol, a glass epoxy resin or the like and a paper / glass substrate. Also, the insulating substrate 1
4 has a film shape of, for example, about 25 to 100 μm. Thus, a rectangular opening 16 is formed in the insulating base material 14. This opening 16
Is for passing the light that has entered through the optical glass plate 11.

On the other hand, as shown in FIG. 2, the electrode pattern 15 is, for example, a copper lead having a thickness of, for example, 18 μm to 35 μm, and the width of the copper lead is, for example, about 100 μm. The electrode patterns 15 are formed at predetermined intervals on the insulating base material 14 at portions 16a and 16b of the insulating base material 14 opposed to each other with the opening 16 interposed therebetween. Therefore, the insulating base material 14 is always exposed between the adjacent electrode patterns 15. Note that other portions 6c, 1 other than the portions 16a, 16b of the insulating base material 14 facing the opening 16 are provided.
An electrode pattern may also be formed on the 6d insulating substrate 14.

The wiring board 12 made of TAB tape
Alternatively, a substrate that cannot be bent freely may be used. In this case, the substrate is preferably black. Thereby, reflection can be prevented, and incidence of unnecessary radiation can be prevented. In this case, a black substrate may be used, or a black paint may be applied to the substrate.

The wiring substrate 12 is bonded to the optical glass plate 11 via the anisotropic conductive film 17. The anisotropic conductive film 17 is formed by, for example, dispersing conductive particles of, for example, gold having a diameter of about 1 to 10 μm, for example, about 3 to 30% by volume in a thermosetting epoxy resin, and applying heat and pressure. .

Further, the photoelectric conversion element 13 has, for example, 410,000 pixels on its light receiving surface and a size of, for example, 4 ×
4 mm and the thickness is, for example, 0.6 mm. In addition, as shown in FIG. 3, the size of the photoelectric conversion element 13 along the two sides is, for example, 100 μm × 10
An electrode pad 18 of 0 μm is formed. Then
The electrode pad 18 is formed with a bump 19 having a spherical shape and functioning as a protruding electrode. The size of the bumps 19 is, for example, 50 to 200 μm in outer diameter and 10 to 50 μm in height, for example. The bumps 19 can be obtained by forming the bumps 19 using a gold wire having a diameter of about 20 to 30 μm by a wire bonding method, and then uniformly shaping the heights by leveling.

The electrode patterns 15 and the corresponding bumps 19 are electrically connected via conductive particles contained in the anisotropic conductive film 17. Further, a microlens 20 and a color filter 20 a are formed on the light receiving surface of the photoelectric conversion element 13.
Numeral 3 receives light through the opening 16, the micro lens 20, and the color filter 20a.

The electrode pattern 1 on the insulating base material 14
A circular spacer 21 having a thickness of several tens of μm and a diameter of several mm or less is protruded immediately below a portion where the bumps 19 are connected on the surface where no 5 is formed. Therefore, the spacer 21 is provided between the insulating base 14 and the optical glass plate 11.
Is formed, and the anisotropic conductive film 17 penetrates into the gap, whereby the insulating base material 14 is formed.
And the optical glass plate 11 are firmly bonded.

The spacer 21 can be formed by an etching method, a plating method, an evaporation method, or the like. Thus, the anisotropic conductive film 17 is formed between the electrode pattern 15 and the bump 1.
9 electrically and mechanically, and mechanically joining the insulating base material 14 and the optical glass plate 11, and sealing the hollow portion formed by the opening 16 and the like from the outside. It has three functions.

The height may be adjusted by forming a bump on the spacer 21. Also,
A spacer may be formed on the optical glass plate 11 side, for example, by a vapor deposition method, instead of the insulating base material 14 side.

Thus, in the photoelectric conversion device of this embodiment, since the spacer 21 is protruded on the surface of the insulating base 14 on which the electrode pattern 15 is not formed, the insulating base 14 and the optical glass plate are provided. A gap corresponding to the spacer 21 is formed between the insulating base material 11 and the optical glass plate 11. The reliability of the mechanical bonding strength can be significantly increased.

By providing a vent in the anisotropic conductive film 17 or the optical glass plate 11, the light receiving space AL may be set to the same environment as the outside air to prevent dew condensation in high humidity. Further, for the purpose of dust prevention, the ventilation hole may be sealed with a resin such as silicon which is quickly humidified.

Next, a method of manufacturing the photoelectric conversion device having the above configuration will be described. As shown in FIG. 4, the method for manufacturing the photoelectric conversion device according to this embodiment includes an optical glass plate holding step (S1 in FIG. 4) of holding the optical glass plate 11 on the fixing jig 22.
And FIG. 5A) and a first anisotropic conductive film applying step of applying an anisotropic conductive film 17 to an outer peripheral portion of the optical glass plate 11 held in the optical glass plate holding step (FIG. 4 and S5 of FIG. 5), and a wiring board for positioning and mounting the wiring board 12 on the optical glass plate 11 via the anisotropic conductive film 17 after the first anisotropic conductive film applying step. A laminating step (see S3 of FIG. 4 and FIG. 5B), and a second anisotropic conductive film 17 is applied along the periphery of the opening 16 of the wiring board 12 after the wiring board laminating step. After the conductive film applying step (see S4 of FIG. 4 and FIG. 5B), and after the second anisotropic conductive film applying step, the bumps 19 of the photoelectric conversion element 13 are positioned on the corresponding electrode patterns 15 of the insulating base material 14. 4 and 5 for positioning and mounting the photoelectric conversion element c)) and after the photoelectric conversion element mounting step, the photoelectric conversion element 13 is thermocompression-bonded with a pressing tool T at, for example, 150 to 170 ° C. for about 20 to 100 seconds to form an anisotropic conductive film made of a thermosetting resin. A thermocompression bonding step of electrically and mechanically connecting the bumps 19 of the photoelectric conversion element 13 to the corresponding electrode patterns 15 of the insulating base material 14 and bonding the insulating base material 14 to the optical glass plate 11 (S6 in FIG. 4) And FIG. 5 (c)).

The fixing jig 22 used in the optical glass plate holding step is made of, for example, steel and has a rectangular parallelepiped large enough to hold the optical glass plate 11. A fitting hole 23 for fitting and holding the optical glass plate 11 is formed on the upper surface. The depth of the fitting hole 23 is provided substantially equal to the thickness of the optical glass plate 11.

Further, for example, four positioning pins 24 are protruded from a portion adjacent to the fitting hole 23 on the upper surface of the fixing jig 22. In the wiring board laminating step, the positioning pins 24 are engaged with positioning holes (not shown) formed in the wiring board 12 in advance, so that the wiring board 1
2 can be accurately positioned with respect to the optical glass plate 11.

A vacuum suction hole may be opened in the surface of the fixing jig 22 so that the optical glass plate 11 and the wiring board 12 are vacuum-sucked in a timely manner. The application of the anisotropic conductive film 17 in the first anisotropic conductive film applying step and the second anisotropic conductive film applying step is performed by, for example, a dispenser method. In this case, the viscosity of the anisotropic conductive film 17 is preferably, for example, about 5000 cps. Further, the application of the anisotropic conductive film 17 in the second anisotropic conductive film application step is performed as follows.
In the case where the diameter of the dispensing part of the dispenser is 0.2 mm, the width of the part to be applied on the wiring substrate 12 at the application pressure of 1.5 to 3.0 kg and the application speed of 1 to 3 mm / sec is 0. 2
An optimum amount of 60-90 μm in mm was obtained. In addition, the application amount of the anisotropic conductive film 17 in the first anisotropic conductive film application step is set to 1/5 or less of the application amount of the anisotropic conductive film 17 in the second anisotropic conductive film application step.

Further, in the thermocompression bonding step, the anisotropic conductive film 17 applied in the first anisotropic conductive film applying step and the second anisotropic conductive film applying step spreads in accordance with the amount thereof, and the photoelectric conversion is performed. Fillets 25 are formed on the outer periphery of the element 13 and the inner periphery of the opening 16.

On the other hand, since a gap corresponding to the spacer 21 is formed between the insulating base material 14 and the optical glass plate 11, the gap is formed in the gap by the first anisotropic conductive film applying step. The applied anisotropic conductive film 17 is filled.

Thus, the electrode pattern 15 and the bump 19 are reliably electrically and mechanically connected by the anisotropic conductive film 17 and the fillet 25 filled in the gap, and the insulating substrate 14 and the optical glass The plate 11 is mechanically firmly joined.

Further, the method of manufacturing the photoelectric conversion device according to this embodiment includes a step of electrically and mechanically connecting the electrode pattern 15 and the bump 19 and a step of mechanically joining the insulating substrate 14 and the optical glass plate 11. Are performed at the same time, so that productivity is dramatically improved.

In the method of manufacturing a photoelectric conversion device according to this embodiment, the anisotropic conductive film 17 is divided into two steps, a first anisotropic conductive film applying step and a second anisotropic conductive film applying step. However, the application in the first anisotropic conductive film application step may be omitted. In this case, the anisotropic conductive film 17 is inserted into the gap between the insulating base material 14 and the optical glass plate 11.
Is filled by the liquid-state anisotropic conductive film 17 passing through the opening 16 into the gap when the fillet 25 is formed in the thermocompression bonding step (see the portion 30 in FIG. 5).

The anisotropic conductive film 17 may be supplied in the form of a film instead of the paste as described above. Next, a photoelectric conversion device according to a second embodiment will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

FIG. 6 shows a photoelectric conversion device according to the second embodiment. In this photoelectric conversion device, an infrared cut layer 31 having a thickness of, for example, several tens of μm that does not selectively transmit infrared light is formed on the optical glass plate 11 by a vapor deposition method or the like. The infrared cut layer 31 has a stepped first optical glass plate in which the outer peripheral portion of the optical glass plate 11 is missing.
The gap forming part 32 is formed. Furthermore, bump 19
A second gap forming portion 33 forming a rectangular groove is formed in an inner region except for a portion immediately below the connection portion.

As described above, in the photoelectric conversion device of the second embodiment, since the first gap forming section 32 and the second gap forming section 33 are formed, the first anisotropic conductive film coating step and the second The anisotropic conductive film 17 applied in the anisotropic conductive film application step spreads in accordance with the amount thereof, and the photoelectric conversion element 1
As a result, the fillet 25 is formed on the outer and inner peripheral portions of the first gap forming portion 3, and the first gap forming portion 32 and the second gap forming portion 33 are surely filled with an appropriate amount of the anisotropic conductive film 17. The reliability of the mechanical bonding strength between the material 14 and the optical glass plate 11 can be significantly increased.

In the photoelectric conversion device according to the second embodiment, only the first gap forming portion 32 is formed and the second gap forming portion 32 is formed.
Even if the gap forming part 33 is omitted, the reliability of the mechanical bonding strength between the insulating base material 14 and the optical glass plate 11 can be sufficiently obtained.

Further, the first gap forming section 32 and the second gap forming section 33 are formed on the optical glass plate 11 without forming the first gap forming section 32 and the second gap forming section 33 via the infrared cut layer 31. Alternatively, it may be formed directly by, for example, machining (see FIG. 7).

Next, a photoelectric conversion device according to a third embodiment will be described. The same parts as those in the first embodiment include:
The same symbols are given and detailed description is omitted. 8 and 9
Indicates a photoelectric conversion device according to the third embodiment. In this photoelectric conversion device, there is no one corresponding to the spacer 21 of the photoelectric conversion device of the first embodiment and the first gap forming portion 32 and the second gap forming portion 33 of the photoelectric conversion device of the second embodiment. Instead, the insulating substrate 14
A rectangular gap forming groove 41 is formed along the opening 16. Since the gap forming groove 41 is a continuous through hole, the front end of the insulating base material 14 having a square shape is
It is connected to the main body only through the electrode pattern 15 which is a copper lead, and forms a frame piece 42 for forming the gap forming groove 41.

As described above, in the photoelectric conversion device according to the third embodiment, since the gap forming groove 41 is formed, the first
The anisotropic conductive film 17 applied in the anisotropic conductive film forming step and the second anisotropic conductive film forming step can flow smoothly through the gap forming groove 41 in the thermocompression bonding step. As a result, a certain gap for filling the anisotropic conductive film 17 is ensured, so that a desired sound fillet 2 is formed.
5 are formed, the insulating base material 14 and the optical glass plate 11 are formed.
The reliability of the mechanical joining strength with the metal can be significantly improved.

In the photoelectric conversion device of the third embodiment, as shown in FIG. 10, a plurality of intermittent passages along the opening 16 are provided instead of the gap forming grooves 41 which are frame-shaped continuous passages. A gap forming groove 52 composed of a hole may be employed. In this case, the intermittent through-holes are formed in the insulating base 14 at equal intervals between the electrode patterns (copper leads) 15 along the two sides 16a and 16b on which the electrode patterns (copper leads) 15 are formed. It is composed of a hole 51a and a long hole 51b formed in the insulating base 14 along the opening 16 of the other two sides 16c and 16d.

In this case as well, the flow of the anisotropic conductive film 17 in the thermocompression bonding step becomes easy, and a certain gap for filling the anisotropic conductive film 17 is ensured. As a result of the formation of the fillet 25, the reliability of the mechanical bonding strength between the insulating base material 14 and the optical glass plate 11 can be significantly improved.

In this case, the same effect can be obtained even if the gap forming groove 52 is constituted by the small through holes 51a instead of the large through holes 51b. Next, a fourth embodiment of the present invention will be described in detail with reference to FIG.

The same parts as those in the photoelectric conversion device of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted. That is, in this photoelectric conversion device, the translucent resin film 71 is interposed between the insulating base material 14 and the optical glass plate 11. The translucent resin film 71 is adhered to the entire surface of the optical glass plate 11 and has a thickness of, for example, 25 to 100.
μm double-sided adhesive sheet. As a material of the translucent resin film 71, for example, an acrylic resin is suitable. Since the light-transmitting resin film 71 has a light-transmitting property, the light-transmitting resin film 71 does not shield light even when the optical glass plate 11 is covered, and does not need to be processed into a frame shape in order to transmit light.

Thus, in the photoelectric conversion device of the embodiment, the insulating base material 14 and the optical glass plate 11 are mechanically joined by interposing the translucent resin film 71,
The hollow portion created by the opening 16 or the like can be completely sealed, which contributes to improving the reliability of the device.

Next, a method of manufacturing the photoelectric conversion device according to the fourth embodiment will be described. That is, in the method of manufacturing the photoelectric conversion device according to the fourth embodiment, the light-transmitting resin film bonding step of bonding the light-transmitting resin film 71 to one main surface of the optical glass plate 11 (S11 in FIG. 12 and FIG. 1A) and a wiring board laminating step of positioning and bonding the optical glass plate 11 and the wiring board 12 via the light-transmitting resin film 71 (FIG. 1).
2 and S13 in FIG. 13) and after the wiring board laminating step, the anisotropic conductive film 17 is placed in the opening 1 of the wiring board 12.
6 and S13 of FIG. 12 and FIG. 13C, and the bumps 19 insulate the photoelectric conversion element 13 after the anisotropic conductive film application step. A photoelectric conversion element mounting step (see S14 and FIG. 13 (d) of FIG. 12) for positioning and mounting to correspond to the position of the corresponding electrode pattern 15 on the base material 14, and after the photoelectric conversion element mounting step, photoelectric conversion by a pressing tool is performed. The element 13 is thermocompression-bonded at, for example, 150 to 170 ° C. for about 20 to 100 seconds, and the bump 19 of the photoelectric conversion element 13 is formed by the anisotropic conductive film 17 made of a thermosetting resin. Thermo-compression bonding step of electrically and mechanically connecting the substrate and bonding the insulating base material 14 to the optical glass plate 11 (FIG. 1)
2 (S15) and FIG. 13 (e)).

The light-transmitting resin film 71 in the form of a sheet in the light-transmitting resin film bonding step is, for example, 2.0 kg / c at room temperature.
This is performed by pressurizing with m2. In the method of manufacturing the photoelectric conversion device according to the fourth embodiment, an adhesive is applied along the periphery of the opening 16 of the wiring board 12 (for example, by a potting method, a screen printing method, or the like) as in the related art. This eliminates the hassle of setup and helps to improve productivity.

Next, a fifth embodiment of the present invention will be described with reference to FIG.
It will be described in detail with reference to FIG. Note that the same parts as those of the photoelectric conversion device of the first embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.

That is, in this photoelectric conversion device,
A light-transmitting substrate 72 is bonded to the insulating base 14 via a light-transmitting resin film 73. The translucent resin film 73 is a double-sided adhesive sheet having a thickness of, for example, 25 to 100 μm. As a material of the translucent resin film 71, for example, an acrylic resin is suitable. Since the light-transmitting resin film 71 has a light-transmitting property, the light-transmitting resin film 71 does not block light even when it covers the light-transmitting substrate 72, and does not need to be processed into a frame shape in order to transmit light. . On the other hand, the translucent substrate 72 is made of a composite substrate of polyimide, polyamide, polyester, phenol, glass epoxy resin or the like and a paper / glass substrate. The thickness of the light-transmitting substrate 72 is, for example, 25 to 100 μm.
It is in the form of a film.

In the photoelectric conversion device according to the fifth embodiment, the insulating base material 14 and the light-transmitting substrate 72 are mechanically joined by the light-transmitting resin film 73 interposed therebetween. The hollow portion created by the opening 16 or the like can be completely sealed, which contributes to the improvement of the reliability of the device. Further, since the optical glass plate 11 is not used, it is useful for reducing the weight of the entire apparatus.

Further, a method of manufacturing the photoelectric conversion device according to the fifth embodiment will be described. That is, in the method of manufacturing the photoelectric conversion device according to the fifth embodiment, the light-transmitting resin film bonding step of bonding the light-transmitting resin film 71 to one main surface of the light-transmitting substrate 72 (see S21 in FIG. 15 and FIG. 16 (a)), the light-transmitting substrate 72 and the wiring substrate 12 with the light-transmitting resin film 71 interposed therebetween.
Wiring board laminating step of positioning and bonding
22 and FIG. 16B), and an anisotropic conductive film applying step of applying an anisotropic conductive film 17 along the periphery of the opening 16 of the wiring board 12 after the wiring board laminating step (see FIG. S23 and FIG. 16 (c)), and the photoelectric conversion element 13 is positioned and mounted such that the bump 19 is located at the position of the corresponding electrode pattern 15 of the insulating base material 14 after the anisotropic conductive film coating step. Mounting process (S24 in FIG. 15)
And FIG. 16D). After the photoelectric conversion element mounting step, the photoelectric conversion element 13 is, for example, 150
Thermocompression bonding at about 170 ° C. for about 20 to 100 seconds and an anisotropic conductive film 17 made of a thermosetting resin;
Of the corresponding electrode pattern 1 on the insulating base material 14
5, electrically and mechanically connected to the insulating substrate 14
Is bonded to the translucent substrate 72 by a thermocompression bonding process (S2 in FIG.
5 and FIG. 16 (e)). When a commercially available product in which the light-transmitting substrate 72 and the light-transmitting resin film 71 are integrated is used, the light-transmitting resin film bonding step can be omitted.

In the method of manufacturing the photoelectric conversion device according to the fifth embodiment, an adhesive is applied along the periphery of the opening 16 of the wiring board 12 (for example, a potting method, a screen printing method) as in the related art. This eliminates the hassle of setting up and helps to improve productivity. Further, the translucent substrate 7
Since the light-transmitting resin film 71 and the light-transmitting resin film 71 are usually sold as a single unit, the step of bonding the light-transmitting resin film can be omitted, and the productivity can be greatly improved from this point as well.

The manufacturing process described in the method of manufacturing the photoelectric conversion device according to the first embodiment can be applied to the manufacturing of the photoelectric conversion device having the conventional structure shown in FIG.
In this case, after the thermocompression bonding step, a sealing resin application step of applying a phenol-based or epoxy-based thermosetting or ultraviolet-curing sealing resin to the outside of the anisotropic conductive film may be added. . By doing so, the adhesion by the anisotropic conductive film can be reinforced.

Further, instead of the anisotropic conductive film used in each of the above embodiments, an insulating resin (joining material) containing no metal particles for imparting conductivity is used to form the bump 19 and the electrode pattern. The mechanical bonding with the optical substrate 15 (electrically connectable) and the bonding between the insulating substrate 14 and the optical glass plate 11 may be performed simultaneously.

Furthermore, although the anisotropic conductive film of the above embodiment is of a thermosetting type, a thermoplastic resin or an ultraviolet curable resin may be used, including the case where the insulating resin is used as a bonding material. It may be. In this case, heating and pressing are not necessarily required, but only pressing is required.

[0061]

According to a first aspect of the present invention, there is provided a photoelectric conversion device having a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a protruding electrode protruding along a peripheral portion of the light receiving surface. An insulating base having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base and connected to the protruding electrode, and the opening on the other main surface of the insulating base. A light-transmitting plate adhered to a position covering the portion and transmitting light received on the light-receiving surface through the opening; connecting the protruding electrode to the electrode pattern; Since there are provided a bonding film for bonding a material and a spacer provided between the light transmitting plate and the insulating base material to form a gap filled with the bonding film, the insulating base material and the light transmitting plate are provided. A gap corresponding to this spacer is formed between An appropriate amount of the bonding film results to be reliably filled, it is possible to significantly increase the reliability of the mechanical bonding strength between the insulating substrate and the transparent plate.

According to a second aspect of the present invention, there is provided a photoelectric conversion device having a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface. Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material. A light-transmitting plate that is adhered to a covering position and transmits light received on the light-receiving surface through the opening, and that connects the protruding electrode and the electrode pattern and that the light-transmitting plate and the insulating base material And a bonding film that adheres the bonding film, and a step that forms a gap filled with the bonding film is formed between the light-transmitting plate and the insulating base material. Mechanical bonding between the insulating substrate and the translucent plate as a result of the film being reliably filled It can significantly enhance the degree of reliability.

According to a third aspect of the present invention, there is provided a photoelectric conversion device comprising: a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a protruding electrode protruding along a peripheral portion of the light receiving surface; Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material A light-transmitting plate adhered to a position covering the light-receiving surface and transmitting light received on the light-receiving surface through the opening, connecting the protruding electrode and the electrode pattern, and connecting the light-transmitting plate and the insulating base material And a bonding film for bonding the insulating film to the light-transmitting plate, and a through-hole forming a gap filled with the bonding film between the insulating substrate and the light-transmitting plate is formed. As a result, the gap is filled with an appropriate amount of bonding film, It can significantly increase the reliability of the mechanical bonding strength between the wood and the transparent plate.

According to a fourth aspect of the present invention, there is provided a photoelectric conversion device having a plate-like photoelectric conversion element having a light receiving surface formed on one main surface and having a protruding electrode protruding along the periphery of the light receiving surface. Formed on the insulating base material, a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and the opening on the other main surface of the insulating base material. A light-transmitting plate adhered to the covering position and transmitting light received on the light-receiving surface through the opening, a bonding film connecting the protruding electrode and the electrode pattern, the light-transmitting plate and the insulation A sheet-shaped translucent adhesive film interposed between the base material and the entire one main surface of the translucent plate, wherein the translucent resin film is interposed. By mechanically joining the insulating base and the light-transmitting plate, the hollow part created by the opening It can be sealed to all, to secure reliable as devices.

According to a seventh aspect of the present invention, there is provided a method for manufacturing a photoelectric conversion device, comprising: a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface; An insulating base having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base and connected to the protruding electrode, and the other main surface of the insulating base. A light-transmitting plate adhered to a position covering the opening and transmitting light received on the light-receiving surface through the opening; connecting the protruding electrode to the electrode pattern; In a method for manufacturing a photoelectric conversion device, comprising: a bonding film for bonding a base material; and connecting the projecting electrodes to the corresponding electrode patterns via the bonding film, and simultaneously connecting the insulating base material to the light-transmitting plate. Adhesive, electrode pattern and protruding electrode Electrically and mechanically connecting process, as well as a result of to perform mechanical bonding process between the insulating substrate and the transparent plate at the same time, the productivity is remarkably improved.

According to a eighth aspect of the present invention, there is provided a method for manufacturing a photoelectric conversion device, comprising: a plate-shaped photoelectric conversion element having a light receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light receiving surface; An insulating base having an opening formed therein, a lead-shaped electrode pattern attached to one main surface of the insulating base and connected to the protruding electrode, and the other main surface of the insulating base. A light-transmitting plate adhered to a position covering the opening and transmitting light received on the light-receiving surface through the opening, a bonding film connecting the protruding electrode and the electrode pattern, and the light-transmitting plate And a sheet-shaped light-transmitting adhesive film interposed between the light-transmitting plate and one of the main surfaces of the light-transmitting plate. The light-transmitting plate to which the adhesive film is adhered is provided on the insulating base material through the light-transmitting adhesive film. In wearing things, as in the prior art, coating (e.g. potting method, or a screen printing method) along the periphery of the opening of the adhesive insulating base material to eliminate the trouble of setup, help improve productivity.

[Brief description of the drawings]

FIG. 1 is a sectional front view of a photoelectric conversion device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a wiring board of the photoelectric conversion device of FIG.

FIG. 3 is an explanatory diagram of an electrode pad of the photoelectric conversion device of FIG.

FIG. 4 is a flowchart illustrating a method for manufacturing a photoelectric conversion device according to an embodiment of the present invention.

FIG. 5 is an explanatory diagram of a method for manufacturing a photoelectric conversion device according to an embodiment of the present invention.

FIG. 6 is a sectional front view of a photoelectric conversion device according to a second embodiment of the present invention.

FIG. 7 is a sectional front view of a modification of the photoelectric conversion device according to the second embodiment of the present invention.

FIG. 8 is a sectional front view of a photoelectric conversion device according to a third embodiment of the present invention.

FIG. 9 is an exploded perspective view of a photoelectric conversion device according to a third embodiment of the present invention.

FIG. 10 is an exploded perspective view showing a modification of the photoelectric conversion device according to the third embodiment of the present invention.

FIG. 11 is a sectional front view of a photoelectric conversion device according to a fourth embodiment of the present invention.

FIG. 12 is a flowchart illustrating a method for manufacturing a photoelectric conversion device according to a fourth embodiment of the present invention.

FIG. 13 is an exploded perspective view illustrating a method for manufacturing a photoelectric conversion device according to a fourth embodiment of the present invention.

FIG. 14 is a sectional front view of a photoelectric conversion device according to a fifth embodiment of the present invention.

FIG. 15 is a flowchart illustrating a method for manufacturing a photoelectric conversion device according to a fifth embodiment of the present invention.

FIG. 16 is an exploded perspective view illustrating a method for manufacturing a photoelectric conversion device according to a fifth embodiment of the present invention.

FIG. 17 is an exploded perspective view showing a conventional technique.

FIG. 18 is a cross-sectional view showing a conventional technique.

[Explanation of symbols]

11: optical glass plate (transparent plate), 12: wiring board, 1
3: photoelectric conversion element, 14: insulating substrate, 15: electrode pattern, 17: anisotropic conductive film, 18: electrode pad, 19: bump (protruding electrode), 21: spacer, 25: fillet, 32: first Gap forming portion, 33: second gap forming portion, 41, 52: gap forming groove.

Claims (9)

[Claims] 1. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a protruding electrode protruding along a peripheral portion of the light-receiving surface, and an insulating substrate having an opening formed therein And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through the opening, and a bonding film that connects the protruding electrode and the electrode pattern and bonds the light-transmitting plate and the insulating base material,
A photoelectric conversion device, comprising: a spacer provided between the light transmitting plate and the insulating base to form a gap filled with the bonding film. 2. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a projecting electrode protruding along a peripheral portion of the light-receiving surface, and an insulating substrate having an opening formed therein. And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through the opening, and a bonding film that connects the protruding electrode and the electrode pattern and bonds the light-transmitting plate and the insulating base material,
A photoelectric conversion device, wherein a step is formed between the transparent plate and the insulating base to form a gap for filling the bonding film. 3. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a protruding electrode protruding along a peripheral portion of the light-receiving surface, and an insulating base material having an opening formed therein. And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through an opening, and a bonding film that connects the protruding electrode and the electrode pattern and that bonds the light-transmitting plate and the insulating base material. And a through hole for forming a gap filled with the bonding film between the insulating substrate and the light transmitting plate is formed in a bonding portion of the insulating base to the light transmitting plate. Photoelectric conversion device. 4. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a protruding electrode protruding along a peripheral portion of the light-receiving surface, and an insulating base material having an opening formed therein. And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through the opening, a bonding film that connects the protruding electrode and the electrode pattern, and a light-transmitting plate between the light-transmitting plate and the insulating base material. And a sheet-shaped translucent adhesive film that is inserted and covers one entire main surface of the translucent plate. 5. The photoelectric conversion device according to claim 1, wherein said bonding film is an anisotropic conductive film. 6. The photoelectric conversion device according to claim 4, wherein said light-transmitting plate has a film shape. 7. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a protruding electrode protruding along the periphery of the light-receiving surface, and an insulating substrate having an opening formed therein And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through an opening; and a bonding film that connects the protruding electrode and the electrode pattern and that bonds the light-transmitting plate and the insulating base material. A method for manufacturing a photoelectric conversion device, comprising: connecting the protruding electrode to the corresponding electrode pattern via the bonding film, and simultaneously bonding the insulating base material to the light transmitting plate. Manufacturing method. 8. A plate-shaped photoelectric conversion element having a light-receiving surface formed on one main surface and having a protruding electrode protruding along the periphery of the light-receiving surface, and an insulating substrate having an opening formed therein. And a lead-shaped electrode pattern attached to one main surface of the insulating base material and connected to the protruding electrode, and adhered to a position covering the opening on the other main surface of the insulating base material, and A light-transmitting plate that transmits light received on the light-receiving surface through the opening, a bonding film that connects the protruding electrode and the electrode pattern, and a light-transmitting plate between the light-transmitting plate and the insulating base material. And a sheet-shaped translucent adhesive film that is inserted and covers the entire one main surface of the translucent plate, wherein the translucent plate to which the translucent adhesive film is adhered is provided. Is adhered to the insulating base material via the translucent adhesive film. Manufacturing method. 9. The method according to claim 7, wherein said bonding film is an anisotropic conductive film.