JPH11176794A - Wet cleaning device for electronic material - Google Patents

Wet cleaning device for electronic material

Info

Publication number
JPH11176794A
JPH11176794A JP34143097A JP34143097A JPH11176794A JP H11176794 A JPH11176794 A JP H11176794A JP 34143097 A JP34143097 A JP 34143097A JP 34143097 A JP34143097 A JP 34143097A JP H11176794 A JPH11176794 A JP H11176794A
Authority
JP
Japan
Prior art keywords
cleaning
cleaning liquid
cleaning agent
circulation line
gas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP34143097A
Other languages
Japanese (ja)
Other versions
JP3797775B2 (en
Inventor
Hiroshi Morita
博志 森田
Junichi Ida
純一 井田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kurita Water Industries Ltd
Original Assignee
Kurita Water Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kurita Water Industries Ltd filed Critical Kurita Water Industries Ltd
Priority to JP34143097A priority Critical patent/JP3797775B2/en
Publication of JPH11176794A publication Critical patent/JPH11176794A/en
Application granted granted Critical
Publication of JP3797775B2 publication Critical patent/JP3797775B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To eliminate occurrence of bubbles in a cleaning bath, by a method wherein a deairing device is provided in a cleaning agent circulation line in a wet cleaning device for an electronic material. SOLUTION: An embodiment comprises a batch type cleaning bath 1, and a cleaning agent circulation line 3 which extracts a cleaning agent by a circulation pump 2 near the cleaning bath and returns again to the cleaning bath, and a deairing device 4 and a purifying device 5 of a cleaning agent are provided in a cleaning agent circulation line. In this deairing device 4, a gas transmitting film module is connected to a vacuum pump 6, and a filter is used in a cleaning device 5 of a cleaning agent. Here, the cleaning agent extracted from the batch type cleaning bath 1 is supplied with pressure by the circulation pump 2, and is returned again to the cleaning bath 1 through the deairing device 5 and the purifying device 5 of the cleaning agent. As the deairing device 4 is provided in the cleaning agent circulation line, a gas component dissolved in the cleaning agent is reduced to a degree of saturation or less in atmospheric pressure, with the result that occurrence of gas in the cleaning bath can be suppressed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、電子材料用ウェッ
ト洗浄装置に関する。さらに詳しくは、本発明は、半導
体用シリコン基板、液晶用ガラス基板などの電子材料の
表面を清浄化するための電子材料用ウェット洗浄装置に
関する。
The present invention relates to a wet cleaning apparatus for electronic materials. More particularly, the present invention relates to a wet cleaning apparatus for electronic materials for cleaning the surface of electronic materials such as silicon substrates for semiconductors and glass substrates for liquid crystals.

【0002】[0002]

【従来の技術】電子材料用の洗浄液としては、過酸化水
素をベースとするRCA洗浄液をはじめ、超純水自体
や、酸、アルカリ、酸化剤、還元剤などを溶解し、pHや
酸化還元電位を調整した超純水などが使用されている。
バッチ式のウェット洗浄方式において、洗浄液の消費量
を低減するために、洗浄槽から洗浄液をポンプにより引
き抜き、フィルターによるろ過を経て再度洗浄槽に供給
する循環システムが採用されている。近年、イオン交換
機能を有する膜モジュールにより、洗浄液中の金属不純
物も除去することができるようになり、循環システムの
採用はますます広がっている。電子材料用の洗浄液を用
いて電子材料を洗浄するとき、気体が洗浄液に溶解する
場合がある。特に、洗浄液が循環して使用される系にお
いては、加圧又は減圧の状態が多かれ少なかれ生じ、洗
浄液中に気泡が発生しやすい。また、洗浄液の成分が分
解してガス化するものでは気泡が発生しやすい。例え
ば、過酸化水素を含有する洗浄液では、過酸化水素が自
己分解して酸素となり、気泡が発生しやすくなる。洗浄
液中に気泡が発生すると、微細な気泡が被洗浄物である
電子材料の表面に付着し、気泡の表面に集合する異物で
被洗浄物を汚染してしまうという問題がある。特に、フ
ッ化水素酸を含む洗浄液の場合は、洗浄された固体表面
が疎水性になって、気泡が固体表面に付着しやすくな
り、固体表面を再汚染することになりやすい。
2. Description of the Related Art Cleaning solutions for electronic materials include RCA cleaning solutions based on hydrogen peroxide, ultrapure water itself, and acids, alkalis, oxidizing agents, reducing agents, and the like. Adjusted ultrapure water is used.
In the batch-type wet cleaning method, a circulation system is used in which the cleaning liquid is drawn out of the cleaning tank by a pump and supplied to the cleaning tank again after being filtered by a filter in order to reduce consumption of the cleaning liquid. In recent years, a membrane module having an ion exchange function has made it possible to remove metal impurities in a cleaning solution, and the use of a circulation system has been spreading more and more. When an electronic material is cleaned using a cleaning liquid for an electronic material, gas may be dissolved in the cleaning liquid. In particular, in a system in which the cleaning liquid is circulated and used, a pressurized or depressurized state is more or less generated, and bubbles are easily generated in the cleaning liquid. In the case where the components of the cleaning liquid are decomposed and gasified, bubbles are easily generated. For example, in a cleaning solution containing hydrogen peroxide, the hydrogen peroxide self-decomposes into oxygen, and bubbles are easily generated. When air bubbles are generated in the cleaning liquid, there is a problem that fine air bubbles adhere to the surface of the electronic material, which is the object to be cleaned, and contaminate the object to be cleaned with foreign substances that collect on the surface of the bubbles. In particular, in the case of a cleaning liquid containing hydrofluoric acid, the cleaned solid surface becomes hydrophobic, air bubbles easily adhere to the solid surface, and the solid surface is likely to be re-contaminated.

【0003】[0003]

【発明が解決しようとする課題】本発明は、半導体用シ
リコン基板、液晶用ガラス基板などの電子材料の表面を
清浄化するための電子材料用ウェット洗浄工程におい
て、洗浄槽における気泡の発生を皆無にすることができ
る電子材料用ウェット洗浄装置を提供することを目的と
してなされたものである。
SUMMARY OF THE INVENTION The present invention provides an electronic material wet cleaning process for cleaning the surface of an electronic material such as a silicon substrate for a semiconductor or a glass substrate for a liquid crystal. An object of the present invention is to provide a wet cleaning device for electronic materials that can be used as a cleaning device.

【0004】[0004]

【課題を解決するための手段】本発明者らは、上記の課
題を解決すべく鋭意研究を重ねた結果、洗浄槽と洗浄槽
の液を引き抜いて再度洗浄槽に戻す洗浄液循環ラインと
を有する電子材料用ウェット洗浄装置において、洗浄液
循環ラインに脱気装置を設けて、洗浄液中に溶解してい
る気体の量を大気圧における飽和度以下とすることによ
り、洗浄槽における気泡の発生を防止することが可能と
なることを見いだし、この知見に基づいて本発明を完成
するに至った。すなわち、本発明は、(1)洗浄槽と、
洗浄槽より洗浄液を引き抜いて再度洗浄槽に返送する洗
浄液循環ラインとを有する電子材料用ウェット洗浄装置
において、洗浄液循環ラインに脱気装置が設けられてな
ることを特徴とする電子材料用ウェット洗浄装置、を提
供するものである。さらに、本発明の好ましい態様とし
て、(2)脱気装置が、気体透過膜モジュールと減圧系
からなる第(1)項記載の電子材料用ウェット洗浄装置、
(3)洗浄液循環ラインに、洗浄液の浄化装置が設けら
れてなる第(1)項記載の電子材料用ウェット洗浄装置、
(4)洗浄液の浄化装置が、脱気装置の下流側に設けら
れてなる第(3)項記載の電子材料用ウェット洗浄装置、
及び、(5)洗浄液の浄化装置がフィルターである第
(3)項記載の電子材料用ウェット洗浄装置、を挙げるこ
とができる。
Means for Solving the Problems The present inventors have made intensive studies to solve the above-mentioned problems, and as a result, have a cleaning tank and a cleaning liquid circulation line for extracting the liquid from the cleaning tank and returning it to the cleaning tank again. In a wet cleaning apparatus for electronic materials, a deaerator is provided in a cleaning liquid circulation line to reduce the amount of gas dissolved in the cleaning liquid to a saturation degree or less at atmospheric pressure, thereby preventing generation of bubbles in the cleaning tank. It has been found that the present invention can be achieved, and the present invention has been completed based on this finding. That is, the present invention provides (1) a cleaning tank,
A wet cleaning apparatus for electronic materials, comprising: a cleaning liquid circulation line for extracting a cleaning liquid from a cleaning tank and returning the cleaning liquid to the cleaning tank again, wherein a deaerator is provided in the cleaning liquid circulation line. , Is provided. Further, as a preferred embodiment of the present invention, (2) the wet cleaning device for electronic materials according to (1), wherein the degassing device comprises a gas permeable membrane module and a decompression system.
(3) The wet cleaning apparatus for electronic materials according to (1), wherein a cleaning liquid purification device is provided in the cleaning liquid circulation line.
(4) The wet cleaning device for an electronic material according to (3), wherein the cleaning liquid purifying device is provided downstream of the deaerator.
And (5) the cleaning liquid purifying device is a filter.
The wet cleaning device for electronic materials according to the item (3) can be used.

【0005】[0005]

【発明の実施の形態】本発明の電子材料用ウェット洗浄
装置は、洗浄槽と、洗浄槽より洗浄液を引き抜いて再度
洗浄槽に返送する洗浄液循環ラインとを有し、さらに洗
浄液循環ラインに脱気装置が設けられてなるものであ
る。本発明装置に用いる洗浄液には特に制限はなく、例
えば、過酸化水素を溶解した超純水、塩酸と過酸化水素
を溶解した超純水、硫酸と過酸化水素を溶解した超純
水、フッ化水素酸と過酸化水素を溶解した超純水、アン
モニアと過酸化水素を溶解した超純水、フッ化水素酸水
溶液などを挙げることができる。本発明装置の洗浄液循
環ラインに設ける脱気装置には特に制限はなく、例え
ば、気相を減圧状態にした減圧タンクを設けることがで
き、あるいは、気体透過膜モジュールを設けることもで
きる。気体透過膜モジュールは、膜の一方の側に循環し
ている洗浄液を通液し、膜の他方の側を真空ポンプで吸
引して減圧とし、洗浄液中の気体を膜の液相側から気相
側に透過させて分離するものである。脱気装置として
は、気体透過膜モジュールと減圧系の組み合わせを好適
に使用することができる。気体透過膜モジュールは、洗
浄液中に含まれる薬品に対して耐久性を有するものであ
ることが好ましい。
BEST MODE FOR CARRYING OUT THE INVENTION The wet cleaning apparatus for electronic materials of the present invention has a cleaning tank, a cleaning liquid circulation line for extracting the cleaning liquid from the cleaning tank and returning the cleaning liquid to the cleaning tank again. An apparatus is provided. There is no particular limitation on the cleaning liquid used in the apparatus of the present invention. Examples of the cleaning liquid include ultrapure water in which hydrogen peroxide is dissolved, ultrapure water in which hydrochloric acid and hydrogen peroxide are dissolved, ultrapure water in which sulfuric acid and hydrogen peroxide are dissolved, and hydrofluoric acid. Examples include ultrapure water in which hydrofluoric acid and hydrogen peroxide are dissolved, ultrapure water in which ammonia and hydrogen peroxide are dissolved, and an aqueous solution of hydrofluoric acid. There is no particular limitation on the deaerator provided in the cleaning liquid circulation line of the apparatus of the present invention. For example, a decompression tank in which the gas phase is decompressed can be provided, or a gas permeable membrane module can be provided. In the gas permeable membrane module, the cleaning liquid circulating on one side of the membrane is passed, the other side of the membrane is suctioned by a vacuum pump to reduce the pressure, and the gas in the cleaning liquid is vapor-phased from the liquid phase side of the membrane. It is transmitted to the side and separated. As the deaerator, a combination of a gas permeable membrane module and a decompression system can be suitably used. It is preferable that the gas permeable membrane module has durability against chemicals contained in the cleaning liquid.

【0006】気体透過膜モジュールは、循環ポンプの吐
き出し側に設置することが好ましい。気体透過膜モジュ
ールの気相部を減圧することにより、薬液に大気圧にお
ける飽和度以上に溶解した気体成分、例えば、過酸化水
素の分解により生成した酸素などを除去することができ
る。気相部を過度に減圧にすると、洗浄液中の薬剤の分
解が促進される場合がある。洗浄液中の気体は、大気圧
における飽和度を超えない濃度まで脱気されれば、洗浄
槽において気泡を発生することがないので、大気圧にお
ける飽和度以下まで溶存気体を減らす程度の脱気にとど
めることが好ましい。なお、洗浄液中の気体の飽和度と
は、水中に溶解している気体の量を、大気圧、常温にお
ける気体の溶解量で除した値である。例えば、圧力10
5Pa、温度20℃で空気と接して平衡状態にある水
は、窒素15.4mg/リットル及び酸素8.8mg/リット
ルを溶解して飽和度1.0倍の状態となっているので、
脱気により気体の溶解量を窒素12.3mg/リットル、
酸素7.0mg/リットルとした水の飽和度は、0.8倍で
ある。洗浄液中の気体の飽和度を0.8倍程度とするこ
とにより、洗浄槽における気泡の発生を確実に防止する
ことができる。本発明装置においては、洗浄液循環ライ
ンに、洗浄液の浄化装置を設けることが好ましい。洗浄
液の浄化装置には特に制限はなく、洗浄液中に含まれる
汚染物に応じて適宜選択することができる。循環する洗
浄液は、洗浄槽で被洗浄物に付着した汚染物を洗浄、除
去したものであり、洗浄液中にその汚染物が含まれる。
汚染物としては、例えば、微粒子、金属、有機物などが
存在する。洗浄液の浄化装置としては、例えば、フィル
ター、イオン交換機能を有するフィルター、イオン交換
器、紫外線照射装置を備えた有機物分解装置などを挙げ
ることができる。洗浄液の浄化装置は、脱気装置の下流
側に設けることが好ましい。洗浄液の浄化装置を脱気装
置の下流側に設けることにより、脱気装置において微粒
子などが発生した場合にも、洗浄液の浄化装置において
除去することができる。
The gas permeable membrane module is preferably installed on the discharge side of the circulation pump. By reducing the pressure in the gas phase portion of the gas permeable membrane module, gas components dissolved in the chemical solution at a saturation level or higher at atmospheric pressure, for example, oxygen generated by decomposition of hydrogen peroxide can be removed. If the pressure in the gas phase is excessively reduced, the decomposition of the drug in the cleaning liquid may be promoted. If the gas in the cleaning liquid is degassed to a concentration that does not exceed the saturation at atmospheric pressure, no bubbles will be generated in the cleaning tank. It is preferable to stop. The saturation of the gas in the cleaning liquid is a value obtained by dividing the amount of gas dissolved in water by the amount of gas dissolved at atmospheric pressure and normal temperature. For example, pressure 10
Water in equilibrium with air at 5 Pa and a temperature of 20 ° C. dissolves 15.4 mg / liter of nitrogen and 8.8 mg / liter of oxygen and has a saturation state of 1.0 times.
By degassing, the dissolved amount of gas is 12.3 mg / liter of nitrogen,
The saturation of water with 7.0 mg / liter of oxygen is 0.8 times. By setting the degree of saturation of the gas in the cleaning liquid to about 0.8 times, the generation of bubbles in the cleaning tank can be reliably prevented. In the apparatus of the present invention, it is preferable to provide a cleaning liquid purifying device in the cleaning liquid circulation line. The cleaning liquid purifying apparatus is not particularly limited, and can be appropriately selected according to contaminants contained in the cleaning liquid. The circulating cleaning liquid is obtained by cleaning and removing contaminants attached to the object to be cleaned in the cleaning tank, and the cleaning liquid contains the contaminants.
Examples of the contaminants include fine particles, metals, and organic substances. Examples of the cleaning liquid purifying device include a filter, a filter having an ion exchange function, an ion exchanger, an organic matter decomposing device equipped with an ultraviolet irradiation device, and the like. The cleaning liquid purifying device is preferably provided downstream of the deaerator. By providing the cleaning liquid purifying device downstream of the degassing device, even if fine particles and the like are generated in the degassing device, the particles can be removed by the cleaning liquid purifying device.

【0007】図1は、本発明の電子材料用ウェット洗浄
装置の一態様の工程系統図である。本態様の装置は、バ
ッチ式洗浄槽1と、洗浄槽より循環ポンプ2により洗浄
液を引き抜いて、再度洗浄槽に返送する洗浄液循環ライ
ン3とを有し、洗浄液循環ラインには脱気装置4と洗浄
液の浄化装置5が設けられている。脱気装置は、気体透
過膜モジュールに真空ポンプ6を接続したものであり、
洗浄液の浄化装置にはフィルターが用いられている。バ
ッチ式洗浄槽から引き抜かれた洗浄液は、循環ポンプに
より圧送され、脱気装置及び洗浄液の浄化装置を経て、
再び洗浄槽に返送される。脱気装置を設けないと、引き
抜きの際に巻き込んだ微量の気泡や、過酸化水素などの
洗浄液成分の自己分解により発生した溶存気体は、ポン
プの吐き出し側では一時的に加圧状態となるので洗浄液
に溶解するが、大気圧の洗浄槽に戻されたのちには、飽
和度を超える気体成分が気泡となり、被洗浄物の表面に
付着する。洗浄液循環ラインに脱気装置を設けることに
より、洗浄液中に溶解している気体成分を、大気圧にお
ける飽和度以下に低減して、洗浄槽における気泡の発生
を抑止することができる。気泡の発生を抑止することに
より、被洗浄物の表面に気泡が付着し、さらに気泡の表
面に異物が集合して、被洗浄物が再汚染されることを防
止することが可能となる。
FIG. 1 is a process flow diagram of one embodiment of the wet cleaning apparatus for electronic materials according to the present invention. The apparatus of the present embodiment has a batch type cleaning tank 1 and a cleaning liquid circulation line 3 for extracting a cleaning liquid from the cleaning tank with a circulation pump 2 and returning the cleaning liquid to the cleaning tank again. A cleaning liquid purifier 5 is provided. The deaerator has a vacuum pump 6 connected to a gas permeable membrane module,
A filter is used in the cleaning liquid purifying apparatus. The cleaning liquid drawn out of the batch-type cleaning tank is pumped by a circulation pump, passes through a deaerator and a cleaning liquid purifying apparatus,
It is returned to the washing tank again. Without a degassing device, trace air bubbles entrained during extraction and dissolved gas generated by the self-decomposition of cleaning liquid components such as hydrogen peroxide will be temporarily pressurized on the discharge side of the pump. Although dissolved in the cleaning liquid, after returning to the cleaning tank at atmospheric pressure, gas components exceeding the saturation level become bubbles and adhere to the surface of the object to be cleaned. By providing a deaerator in the cleaning liquid circulation line, gas components dissolved in the cleaning liquid can be reduced to a degree of saturation or less at atmospheric pressure, and generation of bubbles in the cleaning tank can be suppressed. By suppressing the generation of air bubbles, it is possible to prevent the air bubbles from adhering to the surface of the object to be cleaned and the foreign substances from collecting on the surface of the air bubbles to recontaminate the object to be cleaned.

【0008】[0008]

【発明の効果】本発明の電子材料用ウェット洗浄装置を
用いることにより、洗浄槽内の洗浄液中で微細な気泡が
発生することがなく、気泡に起因する被洗浄物の再汚染
や、洗浄不良を防止することができる。
By using the wet cleaning apparatus for electronic materials according to the present invention, fine bubbles are not generated in the cleaning liquid in the cleaning tank, and re-contamination of the object to be cleaned and defective cleaning caused by the bubbles are prevented. Can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】図1は、本発明の電子材料用ウェット洗浄装置
の一態様の工程系統図である。
FIG. 1 is a process flow diagram of one embodiment of an electronic material wet cleaning apparatus of the present invention.

【符号の説明】[Explanation of symbols]

1 バッチ式洗浄槽 2 循環ポンプ 3 洗浄液循環ライン 4 脱気装置 5 洗浄液の浄化装置 6 真空ポンプ DESCRIPTION OF SYMBOLS 1 Batch type cleaning tank 2 Circulation pump 3 Cleaning liquid circulation line 4 Deaerator 5 Cleaning liquid purification device 6 Vacuum pump

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】洗浄槽と、洗浄槽より洗浄液を引き抜いて
再度洗浄槽に返送する洗浄液循環ラインとを有する電子
材料用ウェット洗浄装置において、洗浄液循環ラインに
脱気装置が設けられてなることを特徴とする電子材料用
ウェット洗浄装置。
In a wet cleaning apparatus for an electronic material having a cleaning tank and a cleaning liquid circulation line for extracting a cleaning liquid from the cleaning tank and returning the cleaning liquid to the cleaning tank again, a deaerator is provided in the cleaning liquid circulation line. Characteristic wet cleaning equipment for electronic materials.
JP34143097A 1997-12-11 1997-12-11 Wet cleaning device for electronic material and processing method for cleaning liquid for electronic material Expired - Fee Related JP3797775B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP34143097A JP3797775B2 (en) 1997-12-11 1997-12-11 Wet cleaning device for electronic material and processing method for cleaning liquid for electronic material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP34143097A JP3797775B2 (en) 1997-12-11 1997-12-11 Wet cleaning device for electronic material and processing method for cleaning liquid for electronic material

Publications (2)

Publication Number Publication Date
JPH11176794A true JPH11176794A (en) 1999-07-02
JP3797775B2 JP3797775B2 (en) 2006-07-19

Family

ID=18346023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP34143097A Expired - Fee Related JP3797775B2 (en) 1997-12-11 1997-12-11 Wet cleaning device for electronic material and processing method for cleaning liquid for electronic material

Country Status (1)

Country Link
JP (1) JP3797775B2 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195632A (en) * 1997-12-29 1999-07-21 Mitsubishi Electric Corp Cleaning method using hydrochloric acid-hydrogen peroxide solution
JP2002370060A (en) * 2001-06-13 2002-12-24 Fuji Photo Film Co Ltd Deaeration system of coating liquid and deaeration method for coating liquid
KR101154094B1 (en) * 2008-06-03 2012-06-11 시바우라 메카트로닉스 가부시키가이샤 Microbubble generating device, microbubble generating method, and substrate processing device
JP2017189739A (en) * 2016-04-13 2017-10-19 オルガノ株式会社 Deaeration method and device of liquid medicine
WO2018022370A1 (en) * 2016-07-25 2018-02-01 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11195632A (en) * 1997-12-29 1999-07-21 Mitsubishi Electric Corp Cleaning method using hydrochloric acid-hydrogen peroxide solution
JP2002370060A (en) * 2001-06-13 2002-12-24 Fuji Photo Film Co Ltd Deaeration system of coating liquid and deaeration method for coating liquid
KR101154094B1 (en) * 2008-06-03 2012-06-11 시바우라 메카트로닉스 가부시키가이샤 Microbubble generating device, microbubble generating method, and substrate processing device
JP2017189739A (en) * 2016-04-13 2017-10-19 オルガノ株式会社 Deaeration method and device of liquid medicine
WO2018022370A1 (en) * 2016-07-25 2018-02-01 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof
US10935896B2 (en) 2016-07-25 2021-03-02 Applied Materials, Inc. Cleaning solution mixing system with ultra-dilute cleaning solution and method of operation thereof

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