JPH11176712A - Method for laying out semiconductor manufacture factory - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the laying out method of a semiconductor manufacture factory carrying in/out facilities so that troubles will not occur in the manufacture of other products on the laying out method of the semiconductor manufacture factory. SOLUTION: A specified facility constituting part, where the facilities required for the manufacture of the respective products is arranged at the periphery of a common facility constitution part 10 in which the facilities used in common to all the products are installed. Private facility carry-in/out ports are provided for the respective facility constituting parts. Thus, reduction in production quantity and delays in production completion due to the carry-in/out of the facilities can be suppressed for preventing the manufacture of the other products from being stopped at the carrying of in/out the facilities.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement in a layout method of a semiconductor manufacturing factory for processing a semiconductor wafer.

2. Description of the Related Art The progress of semiconductor manufacturing technology is remarkable, and the market for semiconductor components is rapidly changing. Therefore, the types and types of products manufactured at semiconductor manufacturing plants are frequently changed and functions are improved. The present invention relates to a layout method of a semiconductor factory that enables easy replacement.

[0003]

2. Description of the Related Art As shown in FIG. 7, a conventional layout method for a semiconductor manufacturing plant is composed of a single clean room including a photo process 110, an etching process 120, and an ion implantation process 1.
30, the oxidation diffusion step 140, the CVD step 150, etc.
60 is common to each process, and when carrying in / out the facilities, it is necessary to move not only the facilities of the process where the facilities are carried in / out, but also the facilities of the adjacent process. In addition, since various chemicals are used through pipes in the manufacture of semiconductors, it is necessary to stop equipment that shares necessary chemicals for the loading and unloading equipment. I was In addition, since all products are manufactured in equipment installed in the same area, the cleanliness of each process must be adjusted to the product that requires the highest cleanliness,
The operating cost of the clean room was expensive.

Conventionally, as shown in Japanese Patent Application Laid-Open No. 4-240714, a processing plant divided for each process is installed radially around a management building, so that land use efficiency is poor. In addition, since the independence of each process is maintained, it is only necessary to move or stop the equipment at the time of loading and unloading the equipment, but in the manufacture of semiconductors, most products perform processing in all steps. , 1 every time the equipment is carried in and out
If the process stopped, the production of most products was hindered. In addition, since all products are produced using equipment installed in the same process factory, the cleanliness of each factory must be adjusted to the products that require the highest level of cleanliness. I was

[0005]

In the conventional layout method of a semiconductor manufacturing plant described above, one clean room is partitioned for each process, so that the equipment entrance and exit are common to each process, and the equipment transportation is carried out. In such a case, it was necessary to move not only the equipment in the process where the equipment was loaded and unloaded, but also the equipment in the adjacent process, which increased the cost of moving the equipment and stopped the production of products using the moving equipment. Or had a problem. In addition, since various chemicals are used in the manufacture of semiconductors through pipes, it is necessary to stop equipment that shares chemicals required for loading and unloading equipment,
There have been problems such as the stoppage of production of various products, a decrease in the number of products produced, and a delay in completion. In addition, since all products are manufactured using equipment installed in the same area, the cleanliness of each process must be adjusted to the products that require the highest cleanliness, resulting in high operating costs for clean rooms. was there.

In the conventional layout method of a semiconductor manufacturing factory, since each processing factory is radially arranged around the management building, there is a problem that land use efficiency is poor. Also,
In semiconductor manufacturing, the majority of products are processed in all processes, so if even a few units in the process of loading and unloading equipment are stopped, there is a problem that production of most products will be stopped. . In addition, since all products are produced using equipment installed in the same process factory, the cleanliness of each factory must be adjusted to the products that require the highest level of cleanliness, resulting in high operating costs for clean rooms. There was a problem.

The present invention has been made in view of the above circumstances, and has as its object to provide a layout method of a semiconductor manufacturing plant that allows loading and unloading of equipment so that production of other products does not become disturbed when semiconductor manufacturing equipment is changed. Things.

[0008]

According to the layout method of a semiconductor manufacturing factory of the present invention, the factory is divided into a common equipment component and a specific equipment component for each product. It is configured to provide a loading / unloading port for the equipment.

Further, the layout method of a semiconductor manufacturing plant according to the present invention is configured such that a specific equipment component for each product is arranged around the common equipment component, centering on the common equipment component.

Further, the layout method of a semiconductor manufacturing factory according to the present invention is configured so that the outer shape of the entire factory is rectangular.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A layout method of a semiconductor manufacturing plant according to a first embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view showing a first embodiment of a layout method of a semiconductor manufacturing plant according to the present invention, and is a common equipment component 10 in which equipment commonly used by all products is installed.
, Flash memory equipment components 20, 4G, which are specific equipment components that collect equipment necessary for the production of each product.
A bit DRAM facility configuration section 30, a 1 Gbit DRAM facility configuration section 40, a microcomputer facility configuration section 50, and a gate array facility configuration section 60 are arranged. Each equipment component 20-6
0 is provided with an equipment entrance 160 and a semiconductor storage shelf 170 for storing products being manufactured. The interior of the common equipment component 10 includes a photo process 110, an etching process 120,
Ion implantation step 130, oxidation diffusion step 140, CV
As in the D step 150, the manufacturing facilities are collectively installed for each step, and each step is provided with a semiconductor storage shelf 170 for storing a product being manufactured.

FIG. 2 is a side view showing the structure of a semiconductor manufacturing plant according to the first embodiment of the present invention, and arrows in the figure show the flow of air. The fan filter unit 200 removes dust in the air in the factory, and flows clean air downward. The air having a high degree of cleanness passes through the installation area of the semiconductor manufacturing apparatus 210 and has an aperture ratio of 30.
After passing through the grating 260, which is a child-like floor of 簀 60%, it is sent up the fan-filter unit 200 again in the area without equipment. A pipe 23 for supplying a chemical to the semiconductor manufacturing equipment 210 is provided below the grating 260.
And a pump 220 for evacuating the inside of the semiconductor manufacturing facility 210. The operator 250 transports the wafer carrier 240 accommodating the semiconductor wafer to the semiconductor manufacturing facility 210 or a semiconductor storage shelf (not shown) or operates the semiconductor manufacturing facility 210. Also, as in the present embodiment, the fan filter unit 2
By changing the installation density of 00 depending on the location, it is possible to set the cleanness for each area.

Various chemicals are required for the manufacture of semiconductors, and pipes for supplying the chemicals are shared by a plurality of facilities. In addition, semiconductors that are being manufactured become defective due to the adhesion of dust, so that semiconductors must be manufactured in an area with high cleanliness. In addition, because the maintenance and operation costs of the clean room are expensive, each manufacturing facility is installed close to each other in order to make effective use of the clean room. Must. For this reason, when loading and unloading equipment, equipment that shares piping with the loading and unloading equipment and equipment near the equipment being loaded and unloaded must be stopped or moved.

As shown in FIG. 1, each equipment component is provided with an equipment loading / unloading port 160, so that only the equipment of the equipment component of the product to be carried in and out needs to be stopped, so that the production of other products can be stopped. Has no effect. For example, in order to increase the production of flash memory,
If you want to add more equipment to the
It is necessary to stop some or all of the facilities within 0,
4G bit DRAM equipment configuration unit 30, 1G bit DRA
Since the facilities of the M component construction unit 40, the microcomputer facility construction unit 50, and the gate array facility construction unit 60 of the other product construction units are independent of each other, there is no effect on the production of other products.
In addition, for example, even when the equipment for a product whose production has been stopped is collectively carried out or the equipment for a new product is collectively carried in, production of only one specific equipment component is stopped, and another common equipment component is stopped. The production of the specific equipment component for the product can be continued, so that the production of other products is not hindered. For this reason, in the present embodiment, it is possible to suppress a decrease in production volume and a delay in product completion. In addition, since the number of moving facilities can be reduced, the cost of moving the facilities can also be reduced. Further, in this embodiment, since a plurality of products are produced in one factory, the equipment can be used more effectively than in a separate factory for each product. Because it can be secured, investment costs can be reduced.

Semiconductors have different manufacturing processes depending on their products, and require different degrees of cleanliness. For example, a 1 Gbit DRAM can be produced in cleanliness class 1,
G-bit DRAMs cannot be produced unless the cleanliness class is 0.1. Conventionally, since all products are produced in the same area, the degree of cleanliness is set according to the product that requires the highest degree of cleanliness. In this embodiment, since the equipment components are divided for each product, the equipment components can be set to the degree of cleanliness required by each product, so that the clean room operating cost can be reduced as compared with the conventional case.

The specific equipment component of this embodiment is, for example, a flash memory equipment component 20, a 4 Gbit D
Although the RAM equipment component 30, the 1-Gbit DRAM equipment component 40, the microcomputer equipment component 50, and the gate array equipment component 60, the present invention requires only five specific equipment components.
It is possible to increase or decrease according to the number of products to be produced, without being limited to the above case.

FIG. 3 is a plan view of another embodiment of the present invention. This embodiment is an example in which the equipment entrance / exit 160 for the common equipment constituent part 10 is provided in the first embodiment. The loading / unloading of the equipment of the common equipment constituent part 10 is easier than in the first embodiment. ing. In this embodiment, the same effect as in the first embodiment can be expected.

FIG. 4 is a plan view of another embodiment. This embodiment is a modification of the first embodiment, in which the flash memory facility configuration unit 20 is connected to a 1 Gbit DRAM facility configuration unit 40. The advantage of this embodiment is that the flash memory equipment component 20 and the 1G
Since the production equipment is shared with the bit DRAM equipment configuration unit 40, the equipment operation rate can be increased and the production efficiency can be improved by sharing the equipment with a plurality of products. Increase production 1
It is easy to increase or decrease the production of each product, such as reducing the production of G-bit DRAMs. Naturally, the same effects as in the first embodiment can be expected. In this embodiment, the independence between the equipment components is deteriorated as compared with the first embodiment. Therefore, there is a possibility that the number of products whose production is stopped by carrying in / out the equipment may increase. By setting the time to, it is possible to adjust the equipment loading / unloading timing of both equipment constituent parts and shorten the equipment stoppage time.

FIG. 5 shows a common equipment configuration unit 10, a flash memory equipment configuration unit 20, and a 4 Gbit DRAM equipment configuration unit 3.
FIG. 2 is a plan view of an embodiment in which a 0- and 1-Gbit DRAM equipment configuration unit 40, a microcomputer equipment configuration unit 50, and a gate array equipment configuration unit 60 are installed in parallel, and the outer shape of the factory is rectangular.
In the present embodiment, the area is divided for each equipment component and the equipment entrance 160 is provided for each equipment component, so that the same effect as in the first embodiment is obtained. Further, in the present embodiment, since the outer shape of the factory is made rectangular, a wedge-shaped land which cannot be used as a factory as in the first embodiment can be eliminated, and there is an advantage that the land use efficiency is improved.

FIG. 6 shows that the common equipment component 10 is installed on the first floor, and the flash memory equipment component 20 and the 4 Gbit DR
AM equipment constituent part 30, 1 Gbit DRAM equipment constituent part 4
FIG. 2 is a perspective view of an embodiment in which a microcomputer facility configuration unit 50 and a gate array facility configuration unit 60 are installed on the second floor. In this embodiment, since it is necessary to transport between layers, the lifting device 180 is installed in each equipment component. Also in this embodiment, since the area is divided for each equipment component and the equipment entrance 160 is provided for each equipment component, the same effect as the embodiment shown in FIG. 5 can be expected.

[0021]

As is apparent from the above description, according to the present invention, a factory is divided into a common equipment component and a specific equipment component for each product, and the specific equipment component is The equipment is designed to have a loading / unloading entrance, so the production of other products is not stopped when loading / unloading the equipment. Can reduce the cost of operating a clean room, reduce the number of equipment to be moved when loading and unloading equipment, reduce the cost of loading and unloading equipment, and improve production efficiency because multiple products can be produced at one factory. Since the investment can be reduced and the external shape of the factory is made rectangular, there is an advantage that land use efficiency is increased, and it is possible to provide a layout method of a semiconductor manufacturing factory which can expect remarkable economic effect and productivity improvement.

[Brief description of the drawings]

FIG. 1 is a plan view of a layout method of a semiconductor manufacturing plant according to a first embodiment of the present invention.

FIG. 2 is a side view of the semiconductor manufacturing plant showing the first embodiment of the present invention.

FIG. 3 is a plan view illustrating a layout method of a semiconductor manufacturing plant according to a second embodiment of the present invention.

FIG. 4 is a plan view showing a layout method of a semiconductor manufacturing plant according to a third embodiment of the present invention.

FIG. 5 is a plan view illustrating a layout method of a semiconductor manufacturing plant according to a fourth embodiment of the present invention.

FIG. 6 is a perspective view illustrating a layout method of a semiconductor manufacturing plant according to a fifth embodiment of the present invention.

FIG. 7 is a plan view illustrating an example of a conventional layout method for a semiconductor manufacturing plant.

[Explanation of symbols]

Reference numeral 10: Common equipment constituent part, 20: Flash memory equipment constituent part, 30: 4 Gbit DRAM equipment constituent part, 4
0: 1 Gbit DRAM equipment constituent part, 50: microcomputer equipment constituent part, 60: gate array equipment constituent part, 110
... Photo process, 120 ... Etching process, 130 ... Ion implantation process, 140 ... Oxidation diffusion process, 150 ...
CVD process, 160: equipment loading / unloading, 170: semiconductor storage shelf, 180: elevating device, 200: fan filter unit, 210: semiconductor manufacturing equipment, 220: pump, 230: piping 240: wafer carrier, 250: worker, 260
… Grating.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Toyohide Hamada 5-2-1, Josuihonmachi, Kodaira-shi, Tokyo In the semiconductor division of Hitachi, Ltd.

Claims (4)

[Claims] 1. A layout method for a semiconductor manufacturing plant, wherein the semiconductor manufacturing plant is divided into a common equipment component and a specific equipment component for each product. 2. A layout method for a semiconductor manufacturing plant according to claim 1, wherein said specific equipment component is provided with a loading / unloading port for each equipment. 3. The semiconductor according to claim 1, wherein the specific equipment component for each product is arranged around the common equipment component centering on the common equipment component. Manufacturing factory layout method. 4. The layout method for a semiconductor manufacturing plant according to claim 1, wherein the layout of the semiconductor manufacturing plant is realized by making the outer shape of the whole factory a rectangular parallelepiped.