JPH11170547A - Ink jet printer head and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent deformation of a silicon board due to diffusion of lead in a piezoelectric ceramics produced at the time of sintering thereof in the manufacture of an ink jet printer head. SOLUTION: In an ink jet printer head for jetting liquid in a pressure chamber 2 through a nozzle 8 to the outside by displacing an electromechanical converting element part comprising a piezoelectric ceramics, an intermediate layer 3 for preventing diffusion of lead in the piezoelectric ceramics (electromechanical converting layer 5) at the time of sintering is provided on a pressure chamber substrate 1 and heat treatment for shaping the electromechanical converting layer 5 is performed at a sufficiently low temperature so that the pressure chamber substrate 1 made of silicon is not deformed due to diffusion of lead in a piezoelectric ceramics. Low temperature sintering is realized by making fine the temporary burnt powder, adding a combustion accelerator and controlling the sintering atmosphere.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet printer head for ejecting ink droplets using an electro-mechanical conversion element and a method for manufacturing the same.

[0002]

2. Description of the Related Art An actuator using an electromechanical transducer is known as one of the methods for ejecting ink droplets by applying pressure to a pressure chamber. In recent years, high-speed, high-quality, low-consumption drive, and low-cost inkjet printers have been demanded. For this reason, a large displacement can be obtained by low-voltage drive, and a large force is generated. Electrostrictive elements, diaphragm materials, and actuator configurations have been devised.

For example, Japanese Patent Application Laid-Open No. 6-40035 discloses a method of forming a pressurized chamber substrate material into a concave shape.
A piezoelectric / electrostrictive actuator with excellent manufacturability that can be formed without using an adhesive by forming a pressurizing chamber and a flow path under a piezoelectric / electrostrictive driving unit by laminating green sheets and integrally firing the same is proposed. . However, this method has problems in processing accuracy and positional accuracy at the time of bonding, and has problems in realizing high density and high integration.

On the other hand, the present applicant previously filed an application (Japanese Patent Application No. 9-107296) for an ink jet recording head and a method for manufacturing the same, and made it possible to perform anisotropic etching on recon, quartz, sapphire, oxidized The use of magnesium or the like eliminates the need for the laminating step, and enables the etching to be formed with high positional accuracy by the micromachining technology.
A high-density, highly integrated inkjet printer head with mechanical conversion elements has been proposed. Here, as a material of the electro-mechanical conversion film, a lead-based piezoelectric ceramic material such as lead zirconate titanate (hereinafter, abbreviated as PZT) generally has the highest piezoelectric performance. Is used.

[0005]

However, after forming PZT on a silicon substrate by a screen printing method,
When heat treatment (hereinafter referred to as baking) is performed for crystallization, there is a problem that lead diffuses into the silicon substrate, deforms the silicon substrate, and lowers the piezoelectric characteristics of PZT.
In the present invention, an object is to provide an electro-mechanical conversion layer which shows a displacement sufficient for discharging ink without displacing a silicon substrate by firing a piezoelectric ceramic at a low temperature.

Here, items required for lowering the temperature at the time of firing the electro-mechanical conversion layer are: 1) making the calcined powder finer, 2) adding a sintering aid, 3) controlling the firing atmosphere, Is mentioned.

In the second, third, and fourth aspects of the present invention, fine particles are formed.
In 8, 9, 10, and 11, low-temperature sintering is realized by using a sintering aid.

[0008]

According to a first aspect of the present invention, there is provided a pressure chamber substrate made of silicon having a concave portion for holding and pressurizing a liquid to be jetted, and a nozzle plate communicating with the pressure chamber substrate. An intermediate layer formed on the pressure chamber substrate;
Further, an electro-mechanical conversion element portion including a lower electrode layer, an electro-mechanical conversion layer, and an upper electrode layer is further formed thereon. In the method for manufacturing an ink jet printer head ejecting to the outside via a substrate, the electro-mechanical conversion layer is made of piezoelectric ceramics, and a heat treatment for molding does not cause deformation of the pressure chamber substrate made of silicon. This is a method for manufacturing an inkjet printer head which is performed at a low temperature.

According to a second aspect of the present invention, in the method for manufacturing an ink jet printer head according to the first aspect, the electro-mechanical conversion layer is made of a grain structure having a grain size of 0.3 to 5 μm, and The specific surface area is 7m ² /
g or more of calcined powder is pasted and printed, 700-105
This is a method for manufacturing an ink jet printer head that performs heat treatment in a temperature range of 0 ° C.

According to a third aspect of the present invention, in the method of manufacturing an ink jet printer head according to the second aspect, the calcined powder has a particle size distribution of 0.005 to 0.2 μm, an average particle size of 0.04 μm or more, This is a method for manufacturing an inkjet printer head having a size of 0.12 μm or less.

According to a fourth aspect of the present invention, there is provided a method of manufacturing an ink jet printer head according to the second aspect, wherein the calcined powder is synthesized by a hydrothermal synthesis method.

According to a fifth aspect of the present invention, there is provided a method of manufacturing an ink jet printer head according to any one of the first to fourth aspects, wherein the electro-mechanical conversion layer is heat-treated in air or helium. Is the way.

According to a sixth aspect of the present invention, in the method of manufacturing an ink jet printer head according to any one of the first to fourth aspects, the inkjet is performed by heat-treating the electro-mechanical conversion layer in helium and then heat-treating the layer in the atmosphere. This is a method for manufacturing a printer head.

According to a seventh aspect of the present invention, there is provided a method for manufacturing an ink jet printer head according to any one of the first to fourth aspects, wherein a component for forming a liquid phase during heat treatment at the time of forming the electro-mechanical conversion layer is provided. PbO, SiO ₂ , Li
A sintering aid containing at least one of CO ₃ , Bi ₂ CO ₃ , and GeO ₂ is added and sintered, and after heat treatment, the composition of the grain boundaries is compared with that of the inside of the particles by Pb, Ge, Si, Li, or Li. This is a method for manufacturing an ink jet printer head containing a large amount of Bi.

According to an eighth aspect of the present invention, the amount of the sintering aid according to the seventh aspect is 8 to the weight of the piezoelectric ceramic.
This is a method for manufacturing an ink jet printer head having an amount of not more than wt%.

According to a ninth aspect of the present invention, in the method for manufacturing an ink jet printer head according to the eighth aspect, the particle size of the supported particles is Dg, and the particle size of the supporting auxiliary particles is Di.
In this method, Di / Dg is in the following range. 0 <Di / Dg <0.8

According to a tenth aspect of the present invention, in the method for manufacturing an ink jet printer head according to the ninth aspect,
A method of manufacturing an ink jet printer head, wherein the particles carrying the sintering aid are formed by hydrolysis of a reaction precursor induced by a reaction between a metal alkoxide or a metal salt and an organic solvent.

According to an eleventh aspect of the present invention, in the method for manufacturing an ink jet printer head according to the tenth aspect, the particles carrying the sintering aid are formed by ultrafiltration. It is a manufacturing method.

A twelfth aspect of the present invention is an ink jet printer head manufactured by the method of manufacturing an ink jet printer head according to any one of the first to eleventh aspects.

[0020]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. 1 schematically shows a cross section of an embodiment of an ink jet head according to the present invention. An intermediate layer 3 is provided on a pressurized chamber substrate 1 partially having a concave portion so as to form a pressurized chamber 2, and a lower electrode layer 4, an electro-mechanical conversion layer 5,
The upper electrode layer 6 is laminated. The pressure chamber substrate 1 and the nozzle plate 7 having the nozzle 8 are joined. This configuration is shown for the sake of convenience, and a plate for closing the nozzle plate may be joined to form an ink chamber, and the nozzle plate may be joined to the end face.

Hereinafter, the manufacturing method of this embodiment will be described. FIG. 3 shows a method of manufacturing the pressurized chamber substrate 1 having a concave portion in a sectional view in the order of steps. The thickness is 300 μm and the plane orientation is (1
10) A silicon oxide film 10 serving as a silicon etching resistant film is formed on the silicon wafer 9 having a plane orientation by a thermal oxidation method (FIG. 3A). The silicon-resistant etching film is not limited to silicon oxide, and may be any film having corrosion resistance to a silicon etchant, such as silicon nitride and metal. Next, a resist 11 is applied on the oxide film by a spin coating method (FIG. 3B), and a resist pattern for forming a concave portion is formed by using a photolithography technique (FIG. 3C).

Then, after the silicon oxide film is etched with a hydrofluoric acid-based etchant, the silicon oxide film is further etched at 90.degree.
Immersed in KOH aqueous solution, anisotropically etched,
Etching is performed by μm to form a concave portion (FIG. 3D). The remaining silicon oxide film on the silicon substrate is separated with a hydrofluoric acid-based etchant (FIG. 3E). The etching amount can be controlled by controlling the concentration, temperature, and permeation time of the KOH aqueous solution in advance.

For the intermediate layer 3 on the pressurizing chamber substrate 1, zirconia, which is a dense, highly brittle, and high-mechanical-strength material in which lead of the electro-mechanical conversion layer does not diffuse, is used. The additive amount of the additive for stabilizing or partially stabilizing zirconia is 2 to 30 mol% with respect to yttrium oxide, and 5 to 5 with respect to magnesium oxide and calcium oxide.
It is preferable to use 40 mol%, 6 to 50 mol% with respect to cerium oxide, and partially or fully stabilized zirconium oxide containing at least one of these oxides. As a film forming method for forming the intermediate layer 3, a film having a thickness of 1 μm is formed by using a sputtering method having a high adhesion to the pressure chamber substrate 1.
m thickness. In the present invention, since the intermediate layer 3 is used as a lead diffusion preventing layer of the electromechanical conversion layer, a thickness of about 0.1 μm is sufficient. If the film thickness is 2 μm or more, cracks occur due to density change during firing, so the zirconia intermediate layer is formed to 2 μm or less.

Further, the lower electrode layer 4 laminated on the intermediate layer 3 has an electrode material mainly composed of a high melting point noble metal such as platinum or a white metal element (Pd, Rh, Ih, Ru), or an alloy thereof. Can be used, and platinum or an alloy thereof is preferable also from the viewpoint of stability. The lower electrode layer 4 is formed by screen printing with a thickness of 5 μm.

The electro-mechanical conversion layer 5 on the lower electrode layer 4 includes
PZT ceramics, which are piezoelectric ceramics, are preferred. In addition, lead magnesium niobate, nickel niobate, and lead manganese niobate obtained by adding a third component to PZT are used as lead antimonate stannate, and a composite material thereof. In addition, lanthanum, barium, niobium, zinc, cerium, chromium,
Cobalt, strontium, yttrium, tantalum,
Materials containing oxides such as tungsten, nickel and manganese and their compounds as additives are preferred.

Regarding the method of forming the electro-mechanical conversion layer 5,
The well-known vacuum film forming methods such as sputtering, CVD, and sol-gel complicate the process and increase the cost due to patterning by the entire surface deposition. In particular, in the sol-gel method, 1
Because the film thickness by a single application is as small as 0.1 μm or less,
In order to form a film having a thickness enough to bend the pressure chamber substrate 1, the number of coatings increases and the number of manufacturing steps increases. Further, it is difficult for the films formed by these methods to have a uniform composition in the film thickness direction, and the reproducibility of piezoelectric characteristics is poor. In contrast, PZ
Films formed by paste processing of calcined powder of a piezoelectric material such as T and screen-printing do not require a patterning step and can be formed in a thickness of 20 μm in a single printing step. The conversion layer 5 can be formed. However, heat treatment needs to be performed after paste printing.

In general, the firing of piezoelectric ceramics is
In the case of this configuration, since the intermediate layer 3, which is a lead diffusion preventing layer, does not shield lead but diffuses lead into the pressurizing chamber substrate (silicon substrate) 1, a silicon substrate is used. Is deformed. The driving force in the solid phase reaction during firing is such that the higher the free energy of the surface, that is, the smaller the particle size, the faster the sintering. From the above, in order to form the piezoelectric ceramic at a low temperature, it is essential to use fine particles. FIG. 2 is a graph showing the correlation between the specific surface area of PZT and the density for each firing temperature. As is clear from this graph, the calcined powder having a density of 7 m ² / g or less at 1050 ° C. has a low density and cannot obtain piezoelectric characteristics.

As the printing paste, a paste is prepared by mixing the above-mentioned piezoelectric ceramic powder, a resin such as ethyl cellulose and nitrocellulose, and a solvent such as terpineol and ethyl acetate. The piezoelectric paste is printed in an arbitrary pattern by screen printing. After printing, 15
After drying at 0 ° C. for 1 hour, it is placed in a firing furnace, and then
Firing at a temperature of 1050 ° C., preferably 900 to 1000 ° C. in the atmosphere. The upper electrode layer 6 is similarly formed by baking silver-palladium by screen printing.

Example 2 The average particle size defined in claim 2 is a particle size derived from the specific surface area. FIG. 4 is a graph showing the correlation between the firing temperature and the density of the piezoelectric ceramic for each average particle size. As is clear from FIG. 4, the smaller the average particle size, the more the densification at low temperature can be realized.

Example 3 Methods for producing fine particles include alkoxide method, oxalic acid method, partial chemical method, hydrothermal synthesis method and the like. The powder obtained by powder synthesis by these chemical methods is a conventional mechanical method. As compared with the preparation method of temporary baking by mechanical pulverization, the particle diameter is smaller in each case, and the baking temperature is lower by about 200 ° C. as compared with the powder of the conventional method. There is also a method of producing fine particles in a gas phase, but piezoelectric ceramics produced by a hydrothermal synthesis method are inexpensive and can form fine powder with the highest crystallinity.

Example 4 FIG. 7 shows the density of the electromechanical conversion layer when the firing atmosphere was changed under firing at 1050 ° C. for 2 hours. High density in air and helium, dense piezoelectric ceramics can be obtained, and maximum polarization and distortion are large.

Example 5 FIG. 8 shows the piezoelectric characteristics when the firing time at 900 ° C. and the post-annealing time after firing were changed. It can be seen that the post annealing time significantly improves the piezoelectric characteristics. The piezoelectric body forms a dense structure by sintering helium, and grows grains while supplementing oxygen vacancies in the air by a post-annealing time. In this case, it is most effective to bake in helium for 2 hours and then bake in air for 18 hours. FIG. 9 shows FIG.
9A shows the parameters of the piezoelectric characteristics of the piezoelectric ceramic in FIG. 9A. In FIG. 9A, Pr indicates polarization, Ec indicates electric field strength, Ps indicates maximum polarization, and FIG. The relationship between the strength and the displacement ΔL is shown.

Example 6 It has been reported that the addition of germanium lead acid or lead-boron-silicon having a low melting point and exhibiting ferroelectricity to PZT increases the dielectric constant and mechanical coupling coefficient at low temperatures (T. Ogawa,
A.Sano, A.Senda and K.Wakino: JJApplied Physics, Vo
l.28 (1989) Supplement 28-2, pp.91-94). The same effect can be obtained by adding germanium / lead silicate or lead oxide.

The method of adding Pb ₅ Ge ₃ O ₁₁ (hereinafter abbreviated as PGO) to PZT will be described below. Pb ₃ O ₄ ,
The powder reagents of TiO ₂ , ZrO ₂ , and GeO ₂ are weighed so as to correspond to the intended composition. After performing ball milling in ethanol for 24 hours, the dried powder was molded,
After firing at 0 ° C. for 10 hours in the air, the compact is pulverized, and then ball-milled again in ethanol for 24 hours. The dried powder is formed and then fired at 1000 ° C. for 10 hours in the air. Through the above steps, a calcined powder of PZT to which PGO is added is produced. These calcined powders are mixed with an organic vehicle to form a paste, which is fired after screen printing. Because PGO has a melting point of 738 ° C., it forms a liquid phase,
A dense structure is formed in order to fill gaps between particles at the grain boundaries of T. Therefore, there are more additive elements near the grain boundaries than in the grains.

Example 7 FIG. 5 is a graph showing the correlation between the amount of the combustion aid and the strain when lead oxide was added to PZT having an average particle size of 0.1 μm. When the sintering aid of lead oxide, lead germanate, or lead germanium silicon silicate is added to the piezoelectric ceramic layer in an amount of more than 8 wt% of the main component lead oxide, the piezoelectric ceramic layer is made of silicon during firing. Since the sintering assistant diffuses into the intermediate layer 3 on the substrate, the intermediate layer 3 for preventing lead diffusion cannot shield the lead and the silicon substrate 1
Lead diffuses up to. However, since the lead concentration in the piezoelectric ceramics is reduced, it is not possible to obtain the piezoelectric characteristics enough to eject ink.

Example 8 With respect to unsupported lead oxide particles which are the main component of the piezoelectric ceramics as fine particles, if the added particle size is large because the particles are supported by the unsupported lead oxide particles, they are uniformly converted into lead oxide. Because it is not coated and there are additives locally,
A uniform grain structure is not formed. On the other hand, the temperature cannot be lowered because particles having a large particle size exist. Therefore, the particle diameter Di of the particles to be supported is always smaller than the particle diameter Dg of the lead oxide which is the main component, and preferably, Di / Dg <
Preferably, it is 0.8.

Example 9 In order to add a sintering aid to the fine particles of unsupported lead oxide, which is the main component of piezoelectric ceramics, there is a method of causing the particles to react in a high-temperature plasma and deposit them. In addition, since particles having a particle size of about 1 μm are the limit,
Not applicable to the following fine particles. In addition, when the particles are supported by a mechanical mixing method, the particle size distribution after firing becomes a distribution as shown in FIG. 6 (A), and abnormal grain growth occurs during firing. Is easy to occur. According to the method defined in the tenth and eleventh aspects, fine particles of 1 μm or less can be uniformly coated and the cost is low. In addition, the particle size distribution after firing has a distribution as shown in FIG. 6B, and the reliability is high.

Hereinafter, a method of adding PGO to PZT will be described. By dissolving germanium alkoxide in ethylene glycol and water and refluxing at 90 ° C for 1 hour,
Hydrolysis and polycondensation are carried out, while lead nitrate or lead chloride is dissolved in ethylene glycol and water,
Reflux in time. Thereafter, both solutions were mixed and 9
Hydrolysis is carried out at 0 ° C. for 1 hour, mixed with PZT dissolved in water as a component, and refluxed at 90 ° C. for 1 hour.
Thus, a powder in which PZT was loaded with PGO was generated in the mixed solution. However, there is a method of drying and evaporating to remove the powder in the solvent. However, this method cannot completely remove ethylene glycol as a solvent and remains as residual organic matter in the powder. There is a problem that prevents the conclusion. Further, in ordinary filtration, the fraction is not filtered through a filter because it is a fine particle. On the other hand, when the filtration is performed under reduced pressure, the filtration efficiency is extremely poor because a pressure of 1 atm or more cannot be applied. Therefore, PZT to which PGO is added can be obtained by effectively removing ethylene glycol and water by ultrafiltration performed by applying an arbitrary pressure.

[0039]

According to the first aspect of the present invention, since the heat treatment can be performed within a temperature range that can withstand without deformation of the silicon substrate, a highly reliable, low-cost, high-density inkjet printer head can be obtained. .

According to the second and third aspects of the present invention, the use of the fine piezoelectric ceramic powder enables the heat treatment to be performed within a temperature range in which the silicon substrate can withstand without deformation, thereby obtaining a highly reliable ink jet printer head. Can be

According to the fourth aspect of the present invention, an ink jet printer head can be obtained at low cost by using fine piezoelectric ceramic powder composed of hydrothermal synthetic powder.

Effects corresponding to claims 5 and 6: A more reliable ink jet printer head can be obtained by a simple method.

Effect corresponding to claim 7: By adding an additive, the firing temperature is lowered, and a highly reliable ink jet printer head can be obtained.

According to the eighth aspect of the invention, by limiting the amount of the additive to be mixed, lead can be prevented from leaking into the intermediate layer, and a highly reliable ink jet printer head can be obtained.

According to the ninth aspect, by limiting the correlation with the powder to be carried, the firing temperature is reduced, and a highly reliable ink jet printer head uniformly added is obtained. .

Effect corresponding to the tenth aspect: An ink-jet printer head which carries additives effectively and has low cost and high long-term reliability can be obtained.

According to the eleventh aspect, by using ultrafiltration, an increase in the sintering temperature due to the residual solvent can be prevented, and a highly reliable ink jet printer head can be obtained.

According to the twelfth aspect, the silicon substrate (pressurizing chamber substrate) is not deformed during firing of the piezoelectric ceramic, and a highly reliable and high-density ink jet printer head can be obtained at low cost.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a cross section of an ink jet printer head of the present invention.

FIG. 2 is a graph showing a correlation between a specific surface area and a density of a piezoelectric ceramic (PTZ).

FIG. 3 is a diagram for explaining a manufacturing process of a pressure chamber substrate of the inkjet printer head.

FIG. 4 is a graph showing a correlation between a firing temperature and a density of a piezoelectric ceramic for each average particle size.

FIG. 5 shows a piezoelectric ceramic (P having an average particle size of 0.1 μm).
It is a graph which shows the correlation between the amount of addition and the strain when lead oxide is added to TZ).

FIGS. 6A and 6B are graphs showing a particle size distribution of a piezoelectric ceramic, wherein FIG. 6A shows a case by a mechanical mixing method, and FIG. 6B shows a case by a chemical coating.

FIG. 7 is a table showing the results of firing atmosphere experiments on piezoelectric ceramics.

FIG. 8 is a table showing the results of post-annealing experiments of piezoelectric ceramics in air after sintering of helium.

9A and 9B are diagrams showing parameters of piezoelectric characteristics of the piezoelectric ceramic in FIG. 8, wherein FIG. 9A shows a relationship between electric field intensity and polarization, and FIG. 9B shows a relationship between electric field intensity and displacement.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Pressurized room board, 2 ... Pressurized room, 3 ... Intermediate layer, 4 ... Lower electrode layer, 5 ... Electro-mechanical conversion layer, 6 ... Upper electrode layer, 7 ... Nozzle plate, 8 ... Nozzle, 9 ... Silicon Wafer, 10: silicon oxide film, 11: resist.

Claims (12)

[Claims] 1. A pressure chamber substrate made of silicon having a concave portion for holding and pressurizing a liquid to be ejected, a nozzle plate communicating with the pressure chamber substrate, and a pressure plate formed on the pressure chamber substrate. , An intermediate layer, and a lower electrode layer,
An electro-mechanical conversion element unit including a mechanical conversion layer and an upper electrode layer, and displacing the electro-mechanical conversion element unit to eject a liquid in a pressurized chamber to the outside through a nozzle. In the manufacturing method, the electro-mechanical conversion layer is made of piezoelectric ceramics, and the heat treatment for forming is performed at a sufficiently low temperature without causing deformation of the pressurized chamber substrate made of silicon. A method for manufacturing an ink jet printer head. 2. The method of manufacturing an ink jet printer head according to claim 1, wherein said electro-mechanical conversion layer has a grain structure having a particle size of 0.3 to 5 μm, and a specific surface area of said piezoelectric ceramic is 7 m ^2. A method for manufacturing an ink jet printer head, comprising: forming a calcined powder of at least / g in a paste, printing the paste, and performing a heat treatment in a temperature range of 700 to 1050 ° C. 3. The method for manufacturing an ink jet printer head according to claim 2, wherein the calcined powder has a particle size distribution of 0.005 to 0.2 μm, and an average particle size of 0.04 μm or more and 0.12 μm or less. A method for manufacturing an ink jet printer head. 4. The method for manufacturing an ink jet printer head according to claim 2, wherein said calcined powder is synthesized by a hydrothermal synthesis method. 5. The method for manufacturing an ink jet printer head according to claim 1, wherein the electromechanical conversion layer is heat-treated in air or helium. Method. 6. The ink-jet printer head manufacturing method according to claim 1, wherein said electro-mechanical conversion layer is heat-treated in helium and then heat-treated in air. Manufacturing method of printer head. 7. The method for manufacturing an ink jet printer head according to claim 1, wherein PbO, SiO ₂ , and PbO, SiO ₂ , are used as components for forming a liquid phase during heat treatment at the time of forming the electro-mechanical conversion layer. LiCO ₃ , Bi ₂ C
A sintering aid containing at least one of O ₃ and GeO ₂ is added and sintered. After the heat treatment, the composition of the grain boundary contains a larger amount of Pb, Ge, Si, Li, or Bi as compared with the inside of the grains. A method for manufacturing an ink jet printer head. 8. The method of manufacturing an ink jet printer head according to claim 7, wherein the amount of the sintering aid is 8 wt% or less based on the weight of the piezoelectric ceramic. Production method. 9. The method for manufacturing an ink jet printer head according to claim 8, wherein Dg is the particle size of the supported particles, and Di is the particle size of the auxiliary particles.
/ Dg is in the following range: 0 <Di / Dg <0.8 10. The method for manufacturing an ink jet printer head according to claim 9, wherein the particles carrying the sintering aid are hydrolyzed by a reaction precursor induced by a metal alkoxide or a metal salt and an organic solvent reaction. A method for manufacturing an ink jet printer head, wherein the method is formed. 11. The method for manufacturing an ink jet printer head according to claim 10, wherein the particles carrying the sintering aid are formed by ultrafiltration. Production method. 12. An inkjet printer head manufactured by the method for manufacturing an inkjet printer head according to claim 1. Description: