JPH11167054A - Image input device - Google Patents

Image input device

Info

Publication number
JPH11167054A
JPH11167054A JP33387497A JP33387497A JPH11167054A JP H11167054 A JPH11167054 A JP H11167054A JP 33387497 A JP33387497 A JP 33387497A JP 33387497 A JP33387497 A JP 33387497A JP H11167054 A JPH11167054 A JP H11167054A
Authority
JP
Japan
Prior art keywords
ccd
mount
image input
input device
parallelism
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP33387497A
Other languages
Japanese (ja)
Inventor
Yoshiteru Masano
吉輝 政野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP33387497A priority Critical patent/JPH11167054A/en
Publication of JPH11167054A publication Critical patent/JPH11167054A/en
Pending legal-status Critical Current

Links

Landscapes

  • Mounting And Adjusting Of Optical Elements (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an image input device capable of obtaining higher the parallisms between a CCD and a CCD mount to which a lens is attached dependently of only the precion of the CCD and the CCD mount. SOLUTION: In this image input device which converts incident light from an optical system into an electric signal by an imaging device and records it, the CCD 11 is pressed through an elastic body part 15 from the rear surface of the CCD 11, and the front surface of the CCD 11 presses the CCD receiving boss 20 of the CCD mount 13, so that this image input device depends on only the presion of the CCD 11 and the CCD mount 13, therefore, the higher parallelism can be obtained between the CCD 11 and the mount 13 to which the lens barrel 18 is attached.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明はデジタルカメラ等に
おける画像入力装置に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an image input device for a digital camera or the like.

【0002】[0002]

【従来の技術】従来の画像入力装置について説明する。
図4、図5は従来の画像入力装置のCCD周りの断面図
である。図4において、1はCCD(Charge C
oupled Device)、2はCCDマウント、
3はCCD実装基板、4は締結部品、8はレンズ鏡筒で
ある。図5において、6はアルミ板、7はCCD実装基
板である。
2. Description of the Related Art A conventional image input device will be described.
4 and 5 are cross-sectional views around a CCD of a conventional image input device. In FIG. 4, reference numeral 1 denotes a CCD (Charge C).
coupled device), 2 is a CCD mount,
3 is a CCD mounting board, 4 is a fastening component, and 8 is a lens barrel. In FIG. 5, 6 is an aluminum plate, and 7 is a CCD mounting board.

【0003】図4において、CCD1はCCD実装基板
3に実装されており、レンズ鏡筒8を組付けたCCDマ
ウント2を、CCD1にかぶせてCCD実装基板3に締
結して固定したものである。図5においては、CCD1
とCCD実装基板7との間にアルミ板6を挟みこんで、
CCD1をCCD実装基板7に実装しており、レンズ鏡
筒8を組付けたCCDマウント2を、CCD1にかぶせ
てアルミ板6に締結して固定したものである。
In FIG. 4, a CCD 1 is mounted on a CCD mounting substrate 3, and a CCD mount 2 having a lens barrel 8 mounted thereon is fixed to the CCD mounting substrate 3 by covering the CCD 1. In FIG. 5, the CCD 1
And an aluminum plate 6 between the CCD mounting board 7 and
The CCD 1 is mounted on a CCD mounting board 7, and a CCD mount 2 with a lens barrel 8 mounted thereon is fixed to the aluminum plate 6 by covering the CCD 1.

【0004】[0004]

【発明が解決しようとする課題】画像入力装置におい
て、レンズ系とCCDとで相対的に傾きがあると傾きの
分だけ焦点がズレ、画像がボケてしまうため、レンズ系
とCCDの平行度は重要である。しかしながら、レンズ
系とCCDは別部品で構成されるため、連結する部品が
必要である。そのため、レンズ系とCCDの平行度をだ
すためには、それぞれの部品と連結部品との間の平行度
をださなければいけない。連結部品であるCCDマウン
トとCCDの平行度について述べる。
In an image input apparatus, if the lens system and the CCD are relatively inclined, the focus shifts by the amount of the inclination and the image is blurred. is important. However, since the lens system and the CCD are composed of different parts, a connecting part is required. Therefore, in order to obtain the parallelism between the lens system and the CCD, the parallelism between each component and the connecting component must be obtained. The parallelism between the CCD mount and the CCD, which are connected parts, will be described.

【0005】図4において、CCD実装基板3にCCD
マウント2を締結して固定した場合、CCD1とCCD
マウント2の平行度は、CCD1を基板に実装する時の
実装傾き、およびCCDマウント2を締結するCCD実
装基板3の反り、およびCCD1単体の傾き、およびC
CDマウント2の精度という4つの精度に依存するため
CCD1とCCDマウント2間の平行度をだしにくい。
[0005] In FIG.
When the mount 2 is fastened and fixed, the CCD 1 and the CCD 1
The parallelism of the mount 2 includes the mounting inclination when the CCD 1 is mounted on the substrate, the warpage of the CCD mounting substrate 3 to which the CCD mount 2 is fastened, the inclination of the CCD 1 alone, and C
Since it depends on the four precisions of the CD mount 2, the degree of parallelism between the CCD 1 and the CCD mount 2 is hardly obtained.

【0006】また図5に示すように、CCD1とCCD
実装基板7の間にアルミ板6を挟んでアルミ板6にCC
Dマウント2を締結して固定した場合、これは前者に比
べ、反りという大きな誤差要因を有しているCCD実装
基板7への締結を、平行度の出やすい金属であるアルミ
板6に締結することにより、CCDマウント2を締結す
る時の誤差をできるだけ小さくした場合であるが、この
場合のCCD1とCCDマウント2の平行度は、CCD
1と実装基板7の間にアルミ板6を挟んでCCD1を実
装するときの実装傾き、およびCCD1単体の傾き、お
よびCCDマウント2の精度という、前者に比べると少
ないが、やはり3つの精度に依存するため、CCD1と
CCDマウント2間の平行度をだしにくいという課題が
あった。
[0006] As shown in FIG.
With the aluminum plate 6 interposed between the mounting substrates 7, the aluminum plate 6
When the D mount 2 is fastened and fixed, the D mount 2 is fastened to the CCD mounting board 7 which has a large error factor of warpage compared to the former, to the aluminum plate 6 which is a metal which is likely to have a high degree of parallelism. In this case, the error when the CCD mount 2 is fastened is made as small as possible. In this case, the parallelism between the CCD 1 and the CCD mount 2 is
The mounting inclination when mounting the CCD 1 with the aluminum plate 6 interposed between the mounting plate 1 and the mounting substrate 7, the inclination of the CCD 1 alone, and the accuracy of the CCD mount 2 are smaller than the former, but still depend on the three accuracy. Therefore, there is a problem that the parallelism between the CCD 1 and the CCD mount 2 is hardly obtained.

【0007】そこで本発明は、組付部品の誤差の累積に
よる精度低下をできるだけ小さくし、光学系において精
度の得やすい画像入力装置を提供することを目的とす
る。
SUMMARY OF THE INVENTION It is an object of the present invention to provide an image input apparatus which can minimize a decrease in accuracy due to accumulation of errors of assembled parts and can easily obtain accuracy in an optical system.

【0008】[0008]

【課題を解決するための手段】この課題を解決するため
に本発明は、光学系からの入射光を撮像素子により電気
信号に変換して記録する画像入力装置であって、CCD
後面より弾性体を介してCCDを押圧し、CCDマウン
トのCCD受け部にCCD前面を押しあてることによ
り、CCDとCCDマウント間において高い平行度が得
られる構成とした。
SUMMARY OF THE INVENTION In order to solve this problem, the present invention relates to an image input device for converting incident light from an optical system into an electric signal by an image pickup device and recording the electric signal.
By pressing the CCD from the rear surface via an elastic body and pressing the front surface of the CCD against the CCD receiving portion of the CCD mount, high parallelism can be obtained between the CCD and the CCD mount.

【0009】この構成により、組付部品の誤差の累積に
よる精度低下をできるだけ小さくし、光学系において精
度の得やすい画像入力装置を実現できる。
[0009] With this configuration, it is possible to minimize the decrease in accuracy due to the accumulation of errors of the assembled parts, and to realize an image input apparatus that can easily obtain accuracy in the optical system.

【0010】[0010]

【発明の実施の形態】請求項1記載の発明は、光学系か
らの入射光を撮像素子により電気信号に変換して記録す
る画像入力装置であって、CCD後面より弾性体を介し
てCCDを押圧し、CCDマウントのCCD受け部にC
CD前面を押しあてることにより、CCDとCCDマウ
ント間において高い平行度が得られるようにした。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention according to claim 1 is an image input device for converting incident light from an optical system into an electric signal by an image pickup device and recording the electric signal. Press and place C on the CCD receiver of the CCD mount.
By pressing the front of the CD, high parallelism between the CCD and the CCD mount can be obtained.

【0011】この構成により、CCDおよびレンズを装
着するCCDマウント間において、CCDとCCDマウ
ントの精度にしか依存しないため、より高い平行度が得
られる画像入力装置が得られる。
With this configuration, an image input device that can obtain higher parallelism between the CCD and the CCD mount on which the lens is mounted depends only on the accuracy of the CCD and the CCD mount.

【0012】以下、本発明の一実施の形態について、図
面を参照しながら説明する。図1は本発明の一実施の形
態における画像入力装置のCCD周りの部品構成図、図
2は同画像入力装置のCCD、CCDマウント間の詳細
図、図3は同画像入力装置のCCD周りの断面図であ
る。
An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a view showing the configuration of components around a CCD of an image input device according to an embodiment of the present invention, FIG. 2 is a detailed view of a portion between a CCD and a CCD mount of the image input device, and FIG. It is sectional drawing.

【0013】図1において、11はCCD、12はCC
D位置決め穴、13はCCDマウント、14はCCD実
装基板、15は弾性体部品、16は押圧部材、17は締
結部品、18はレンズ鏡筒である。
In FIG. 1, 11 is a CCD, and 12 is a CC.
D positioning hole, 13 is a CCD mount, 14 is a CCD mounting board, 15 is an elastic part, 16 is a pressing member, 17 is a fastening part, and 18 is a lens barrel.

【0014】図2において、19はCCD位置決めピ
ン、20はCCD受けボスである。CCD位置決めピン
19、CCD受けボス20は共にCCDマウント13の
一部である。
In FIG. 2, reference numeral 19 denotes a CCD positioning pin, and reference numeral 20 denotes a CCD receiving boss. The CCD positioning pin 19 and the CCD receiving boss 20 are both part of the CCD mount 13.

【0015】図1において、CCD11をCCD実装基
板14に実装したものをCCDマウント13に組みつ
け、CCD実装基板14の裏面(CCD11が実装され
ている裏辺り)に弾性体部品15を押しあて、その上か
ら押圧部材16をのせ締結部品17で押圧部材16とC
CDマウント13とを締結することにより組立てる。そ
の際、図2に示すように、CCD11とCCDマウント
13の位置決めはCCD位置決めピン19がCCD位置
決め穴12に挿入されることによって行われる。ここに
示してあるCCD11とCCDマウント13の位置決め
の方法は一形態に過ぎず、CCD11上面に平行な方向
を規制する方法であればよい。また、CCD11はCC
D11の上面がCCD受けボス20に均一にあたること
により、CCD11上面に垂直な方向の位置決めがなさ
れる。
In FIG. 1, the CCD 11 mounted on a CCD mounting board 14 is assembled to a CCD mount 13, and an elastic part 15 is pressed against the back surface of the CCD mounting board 14 (around the back side on which the CCD 11 is mounted). The pressing member 16 is put on the pressing member 16 and the pressing member 16 is
Assembling is performed by fastening with the CD mount 13. At this time, as shown in FIG. 2, the positioning of the CCD 11 and the CCD mount 13 is performed by inserting the CCD positioning pin 19 into the CCD positioning hole 12. The method of positioning the CCD 11 and the CCD mount 13 shown here is only one mode, and any method may be used as long as it restricts the direction parallel to the upper surface of the CCD 11. Also, the CCD 11 is CC
Since the upper surface of D11 uniformly hits the CCD receiving boss 20, positioning in the direction perpendicular to the upper surface of the CCD 11 is performed.

【0016】図3に画像入力装置のCCD周りの組立側
面部分断面図を示す。図3において、CCD実装基板1
4に実装されたCCD11はCCD実装基板14の後方
を弾性体部品15を介して押圧部材16より後方から押
されているわけであるが、この時CCD11をCCD実
装基板14に実装する時の実装誤差(傾き)があって
も、後方で弾性体部品15がそれを吸収するため、押圧
部材16の締め付け量には影響を及ぼさず、またCCD
実装基板14は組立状態においてCCDマウント13に
接触しておらず、CCD11を直接CCDマウント13
に押し付けることになるので、CCD11の上面がCC
D受けボス20に均一に押し当てられることにも影響を
及ぼさないため、CCD11とCCDマウント13の間
の平行度は、CCD11単体とCCDマウント13の一
部であるCCD受けボス20の2つの要因によって決ま
る。CCD実装基板14は弾性体部品15により押圧さ
れているため、基板要因は弾性体部品15によって吸収
されるので、基板の硬さ、また形状に制約はない。ま
た、CCD11の実装形態は表面実装、DIPどちらで
も構わない。
FIG. 3 is a partial cross-sectional view of an assembly side around the CCD of the image input device. In FIG. 3, the CCD mounting substrate 1
The CCD 11 mounted on the CCD 4 is pressed from behind the pressing member 16 via the elastic component 15 behind the CCD mounting board 14. At this time, the mounting when the CCD 11 is mounted on the CCD mounting board 14 is performed. Even if there is an error (inclination), the elastic member 15 absorbs the error behind, so that it does not affect the amount of tightening of the pressing member 16.
The mounting substrate 14 is not in contact with the CCD mount 13 in the assembled state, and the CCD 11 is directly connected to the CCD mount 13.
So that the upper surface of the CCD 11
The parallelism between the CCD 11 and the CCD mount 13 depends on two factors of the CCD 11 alone and the CCD receiving boss 20 which is a part of the CCD mount 13 because the parallelism between the CCD 11 and the CCD mount 13 is not affected. Depends on Since the CCD mounting substrate 14 is pressed by the elastic component 15, the substrate factor is absorbed by the elastic component 15, so there is no restriction on the hardness or shape of the substrate. The mounting form of the CCD 11 may be either surface mounting or DIP.

【0017】[0017]

【発明の効果】以上のように本発明によれば、光学系か
らの入射光を撮像素子により電気信号に変換して記録す
る画像入力装置であって、CCD後面より弾性体を介し
てCCDを押圧し、CCDマウントのCCD受け部にC
CD前面を押しあてることにより、CCDとCCDマウ
ントの精度にしか依存しないため、CCDおよびレンズ
を装着するCCDマウント間において、より高い平行度
が得られる。
As described above, according to the present invention, there is provided an image input device for converting incident light from an optical system into an electric signal by an image pickup device and recording the electric signal. Press and place C on the CCD receiver of the CCD mount.
By pressing the front surface of the CD, only the accuracy of the CCD and the CCD mount is dependent, so that a higher degree of parallelism can be obtained between the CCD and the CCD mount on which the lens is mounted.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一実施の形態における画像入力装置の
CCD周りの部品構成図
FIG. 1 is a configuration diagram of components around a CCD of an image input device according to an embodiment of the present invention.

【図2】本発明の一実施の形態における画像入力装置の
CCD、CCDマウント間の詳細図
FIG. 2 is a detailed view between a CCD and a CCD mount of the image input device according to the embodiment of the present invention.

【図3】本発明の一実施の形態における画像入力装置の
CCD周りの断面図
FIG. 3 is a cross-sectional view around a CCD of the image input device according to the embodiment of the present invention.

【図4】従来の画像入力装置のCCD周りの断面図FIG. 4 is a cross-sectional view around a CCD of a conventional image input device.

【図5】従来の画像入力装置のCCD周りの断面図FIG. 5 is a cross-sectional view around a CCD of a conventional image input device.

【符号の説明】[Explanation of symbols]

11 CCD 12 CCD位置決め穴 13 CCDマウント 14 CCD実装基板 15 弾性体部品 16 押圧部材 17 締結部品 18 レンズ鏡筒 19 CCD位置決めピン 20 CCD受けボス DESCRIPTION OF SYMBOLS 11 CCD 12 CCD positioning hole 13 CCD mount 14 CCD mounting board 15 Elastic body component 16 Pressing member 17 Fastening component 18 Lens barrel 19 CCD positioning pin 20 CCD receiving boss

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】光学系からの入射光を撮像素子により電気
信号に変換して記録する画像入力装置であって、CCD
後面より弾性体を介してCCDを押圧し、CCDマウン
トのCCD受け部にCCD前面を押しあてることによ
り、CCDとCCDマウント間において高い平行度が得
られるようにしたことを特徴とする画像入力装置。
An image input apparatus for converting incident light from an optical system into an electric signal by an image pickup device and recording the electric signal, comprising:
An image input device wherein a high degree of parallelism is obtained between the CCD and the CCD mount by pressing the CCD from the rear surface via an elastic body and pressing the front surface of the CCD against the CCD receiving portion of the CCD mount; .
JP33387497A 1997-12-04 1997-12-04 Image input device Pending JPH11167054A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP33387497A JPH11167054A (en) 1997-12-04 1997-12-04 Image input device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33387497A JPH11167054A (en) 1997-12-04 1997-12-04 Image input device

Publications (1)

Publication Number Publication Date
JPH11167054A true JPH11167054A (en) 1999-06-22

Family

ID=18270923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP33387497A Pending JPH11167054A (en) 1997-12-04 1997-12-04 Image input device

Country Status (1)

Country Link
JP (1) JPH11167054A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002014949A1 (en) * 2000-08-11 2002-02-21 Em Microelectronic-Marin Sa Small-size imaging apparatus, in particular photographic appliance or camera

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002014949A1 (en) * 2000-08-11 2002-02-21 Em Microelectronic-Marin Sa Small-size imaging apparatus, in particular photographic appliance or camera
WO2002014948A3 (en) * 2000-08-11 2002-07-25 Em Microelectronic Marin Sa Small-size imaging apparatus, in particular photographic appliance or camera

Similar Documents

Publication Publication Date Title
US6956615B2 (en) Structure for mounting a solid-state imaging device
US7973854B2 (en) Image pickup apparatus having mechanisms for holding an image pickup element
CN100409668C (en) Image pickup unit and image pickup apparatus
US7855750B2 (en) Optical filter and optical device with filter holding member for an image capturing device
EP0860990A3 (en) Mounting structure for the image pickup element of a video camera
JP4562820B2 (en) Mounting method of solid-state image sensor
JP2008116739A (en) Imaging part holding unit, lens barrel and imaging apparatus
JP2003324635A (en) Image pickup device unit
JPH11167054A (en) Image input device
JP3557346B2 (en) Imaging device
JP4194449B2 (en) Solid-state image sensor holding structure
JP2004015427A (en) Image pickup element unit
JP2003046825A5 (en)
JP2018189667A (en) Imaging apparatus
JP2007228463A (en) Camera module
US7106963B2 (en) Electronic equipment
JP2005278033A (en) Image pickup apparatus
JP2008283358A (en) Imaging apparatus
JP2002300441A (en) Fixing structure of solid-state imaging element
JPH10150588A (en) Method and unit for attaching solid-state image-pickup element
JP2603473Y2 (en) Solid-state imaging device
JPH034681A (en) Lens unit
JPH05122566A (en) Fitting device for solid-state image pickup device
JPH09130652A (en) Image pickup element mount structure for video camera
JP5018833B2 (en) Imaging device