JPH11166158A - Inorganic adhesive - Google Patents
Inorganic adhesiveInfo
- Publication number
- JPH11166158A JPH11166158A JP35004097A JP35004097A JPH11166158A JP H11166158 A JPH11166158 A JP H11166158A JP 35004097 A JP35004097 A JP 35004097A JP 35004097 A JP35004097 A JP 35004097A JP H11166158 A JPH11166158 A JP H11166158A
- Authority
- JP
- Japan
- Prior art keywords
- inorganic
- adhesive
- average particle
- powder
- particle size
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、無機接着剤に関
し、主に耐熱用分野で用いられる無機質接着剤に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inorganic adhesive, and more particularly, to an inorganic adhesive used in the field of heat resistance.
【０００２】[0002]
【従来の技術】従来、上記分野で使用される無機質接着
剤としては、コロイダルシリカ等の無機バインダと無機
粉体を混合した無機接着剤が用いられている。例えば、
特公昭５６−３４１９４号公報に開示されている、固形
分としてコロイダルシリカ８〜２０重量％と、１〜５０
μｍの平均粒径を有する粉末状耐火物７５〜９１．５重
量％と、３０〜５００μｍの平均粒径を有する無機質マ
イクロバルーン０．５〜５重量％からなる無機質接着剤
や、或いは、ハニカムエレメント接着用の無機質接着剤
として、特公平４−１８８９６号公報に開示されてい
る、精製ベントナイト、またはこれに酸化チタン、シリ
カ粉末、アルミゾル等を加えた無機質接着剤、シリカ粉
末及びアルミナ粉末からなる無機質接着剤、アルミナ粉
末及びカオリンにコロイダルシリカまたはセラミック繊
維を加えた無機質接着剤、ジルコニア粉末及びコロイダ
ルシリカからなる無機質接着剤（何れも水を希釈剤とし
て用いる）等が知られたいる。更に、市販品として住友
化学工業社製スミセラム等が知られている。2. Description of the Related Art Conventionally, as an inorganic adhesive used in the above field, an inorganic adhesive obtained by mixing an inorganic binder such as colloidal silica and an inorganic powder has been used. For example,
JP-B-56-34194 discloses a solid content of colloidal silica of 8 to 20% by weight,
An inorganic adhesive or a honeycomb element comprising 75 to 91.5% by weight of a powdery refractory having an average particle size of μm and 0.5 to 5% by weight of an inorganic microballoon having an average particle size of 30 to 500 μm. As an inorganic adhesive for bonding, purified bentonite or an inorganic adhesive obtained by adding titanium oxide, silica powder, aluminum sol and the like, an inorganic adhesive comprising silica powder and alumina powder, which are disclosed in Japanese Patent Publication No. Hei 4-18896. There are known an adhesive, an inorganic adhesive obtained by adding colloidal silica or ceramic fiber to alumina powder and kaolin, and an inorganic adhesive composed of zirconia powder and colloidal silica (all using water as a diluent). Further, Sumicerum manufactured by Sumitomo Chemical Co., Ltd. is known as a commercial product.
【０００３】[0003]
【発明が解決しようとする課題】上記分野で使用される
無機質接着剤に必要な特性は耐熱性はもちろんのこと、 （１）被接着物に塗布、硬化後に強固な接着力を発揮す
ること。 （２）塗布作業が容易に確実に行えること。すなわち、
無機質接着剤塗布時の延びが良く、均一に塗布できかつ
液垂れが起こりにくいこと。 （３）無機粉体の沈殿が起こりにくいこと。 等の特性が求められる。しかしながら、従来の無機質接
着剤は、接着力は比較的にあるものの沈殿が発生する、
或いは、作業性は良好だが接着力が弱い等の問題があっ
た。本発明は、耐熱性はもちろんのこと接着力が強く、
かつ沈殿しにくく作業性の良い無機質接着剤を提供する
ことを目的とする。The properties required of the inorganic adhesive used in the above fields are not only heat resistance, but also (1) exhibiting a strong adhesive force after being applied and cured on an object to be bonded. (2) The coating operation can be performed easily and reliably. That is,
Good elongation at the time of application of the inorganic adhesive, uniform application and less dripping. (3) Inorganic powder is less likely to precipitate. Are required. However, the conventional inorganic adhesive has a relatively high adhesive strength, but precipitates.
Alternatively, there is a problem that workability is good but adhesive strength is weak. The present invention has strong adhesive strength as well as heat resistance,
It is another object of the present invention to provide an inorganic adhesive which does not easily precipitate and has good workability.
【０００４】[0004]
【課題を解決するための手段】本発明の無機質接着剤
は、前記目的を達成するべく、平均粒径が０．１〜３μ
ｍと１０〜３０μｍからなる少なくとも２種の無機粉体
と無機バインダからなることを特徴とする。また、請求
項２記載の無機質接着剤は、平均粒径０．１〜３μｍの
無機粉体５〜３０重量％と、平均粒径１０〜３０μｍの
無機粉体２０〜６０重量％と、無機バインダ３０〜５０
重量％を配合して、固形分で５０〜８０重量％になるよ
うに調整したことを特徴とする。また請求項３記載の無
機質接着剤は、請求項１または２記載の無機質接着剤に
おいて、粘度調整材を配合したことを特徴とする。ま
た、請求項４記載の無機質接着剤は、請求項１乃至３の
何れか１項に記載の無機質接着剤において、平均粒径３
〜１０μｍの無機粉体を配合したことを特徴とする。In order to achieve the above object, the inorganic adhesive of the present invention has an average particle size of 0.1 to 3 μm.
m and at least two kinds of inorganic powder of 10 to 30 μm and an inorganic binder. Further, the inorganic adhesive according to claim 2 comprises 5 to 30% by weight of an inorganic powder having an average particle size of 0.1 to 3 μm, 20 to 60% by weight of an inorganic powder having an average particle size of 10 to 30 μm, and an inorganic binder. 30-50
% By weight and adjusted to be 50 to 80% by weight in solid content. The inorganic adhesive according to a third aspect is characterized in that the inorganic adhesive according to the first or second aspect further comprises a viscosity modifier. The inorganic adhesive according to claim 4 is the inorganic adhesive according to any one of claims 1 to 3, wherein
It is characterized by incorporating an inorganic powder of 10 to 10 μm.
【０００５】[0005]
【発明の実施の形態】本発明の無機質接着剤は、まず接
着強度を向上させるため、平均粒径が０．１〜３μｍと
１０〜３０μｍの２種類の無機粉体を使用する。粒子を
密に詰めたとき、平均粒径が１０〜３０μｍの粒子間に
平均粒径０．１〜３μｍの粒子を詰めて充填率を向上さ
せ、その粒子同士を無機バインダで結合させることによ
り、強固な接着力が得られる。DESCRIPTION OF THE PREFERRED EMBODIMENTS The inorganic adhesive of the present invention uses two types of inorganic powders having an average particle size of 0.1 to 3 .mu.m and 10 to 30 .mu.m in order to improve the adhesive strength. When the particles are densely packed, an average particle diameter of 10 to 30 μm is filled with particles having an average particle diameter of 0.1 to 3 μm to improve the filling rate, and the particles are bonded with an inorganic binder, Strong adhesion is obtained.
【０００６】平均粒径が０．１〜３μｍの無機粉体とし
ては、シリカ粉、アルミナ粉等が挙げられる。０．１μ
ｍ未満の粒子を使用すると、平均粒径１０〜３０μｍの
粒子との平均粒径の差が大きすぎ、充填による接着力増
強効果が発揮できなくなる。更に粉体自体が高価にな
る。また、平均粒径が３μｍを超えると平均粒径が１０
〜３０μｍの粒子との平均粒径の差が小さくなり、接着
力増強効果が低下する。Examples of the inorganic powder having an average particle size of 0.1 to 3 μm include silica powder and alumina powder. 0.1μ
When particles having a particle diameter of less than m are used, the difference in average particle diameter from particles having an average particle diameter of 10 to 30 μm is too large, and the effect of enhancing the adhesive force by filling cannot be exhibited. Further, the powder itself becomes expensive. If the average particle size exceeds 3 μm, the average particle size becomes 10%.
The difference between the average particle size and the particle size of 30 μm is reduced, and the effect of enhancing the adhesive strength is reduced.
【０００７】平均粒径が１０〜３０μｍの無機粉体とし
ては、シリカ粉、コーディエライト等が挙げられる。平
均粒径を３０μｍを超える粒子を使用すると、無機質接
着剤の塗布膜の厚さが厚くできる場合は良いが、薄い場
合、例えば膜厚０．３ｍｍ程度以下で使用する場合は粒
径が大きすぎ、亀裂発生等の不具合が生じる。Examples of the inorganic powder having an average particle size of 10 to 30 μm include silica powder, cordierite and the like. When particles having an average particle diameter exceeding 30 μm are used, it is good if the thickness of the coating film of the inorganic adhesive can be increased, but if the particles are thin, for example, if the film thickness is about 0.3 mm or less, the particle diameter is too large. In addition, problems such as cracks occur.
【０００８】無機バインダとしては、シリカゾル（コロ
イダルシリカ）、アルミナゾル、リン酸アルミニウム等
が挙げられる。Examples of the inorganic binder include silica sol (colloidal silica), alumina sol, and aluminum phosphate.
【０００９】平均粒径０．１〜３μｍの無機粉体を５〜
３０重量％と、平均粒径１０〜３０μｍの無機粉体を２
０〜６０重量％と、無機バインダを３０〜５０重量％を
配合して、固形分で５０〜８０重量％になるように調整
することにより、特に、強い接着力の無機質接着剤が得
られる。An inorganic powder having an average particle size of 0.1 to 3 μm
30% by weight and an inorganic powder having an average particle size of 10 to 30 μm
By mixing 0 to 60% by weight and an inorganic binder in an amount of 30 to 50% by weight and adjusting the solid content to 50 to 80% by weight, an inorganic adhesive having particularly strong adhesive strength can be obtained.
【００１０】また、上記の無機質接着剤に粘度調整剤を
配合することにより、無機質接着剤に増粘効果が出て無
機粉体の沈降を防止できる。粘度調整剤としてはベント
ナイト、超微粒シリカ（平均粒径０．０１〜０．０２μ
ｍ）等が挙げられる。上記の無機質接着剤にベントナイ
トであれば１重量％以下、超微粒シリカであれば１０重
量％程度配合し、粘度が１０００ｃＰ程度となるように
調整すれば、被接着物に無機質接着剤を塗布する際に、
延びが良くかつ液垂れの起こりにくい作業性の良い無機
質接着剤が得られる。Further, by blending a viscosity modifier with the above-mentioned inorganic adhesive, the inorganic adhesive has a thickening effect and can prevent sedimentation of the inorganic powder. Bentonite and ultrafine silica (average particle size 0.01 to 0.02 μm)
m) and the like. 1 wt% or less of bentonite is added to the above-mentioned inorganic adhesive, and about 10 wt% of ultrafine silica is blended. If the viscosity is adjusted to about 1000 cP, the inorganic adhesive is applied to the adherend. At that time,
An inorganic adhesive having good workability and good spreadability and less dripping can be obtained.
【００１１】また、上記の無機質接着剤に平均粒径が３
μｍを超え、１０μｍ未満の無機粉体を５〜３０重量％
配合すれば、さらに無機粉体の粒径分布が０．１〜３０
μｍまでなだからになり、無機粉体同士がより緻密に充
填結合される。The above-mentioned inorganic adhesive has an average particle size of 3%.
5 to 30% by weight of inorganic powder exceeding 10 μm
If blended, the particle size distribution of the inorganic powder can be 0.1 to 30
This is because the particle size is up to μm, so that the inorganic powders are more closely packed together.
【００１２】[0012]
【実施例】次に、具体的実施例について説明する。下記
表１に示す原料を用い、攪拌機ホモジナイザーによって
原料調合を行い、混合された調合液を２５℃まで冷却し
て無機質接着剤を得た。この各無機質接着剤の粘度をＢ
型粘度計を用い回転数６０ｒｐｍで測定した。その後、
１日間及び７日間放置した後、ガラス棒で軽くかき混ぜ
て沈殿が生じてないか分散状態を確認した。更に、接着
強度について、５０ｍｍ角のアルミナ板を２枚準備し、
接着剤を塗布してアルミナ板同士を面接合させ、１５０
℃で接着剤を硬化させた後、引張試験装置により、接着
面が破断するまでの最大荷重（ｋｇｆ）を測定し、その
荷重をせん断面積で割って求めた値を、接着強度（ｋｇ
ｆ／ｃｍ2 ）として測定した。Next, specific examples will be described. Using the raw materials shown in Table 1 below, the raw materials were mixed by a stirrer homogenizer, and the mixed liquid mixture was cooled to 25 ° C. to obtain an inorganic adhesive. The viscosity of each inorganic adhesive is B
It was measured at a rotation speed of 60 rpm using a mold viscometer. afterwards,
After standing for 1 day and 7 days, the mixture was stirred gently with a glass rod to check the dispersion state for precipitation. Further, regarding the adhesive strength, two alumina plates of 50 mm square were prepared,
Apply an adhesive to bond the alumina plates to each other.
After the adhesive was cured at ℃, the maximum load (kgf) until the bonded surface was broken was measured by a tensile tester, and the value obtained by dividing the load by the shear area was used as the adhesive strength (kg).
f / cm 2 ).
【００１３】[0013]
【表１】 [Table 1]
【００１４】表１から明らかなように、比較例１〜４は
従来の無機質接着剤に相当し、接着強度が悪いことがわ
かる。これに対し、実施例１〜６は、全て粘着強度が１
００ｋｇｆ／ｃｍ2 以上であって接着強度に優れること
がわかる。特に、実施例４は、粘度調整により、基材へ
の塗工時に接着剤の垂れ落ちがしにくく、混合後も無機
質接着剤中の無機粉体の沈殿が長期に渡って生じにくく
なっていることがわかる。また、特に、実施例４は、大
中小の３種の粒径の無機粉体が配合され、緻密な結合と
なり接着強度が１２０ｋｇｆ／ｃｍ2 以上となることが
わかる。As is clear from Table 1, Comparative Examples 1 to 4 correspond to conventional inorganic adhesives and have poor adhesive strength. In contrast, Examples 1 to 6 all had an adhesive strength of 1
It can be seen that the adhesive strength is excellent because it is at least 00 kgf / cm 2 . In particular, in Example 4, the viscosity was adjusted so that the adhesive did not easily drip during application to the base material, and the precipitation of the inorganic powder in the inorganic adhesive was unlikely to occur over a long period of time even after mixing. You can see that. In particular, in Example 4, it can be seen that three types of inorganic powders of large, medium and small sizes are blended to form a dense bond, and the adhesive strength becomes 120 kgf / cm 2 or more.
【００１５】[0015]
【発明の効果】本発明によれば、平均粒径が０．１〜３
μｍと１０〜３０μｍからなる少なくとも２種の無機粉
体と無機バインダからなる構成により、接着強度１００
ｋｇｆ／ｃｍ2 以上の優れた接着力を有する無機質接着
剤が得られる。また、粘度調整材を配合することによ
り、基材への塗工時に接着剤の垂れ落ちがしにくく、混
合後も無機質接着剤中の無機粉体の沈殿が長期に渡って
生じにくい無機質接着剤が得られる。また、平均粒径が
３〜１０μｍの無機粉体を更に配合することにより、大
中小の３種の粒径の無機粉体が配合され、緻密な結合と
なり接着強度が１２０ｋｇｆ／ｃｍ2 以上の優れた接着
力を有する無機質接着剤が得られるという効果を有す
る。According to the present invention, the average particle size is 0.1 to 3
Adhesive strength of at least two kinds of inorganic powders of 10 μm and 10 to 30 μm and an inorganic binder
An inorganic adhesive having an excellent adhesive force of not less than kgf / cm 2 can be obtained. In addition, by blending the viscosity adjusting material, the inorganic adhesive hardly drools down at the time of coating on the base material and the inorganic powder in the inorganic adhesive hardly precipitates for a long time even after mixing. Is obtained. Further, by further blending an inorganic powder having an average particle diameter of 3 to 10 μm, inorganic powders of three types, large, medium, and small, are blended to form a dense bond and have an adhesive strength of 120 kgf / cm 2 or more. This has the effect that an inorganic adhesive having an improved adhesive strength can be obtained.
Claims (4)
μｍからなる少なくとも２種の無機粉体と無機バインダ
からなる無機質接着剤。An average particle size of 0.1 to 3 μm and 10 to 30
An inorganic adhesive comprising at least two kinds of inorganic powders each having a particle diameter of μm and an inorganic binder.
３０重量％と、平均粒径１０〜３０μｍの無機粉体２０
〜６０重量％と、無機バインダ３０〜５０重量％を配合
して、固形分で５０〜８０重量％になるように調整した
ことを特徴とする請求項１記載の無機質接着剤。2. An inorganic powder having an average particle size of 0.1 to 3 μm.
30% by weight and inorganic powder 20 having an average particle size of 10 to 30 μm
2. The inorganic adhesive according to claim 1, wherein ６０60 wt% and 30-50 wt% of an inorganic binder are blended to adjust the solid content to 50-80 wt%.
請求項１または２記載の無機質接着剤。3. The inorganic adhesive according to claim 1, further comprising a viscosity modifier.
したことを特徴とする請求項１乃至３の何れか１項に記
載の無機質接着剤。4. The inorganic adhesive according to claim 1, further comprising an inorganic powder having an average particle diameter of 3 to 10 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35004097A JPH11166158A (en) | 1997-12-04 | 1997-12-04 | Inorganic adhesive |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP35004097A JPH11166158A (en) | 1997-12-04 | 1997-12-04 | Inorganic adhesive |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH11166158A true JPH11166158A (en) | 1999-06-22 |
Family
ID=18407831
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP35004097A Withdrawn JPH11166158A (en) | 1997-12-04 | 1997-12-04 | Inorganic adhesive |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH11166158A (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272862A (en) * | 2004-03-23 | 2005-10-06 | Hitachi Metals Ltd | Rotary body made of of ceramics |
| JP2006111792A (en) * | 2004-10-18 | 2006-04-27 | Asahi Kagaku Kogyo Co Ltd | Adhesive composition |
| JP2006137823A (en) * | 2004-11-11 | 2006-06-01 | Sumitomo Chemical Co Ltd | Method for bonding |
| WO2009014199A1 (en) * | 2007-07-26 | 2009-01-29 | Ngk Insulators, Ltd. | Bonding material for honeycomb structure and honeycomb structure utilizing the material |
| EP2267092A1 (en) | 2009-06-24 | 2010-12-29 | Forestry And Forest Products Research Institute | Adhesive compositions containing bond-strength enhancing agent and methods for producing wood composite using the adhesive compositions |
| JP2011258818A (en) * | 2010-06-10 | 2011-12-22 | Ibiden Co Ltd | Printed wiring board, electronic device, and manufacturing method of printed wiring board |
| WO2012127777A1 (en) | 2011-03-18 | 2012-09-27 | ニチアス株式会社 | Adhesive for inorganic fibers |
| US8715451B2 (en) | 2008-10-23 | 2014-05-06 | Forestry And Forest Products Research Institute | Heat pressing apparatus with puncture prevention function and method for producing woody material |
| JP5485546B2 (en) * | 2006-03-30 | 2014-05-07 | 日本碍子株式会社 | Bonded body, honeycomb segment bonded body, and honeycomb structure using the same |
| US8821626B2 (en) | 2011-03-18 | 2014-09-02 | Nichias Corporation | Adhesive for inorganic fiber |
-
1997
- 1997-12-04 JP JP35004097A patent/JPH11166158A/en not_active Withdrawn
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005272862A (en) * | 2004-03-23 | 2005-10-06 | Hitachi Metals Ltd | Rotary body made of of ceramics |
| JP2006111792A (en) * | 2004-10-18 | 2006-04-27 | Asahi Kagaku Kogyo Co Ltd | Adhesive composition |
| JP4675081B2 (en) * | 2004-10-18 | 2011-04-20 | 朝日化学工業株式会社 | Adhesive composition |
| JP2006137823A (en) * | 2004-11-11 | 2006-06-01 | Sumitomo Chemical Co Ltd | Method for bonding |
| JP5485546B2 (en) * | 2006-03-30 | 2014-05-07 | 日本碍子株式会社 | Bonded body, honeycomb segment bonded body, and honeycomb structure using the same |
| WO2009014199A1 (en) * | 2007-07-26 | 2009-01-29 | Ngk Insulators, Ltd. | Bonding material for honeycomb structure and honeycomb structure utilizing the material |
| JP5486305B2 (en) * | 2007-07-26 | 2014-05-07 | 日本碍子株式会社 | Bonding material for honeycomb structure and honeycomb structure using the bonding material |
| US8101270B2 (en) | 2007-07-26 | 2012-01-24 | Ngk Insulators, Ltd. | Bonding material for honeycomb structure and honeycomb structure utilizing the material |
| US8715451B2 (en) | 2008-10-23 | 2014-05-06 | Forestry And Forest Products Research Institute | Heat pressing apparatus with puncture prevention function and method for producing woody material |
| EP2267092A1 (en) | 2009-06-24 | 2010-12-29 | Forestry And Forest Products Research Institute | Adhesive compositions containing bond-strength enhancing agent and methods for producing wood composite using the adhesive compositions |
| JP2011258818A (en) * | 2010-06-10 | 2011-12-22 | Ibiden Co Ltd | Printed wiring board, electronic device, and manufacturing method of printed wiring board |
| WO2012127777A1 (en) | 2011-03-18 | 2012-09-27 | ニチアス株式会社 | Adhesive for inorganic fibers |
| US8821626B2 (en) | 2011-03-18 | 2014-09-02 | Nichias Corporation | Adhesive for inorganic fiber |
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Legal Events
| Date | Code | Title | Description |
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| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20050301 |