JPH11160721A - Substrate joining device and seal agent applying nozzle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve productivity when substrates are joined by arranging a substrate positioning part, a substrate pressurizing part and an ultraviolet irradiation part on a stage formed in a disklike shape at a prescribed distance along the peripheral direction of the stage. SOLUTION: First of all, a cell C is received from a substrate transfer part 30. Then, a rotation drive mechanism 22 is operated, and the rotary stage 21 is rotated by 90 deg. in the direction of the arrow R, and the cell C is moved to the substrate positioning part 40. After the cell C is adjusted so that a deviation value enters without the allowable range, the rotary stage 21 is rotated, and the cell C is moved to the substrate pressurizing part 50. Pressurization by atmospheric pressure is performed sufficiently, and after a prescribed time elapses, the rotary stage 21 is rotated, and the cell C is moved to the ultraviolet irradiation part. In the ultraviolet irradiation part, after a seal agent is irradiated by ultraviolet rays, the rotary stage 21 is rotated, and the cell C is moved to the substrate transfer part 30. Then, the cell C is transferred to a next process injecting a liquid crystal into the cell C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate bonding apparatus for bonding two substrates used for cells of a liquid crystal panel or the like at a small interval via a sealant, and a seal for applying the sealant to the substrate. The present invention relates to an agent application nozzle.

[0002]

2. Description of the Related Art In a liquid crystal display element of a liquid crystal display device, an electrode plate formed on a substrate made of glass, plastic or the like on which electrodes are formed is disposed with the electrode surfaces facing each other, and the electrode plates are stacked with a sealant interposed therebetween. A cell is manufactured by sealing together, and a liquid crystal, which is an electro-optical liquid, is sealed inside the cell.

Such a cell C generally has a structure as shown in FIG. That is, the color filter substrate F
And the array substrate A are joined by the sealant S.
A spacer T is arranged between the color filter substrate F and the array substrate A, and defines a constant distance between the two substrates F and A. Further, a transparent electrode (not shown) is formed on each of the color filter substrate F and the array substrate A. Then, the liquid crystal is poured into the gap between the two substrates F and A of the cell C.

Conventionally, when manufacturing such a cell C, the following three steps are roughly performed. That is, an alignment step of aligning the color filter substrate F and the array substrate A, a pressing step of pressing both substrates F, A to bring the substrates F, A closer together until regulated by the spacer T, and a sealing step. This is a curing step of curing the agent S.

[0005] The sealant S includes a thermosetting type and an ultraviolet curable type. When a thermosetting type is used as the sealant S, the pressing and joining steps are performed first,
After that, an alignment step is performed. Then, heat curing is performed in a state where the pressure is applied using a pressing jig.

On the other hand, in the alignment step when an ultraviolet curing type is used as the sealant S, the color filter substrate F is temporarily fixed on the array substrate A with a temporary fixing agent, and the cell C as shown in FIG. The alignment process is completed at the stage when the configuration is completed.

Further, the cell C is transferred to a pressure bonding apparatus (not shown) for performing a pressure bonding step. In the pressure bonding apparatus, the color filter substrate F is brought close to the array substrate A by pressing the rear surface of the color filter substrate F with a predetermined load P. At this time, since the spacer T is disposed between the color filter substrate F and the array substrate A, an interval corresponding to the spacer T is secured. In this state, the entirety of the color filter substrate F and the array substrate A is irradiated with ultraviolet rays to cure the sealant S, and the joining is completed.

Further, in order to omit the temporary fixing step and to maintain the alignment accuracy in the alignment step, the above steps are performed by a single apparatus, that is, the array substrate A is mounted, and alignment, pressurization, ultraviolet light In some cases, irradiation was performed.

On the other hand, in a pre-process of supplying a laminate of the array substrate A and the color filter substrate F to the above-described substrate bonding apparatus, there is a sealant applying step of applying a sealant S to the array substrate A.

In this sealing agent application step, for example, a container 1 made of a metal material as shown in FIG. 8 is used. Container 1
The nozzle 2 is integrally formed at the bottom of the nozzle. In such a case where the container 1 and the nozzle 2 are integrated, it is necessary to clean the container 1 every time the sealant S is replaced, and each time the sealant S is defoamed (air vented), it is very difficult. There was a problem of inefficiency.

For this reason, as shown in FIG. 9A, a disposable container 3 and a nozzle 4 in which the nozzle 4 is detachable are also used. The container 3 includes a sealant injection port 3a, a nozzle connection 3b, a flow path 3c provided in the nozzle connection 3b, and a discharge port 3d which is an opening of the flow path 3c.
And The nozzle 4 includes a nozzle body 4a, a flow path 4b provided in the nozzle body 4a, and a screwing portion 4c screwed to the nozzle connection port 3b.

[0012]

However, the conventional substrate bonding method as described above has the following problems. That is, when a thermosetting sealant is used as the sealant S, it is necessary to put it in a constant-temperature oven at about 150 ° C. for about 8 hours in the joining step, so that the production efficiency is low. Since pressurization is required to form the gap, apart from the influence of heating and thermal expansion, the overlay accuracy is also reduced by pressurization.

On the other hand, when an ultraviolet curing type sealant is used as the sealant S, the alignment apparatus for performing the alignment step and the pressure bonding apparatus for performing the pressure bonding step are different apparatuses. However, there is a problem that a temporary fixing step and a transporting step are required, and the substrate efficiency and the production efficiency are lowered.

Further, alignment, pressurization,
In the curing device, the substrate once mounted on the device
Since the device is not removed from the device until the joining is completed, the alignment device and the ultraviolet irradiation device cannot be used during the pressing process that takes the longest time, and the use efficiency of the expensive alignment device is reduced. there were.

Further, there is an apparatus in which the pressure bonding step is performed as it is in a state where the alignment of the substrate is performed in the alignment step, but the pressing step requires the longest time. During this pressurization, other operations, ie, steps such as alignment and irradiation of ultraviolet rays, cannot be performed, so that there is a problem that production efficiency is reduced.

On the other hand, as shown in FIG.
The use of a material that can be attached and detached for applying the sealant S has the following problems. A step is generated between the tip 5 of the nozzle connection port 3b and the flow path 4b of the nozzle 4, and a gap 6 is generated. The air in the gap 6 may be mixed into the sealant S being applied and cause the seal to break. When the seal breaks, there is a possibility that the liquid crystal will leak from that part when the liquid crystal is injected in a later step. As a result, there is a problem that defective products are generated and production efficiency is reduced.

It is an object of the present invention to provide a substrate bonding apparatus capable of improving production efficiency when two substrates such as a color filter substrate and an array substrate are bonded at a predetermined interval. Another object of the present invention is to provide a sealant application nozzle in which air is not mixed into a sealant applied at the time of joining substrates, and to improve production efficiency.

[0018]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems and to achieve the object, according to the first aspect of the present invention, a first substrate and a second substrate facing each other are arranged in a gap between these substrates. In a substrate bonding apparatus for superposing and curing the above-mentioned sealant via an ultraviolet-curable sealant while maintaining a predetermined distance by the spacer, a fixing part formed in a disc shape and fixing the first substrate is provided. A plurality of stages, a drive unit for driving the stage to rotate in a predetermined direction about the axis thereof, the first substrate and the second
A substrate supply unit configured to supply a stack of substrates, and a second supply unit that is disposed at a predetermined distance from the substrate supply unit in a circumferential direction of the stage and is fixed to the fixed unit; A substrate positioning unit that positions the substrate, a substrate pressing unit that is disposed along a circumferential direction of the stage of the substrate positioning unit, and presses the first substrate and the second substrate; An ultraviolet light irradiating unit is provided which is arranged at a predetermined distance from the substrate pressing unit along the circumferential direction of the stage and irradiates the sealing agent with ultraviolet light.

According to a second aspect of the present invention, in the first aspect of the present invention, the substrate pressing section includes the first pressure section.
A decompression unit is provided for depressurizing a gap formed between the substrate and the second substrate to pressurize the first substrate and the second substrate with atmospheric pressure.

According to a third aspect of the present invention, in the second aspect of the present invention, the decompression unit is provided between the periphery of the first substrate and a surface of the second substrate on the first substrate side. The apparatus includes closing means for closing to form a closed space, and pressure reducing means for reducing the pressure in the closed space.

According to a fourth aspect of the present invention, there is provided a sealant applying nozzle detachably attached to a discharge port of a container containing a sealant, wherein the nozzle body is attached to the container, and the nozzle body is provided inside the nozzle body. The discharge port is provided with an opening at one end thereof opposed to the discharge port, and a flow path formed so that the inside diameter of the opening is substantially the same as the inside diameter of the discharge port.

As a result of taking the above-described measures, the following operation occurs. That is, according to the first aspect of the present invention, the first substrate and the second substrate fixed to the fixing unit are kept in a fixed state with the rotation of the stage.
Since the substrate pressurizing unit and the ultraviolet irradiation unit are sequentially transferred, the process can be shifted to the next process after the process in each unit is completed. For this reason, it is possible to perform the positioning step in the positioning section and the ultraviolet irradiation step in the ultraviolet irradiation section without waiting for the time-consuming completion of the pressing step in the substrate pressing section, thereby improving the use efficiency of each device. Can be done.

According to the second aspect of the present invention, the substrate pressing unit reduces the pressure in the gap between the first substrate and the second substrate, thereby pressing the first substrate and the second substrate with the atmospheric pressure. Is provided, the load due to the atmospheric pressure is uniformly applied to the substrate, and the gap between the first substrate and the second substrate can be kept constant.

According to the third aspect of the present invention, the pressure reducing section closes the space between the periphery of the first substrate and the surface of the second substrate on the first substrate to form a closed space; Is provided with a pressure reducing means for reducing the pressure on the substrate. Therefore, it is possible to prevent foreign substances adhering to the first substrate and the second substrate from damaging the substrates.

According to the fourth aspect of the present invention, the nozzle body attached to the container, the opening provided at the nozzle body, one end of the discharge port is opposed to the nozzle, and the opening is formed by the discharge port. Since the flow path is formed so as to be included in the area of the outlet, no step is formed near the discharge port and the opening of the flow path, and air does not stay. For this reason, it is possible to prevent air from being mixed into the sealant.

[0026]

1A and 1B are schematic views showing a substrate bonding apparatus 10 according to an embodiment of the present invention, and FIG.
4 to 4 show the main parts of the substrate bonding apparatus 10, and FIG. 5 shows the sealant applying nozzle 2 incorporated in the sealant applying apparatus.
It is a longitudinal cross-sectional view which shows the principal part of 00. Arrow Z in FIGS.
The direction indicates the vertical direction.

The substrate joining apparatus 10 joins a color filter substrate F (first substrate) to an array substrate A (second substrate) in which transistors and the like are pre-installed via an ultraviolet-curable sealant S, thereby forming a liquid crystal. This is an apparatus for manufacturing a cell C for a display element.

As shown in FIG. 1, the substrate bonding apparatus 10 includes a stage device 20, a substrate transfer section 30 provided at each position of the stage apparatus 20, a substrate positioning section 40,
A substrate pressing unit 50 and an ultraviolet irradiation unit 60 are provided. In FIG. 1, reference numeral 100 denotes a transfer robot that transfers cells C from a sealant application device (not shown) that performs a pre-process to the substrate transfer unit 30 and transfers the cells C from the substrate transfer unit 30 to a post-process. I have.

The stage device 20 includes an annular rotary stage 21 whose axis is vertically arranged, and a rotary drive mechanism 22 for intermittently rotating the rotary stage 21. The rotating stage 21 has 90
Four substrate holding units 70 provided each time and holding a cell C
Is provided.

As shown in FIG. 2, the substrate holding portion 70 is a quartz plate 71 fitted on the rotary stage 21 and transmitting ultraviolet light.
And an upper cover 72 opposed to the quartz plate 71.
A guide 73 for vertically guiding the upper cover 72 with respect to the rotary stage 21;
Cylinder 7 for moving upper cover 72 up and down along
4 is provided.

The quartz plate 71 is provided with a vacuum hole 71a and a through hole 71b through which a lift pin 32 described later passes. The upper cover 72 includes a rectangular frame-shaped main body 72a.
And an elastic ring 72 provided on the lower surface of the main body 72a.
b, an elastic sheet 72c provided inside the opening of the main body 72a, and a vacuum suction hole 72d provided in the main body 72a.
And

The substrate transfer section 30 is disposed on the floor surface and operates along an arrow Z direction in FIG. 1A, and four lift pins provided at the upper end of the air cylinder 31. 32.

The board positioning unit 40 includes a pedestal 41 disposed on the floor surface, and an
An XYθ stage 43 attached to the lower end of the air cylinder 42 for positioning in the θ direction around the X, Y, and Z directions; and a leaf spring 44 on the lower surface of the XYθ stage 43. Fine Z-axis 4 which is supported so as to be vertically movable along arrow Z direction in FIG.
5, a vacuum chuck 46 attached to the lower end of the fine movement Z-axis 45, and a pair of microscope mechanisms 4 arranged with the vacuum chuck 46 and the rotary stage 21 interposed therebetween.
7 and a clamp 48 configured to sandwich the rotary stage 21 from above and below in FIG. Note that FIG.
The middle arrow X indicates a direction perpendicular to the paper surface, and the arrow Y indicates a horizontal direction orthogonal to the arrow X.

The microscope mechanism 47 is attached to the gantry 41 and performs an XYZ stage 47a for positioning in the XYZ directions.
And a microscope 47 supported by the XYZ stage 47a
b.

The UV irradiator 60 includes a lamp house 61
And an ultraviolet lamp 62 disposed in the lamp house 61; a cold mirror 63 disposed above the ultraviolet lamp 62; a filter 64 disposed above the cold mirror 63; Inlet 6 for introducing cooling water for cooling ultraviolet lamp 62
5 and an outlet 66 for discharging the cooling water. The cold mirror 63 and the filter 64 are connected to the cell C
It has a function of blocking extra light such as infrared rays in order to avoid a temperature rise.

As shown in FIG. 5, a sealant application nozzle 200 provided in a sealant application device (not shown) includes a nozzle body 201, a flow path 202 provided in the nozzle body 201, And a screwing portion 203 which is screwed to the nozzle connection port 3b. The opening 202 a of the flow path 202 on the container 3 side is arranged to face the discharge port 3 d of the container 3. The lower end of the flow path 202 is
b is formed.

The inner diameter of the opening 202a on the container 3 side of the flow path 202 is formed to be substantially the same as the inner diameter of the discharge port 3d of the flow path 3c of the container 3. In the sealant applying device (not shown) having the sealant applying nozzle 200 configured as described above, the sealant S is applied as follows. That is, the sealant S is discharged from the discharge port 3d by applying pressure from the container 3 side. The discharged sealant S flows into the flow path 202 in the sealant application nozzle 200. At this time, the inner diameter of the discharge port 3d of the container 3 and the flow path 202
Is substantially the same as the inner diameter of the opening 202a, so that there is no step and there is no room for air to accumulate. Therefore, the air is not mixed with the sealant S, and the discharge port 2
02b. For this reason, a good application can be performed without running out of the sealant.

The substrate bonding apparatus 10 having the above-described structure can be used as a color filter substrate F and an array substrate A as follows.
And bonding. The steps of performing the substrate bonding are roughly divided into a receiving step in the substrate transfer section 30, a positioning step in the substrate positioning section 40, and the substrate pressing section 5.
0, a UV irradiation step in the UV irradiation section 60, and a delivery step in the substrate delivery section 30.

First, as shown in FIG. 2, the lift pins 32 are raised. Then, the array substrate A and the color filter substrate F are applied with a sealant S of an ultraviolet curable resin in a ring shape using the sealant application nozzle 200, and then the temporarily fixed cells C are placed on the lift pins 32. Next, the air cylinder 31 is operated to slowly lower the lift pins 32, and the cell C is placed on the quartz plate 71. And
The cell C is fixed on the quartz plate 71 by operating the vacuum chuck 71a.

Next, the air cylinder 74 is operated to lower the upper cover 72 so that the elastic sheet 72c is brought into close contact with the outer peripheral portion of the upper surface of the cell C, and the elastic ring 72b is brought into close contact with the quartz plate 71. Thereby, the space inside the cell C becomes a closed space G.

Next, the rotary drive mechanism 22 is operated to rotate the rotary stage 21 by 90 degrees in the direction of arrow R in FIG. 1 to move the cell C to the substrate positioning unit 40. Then, the rotary stage 21 is clamped and fixed by the clamp 48.

Next, the vacuum chuck 46 is lowered by the air cylinder 42 to hold the upper surface of the array substrate A by suction. At this time, a deviation between the plane of the lower surface of the vacuum chuck 46 and the upper surface of the array substrate A is absorbed by the leaf spring 44, thereby preventing one-sided contact. And the XY stage 47
The microscope 47b is moved to a predetermined position by a, and the amount of displacement between the alignment marks provided on the array substrate A and the filter substrate F is detected. The XYθ stage 43 is operated on the basis of the deviation amount, and is adjusted so that the deviation amount falls within the allowable error range.

Next, the pressure is reduced through the vacuum suction hole 72d. Therefore, the pressure in the space G is reduced, and the color filter substrate F and the array substrate A are pressurized by the atmospheric pressure from the upper surface side of the color filter substrate F. Due to this pressurization, the sealant S is pressed, and the gap between the color filter substrate F and the array substrate A is reduced until it is regulated by the spacer T.

At this time, the deviation amount of the alignment mark is detected again by the microscope 48b, and if the deviation is out of the allowable range, the space G is once returned to the atmospheric pressure, adjusted by the XYθ stage 43, and decompressed again. Do. If the displacement amount of the alignment mark is within the allowable range while the space G is depressurized, the state is maintained.

Next, the clamp 48 is released, the rotary stage 21 is rotated, and the cell C is moved to the substrate pressing section 50.
In the substrate pressing unit 50, the state of the cell C is maintained as it is. Thereby, pressurization by the atmospheric pressure is sufficiently performed, and the spacer T is crushed until it reaches a predetermined diameter (for example, 5 to 6 μm). After a lapse of a predetermined time, the rotation stage 21 is rotated and moved to the ultraviolet irradiation unit 60.

A nozzle body attached to the container, an opening provided on the nozzle body, one end of which is opposed to the discharge port, and formed so that the opening is included in the area of the discharge port. And the flow path
No step is formed in the vicinity of the discharge port and the opening of the flow path, so that air does not stay. For this reason, it is possible to prevent air from being mixed into the sealant.

In the ultraviolet irradiating section 60, an ultraviolet lamp 62 is turned on from below the quartz plate 71 to irradiate the sealing agent S with ultraviolet rays.
The UV irradiation step is completed when J / cm ² is reached.
Thus, a cell C in which the color filter substrate F and the array substrate A are joined is completed.

Next, the rotary stage 21 is rotated, and the cells C
Is moved to the substrate transfer section 30. Then, the space G is returned to the atmospheric pressure, the air cylinder 74 is raised, the upper plate 72 is raised, and the space C is separated from the cell C. Further, the suction by the air chuck 71a is released. Then, the air cylinder 31 is operated, and the lift pin 32 is raised. Then, the liquid is transferred to the next step of injecting the liquid crystal into the cell C by the transfer robot 100.

As described above, according to the substrate bonding apparatus 10 of the present embodiment, the color filter substrate F is pressed while being positioned on the array substrate A, and the sealant S is cured in that state. Therefore, no displacement occurs and joining can be performed with the positioning maintained. Therefore, a highly accurate cell C can be manufactured.

The color filter substrate F and the array substrate A fixed to the substrate fixing part 70 are kept in a fixed state with the rotation of the rotary stage 21 while the substrate positioning part 4
0, the substrate pressing unit 50, and the ultraviolet irradiation unit 60 are sequentially transferred, so that when the process in each unit is completed, the process can proceed to the next process. Therefore, the positioning step in the substrate positioning section 40 and the ultraviolet irradiation step in the ultraviolet irradiation section 60 can be performed without waiting for the time-consuming completion of the pressing step in the substrate pressing section 50. Usage efficiency can be improved.

Further, the pressure in the pressing step is applied to the color filter substrate F from the upper surface of the array substrate A by the atmospheric pressure. Therefore, between the color filter substrate F and the quartz plate 71, the color filter substrate F and the array substrate A
It takes only about its own weight. Therefore, even when dust or the like is interposed between the color filter substrate F and the quartz plate 71, the color filter substrate F is hardly damaged by the dust or the like, and the yield can be improved.

Further, since the pressure between the color filter substrate F and the array substrate A is reduced and the pressure is increased by the atmospheric pressure, the load by the atmospheric pressure is uniformly applied to each substrate.
For this reason, it is possible to prevent pressure unevenness caused by a difference in flatness between the array substrate A and the vacuum chuck 46, which occurs when the array substrate A is directly pressed by the vacuum chuck 46. Therefore, a highly accurate product can be produced.

FIG. 6 is a view showing a substrate bonding apparatus 10A according to a modification of the above-described substrate bonding apparatus 10. As shown in FIG. The substrate bonding apparatus 10A is different from the substrate bonding apparatus 10 in that the rotary stage 21 rotates by 60 degrees and three substrate pressing portions 50 are provided. That is, pressurization by the atmospheric pressure is performed at the three substrate pressurizing units 50. Therefore, even if the residence time of the cell C in the substrate transfer part 30, the substrate positioning part 40, and the ultraviolet irradiation part 60 is shortened, a sufficient pressurizing time can be obtained. For this reason, the throughput of the substrate bonding apparatus 10A can be improved.
It should be noted that the substrate pressing unit 50 may be appropriately increased or decreased according to the required pressing time.

The present invention is not limited to the above embodiment. That is, in the embodiment, the case where the cell C for the liquid crystal display device is manufactured by joining the color filter substrate F and the array substrate A is described, but the present invention is not limited thereto. In addition, it goes without saying that various modifications can be made without departing from the spirit of the present invention.

[0055]

According to the present invention, the production efficiency of a liquid crystal display device can be improved.

[Brief description of the drawings]

FIG. 1 is a view showing a schematic configuration of a substrate bonding apparatus according to an embodiment of the present invention, wherein FIG. 1 (a) is a top view, and FIG. 1 (b) is cut along α-α line in FIG. FIG.

FIG. 2 is a view showing a substrate transfer unit and a substrate holding mechanism incorporated in the substrate bonding apparatus, wherein (a) is a top view,
(B) is a sectional view taken along the line β-β in (a) and viewed in the direction of the arrow, and (c) is a sectional view taken along the line γ-γ in (a) and viewed in the direction of the arrow.

FIG. 3 is a vertical sectional view showing a substrate positioning unit incorporated in the substrate bonding apparatus.

FIG. 4 is a vertical sectional view showing an ultraviolet irradiation unit incorporated in the substrate bonding apparatus.

FIG. 5 is a longitudinal sectional view showing a main part of a sealant application nozzle incorporated in the sealant application device.

FIG. 6 is a view showing a modification of the substrate bonding apparatus.

FIG. 7 is a perspective view showing the structure of a liquid crystal cell.

FIG. 8 is a longitudinal sectional view showing an example of a conventional nozzle for applying a sealant.

FIG. 9 is a longitudinal sectional view showing another example of a conventional sealing agent applying nozzle.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Substrate bonding apparatus 21 ... Rotation stage 30 ... Substrate transfer part 40 ... Substrate positioning part 50 ... Substrate pressing part 60 ... Ultraviolet irradiation part 200 ... Sealant application nozzle

Claims (4)

[Claims] 1. A method according to claim 1, wherein the first substrate and the second substrate facing each other are overlapped with each other via a UV-curable sealant while maintaining a predetermined distance by a spacer disposed in a gap between the substrates. A substrate bonding apparatus for bonding the first substrate, the stage having a plurality of fixing parts for fixing the first substrate, a driving part for rotating the stage in a predetermined direction about an axis thereof, A substrate supply unit for laminating the first substrate and the second substrate on the fixed unit and supplying the stacked substrate and the substrate supply unit and the substrate supply unit disposed at a predetermined distance along a circumferential direction of the stage and fixed to the fixed unit The above-mentioned first
A substrate positioning unit for positioning the second substrate with respect to the substrate; and a substrate disposed along a circumferential direction of the stage of the substrate positioning unit and configured to press the first substrate and the second substrate. A substrate pressing unit comprising: a pressing unit; and an ultraviolet irradiating unit that is arranged at a predetermined distance from the substrate pressing unit and along the circumferential direction of the stage and irradiates the sealing agent with ultraviolet light. apparatus. 2. The depressurizing section pressurizes the first and second substrates with atmospheric pressure by depressurizing a gap formed between the first substrate and the second substrate. The substrate bonding apparatus according to claim 1, further comprising: 3. A decompression unit for closing a space between the periphery of the first substrate and a surface of the second substrate on the first substrate side to form a closed space, and reducing the pressure in the closed space. The substrate bonding apparatus according to claim 2, further comprising a pressure reducing unit. 4. A sealing agent applying nozzle detachably attached to a discharge port of a container containing a sealing agent, a nozzle body attached to the container, a nozzle body provided in the nozzle body, and A sealant application nozzle, comprising: a flow passage formed such that an opening at one end is opposed to the opening, and an inner diameter of the opening is substantially equal to an inner diameter of the discharge port.