JPH1115942A - Input-output device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an input-out device having high reliability without obstructing assembly work by providing a frame with circuit board holding parts and absorbing pressure applied to the circuit board rate of an extending part with the circuit board holding parts. SOLUTION: A semiconductor part 2 is mounted on a circuit board 3 and is electrically connected to a wiring pattern of the circuit board 3. Also, a connector 4 electrically connected to an electric apparatus and a connector 5 having a terminal 16 electrically connected to a telephone line and an HUB are mounded on the circuit board 3 and connected to the wiring pattern. A frame 6 of resin compact holds a periphery of the circuit board 3. Metallic clips 11 are separated from the connector 4 that is electrically connected to the electric apparatus, is respectively arranged at side edges of the frame 6 and also, a circuit board holding part 15 having fine pattern is provided in their neighborhoods. Extending parts 12 have pressure in a reverse direction because they are electrically connected to ground terminals 14. As a result, the parts 15 absorb pressure applied on solder that connects the terminal 16 and the wiring pattern of the circuit board 3 and the terminal 16.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a memory card, a LAN card, a MODEM card, and the like, which are detachably inserted into and removed from an electronic device such as a personal computer.
The present invention relates to a card-type input / output device called an ISDN card, a MUSIC card, a video capture card, or the like.

[0002]

2. Description of the Related Art Conventionally, many input / output devices of this kind have been invented. For example, Japanese Patent Application No. 9-1 filed by the present applicant
No. 31767 is configured as follows.

As shown in an exploded perspective view of FIG. 3, an input / output device 101 includes a semiconductor component 102 electrically connected by a wiring pattern of a substrate 103, a connector 104 electrically connected to an electronic device such as a personal computer, and the like. A connector 105 for electrically connecting to a telephone line or HUB is provided.
Of the front metal panel 109 and the back metal panel 1
10, the frame 106 is sandwiched and fixed.

[0004] The metal clip 111 is a personal computer printing memory card international association (PCMCI).
A) and the “PC STANDARD” standard recommended by the Japan Electronic Industry Development Association (JEIDA) specify that the input / output device 101 be provided on both side edges. A part of the metal clip 111 includes an extension 112 having elasticity. The extension 112 is electrically connected to the ground terminal 114 of the substrate 103, the front metal panel 109, and the back metal panel 110 to have the same potential. The input / output device protects the semiconductor component 102 from external noise and static electricity discharged from a human body by enabling discharge from the connector 104 to a ground circuit of an electronic device.

[0005]

SUMMARY OF THE INVENTION The aforementioned Japanese Patent Application No. 9-13 / 1997
The conventional input / output device 101 proposed in No. 1767 has a connector 105 for electrically connecting to a personal computer or the like and a connector 104 for electrically connecting to a telephone line or HUB in order to fix the substrate 103 and the frame 106.
Is fitted into the frame 106.

That is, the terminals of the connector 104 and the terminals 116 of the connector 105 are soldered for electrical connection to the wiring pattern of the substrate 103, and are fixed only with the solder.

For this reason, when the substrate 103 is mounted, the extension 10
No. 3 has a drawback in that a load is applied in the direction of arrow P and the terminal 116 is damaged, the solder is cracked, and a contact failure occurs, and it is necessary to solve this.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems. That is, when a pressure is applied in the P direction, a substrate holding portion for absorbing and reducing the pressure is provided on the frame.
More specifically, (1) a semiconductor component, a substrate on which the semiconductor component is mounted, a frame for holding the outer periphery of the substrate, and a metal clip having extensions arranged on both side edges of the frame And a metal panel that sandwiches and fixes the frame to form both front and back surfaces, a substrate holding portion is provided on the frame, and the pressure of the extension portion on the substrate is absorbed by the substrate holding portion. Input / output device.

(2) The input / output device according to (1), wherein the substrate holding portions are provided on both side edges of the frame.

(3) The input / output device according to (1), wherein the substrate holding portion is provided near the metal clip.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An input / output device according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of an input / output device 1 showing one embodiment of the present invention.

The semiconductor component 2 is mounted on a substrate 3 and is electrically connected to a wiring pattern on the substrate 3. The board 3 has a connector 4 electrically connected to an electronic device such as a personal computer and a connector 5 electrically connected to a telephone line or a HUB and having a terminal 16 and connected to a wiring pattern. The frame 6 of the resin molded body holds the outer periphery of the substrate 3. The front metal panel 9 and the back metal panel 10 sandwich and fix the frame 6 to form both front and back surfaces of the input / output device 1.

A metal clip 11 is provided on each side edge of the frame 6 at a position distant from the connector 4 for electrically connecting to an electronic device such as a personal computer. Provide. The metal clip 11 has an extension 12 and a cutout 13, and the extension 12 is electrically connected to a ground terminal 14 of the substrate 3, and the cutout 13 is formed by the front metal panel 9 and the back metal panel 10. Electrically connected to

With this configuration, the ground terminal 14 of the substrate 3 of the input / output device 1, the metal clip 11 having the extension 12 and the cutout 13, the front metal panel 9 and the back metal panel 10 have the same potential, and are charged. The electric charge is discharged from the connector 4 to a ground circuit of an electronic device such as a personal computer.

FIG. 2 is an exploded perspective view in which the vicinity of the metal clip 11 and a part of the substrate 3 are enlarged.

When assembling the input / output device 1, the substrate 3 is inserted in the direction of arrow Q. The extension 12 is pressed in a direction opposite to the arrow Q in order to be electrically connected to the ground terminal 14 of the substrate 3. As a result, the terminal 16 and the substrate 3
The board holding unit 15 absorbs the solder applied to the wiring pattern and the pressure applied to the terminal 16.

Therefore, after the assembly, solder cracks and breakage of the terminals 16 do not occur irrespective of the pressure.

The substrate holder 15 is provided with a metal clip 1.
1 mm long x 2 mm wide on both sides of frame 6 near 1
The degree of protrusion. Since the substrate holding portion 15 has such a small shape, it does not hinder the assembling work, and a highly reliable input / output device can be provided without damage to the terminal 16 or cracking of the solder attached to the terminal 16. .

[0020]

As described above, according to the input / output device of the present invention, the semiconductor component, the board on which the semiconductor component is mounted, the frame for holding the outer periphery of the board, and the side edges of the frame are provided. A metal clip having an extended portion disposed thereon, and a metal panel for holding and fixing the frame to form both front and rear surfaces, a substrate holding portion provided on the frame, and a pressure applied to the substrate by the extended portion. The absorption by the substrate holding unit can provide a highly reliable input / output device without hindering the assembling work.

Further, the substrate holding portions may be provided on both side edges of the frame.

Further, the substrate holding portion may be provided near the metal clip.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view showing an input / output device of the present invention.

FIG. 2 is an exploded perspective view showing the vicinity of a metal clip portion of the input / output device of the present invention.

FIG. 3 is an exploded perspective view showing a conventional input / output device.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 input / output device 2 semiconductor component 3 substrate 4 connector 5 connector 6 frame 9 front metal panel 10 back metal panel 11 metal clip 12 extension portion 13 cutout portion 14 ground terminal 15 substrate holding portion 16 terminal 101 input / output device 102 semiconductor component 103 Board 104 Connector 105 Connector 106 Frame 109 Front Metal Panel 110 Back Metal Panel 111 Metal Clip 112 Extension 114 Ground Terminal 116 Terminal

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yoshikazu Karaki 1-13-1 Nihonbashi, Chuo-ku, Tokyo Inside TDK Corporation

Claims (3)

[Claims] 1. A semiconductor component, a substrate on which the semiconductor component is mounted, a frame for holding an outer periphery of the substrate, a metal clip having extensions arranged on both side edges of the frame, and a frame for holding the frame. An input / output device, comprising: a metal panel that forms the front and back surfaces of the frame, the substrate holding portion being provided on the frame, and the pressure of the extension portion on the substrate being absorbed by the substrate holding portion. 2. The input / output device according to claim 1, wherein the substrate holding portions are provided on both side edges of the frame. 3. The input / output device according to claim 1, wherein the substrate holding unit is provided near the metal clip.