JPH11154217A - Hybrid card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a hybrid card capable of preventing the generation of noises at the time of optical recording/reproducing and preventing a card design print from being spoiled at the time of looking at it from an optical recording face. SOLUTION: The hybrid card is provided with a transparent substrate 19, an optical recording layer 20, an adhesive layer 21, and a non-contact IC card 15 having at least a thin type IC chip 8 and a coil wiring part consisting of coils 4, wirings 5, etc. In this case, a recording/reproducing light noise preventing part 2 is formed between at least the IC chip 8 or the coil wiring part and the adhesive layer 21.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid card comprising a combination of an optical card and a contactless IC card.

[0002]

2. Description of the Related Art In recent years, an information recording medium in the form of a card (hereinafter, referred to as a card) on which various information is recorded has been manufactured and used. The card includes emboss information, character information such as optically readable characters formed on a machine readable zone (MRZ), bar code information, magnetic memory, IC memory or optical recording memory. , Such as an embossed card, a card with an OCR, a card with a barcode, a magnetic card, an IC card, an optical card, or a combination of the above information, for example, (magnetic + IC)
So-called hybrid cards such as cards, (magnetic + optical) cards, (IC + optical) cards, and the like are known.

An optical card has excellent features such as a long recording life because of its large recording capacity and non-contact recording / reproduction, and an IC card has a small recording capacity but rewrites recorded information. Has high security.

[0004] IC cards are classified into a contact type and a non-contact type, and non-contact type IC cards are further classified into a contact type, a proximity type, and a long distance type. For these IC cards, ISO / IEC7816 for contact type and ISO / IECl0536 for contact type among non-contact type are established as international standard. Other types are currently being standardized.

In the case of a contact type IC card, the terminals of the IC need to be arranged on the surface of the card. On the other hand, in the case of a non-contact type IC card, the terminals of the IC are not required.
It is possible to embed a C chip inside the card. In addition, since the terminals are not exposed to the outside, they are excellent in environmental resistance, and there is no destruction of the IC chip due to static electricity caused by exposure of the IC terminals in the contact type IC card. Sex can be obtained. Furthermore, I
The ultra-thin non-contact IC card in which the C chip is thinned not only has excellent portability and flexibility, but also has a feature that since its structure is flat, it is easy to handle and excellent in mass productivity.

[0006] As a non-contact type IC card structure, IC
A structure in which an IC module composed of a chip, a capacitor, wiring, and a coil is sandwiched between upper and lower card substrates via an adhesive, or "Hitachi Review," May 1997, Vol. As described on pages 79 and 37 to 40, there is known a device in which an IC chip, a capacitor, and a print coil are mounted on a card substrate to reduce the thickness to about 0.2 mm.

On the other hand, an optical card is formed by laminating a transparent substrate coated with an optical recording layer, an adhesive layer made transparent by lamination, and a protective substrate provided with a printed layer. Conventionally, in an optical recording medium, there has been a problem of noise generation during recording / reproduction due to the fact that light transmitted through the recording film among the irradiated laser light is reflected on the surface of the protective layer and returns.

On the other hand, for example, Japanese Patent Publication No. 6-85236
Japanese Patent Laid-Open Publication No. H11-163873 proposes a configuration for preventing generation of noise by forming an opaque synthetic resin layer having a small difference in refractive index from the transparent protective layer on the transparent protective layer on the optical recording layer provided on the substrate. ing.

[0009]

SUMMARY OF THE INVENTION A non-contact IC card is
In that design, the coil is centered. When this non-contact IC card is incorporated into an optical card,
It has a transparent substrate, an optical recording layer, an adhesive layer, a non-contact IC card, and a protective substrate. That is, when viewed from the transparent substrate side,
An IC chip and a coil wiring portion of a non-contact IC card are stacked under the optical recording layer. The coil wiring portion used in this non-contact IC card is provided by a conductive printing layer, has a somewhat metallic luster, occupies a large area in the center of the card, and is opaque. If provided, the laser beam irradiated during optical recording and reproduction is reflected back to the coil surface, and this return light may cause noise during recording and reproduction.

[0010] Conventionally, an opaque resin layer provided under the optical recording layer for preventing noise uniformly covers the lower part of the optical recording area with an opaque resin layer such as carbon black. Even if the design print is provided on the back substrate (protective substrate) under the recording area, it is not visible from the transparent substrate side, and the visible information area of the card cannot be effectively utilized.

SUMMARY OF THE INVENTION The present invention has been made in order to improve such disadvantages of the prior art, and it is intended to prevent occurrence of noise at the time of optical recording / reproducing and to perform card design printing when viewed from an optical recording surface. It is an object of the present invention to provide a hybrid card that does not impair.

[0012]

That is, the present invention provides an optical card and a non-contact card including a transparent substrate, an optical recording layer, an adhesive layer, and a non-contact IC card having at least an IC chip and an antenna coil wiring portion. A hybrid card of a contact IC card, wherein a recording / reproducing light noise prevention structure is provided at least between an IC chip or an antenna coil wiring portion and the adhesive layer.

In the hybrid card of the present invention, the recording / reproducing light noise prevention structure is formed by roughening at least the surface of the IC chip or antenna coil wiring portion, or at least the IC chip or antenna coil wiring. It is preferably constituted by an antireflection layer provided on the surface of the portion.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The hybrid card of the present invention
A hybrid card of an optical card and a non-contact IC card including a configuration including a transparent substrate, an optical recording layer, an adhesive layer, and a non-contact IC card having at least an IC chip and an antenna coil (hereinafter abbreviated as coil) wiring portion. In this case, noise generation during optical recording / reproduction is reduced by forming a recording / reproduction light noise prevention structure at least between the IC chip or coil wiring portion and the adhesive layer.

Further, in the present invention, the recording / reproducing light noise preventing structure may have a structure in which at least the surface of the IC chip or the coil wiring portion is roughened, or an anti-reflection layer is provided on the surface of the IC chip or the coil wiring portion. It is composed of the provided
Because it is limited to the surface portion of the IC chip and the coil wiring portion, even if a material having a light shielding property is used as an anti-reflection layer, for example, the card design print applied to the back substrate through the optical recording layer can be viewed as it is. .

Hereinafter, the present invention will be described with reference to the drawings.
FIG. 1 is a sectional view showing an embodiment of the hybrid card of the present invention. In the figure, 1 is a hybrid card, 2 is a recording / reproducing light noise prevention unit, 3 is a transparent PET substrate, 4 is a coil, 5 is a wiring, 6 is a thin capacitor, 7 is a transparent PET substrate, 8 is a thin IC chip, 9 is Anisotropic conductive adhesive, 10
Are the core parts of the ultra-thin contactless IC card, 11, 12
Is an adhesive layer, 13 and 14 are PET, 15 is an ultra-thin non-contact I
C card, 16 is printing, 17 is PVC sheet, 18 is pregroove, 19 is PC transparent substrate, 20 is optical recording layer, 2
1 is a hot melt adhesive layer.

In FIG. 1, a hybrid card according to the present invention is a non-contact IC having a transparent substrate 19, an optical recording layer 20, an adhesive layer 21, and a coil wiring portion including at least a thin IC chip 8, a coil 4, a wiring 5, and the like. In a hybrid card of an optical card and a non-contact IC card including a configuration including the card 15, the recording / reproducing light noise prevention unit 2 is provided on at least the surface of the IC chip 8 or the coil wiring unit. And

FIG. 7 is a sectional view showing a conventional hybrid card. In the configuration of the hybrid card of the present invention shown in FIG. 1, the recording / reproducing light noise prevention unit 2 is provided, so that the laser light irradiated from the transparent substrate 19 side during the optical recording / reproducing is transmitted from the coil 4, the wiring 5, and the like. Since the amount of light reflected and returned on the surface of the coil wiring portion is small, noise does not occur due to the return light from the coil wiring portion. On the other hand, the conventional hybrid card of FIG. 7 does not have the recording / reproducing light noise prevention structure, and therefore, the laser beam irradiated at the time of optical recording / reproducing has a coil wiring portion composed of the coil 4, the wiring 5, and the like. Since there is a large amount of light reflected back from the surface, noise is generated due to this return light.

Furthermore, in the conventional noise prevention structure, since the entire optical recording area is covered with the opaque resin, the design printing applied to the card backing substrate cannot be seen. Since only the wiring portion has a return light prevention structure, as shown in FIG. 6, the card design print layer can be seen through the transparent substrate and the optical recording layer.

The recording / reproducing light noise prevention structure according to the present invention can be used not only for an IC chip and a coil wiring portion,
If there are other components, such as capacitors
By performing similar processing, the effect of preventing noise can be further enhanced.

As a method of providing a structure for preventing noise on the IC chip or the coil wiring portion, a structure for preventing return light of recording / reproducing light may be provided on at least the surface of the IC chip and the coil wiring portion on the optical recording layer side. .

As a method of providing the recording / reproducing light noise prevention structure, there is a method of roughening the surface of the IC chip and the coil wiring portion. As the method of the surface roughening treatment, any method may be used as long as it is a general method of chemically and physically roughening the surface. For example, a pressing method for transferring fine grooves formed on a substrate, sand, grid, A sand blast method in which carborundum or the like is sprayed on the surface of the base material, a solvent method in which the surface is eluted with a solvent, and the like can be used. In addition, a method of roughening the surface by fine cutting, sputtering or an ion beam may also be used. It can be performed using the above-mentioned general surface roughening technique.

The coil wiring portion can also be obtained by subjecting the surface of a PET sheet as a substrate to be printed to the above-mentioned surface roughening treatment and printing the wiring thereon before printing the coil wiring portion. The surface can be roughened in the same manner as described above.

Another method of providing a noise prevention structure at the time of recording / reproducing is as follows.
What is necessary is just to provide a layer which reduces the return light, for example, a resin having a small difference in refractive index from the support portion between the coil portion and the coil support substrate, and having a low light transmittance by adding a dye and a pigment. , An antireflection layer (light prevention layer) may be provided. Any material that can be added may be used as long as it has a large absorption of the recording laser light. For example, pigments include general black carbon black and chromium oxide. The effect of the present invention can be obtained even with a pigment such as titanium oxide which can obtain the property.

Further, a dye capable of sufficiently absorbing the laser beam even if the light transmittance is high, such as a tungsten-based dye and a phthalocyanine-based dye, can be used. WO ₃ can be used as a tungsten-based dye. As the phthalocyanine dye, Excolor (trade name) manufactured by Nippon Shokubai can be used. The material can be changed to an appropriate material depending on the wavelength of light used for optical recording / reproduction. For example, when using a semiconductor laser of 830 nm, an ex-color 80lW
(15% transmittance in the dye thin film: light transmittance at 808 nm). When a 780 nm semiconductor laser is used, Excolor 703B (transmittance in the dye thin film of 15%) is used.
%: Light transmittance at 778 nm), and when a semiconductor laser of 650 nm is used, Excalor 60 lW (transmittance in a dye thin film 12%: light transmittance at 663 nm) is preferably used, and these materials are mixed with resin. It can be formed as a printed resin sheet.

The optical card material used in the present invention is not particularly limited, and ordinary materials can be used.
For example, the materials disclosed in JP-A-8-161770 can be used.

More specifically, for example, as the material used for the optical card transparent substrate, any substrate can be used as long as the substrate can be optically recorded and reproduced and can be cut to embed an IC module. A good example is a plastic resin substrate such as polycarbonate, polyvinyl chloride, polymethyl methacrylate, and polyolefin.

A hardened surface layer, which is a scratch-resistant protective layer, may be provided to protect the surface of the transparent substrate from scratches, dust and the like. For the surface hardened layer, a material that does not hinder recording and reproduction optically and that is not deformed by the heat of the thermal head can be used. For example, urethane acrylate-based photocurable resins, epoxy-based resins, acrylic-based resins, silicon-based resins, and the like can be used.

As the optical recording layer, any material can be used as long as it is a material used for an optical recording material capable of recording / reproducing and erasing by a laser beam. Organic dye-based recording materials such as anthraquinone derivatives, dioxazine compounds and derivatives thereof, Nodithiazine compounds, phenanthrene derivatives, cyanine compounds, merocyanine compounds, pyrylium compounds, xanthene compounds, triphenylmethane compounds, croconium dyes, azo dyes, crocones, azines, indigoids, cyanine compounds having a polymethine chain Dyes, tetraphenylcyanine dyes,
Metallic recording materials, for example, Te, TeOx and the like can be used. Further, there may be other layer configurations such as a reflective layer, an undercoat layer, and the like.

As the adhesive layer, a conventionally known ordinary adhesive can be used. For example, polymers and copolymers of vinyl monomers such as vinyl acetate, acrylate, vinyl chloride, ethylene, acrylic acid, and acrylamide; thermoplastic adhesives such as polyamide, polyester, and epoxy; amino resins (urea resins, melamine Resins), adhesives such as phenolic resins, epoxy resins, urethane resins, and thermosetting vinyl resins, and rubber-based adhesives such as natural rubber, nitrile rubber, chloro rubber, and silicone rubber. When the adhesive layer overlaps the back surface of the IC, it is preferable to use a transparent material for the adhesive layer so that the visible information on the back surface of the IC can be easily recognized.

As the protective substrate, any material capable of mechanically and chemically protecting the optical recording layer and the IC card portion can be used, and plastic is particularly desirable. A card printing layer can be provided on either side of the protection substrate, and the card can be designed and printed, a photograph of the card, initialization information about the card holder, a bar code, and a card that can be optically recognized. OCR (Optical Character)
r Recognition), holograms, sign panels, etc., which are all provided in general credit cards and the like can be provided. If necessary, an overcoat layer may be provided on the surface of the card printing layer, that is, on the portion to be the outermost layer of the card.

In particular, in the above configuration, as the light transmittance of the optical recording layer and the adhesive provided on the transparent substrate is higher,
It is easily affected by the coil wiring portion, and the effect of design printing viewed through the optical recording layer is large. Therefore, the effect of providing the noise prevention structure is further enhanced.

[0033]

EXAMPLES The present invention will be specifically described below with reference to examples.

Example 1 The hybrid card shown in FIG. 1 was prepared by the method shown in FIGS.

Production of Ultra-Thin Non-Contact IC Card (Steps (a) to (d)) The transparent PET substrate 3 having a thickness of 10 μm was roughened by sandblasting. (Surface roughness Ra = 0.5 μm) The PE
On the surface on which the recording / reproducing light noise prevention unit 2 was formed by roughening the surface of the T substrate, the coil 4 and the wiring 5 were provided in a shape of 7000 mm by conductive printing. Further, a thin capacitor 6 of 3 μm was arranged.

On the other hand, a support substrate provided with an insulating film is bonded on a silicon wafer on which devices are formed. After the silicon wafer is removed from the back surface by a chemical method, the front surface is cut. (Literature: Electric device characteristics in defect remedy method using ultra-high density Si bonding technology; Usami et al., Hitachi, Ltd.)
Thus, a thin IC chip 8 having a thickness of 3 μm was provided on a transparent PET substrate 7 having a thickness of 10 μm.

These were bonded together via an anisotropic conductive adhesive 9 to produce a core 10 of an ultra-thin non-contact IC card having a thickness of 24 μm. (See FIGS. 2A and 2B.) For adjusting the thickness, the adhesive layers 11 and l
PET 1 of 75 μm thickness through 2 (40 μm thickness)
3 and 14 were laminated. A non-contact IC card 15 having a thickness of 254 μm was produced. (See Fig. 2 (c))

A printing layer 16 (thickness: 5 μm)
Was formed, a PVC sheet 17 having a thickness of 100 μm was laminated. (Thickness: 359 μm) In printing, an image seen through an IC card and white printing were applied to the outside thereof. (See Fig. 3 (d))

Incorporation into Optical Card (Step (e)) PC Transparent Substrate 19 with 400 μm Thick Pregroove 18
A hard coat (thickness: 5 μm) made of urethane acrylate was applied to the side without the pre-groove (not shown), and an optical recording layer 20 (thickness: 3000 mm) made of a polymethine dye was provided on the groove side. A non-contact IC card is placed on the outside of the PVC sheet 17 via a hot-melt adhesive 21 made of ethylene acrylic acid having a thickness of 50 μm.
Glued with a laminator. (814 μm) Thus, a hybrid card having the configuration shown in FIG. 1 was obtained.

In the first embodiment, the occurrence of noise during optical recording / reproducing is reduced by providing a recording / reproducing optical noise prevention structure on the surface of the IC chip portion or coil wiring portion. In addition, the card design print could be viewed as it was through the optical recording layer.

Example 2 The hybrid card shown in FIG. 4 was manufactured by the method shown in FIG.

Production of Ultra-Thin Non-Contact IC Card: 20
After providing an anti-reflection layer (anti-reflection layer) 2a (thickness of 5 μm) with the following material on the coil printed part on a transparent PET substrate with a thickness of μm, the shape of the coil and wiring is formed by conductive printing with the same type of plate. It was provided to a thickness of 5000 mm. Further, a thin capacitor having a thickness of 15 μm was arranged. Material Polystyrene resin 10 parts by weight Ceramic black 10 parts by weight Xylene 50 parts by weight

On the other hand, a support substrate provided with an insulating film is bonded on a silicon wafer on which devices are formed. After the silicon wafer is removed from the back surface by a chemical method, the front surface is cut. As a result, a thin IC chip having a thickness of 15 μm was provided on a transparent PET substrate having a thickness of 20 μm.

These were bonded together via an anisotropic conductive adhesive to prepare a core portion of a non-contact IC card having a thickness of 55.5 μm. For thickness adjustment, a 30 μm-thick PET was laminated on one side via an adhesive layer (10 μm thickness) to produce an ultra-thin non-contact IC card.

Incorporation into Optical Card A hard coat (thickness: 5 μm) made of urethane acrylate is applied to the pre-groove-free side of the PC transparent substrate 19 having a pre-groove having a thickness of 0.4 mm, and light consisting of a polymethine dye is applied to the pre-groove side. Recording layer 20 (thickness 3000)
Ii).

The transparent P having a thickness of 160 μm with the printed layer 22
The C substrate 23 is printed outside, the adhesive layer 24 having a thickness of 40 μm, an ultra-thin non-contact IC card, the adhesive layer 2 having a thickness of 40 μm
1. Overlap the transparent substrate 19 with pre-groove in the order of 140 ° C.
Was thermally laminated at a temperature of (786 μm thickness) In this way, a hybrid card having the configuration shown in FIG. 4 was obtained.

In the second embodiment, the occurrence of noise during optical recording / reproducing is reduced by providing a recording / reproducing optical noise prevention structure on the surface of the IC chip portion or the coil wiring portion. In addition, the card design print could be viewed as it was through the optical recording layer.

Comparative Example 1 An ultra-thin non-contact IC card shown in FIG. 7 was produced. 20μ
On a transparent PET substrate having a thickness of m, a coil and a wiring were formed to a thickness of 5000 mm by conductive printing. Further thickness 15μ
m thin capacitors were arranged. Thereafter, in the same manner as in Example 2, a core portion of an ultra-thin non-contact IC card having a thickness of 55.5 μm was produced.

For thickness adjustment, a 30 μm-thick PET is laminated on one side via an adhesive layer (10 μm thickness), and a hybrid card of an optical card and a non-contact IC card is prepared in the same manner as in the second embodiment. did.

Recording and reproduction were performed with the 830 nm laser using the cards obtained in Examples 1 and 2 and Comparative Example 1, and the C / N was measured. In Comparative Example 1 having no noise prevention structure, 46 to 48 dB was obtained. In Examples 1 and 2, it was 53 to 56 dB.

[0051]

As described above, in the hybrid card of the present invention, the occurrence of noise during optical recording / reproducing is reduced by providing the recording / reproducing optical noise prevention structure at least on the surface of the IC chip or the coil wiring portion.

Further, since the recording / reproducing light noise prevention structure is limited to the surface of the IC chip and the coil wiring portion, the card design print on the back substrate can be viewed as it is through the optical recording layer.

[Brief description of the drawings]

FIG. 1 is a sectional view showing one embodiment of a hybrid card of the present invention.

FIG. 2 is a process chart showing a first half of a manufacturing process of the hybrid card of the first embodiment.

FIG. 3 is a process chart showing the latter half of the hybrid card manufacturing process of the first embodiment.

FIG. 4 is a sectional view showing a hybrid card according to a second embodiment of the present invention.

FIG. 5 is a diagram illustrating a manufacturing process of the hybrid card according to the second embodiment.

FIG. 6 is a diagram showing a state of the hybrid card of the present invention viewed from a plane.

FIG. 7 is a sectional view showing a conventional hybrid card.

[Description of Signs] 1 Hybrid card 2 Recording / playback light noise prevention unit 3 Transparent PET substrate 4 Coil 5 Wiring 6 Thin capacitor 7 Transparent PET substrate 8 Thin IC chip 9 Anisotropic conductive adhesive 10 Ultra thin non-contact IC card Core part 11, 12 Adhesive layer 13, 14 PET 15 Ultra-thin non-contact IC card 16 Printing 17 PVC sheet 18 Pregroove 19 PC board 20 Optical recording layer 21 Hot melt adhesive layer 22 Printing 23 Transparent PC board 24 Adhesion layer

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI G11B 7/24 572 G06K 19/00 C 13/00 H

Claims (3)

[Claims] 1. A hybrid card of an optical card and a non-contact IC card, including a structure including a transparent substrate, an optical recording layer, an adhesive layer, and a non-contact IC card having at least an IC chip and an antenna coil wiring portion. A hybrid card having a recording / reproducing light noise prevention structure provided at least between an IC chip or an antenna coil wiring portion and the adhesive layer. 2. The hybrid card according to claim 1, wherein the recording / reproducing light noise prevention structure is formed by roughening at least a surface of an IC chip or an antenna coil wiring portion. Hybrid card. 3. The hybrid card according to claim 1, wherein the recording / reproducing light noise prevention structure comprises at least an anti-reflection layer provided on a surface of an IC chip or an antenna coil wiring portion. .