JPH11147279A - Laminate and capacitor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminate obtained by laminating a plurality of laminating units each consisting of a resin thin film layer and a metal thin film layer, good in surface characteristics regardless of laminating thickness and capable of sufficiently responding to the request of the reduction in thin film thickness and the enhancement of capacity because no foreign matter is contained in the laminate. SOLUTION: In a laminate obtained by laminating a plurality of laminating units each consisting of a resin thin film layer 11 and a metal thin film layer 12, the surface roughness of the resin thin film layer 11 is set to 0.1 μm or less and a projection forming component is not added to the resin thin film layer 11 or the surface roughness of the metal thin film layer 12 is set to 0.1 μm less.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminate formed by laminating a plurality of laminate units each composed of a resin thin film layer and a metal thin film layer.

[0002]

2. Description of the Related Art A laminate comprising a resin thin film layer and a metal thin film layer is widely used in magnetic recording media such as magnetic tapes, packaging materials, and electronic components.

[0003] The resin thin film layer used in such a laminate is
A method obtained by applying a solution obtained by diluting a resin material with a solvent to a support, drying and curing the resin material in addition to a method of obtaining a self-supporting film by melting and stretching the resin material to form a film. Has been put to practical use. However, the resin thin film layer obtained by the former method includes a projection-forming component (for example, externally added particles) in the film and imparts fine irregularities to the film surface in order to ensure the transportability of the film. In addition, a technique for reducing the friction coefficient has been adopted. In addition, the manufacturing equipment tends to be large. On the other hand, in the resin thin film layer obtained by the latter method, a defect may occur in the coating film after drying, and coarse projections are easily generated on the thin film surface. In addition, some solvents may be environmentally unfavorable. Further, in any of the above methods, the thickness of the obtained resin thin film layer is at most about 1 μm, and it is difficult to stably obtain a thinner resin thin film layer.

On the other hand, as a method for stably obtaining a thin resin layer, a method of forming a thin resin film on a support in a vacuum has been proposed. According to this method, after a resin material is vaporized in a vacuum, it is attached to a support to form a thin film. According to this method, a resin thin film layer is formed on a relatively small-scale facility with less adverse effect on the environment. It can be formed.

On the other hand, for forming a metal thin film layer, a method of vacuum deposition on the surface of a substrate moving at a high speed is suitable for mass production and has been industrially put to practical use. Since the thickness of such a metal thin film layer is extremely small, the surface shape of the substrate surface is directly reflected on the surface of the metal thin film layer.

[0006] Today's demands for laminates composed of a resin thin film layer and a metal thin film layer are increasingly toward miniaturization and high performance. Therefore, the thickness of the resin thin film layer or the metal thin film layer is becoming thinner and the instability factors such as abnormal projections and foreign matter tend to be eliminated.

[0007]

However, after applying the solution obtained by diluting the resin material with a solvent to a resin thin film layer obtained by melting and stretching the above resin material, or a support, the resin film is dried and cured. In the laminate obtained by forming a metal thin film layer on the obtained resin thin film layer by vapor deposition or the like, it is difficult to obtain a thin resin thin film layer, and the resin thin film layer contains foreign matter or has various characteristics on the surface. There is no one that has a projection that hinders or satisfies the demand for a thinner and higher performance laminate.

[0008] Further, in a laminate in which a metal thin film layer is formed on a resin thin film layer formed on a support in a vacuum by vapor deposition or the like, a thin laminate can be obtained, but the surface characteristics are still insufficient. Therefore, the stability of various characteristics is lacking, and it is not possible to satisfy the strict requirements for today's laminate.

Therefore, the present invention provides a laminated body comprising a plurality of laminated units composed of a resin thin film layer and a metal thin film layer, which has good surface characteristics regardless of the lamination thickness, and prevents foreign matter from entering the laminated body. An object of the present invention is to provide a laminate that can sufficiently respond to today's demand for thinner and higher performance because it does not contain.

[0010]

The present invention has the following configuration to achieve the above object.

That is, the laminate according to the present invention is a laminate formed by laminating a plurality of lamination units each composed of a resin thin film layer and a metal thin film layer, wherein the resin thin film layer has a surface roughness of 0.1 μm or less. It is characterized by being.

The laminate of the present invention is a laminate obtained by laminating a plurality of lamination units each composed of a resin thin film layer and a metal thin film layer, wherein the resin thin film layer does not contain a projection forming component. It is characterized by the following.

Further, the laminate of the present invention is a laminate formed by laminating a plurality of lamination units each composed of a resin thin film layer and a metal thin film layer, wherein the metal thin film layer has a surface roughness of 0.1 μm or less. It is characterized by being.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The laminate of the present invention is formed by laminating a plurality of lamination units each composed of a resin thin film layer and a metal thin film layer.
A laminate in which a plurality of such laminate units are laminated is widely used in applications such as a magnetic recording material, a packaging material, and an electronic component material, and there is a great demand for reducing the thickness of the laminate and stabilizing characteristics. Such a laminated unit may be continuously laminated, or another layer may be laminated therebetween. Further, another layer may be laminated on the laminate of the present invention above, below, or between them.

The surface roughness of the resin thin film layer of the laminate of the present invention must be 0.1 μm or less, preferably 0.1 μm.
It is at most 04 μm, particularly preferably at most 0.02 μm. Further, the surface roughness of the metal thin film layer of the laminate of the present invention,
It must be 0.1 μm or less, preferably 0.04
μm or less, particularly preferably 0.02 μm or less. If the surface roughness is larger than this, it is not possible to attain a higher level of characteristics in various applications in which the laminate is used, and the characteristics will be unstable. For example, in magnetic recording media, high-density recording becomes difficult, and large-surface projections cause dropouts and the like, and recording reliability decreases. Further, in the application of electronic components, it is difficult to achieve high integration, and an electric field is concentrated on the surface rough projections, which leads to melting of the resin thin film layer and burning of the metal thin film layer.

The surface roughness of the resin thin film layer is 1/10 or less, more preferably 1/25 or less, especially 1/5 of the thickness of the resin thin film layer.
It is preferably 0 or less. If the surface roughness of the resin thin film layer is too large with respect to the thickness of the resin thin film layer, concentration of electric and magnetic fields and flattening of adjacent metal thin film layers will occur. Further, the surface roughness of the metal thin film layer is 1/10 or less, more preferably 1/25 or less, especially 1/50 of the thickness of the resin thin film layer or the thickness of the metal thin film layer.
It is preferred that: If the surface roughness of the metal thin film layer is too large relative to the thickness of the resin thin film layer or the thickness of the metal thin film layer, concentration of an electric field or a magnetic field, flattening failure of an adjacent resin thin film layer, and concentration of current will occur.

In the present invention, the surface roughness is measured by using a diamond needle having a tip diameter of 10 μm and measuring load of 10 mg.
Is a ten-point average roughness Ra measured by a contact type surface roughness meter. The surface roughness of the resin thin film layer was measured by applying a direct contact needle to the surface of the resin thin film layer, and the surface roughness of the metal thin film layer was measured by applying a direct contact needle to the surface of the metal thin film layer. is there. At this time, the influence of another laminated portion (for example, a step due to the presence of an electrically insulating portion or an electrically insulating band described later).
It is needless to say that it is necessary to eliminate the measurement.

The resin thin film layer of the laminate according to the present invention must not contain a projection-forming component. Here, the protrusion-forming component means a component added to the matrix resin or a component synthesized in the matrix resin and having a capability of forming an uneven shape on the surface of the resin thin film layer. It does not matter whether or not it has a fixed form regardless of an organic substance or an inorganic substance. For example, inorganic particles, organic particles, a resin incompatible with the matrix resin, a component by-produced during the synthesis of the matrix polymer, and the like are applicable. The presence of such a component makes it impossible to obtain the characteristics as designed in various applications in which the laminate is used, resulting in instability of the characteristics. For example, optical characteristics become unstable in optical recording applications. Also, in electronic component applications, the dielectric constant fluctuates. Further, such components form various irregularities on the surfaces of the resin thin film layer and the metal thin film layer, and increase the surface roughness, thereby causing the above problem.

The thickness of the resin thin film layer is not particularly limited and can be appropriately determined according to the use in which the laminate is used.
Hereinafter, it is more preferably 0.7 μm or less, particularly preferably 0.4 μm or less. Thinner layers can meet the demand for miniaturization of the laminate. For example, when used as a capacitor, the smaller the thickness of the resin thin film layer serving as the dielectric layer, the greater the capacitance, and at the same time the size of the capacitor can be reduced. Further, the laminate of the present invention does not have the above-described problem because the surface properties are good even if the resin thin film layer is thin.

The thickness of the metal thin film layer is not particularly limited and can be appropriately determined according to the use in which the laminate is used.
nm or less, more preferably 50 nm or less, particularly preferably 10 to 40 nm. The film resistance is 2Ω / □ or more, and 3
It is preferably Ω / □ or more, particularly preferably 3 to 10Ω / □.
If the metal thin film layer is thicker than the above range, or if the film resistance is smaller than the above range, the thickness of the laminate is too large to be reduced in size, or characteristics such as high frequency characteristics are deteriorated. If the metal thin film layer is thinner than the above range, or if the film resistance is larger than the above range, the moisture resistance may decrease or the allowable current value may become insufficient.

The (thickness of the resin thin film layer) / (thickness of the metal thin film layer) is not particularly limited and can be appropriately determined according to the use in which the laminate is used. Hereinafter, it is more preferable to be 15 or less. When this range is satisfied, when the opposed metal thin film layer is electrically short-circuited due to a pinhole or the like of the resin thin film layer serving as the dielectric layer, the metal thin film layer disappears or melts due to an overcurrent, and defects are generated. The self-healing function of removing is well exhibited.

The degree of cure of the resin thin film layer is preferably from 50 to 95%, more preferably from 70 to 90%, from the viewpoint of the handleability of the laminate and the stability of the properties. The degree of curing means the degree of polymerization and / or crosslinking of the resin thin film layer. When the curing degree is smaller than the above range, in various applications of the press or the laminate in the production process of the laminate, for example, it is easily deformed when an external force or the like is applied in a process of mounting on a circuit board as an electronic component, or the metal thin film layer Breakage or short circuit may occur.
On the other hand, if the degree of cure is greater than the above range, when removing the continuous body of the cylindrical laminate from the can roller in the manufacturing process of the laminate described below, or when pressing to obtain a flat laminate mother element, Further, when the laminated body is used for various applications, there may be a problem that the laminated body is broken when an external force is applied. Further, when an external electrode is formed on the laminate and used as an electronic component (see FIG. 11), the sprayed metal particles at the time of forming the external electrode are less likely to penetrate between the metal thin film layers, thereby weakening the adhesion strength of the external electrode. The curing degree of the present invention is determined by measuring the absorbance of the C ＝ O group and the C ＝ C group (1
600 cm ^-1 ), the ratio of each monomer to the cured product was taken, and the absorbance of the decrease was subtracted from 1.

The material of the metal thin film layer is aluminum, copper,
It is preferably made of zinc, nickel, or a compound thereof, or an oxide of these compounds, or an oxide of these compounds. Among them, aluminum is preferable in terms of adhesiveness to the resin thin film layer and economy. In addition, these may be the main components and may contain trace amounts of other components.

The material of the resin thin film layer can be laminated to a thickness of about 1 μm or less, and is not particularly limited as long as it satisfies the required characteristics of various uses in which the laminate is used. In this case, for example, it is preferable to use an acrylate resin or a vinyl resin as a main component. Specifically, a polymer of a polyfunctional (meth) acrylate monomer or a polyfunctional vinyl ether monomer is preferable. Among them, a polymer such as dicyclopentadiene dimethanol diacrylate or a cyclohexane dimethanol divinyl ether monomer or a hydrocarbon group is substituted. Polymers of monomers are preferred in terms of electrical properties.

Although the laminate of the present invention is a laminate of a resin thin film layer and a metal thin film layer, the metal thin film layer laminated on the resin thin film layer does not necessarily have to be continuous, but is divided into a plurality. May be. FIG. 1 is a sectional view in the thickness direction schematically showing an example of such a laminate. FIG. 2 shows FIG.
1 shows a cross-sectional view as seen from the direction of the arrow II of FIG. The metal thin film layer laminated on the resin thin film layer 11 is divided into a first metal thin film layer 12 and a second metal thin film layer 14 by a band-shaped electrically insulating portion 13. The number of electrically insulating portions on the resin thin film layer does not need to be one, but may be plural, and the number of divisions of the metal thin film layer may be three or more. By dividing the metal thin film layer into a plurality of pieces as described above, for example, in an electronic component application, each metal thin film layer can be used as an electrode having a different potential.

For example, as shown in FIG. 1, one electrically insulating portion is formed on the resin thin film layer, and thereby the metal thin film layer is divided into two. Further, the electrical insulation portions of adjacent stack units are arranged so that the stack positions are different. That is, FIG.
As shown in the figure, when the stacking unit 15a is stacked adjacent to the stacking unit 15, the stacking positions of the electrically insulating portion 13 of the stacking unit 15 and the electrical insulating portion 13a of the stacking unit 15a are different. Deploy. As described above, by sequentially laminating the lamination units having different positions of the electrically insulating portions, the external electrodes are formed on the side portions of the laminate (FIG. 11).
), A capacitor can be formed. That is,
An external electrode (not shown) for connecting the first metal thin-film layer 12 of the stacked unit 15 and the first metal thin-film layer 12a of the adjacent stacked unit 15a at substantially the same potential; External electrode (not shown) for connecting the metal thin film layer 14 of the first embodiment and the second metal thin film layer 14a of the laminated unit 15a at substantially the same potential.
And a potential difference is applied between both external electrodes. At this time, since the electrically insulating portions 13 and 13a of the stacked unit 15 and the stacked unit 15a adjacent to the stacked unit 15 are arranged at different positions, the first metal thin film layer 12 of the stacked unit 15 and the The second metal thin film layer 14a is used as an electrode, and a portion of the resin thin film layer 11a sandwiched between the first metal thin film layer 12 and the second metal thin film layer 14a is a dielectric (capacitance generating portion). Is formed. Accordingly, disposing the electrically insulating portions of adjacent lamination units so that the lamination positions are different means that the lamination positions are different to such an extent that the capacitance generating portion of the capacitor can be formed as described above. From such a viewpoint, it is preferable to provide the electrically insulating portion so that the area of the capacitance generating portion is as large as possible.

In the above description, of the resin thin film layer 11a, the first metal thin film layer 12 and the second metal thin film layer 14a
The portion other than the portion sandwiched between these components does not contribute to the formation of the capacitance of the capacitor. At the same time, the second metal thin film layer 14 of the stack unit 15 and the first metal thin film layer 1 of the stack unit 15a
2a does not function at all as a capacitor electrode. However, the second metal thin film layer 14 of such a stacked unit 15 and the first metal thin film layer 12a of the stacked unit 15a
Is significant in increasing the adhesion strength of the external electrode. That is, the adhesion strength of the external electrode greatly depends on the connection strength with the metal thin film layer, and the connection strength with the resin thin film layer does not contribute much. Therefore, even if the metal thin film layer does not contribute to the generation of the capacitance of the capacitor, the presence of the metal thin film layer greatly improves the adhesion strength of the external electrode when the capacitor is used. The presence of such a metal thin film layer is particularly important in the case of a small-sized laminate. The external electrode is formed by metal spraying or the like. At this time, the particles of the sprayed metal are relatively large, and when the resin thin film layer is extremely thin, it is difficult to penetrate between the metal thin film layers. Moreover, since the laminate is small, the exposed portion of the metal thin film layer is small. Therefore, it is extremely important to increase the contact area with the external electrode as much as possible from the viewpoint of securing the adhesion strength of the external electrode.

The shape of the electrically insulating portion is a band having a constant width W from the viewpoint of ease of manufacture. The width W of the electrically insulating portion is not particularly limited, but is preferably 0.03 to 0.5 mm when used as a capacitor, and more preferably 0.05 to 0.5 mm.
It is preferably 0.4 mm, especially about 0.1 to 0.3 mm. If it is larger than this range, the area of the capacitance generating portion as the capacitor becomes small, and it is impossible to realize a high capacitance. On the other hand, if it is smaller than this range, it becomes difficult to secure electrical insulation properties, and it becomes difficult to accurately manufacture a narrow width electrical insulation portion.

It is preferable that the lamination positions of the electrically insulating portions are not the same in the entire laminated body. As shown in FIG. 1, the electrically insulating portions of adjacent stacked units are arranged at different positions,
When the lamination positions of the electrically insulating portions of every other lamination unit are arranged at substantially the same position, it is preferable that the lamination positions of the electrically insulating portions of every other lamination unit are not the same position in the entire laminate. FIG. 3 is a sectional view in the thickness direction (stacking direction) schematically showing an example of the element layer having such a configuration. That is, with respect to the electrically insulating portion 23 of the laminated unit 25, the position of the electrically insulated portion 23b of the laminated unit 25b is not set to the same position as the electrically insulated portion 23, but instead of the electrically insulated portion 23. Shift by d in the width direction. Hereinafter, in the same manner, the position of the electrically insulating portion of the further stacked unit is set in the width direction of the electrically insulating portion by d.
Just shift in any direction. Alternatively, the positions of the electrically insulating portions of one stacked unit may be the same, and the positions of the electrically insulating portions of the three stacked units may be shifted in the width direction of the electrically insulating portion.

By shifting the lamination position of the electrically insulating portion in this way, the irregularities on the upper and lower surfaces of the laminate can be suppressed. That is, since there is no metal thin film layer in the electrically insulating portion, when viewed as a whole of the laminate, the laminated thickness of this portion is reduced, and concave portions are formed in the portions 26a and 26b on the upper surface of the laminate. When soldering to a printed circuit board is performed, the recess may have poor handling properties. In addition, when such a concave portion is generated, as the depth of the concave portion increases, it becomes difficult to attach a patterning material described later to the bottom portion of the concave portion during the manufacturing process of the laminate, and a good electric power having a certain width is obtained. It becomes difficult to form an electrically insulating portion. Further, with the formation of the concave portion, the resin thin film layer and the metal thin film layer on both sides of the electrically insulating portion laminated thereon become inclined, and therefore, the lamination thickness of the resin thin film layer and the metal thin film layer is locally increased. Thinner. When the laminated thickness of the resin thin film layer is locally reduced, when the laminated body is used as a capacitor, the withstand voltage of the capacitor is reduced due to the presence of the portion, and a short circuit occurs due to a pinhole of the resin thin film layer. Further, when the lamination thickness of the metal thin film layer is locally reduced, poor conductivity or the like is likely to occur at that portion.

The metal thin film layer of the present invention does not need to be laminated on the entire surface of the resin thin film layer, but may be laminated only on a part thereof. FIG. 4 is a sectional view in the thickness direction schematically showing an example of such a laminate.
FIG. 5 is a cross-sectional view taken along the line II-II of FIG. Metal thin film layer 32 laminated on resin thin film layer 31
Are laminated on a portion of the resin thin film layer 31 excluding the strip-shaped electrically insulating portion 33 existing at one end. By forming an electrically insulating portion at one end of the resin thin film layer instead of laminating the metal thin film layer on the entire surface of the resin thin film layer, for example, in an electronic component application, different metal thin film layers of different lamination units are used. It can be used as an electrode having a potential.

For example, the layers are stacked such that the respective electrically insulating portions of the adjacent stacked units are located on opposite sides. That is, as shown in FIG. 4, when the stacking unit 34 a is stacked adjacent to the stacking unit 34 and the electrically insulating portion 33 of the stacking unit 34 is at the right end of the resin thin film layer 31,
The electrically insulating portion 33a of the laminated unit 34a is formed of the resin thin film layer 3
Lamination is performed so as to exist on the left end of 1a. In this way, by sequentially laminating the lamination units such that the position of the electrically insulating portion is located on the opposite side, when the external electrode is formed on the side of the laminate (see FIG. 11), the capacitor is formed. Can be done. That is, one external electrode is connected to the laminate unit 3
4 and the other external electrode is connected to the metal thin film layer 32a of the adjacent stacked unit 34a, and a potential difference is applied between the two external electrodes. At this time, the metal thin film layer 32 of the stacked unit 34 and the metal thin film layer 32a of the stacked unit 34a are used as electrodes, respectively.
A capacitor is formed in which the portion sandwiched between a and a is a dielectric (capacitance generating portion). From such a viewpoint, it is preferable to reduce the width of the electrically insulating portion as much as possible so that the area of the capacitance generating portion becomes as large as possible.

The shape of the electrically insulating portion is a band having a constant width W from the viewpoint of ease of manufacture. The width W of the electrically insulating portion is not particularly limited. However, when used for a capacitor, the width W is 0.03 to 0.5 mm, and more preferably 0.05 to 0.4 mm.
mm, especially about 0.1 to 0.3 mm, is preferable from the viewpoints of increasing the capacity of the capacitor, securing electrical insulation, and facilitating manufacturing.

Further, it is preferable that the widths of the electrically insulating portions stacked at substantially the same position are not the same when viewed as a whole of the laminate. For example, as shown in FIG. 4, when the respective electrically insulating portions of adjacent stacked units are stacked so as to be located on opposite sides, the width of the band-shaped electrically isolated portion of every other stacked unit is It is preferable that all of the laminates are not the same in width. FIG. 6 is a cross-sectional view in the thickness direction (stacking direction) schematically illustrating an example of a stacked body having such a configuration. That is, as shown in FIG.
The width of the electrically insulating portion 43b of the stacked unit 44b is set to be smaller than that of the electrically insulating portion 43.
3 is assumed. Hereinafter, the width of the electrically insulating portion of each of the stacked units is sequentially changed. Alternatively, the width of the electrically insulating portion of one stacked unit may be the same width, and the width of the electrically insulating portion of three stacked units may be changed.

If the widths of the electrically insulating portions laminated at substantially the same position are all the same width, the end portion where the electrically insulating portion exists has a small number of laminated metal thin film layers, and thus is viewed in the entire laminated body. In this case, the lamination thickness of this portion is reduced, and a marked concave portion is formed on the upper surface of the laminate. When soldering to a printed circuit board is performed, the recess may have poor handling properties. In addition, when such a concave portion is generated, as the depth of the concave portion increases, it becomes difficult to attach a patterning material described later to the bottom portion of the concave portion during the manufacturing process of the laminate, and a good electric power having a certain width is obtained. It becomes difficult to form an electrically insulating portion. Further, with the formation of the concave portion, the resin thin film layer and the metal thin film layer on the side of the electrically insulating portion laminated thereon become inclined, and therefore, the lamination thickness of the resin thin film layer and the metal thin film layer is locally increased. Thinner. When the laminated thickness of the resin thin film layer is locally reduced, when the laminated body is used as a capacitor, the withstand voltage of the capacitor decreases due to the presence of the portion, and a short circuit occurs due to a pinhole in the dielectric layer. Further, when the lamination thickness of the metal thin film layer is locally reduced, poor conductivity or the like is likely to occur at that portion.

In the above case, the surface roughness of the resin thin film layer where the electrically insulating portion is laminated is not more than twice the surface roughness of the resin thin film layer where the metal thin film layer is laminated. It is preferably at most one time. If the two do not satisfy this relationship, the surface roughness of the upper and lower layers of the electrically insulating portion will be rough, resulting in electric field concentration, current concentration,
The insulation of the insulating part deteriorates.

The number of laminations of the lamination unit composed of the resin thin film layer and the metal thin film layer is not particularly limited, and may be appropriately determined according to the use of the laminate. For example, when the laminate is used for a large-capacity capacitor, the number of laminates is preferably 1000
The number of layers is preferably at least 2,000, more preferably at least 2,000, particularly preferably at least 3,000. The larger the number of layers, the larger the capacity when used as a capacitor. In addition, the laminate of the present invention can obtain a high adhesion strength of the external electrode even if the resin thin film layer is thinned by forming a reinforcing layer and a protective layer described later, and can sufficiently withstand a heat load and an external force. be able to. In addition, even if the thickness of the resin thin film layer is reduced and the number of laminated layers is increased, the overall thickness does not increase so much. With a capacity, a smaller capacitor can be obtained.

The laminate of the present invention may have a laminate having a different lamination form on at least one side of the above-mentioned laminate or between them, depending on the use and required characteristics.
For example, a reinforcing layer formed by laminating a plurality of laminated units each composed of a resin layer and a metal layer laminated on one surface of the resin layer may be laminated on at least one surface of the laminate.

Such a reinforcing layer is used in a manufacturing process of the laminate or in various uses of the laminate, for example, in a process of mounting an electronic component on a printed circuit board or the like, and the above-mentioned laminate portion is damaged by a thermal load or an external force. It is effective to prevent receiving. Further, since the reinforcing layer has the metal layer, it is effective to increase the adhesion strength of the external electrode (see FIG. 11). That is, the adhesion strength of the external electrode depends on the connection strength with the metal layer, and the connection strength with the resin layer does not contribute much. Therefore, by using a reinforcing layer having a metal layer, the adhesion strength of the external electrode when a capacitor is formed is greatly improved. The reinforcing layer may function as a capacitance generating portion of the capacitor when, for example, an external electrode is formed and used as a capacitor, but when it does not function, the design of the capacitor becomes easier.

The reinforcing layer may be provided only on one side of the laminate,
Although it may be provided on both sides, it is preferable to provide it on both sides, since the effect of protecting the element layer and improving the adhesion strength of the external electrode is favorably exhibited.

The reinforcing layer may be laminated in contact with the above-mentioned laminate, or may be laminated with another layer interposed.

The reinforcing layer is preferably formed by laminating a plurality of laminating units in order to further exert the effect of the reinforcing layer.

In order for the reinforcing layer to exhibit the above-mentioned effects sufficiently, the thickness (the thickness on one side) is 20 μm or more.
Further, the thickness is preferably 50 to 500 μm, particularly preferably 100 to 300 μm.

The form of lamination of the reinforcing layer is appropriately determined depending on the application of the laminate, and when the laminate is used as a capacitor, an electric insulating band is formed on the resin layer. Without the electric insulating band, when external electrodes (see FIG. 11) are provided opposite to both side surfaces of the laminate, the external electrodes are short-circuited via the metal layer. The shape of the electrical insulating band is a band shape having a certain width from the viewpoint of ease of manufacturing and the like. In addition, if the number of electric insulating bands is one, the insulation of both external electrodes can be ensured, but two or more electric insulating bands may be present.

FIG. 7 shows an example of a reinforcing layer having a configuration in which a plurality of lamination units in which two metal layers distinguished by a strip-shaped electric insulator existing on a resin layer are laminated on the resin layer. FIG. 2 shows a schematic cross-sectional view in the thickness direction (lamination direction).

The reinforcing layer 50 is formed by laminating at least one laminated unit 55 composed of a resin layer 51 and a first metal layer 52 and a second metal layer 53 laminated on one side thereof. The first metal layer 52 and the second metal layer 53 are distinguished by an electric insulating band 54.

Although there is no particular limitation on the position of the electric insulating band, it is preferable that the electric insulating band is disposed substantially at the center of the reinforcing layer as shown in FIG. When arranged at substantially the same position as the above-mentioned electrically insulating portion, a concave portion formed on the upper surface of the laminated body becomes large, for example, when soldering is performed on a printed circuit board, the handling property deteriorates, and the probability of occurrence of short-circuit failure due to defective soldering is reduced. Will be higher. In addition, when such a concave portion is formed, as the depth of the concave portion increases, it becomes difficult to adhere a patterning material to be described later to the bottom of the concave portion. It becomes difficult to form a band. Further, with the occurrence of the concave portion, the resin thin film layer and the metal thin film layer on both sides of the electrically insulating portion laminated thereon become inclined, so that the laminated thickness becomes thin, and the withstand voltage of the capacitor becomes low. It is easy to cause deterioration, pinholes in the dielectric layer, and poor conductivity in the metal thin film layer.

When laminating two or more layers of the reinforcing layer, when the whole reinforcing layer (or the reinforcing layer on both sides is provided on one side), the lamination positions of the electric insulating bands are not the same. Is preferred. For example, as shown in FIG. 8, the lamination position of the electric insulation band of the adjacent lamination unit is d1
Just stagger. Hereinafter, in the same manner, the position of the electric insulating band of the adjacent laminated unit is shifted in any direction by d1 in the width direction of the electric insulating band. Alternatively, the positions of the electrical insulating bands of two consecutive (or more) stacked units are the same, and the position of the electrical insulating band of the third (or more) stacked unit is set in the width direction of the electrical insulating band. It may be shifted. If the lamination positions are the same, a concave portion is formed in the electric insulating band portion on the surface of the laminate, and when soldering is performed on a printed circuit board, handling properties may be deteriorated. In addition, when such a concave portion is formed, as the depth of the concave portion increases, it becomes difficult to adhere a patterning material described later to the bottom portion of the concave portion. It becomes difficult to form parts. Further, with the occurrence of the concave portion, the resin thin film layer and the metal thin film layer on both sides of the electrically insulating portion laminated thereon become inclined, so that the laminated thickness becomes thin, and the withstand voltage of the capacitor becomes low. This tends to cause deterioration, pinholes in the resin thin film layer, and poor conductivity in the metal thin film layer.

On the other hand, if the deviation d1 is too large, the effect of eliminating the concave portions on the upper surface of the laminated body will not be remarkable,
When the lamination position of the electric insulating band coincides with the lamination position of the electrically insulating portion, a concave portion is formed on the surface of the laminate, and the above-described problem occurs. Further, if the first metal layer and the second metal layer of the adjacent stacked unit overlap, a capacitor may be formed at the overlapping portion, which may cause a problem in designing the capacitance.

FIG. 9 is a cross-sectional view in the thickness direction (lamination direction) schematically showing an example of a reinforcing layer formed by laminating a plurality of lamination units having different lamination forms.

The reinforcing layer 70 of this embodiment is formed by laminating a plurality of laminated units 74 each composed of a resin layer 71 and a metal layer 72 laminated on one side of the resin layer. The metal layer does not exist in the band-shaped electrically insulating band portion 73 existing at one end of the resin layer surface.

When laminating two or more lamination units,
It is preferable that the widths of the electrically insulating bands are not the same when viewed over the entire reinforcing layer (when the reinforcing layers are provided on both sides, the entire reinforcing layer on one side). For example, as shown in FIG. 10, the width of the electric insulating band 82 of the adjacent laminated unit is changed with respect to the electric insulating band 81, the width of the electric insulating band 83 of the adjacent laminated unit is changed, and so on. The width of the electrical insulation zone is gradually increased. Alternatively, the width of the electric insulation band of two (or more) continuous lamination units may be the same width, and the width of the electric insulation band of the third (or more) lamination unit may be changed. Good.

If the widths of the electric insulating bands are all the same, the end portion where the electric insulating bands are present has a small number of metal thin film layers. As a result, a marked concave portion is formed on the upper surface of the laminate. For example, when solder is mounted on a printed circuit board, the concave portion has poor handleability, and may adversely affect solder wettability. In addition, when such a concave portion is generated, as the depth of the concave portion increases, it becomes difficult to attach a patterning material described later to the bottom portion of the concave portion during the manufacturing process of the laminate, and a good electric power having a certain width is obtained. It becomes difficult to form insulating bands and electrically insulating portions. Further, with the occurrence of the concave portion, the resin thin film layer and the metal thin film layer on the side of the electrically insulating portion laminated thereon become inclined, so that the laminated thickness of the dielectric layer and the metal thin film layer is locally increased. Thinner. When the laminated thickness of the resin thin film layer is locally reduced, when the laminated body is used as a capacitor, the withstand voltage of the capacitor is reduced due to the presence of the portion, and a short circuit occurs due to a pinhole of the resin thin film layer. Further, when the lamination thickness of the metal thin film layer is locally reduced, poor conductivity or the like is likely to occur at that portion.

The materials of the resin layer and the metal layer of the reinforcing layer are not particularly limited, and may be appropriately determined according to the use of the laminate, required characteristics for the reinforcing layer, and the like. For example, it is preferable to use materials used for the dielectric layer and the metal thin film layer, respectively, in terms of manufacturing efficiency. Further, in order to adjust the adhesion strength when forming the external electrode, or to adjust the hardness or mechanical strength of the entire laminate, for example, the material used for the dielectric layer and the metal thin film layer It may be preferable to use different materials.

The degree of curing of the resin layer of the reinforcing layer is 50 to 95%,
In particular, it is preferably 70 to 90%. When the degree of cure is smaller than the above range, the laminate is easily deformed when an external force or the like is applied when a press or a laminate is used for various applications in a manufacturing process of the laminate, for example, when the laminate is mounted on a printed circuit board or the like as an electronic component. . On the other hand, if the curing degree is larger than the above range, when removing the continuous body of the cylindrical laminate from the can roller in the process of manufacturing the laminate described below,
When pressing to obtain a plate-shaped laminated body mother element, or when using the laminated body for various applications, for example, a problem such as cracking occurs when external force or the like is applied in a process of mounting the laminated body as an electronic component Sometimes. Further, when an external electrode is formed on the laminate, the sprayed metal particles are less likely to penetrate between the metal layers, and the adhesion strength of the external electrode may be weakened.

The thicknesses T5 (FIG. 7) and T7 (FIG. 9) of the resin layer
Is preferably from 0.1 to 1 μm, particularly preferably from 0.1 to 0.6 μm. The thicknesses T6 (FIG. 7) and T8 (FIG. 9) of the metal layer are 100 to 500 angstroms, particularly 200 to 500 angstroms.
~ 400 angstroms, membrane resistance 1 ~ 10Ω / □,
Particularly, it is preferably 2 to 6 Ω / □. In the case of FIG.
Although the thickness of the first metal layer and the thickness of the second metal layer may be different, it is preferable that the thickness is the same because the uniformity of the thickness of the entire laminate can be ensured.

The thickness T5 of the resin layer of the reinforcing layer (FIG. 7), T7
(FIG. 9) is preferably larger than the thicknesses T1 (FIG. 1) and T3 (FIG. 4) of the resin thin film layer. It is preferable that the thicknesses T6 (FIG. 7) and T8 (FIG. 9) of the metal layer of the reinforcing layer are larger than the thicknesses T2 (FIG. 1) and T4 (FIG. 4) of the metal thin film layer of the element layer. This is effective for protecting the laminated body portion composed of the resin thin film layer and the metal thin film layer and improving the adhesion strength of the external electrode. That is, as the thickness of the resin layer or the metal layer of the reinforcing layer is larger, the buffer function against external force or thermal stress works more effectively. Further, the external electrodes are formed by thermal spraying or the like, but the particles of the thermal sprayed metal are relatively coarse and hardly penetrate between the metal thin film layers. However, the thickness of the resin thin film layer cannot be increased from the viewpoint of securing the capacity of a capacitor. Therefore, by increasing the thickness of the resin layer of the reinforcing layer,
The penetration of the spray metal can be facilitated, and the adhesion strength of the external electrode can be easily increased. In addition, the larger the area of the metal layer exposed on the side surface, the larger the contact area with the external electrode. Therefore, by increasing the thickness of the metal layer of the reinforcing layer, the adhesion strength of the external electrode can be increased.

The laminate of the present invention may have a protective layer formed on at least one side thereof.

The protective layer may be damaged by a thermal load or an external force in the manufacturing process of the laminate or when the laminate is used for various purposes, for example, in a process of mounting the laminate on a printed circuit board or the like as an electronic component. It is effective in preventing. In addition, although the degree of improvement in the adhesion strength to the external electrode is lower than the contribution of the metal thin film layer or the metal layer, it has a certain effect.

The protective layer exhibits its effect if provided on at least one side of the laminate, but is preferably provided on both sides in order to sufficiently protect the laminate portion. At this time, the protective layer may be provided via the reinforcing layer, or may be provided without the reinforcing layer. Further, the protective layer may be provided in contact with the laminate portion or the reinforcing layer, or may be provided with another layer interposed therebetween.

The thickness of the protective layer is not particularly limited and can be appropriately determined depending on the environment to which the laminate is exposed. However, in order to sufficiently exhibit the above effects, the thickness is usually 2 μm or more.
Further, the thickness is preferably 2 to 100 μm, particularly preferably 4 to 30 μm.

The material of the protective layer is not particularly limited. However, when the material is used for the resin thin film layer and / or the resin layer, the production efficiency is improved. On the other hand, in order to give a specific function to the protective layer, a material different from the material used for the resin thin film layer and / or the resin layer may be used. For example,
The use of an epoxy ester such as 2-hydroxy-3-phenoxypropyl acrylate is preferable because the adhesion between the protective layer and the reinforcing layer is improved.

The degree of cure of the protective layer is 50 to 95%, especially 70
It is preferably about 90%. If the degree of cure is smaller than the above range, pressing in the manufacturing process of the laminate, or when the laminate is used for various purposes, it is easily deformed when an external force or the like is applied in a process of mounting on a circuit board as an electronic component, for example. . On the other hand, if the degree of curing is larger than the above range, when removing the continuous body of the cylindrical laminated body from the can roller in the manufacturing process of the laminated body described below, when pressing to obtain a flat laminated body element, or when laminating When the body is used for various purposes, for example, a problem may occur such that the body is broken when an external force is applied in a process of mounting the body on a circuit board as an electronic component.

The protective layer can be colored in a specific color. As a result, the recognition accuracy of pattern recognition when mounted on a printed wiring board as an electronic component is improved, and each product can be easily identified. For coloring, for example, a coloring agent such as a pigment may be mixed, or the outer surface may be painted with a paint or the like. Further, the protective layer can be made transparent if necessary.

Although the laminate of the present invention can be used for various applications, it is preferable to form external electrodes on both opposing sides of the laminate when it is used as an electronic component, particularly as a capacitor. FIG. 11 is a schematic perspective view of an example in which external electrodes are formed on the laminate of the present invention to form a capacitor.

In this embodiment, reinforcing layers 102a and 102b are laminated on both sides of a laminated body portion 101 formed by laminating a plurality of laminating units each composed of a resin thin film layer and a metal thin film layer. , 103b are stacked.
Then, external electrodes 104a, 104b
Are formed.

In the case where the laminate portion 101 has the laminated form shown in FIG. 1 or FIG. 3, the first metal thin film layer and the second metal thin film layer are electrically connected to the external electrodes 104a and 104b, respectively. . When the laminated body portion 101 has the laminated form shown in FIG. 4 or FIG. 6, the metal thin film layers of adjacent laminated units are alternately electrically connected to the external electrodes 104a and 104b. Similarly, when the reinforcing layers 102a and 102b take the laminated form shown in FIG. 7 or FIG. 8, the first metal layer and the second metal layer are external electrodes 104a and 1b, respectively.
04b and the reinforcing layers 102a, 102b
Takes the layered form shown in FIG. 9 or FIG. 10, the metal layer is electrically connected to only one of the external electrodes 104a and 104b.

The external electrodes can be formed, for example, by metal spraying brass or the like. Further, the external electrode may be composed of a plurality of layers. For example, a base layer electrically connected to the metal thin film layer of the laminate portion 101 is formed by metal spraying, and another layer can be provided thereon by a method such as metal spraying, plating, or painting. Specifically, the base layer is made of a metal having good adhesion strength to the laminate, and the upper layer is made of a metal having good adhesion to various metals or resins to be contacted (laminated) thereon. Each can be selected and formed.

Further, in consideration of solderability at the time of mounting, molten solder plating, melting tin plating, electroless solder plating, or the like may be applied thereon. At that time, as a base layer, a conductive paste in which copper powder or the like is dispersed in a thermosetting phenol resin is applied and cured by heating, or a metal sprayed layer of an alloy composed of copper / phosphorus / silver is formed. You may leave.

Further, a bump electrode may be provided on the external electrode. Thereby, the mounting on the circuit board becomes easier.
The bump electrode can be provided by appropriately selecting from known materials and shapes.

Further, a necessary exterior can be provided according to the application. For example, for the purpose of improving the moisture resistance of the laminate and protecting the exposed metal thin film layer and / or the metal layer, a surface treatment agent such as a silane coupling agent may be coated to a thickness of about several tens angstroms, or the metal thin film may be coated. On the surface where the layer is exposed, apply light or thermosetting resin to a thickness of several hundred μm.
To the extent that it has been applied and cured.

The laminate of the present invention can be used for applications such as a chip capacitor, a chip coil, a chip resistor, and a composite element thereof, and can be suitably used especially for an electronic component such as a capacitor. In particular, since the laminate of the present invention is a small but high-capacity capacitor, its practical value is high when used as a chip capacitor.

Next, a method for producing a laminate of the present invention will be described.

FIG. 12 is a schematic view schematically showing one example of a manufacturing apparatus for manufacturing the laminate of the present invention.

A metal thin film forming apparatus 203 is disposed below a can roller 201 which rotates at a constant angular velocity or a peripheral velocity in the direction of the arrow in FIG.
A resin thin film forming apparatus 202 is arranged on the downstream side in the rotation direction.

In this embodiment, the metal thin film forming apparatus 203 is used.
A patterning material applying device 208 is provided on the upstream side, and a patterning material removing device 207 is provided between the metal thin film forming device 203 and the resin thin film forming device 202.
A resin curing device 206 and a resin surface treatment device 207 are provided between the device 02 and the patterning material applying device 208, respectively, and these may be provided as needed.

These devices are housed in a vacuum vessel 204, and the inside thereof is maintained at a vacuum by a vacuum pump 205.

The outer peripheral surface of the can roller 201 is smooth,
It is preferably mirror-finished, and is preferably -2.
It is cooled to 0 to 40C, particularly preferably to -10 to 10C. The rotation speed can be set freely, but 15 to 70r
pm.

The metal thin film forming apparatus 203 is for forming a metal thin film on the surface of the can roller 201.
For example, a metal deposition source can be used. The formed metal thin film forms the metal thin film layer of the laminate of the present invention and the metal layer of the reinforcing layer. For example, Al, Cu, Zn,
At least one selected from the group consisting of Sn, Au, Ag, and Pt is used. Instead of vapor deposition, a thin metal film may be formed by a known means such as sputtering or ion plating.

The resin thin film forming apparatus 202 evaporates and evaporates the reactive monomer resin toward the surface of the can roller 201. The resin is deposited and the resin thin film layer of the present invention,
A resin layer of the reinforcing layer and a protective layer are formed.

FIG. 13 is a schematic sectional view showing the internal structure of the resin thin film forming apparatus 202 shown in FIG.

The liquid reactive monomer for forming the resin thin film layer is supplied through the raw material supply pipe 211 to the resin thin film forming apparatus 2.
02 is dropped on a heating plate A212 installed obliquely inside. The reactive monomer is heated while flowing downward on the heating plate A212, a part thereof is evaporated, and the reactive monomer that has not been completely evaporated falls onto the heating drum 213 rotating at a predetermined rotation speed. A part of the reactive monomer on the heating drum 213 evaporates, and the reactive monomer that has not completely evaporated falls onto the heating plate B214. While the reactive monomer flows downward on the heating plate B214, a part of the reactive monomer evaporates, and the reactive monomer that has not completely evaporated falls onto the heating plate C215. As the reactive monomer flows downward on the heating plate C215, a part of the reactive monomer evaporates, and the reactive monomer that has not completely evaporated falls into the heated cup 216. The reactive monomer in the cup 216 evaporates gradually. The gaseous reactive monomer evaporated by the above rises inside the peripheral wall 218,
It passes through between the shielding plates 217a, 217b, and 217c, reaches the outer peripheral surface of the can roller 201, and liquefies.
Solidify to form a resin thin film layer. Note that the means for evaporating the reactive monomer is not limited to the above configuration, and can be appropriately changed.

The resin thin film layer of the present invention is formed by liquefying the vaporized reactive monomer on the can roller 201 in this manner, so that a resin thin film layer having a smooth surface can be obtained. That is, a resin thin film layer (resin film) obtained by melting and stretching a conventional resin material to obtain a protrusion-forming component which was contained to impart its slipperiness,
In the present invention, it is not necessary to contain it at all. In addition, in a resin thin film layer obtained by applying a solution obtained by diluting a resin material with a solvent to a conventional support and then drying and curing, defects such as coarse protrusions were formed on the surface during the evaporation of the solvent. In the present invention, since no solvent is contained, such a defect does not occur.

In order to form a resin thin film layer having a smoother surface, the above-mentioned shielding plates 217a and 217 are required during the process in which the evaporated reactive monomer reaches the can roller 201.
7b and 217c are preferably provided. The liquid reactive monomer supplied by the raw material supply pipe 211 may be rapidly heated by the heating plate A212, become coarse particles, and partly scatter. Therefore, a shielding plate is provided so that the adhering point on the surface of the can roller cannot be directly seen from the evaporating point of the reactive monomer. Thereby, the adhesion of the coarse particles can be greatly reduced, and the surface of the resin thin film layer becomes very smooth. Therefore, the arrangement of the shielding plate is not limited to the one shown in FIG. 13 as long as the above-described effect is achieved.

Further, in order to form a resin thin film layer having a smooth surface, it is preferable to charge the vaporized reactive monomer and / or the surface to be adhered.

In the resin thin film forming apparatus shown in FIG. 13, a charged particle beam irradiation device 219 is provided at the passage point of the reactive monomer. The charged reactive monomer particles are accelerated by electrostatic attraction, and adhere to the charged particles avoiding the previously attached charged particle portions due to micro repulsion of electrostatic force. By such an operation, an extremely smooth resin thin film layer is formed.

The charged particle beam irradiation device may be installed toward the surface on which the reactive monomer is to be adhered. FIG. 14 is a schematic view schematically showing an example of a manufacturing apparatus for a laminate having such a configuration. The charged particle beam irradiation device 220 is located downstream of a patterning material removing device 209 described below and upstream of the resin thin film forming device 202 ′.
It is installed facing the outer peripheral surface of. In this case, a resin thin film forming apparatus 202 having a charged particle beam irradiation apparatus as shown in FIG. 13 may be used as the resin thin film forming apparatus.

The charged particle beam irradiation apparatus is not limited as long as it applies an electrostatic charge to the reactive monomer particles or the surface to which the reactive monomer particles are adhered.
An ion source that emits an ion beam, a plasma source, or the like can be used.

Since the metal thin film layer of the present invention is very thin, the shape of the surface of the underlying layer on which it is formed is reflected almost directly on the surface of the metal thin film layer. Therefore, the surface of the resin thin film layer formed by the above means is very smooth, and the surface of the metal thin film layer formed on the surface is also very smooth.

The reactive monomer resin deposited as described above is polymerized and / or
Alternatively, it is crosslinked and cured to a desired degree of curing to form a thin film. As the resin curing device, for example, an electron beam irradiation device or an ultraviolet irradiation device can be used.

The formed resin thin film is subjected to a surface treatment by a resin surface treatment device 207 as required. For example, by performing an oxygen plasma treatment or the like, the surface of the resin thin film layer can be activated to improve the adhesiveness to the metal thin film.

When the metal thin film layer is not to be laminated on the entire surface of the resin thin film layer but is to be laminated only on a specific area, a patterning material applying device 208 is used. The patterning material applying device 208 deposits the patterning material on the surface of the resin thin film in a belt shape in the outer circumferential direction of the can roller 201. No metal thin film is formed at the location where the patterning material is deposited, and the location becomes, for example, the above-described electrically insulating portion and the electrically insulating band of the reinforcing layer. For example, oil can be used as the patterning material. Means for applying the patterning material is a method of spraying the vaporized patterning material from the fine holes to liquefy on the surface of the resin thin film, or a non-contact adhesion means such as a method of spraying a liquid patterning material, reverse coating, Although there is a method by application such as die coating, in the present invention, non-contact attachment means is preferable in that external force is not applied to the resin surface, and among them, the patterning material evaporated from the point of relatively simple structure is liquefied on the surface of the resin thin film. Is preferred.

FIG. 15 is a schematic front view of an example of a patterning material applying apparatus which sprays evaporated oil to apply a band-like oil film on the surface of a resin thin film as an example of the patterning material applying apparatus. On the front side of the patterning material applying apparatus, a predetermined number of micro holes 231 are arranged at predetermined intervals. The patterning material applying device 208 is installed such that the fine holes 231 face the outer peripheral surface of the can roller 201 and the direction of the arrow 232 coincides with the moving direction of the outer peripheral surface of the can roller 210. By discharging the vaporized patterning material from the fine holes 231, the patterning material adheres to the resin thin film layer on the can roller, cools and liquefies, and forms an adhered film of the patterning material. Therefore, the spacing and the number of the fine holes 231 correspond to the spacing and the number of the electrically insulating portions (or electrical insulating bands) formed in the resin thin film layer. The shape of the fine holes 231 is not only circular as shown in FIG.
A rectangular shape, a circular shape, an elliptical shape, a long hole shape, or a square shape may be provided in the moving direction of the can roller surface.

The patterning material applied by the patterning material applying device 208 is removed by the patterning material removing device 209 as necessary. If the patterning material remains, the surfaces of the resin thin film layer and the metal thin film layer are roughened, so that the laminate having the surface roughness of the present invention cannot be obtained, or the pinhole of the resin thin film layer and the metal thin film layer (lamination loss). ) Occurs, or an electrically insulating portion (or an electrically insulating band) is not formed stably at a predetermined width. The means for removing the patterning material is not particularly limited. For example, when the patterning material is oil, it can be removed by heating and evaporating with a heater, decomposing and removing by plasma irradiation, or a combination thereof. At this time, the plasma irradiation can use oxygen plasma, argon plasma, nitrogen plasma, or the like, and among them, oxygen plasma is particularly preferable.

Thus, by rotating the can roller 201, a laminate in which the lamination unit composed of the resin thin film layer and the metal thin film layer is laminated a predetermined number of times on the outer peripheral surface is obtained.

In order to form a laminate as shown in FIG. 1, FIG. 3, FIG. 4, and FIG. 6, each time one laminate unit composed of a resin thin film layer and a metal thin film layer is laminated, In order to change the position of the insulating portion, it is necessary to move the position where the patterning material is attached by a predetermined amount in the direction perpendicular to the traveling direction of the outer peripheral surface of the can roller 201. Similarly, FIG. 8, FIG.
In order to form a reinforcement layer such as 0, the position of the patterning material is changed by changing the position of the patterning material in order to change the position of the electrical insulation band every time one lamination unit composed of the resin layer and the metal layer is laminated. It is necessary to move the outer peripheral surface of the motor 201 by a predetermined amount in the direction perpendicular to the traveling direction.

In the manufacturing process of the laminated body, the lamination thickness increases as the lamination units are sequentially laminated, so that the patterning material is directly adhered by application or the like, but is also adhered in a non-contact manner. Even in this case, it is preferable that the patterning material applying device 208 be retracted as the lamination proceeds. That is, in FIG.
Distance Dn between the outer peripheral surface of the laminate being formed on can roller 201 and the end of the fine hole of the patterning material applying apparatus
It is preferable that the layers are stacked while always maintaining a constant distance. This is because the patterning material diffuses with a constant directivity, especially when the vaporized oil is sprayed and adhered, so that the width of adhesion fluctuates due to the fluctuation of the distance Dn and the electrically insulating portion having a predetermined width. Is not obtained stably.

The retreating of the patterning material applying device and the movement of the patterning material adhering position can be realized by, for example, the device shown in FIG.

First, the retreat of the patterning material applying device is performed as follows. That is, the actuator A302 is fixed on the movable base 301, and the patterning material applying device 208 is attached to the moving end of the actuator A302. Patterning material applying device 208
Is movable base 301 by actuator A302.
It is installed movably in the direction of arrow 303 above. The patterning material applying device 208 includes a can roller 201.
A gap measuring device 304 for measuring the distance from the surface (in the process of forming the laminate, the outer peripheral surface of the laminate) is provided. As the gap measuring device 304, for example, a non-contact distance measuring device using a laser can be used. The gap measuring device 304 is used to constantly control the can roller 201 during the production of the laminate.
The distance from the outer peripheral surface of the stacked body on the surface is measured, and the signal is sent to the gap measuring circuit 305. The gap measuring circuit 305 constantly checks whether or not the distance between the end of the fine hole of the patterning material applying device 208 and the surface of the can roller 201 (the outer peripheral surface of the laminate in the process of forming the laminate) is within a predetermined range. Advances to determine that the distance is smaller than the predetermined range, the actuator A30
2 is instructed to retract the patterning material applying device 208 by a predetermined amount, and based on this, the patterning material applying device 208 is retracted by a predetermined amount. Thus, the edge of the fine hole of the patterning material applying device 208 and the can roller 201
Lamination proceeds while the distance Dn to the outer peripheral surface of the upper laminate is always maintained at a constant interval.

The gap measuring device 30 as described above
4 and the control using the gap measuring circuit 305 is performed without being performed, and the motor is sequentially retracted by a preset amount based on the lamination thickness in accordance with the rotation speed (for example, one rotation) of the can roller 201. Is also good. In addition, the distance measurement by the gap measuring device 304 may be used together for confirmation, and fine adjustment may be appropriately performed.

Next, the change of the position where the patterning material is applied is performed as follows. That is, the actuator B307 is fixed on the fixed base 306, and the movable base 301 is attached to the moving end of the actuator B307. The movable base 301 includes an actuator B3
At 07, it is installed movably in the direction of arrow 308 on the fixed base 306. The rotation of the can roller 201 is monitored by a rotation detector (not shown), and a rotation signal S1 is sent to the rotation detection circuit 309 every time the can roller 201 makes one rotation. The rotation detection circuit 309 instructs the actuator B307 to move the movable base 301 in the predetermined direction in the direction of the arrow 308 each time the rotation signal S1 is detected a predetermined number of times (for example, once). The movable base 301, that is, the patterning material applying device 208 moves by a predetermined amount in a predetermined direction in the direction of the arrow 308. Thus, each time the can roller 201 rotates a predetermined number of times, the position where the patterning material is applied is changed by a predetermined amount in a direction perpendicular to the rotational movement direction of the surface of the can roller 201.

As described above, a laminate is formed on the outer peripheral surface of the can roller 201 by laminating a plurality of lamination units composed of the resin thin film layer and the metal thin film layer. When a layer in which a metal thin film layer is not laminated, such as the above-described protective layer, is formed, a predetermined thickness is provided by providing a shielding plate so that the metal thin film forming device 203 and the patterning material applying device 208 do not function. The resin can be deposited by rotating the can roller 201 until it is no longer necessary and using the resin thin film forming apparatus 202. Similarly, when only the metal thin film layer is continuously formed, the can roller 201 is rotated to a predetermined thickness by providing a shielding plate or the like so that the resin thin film forming apparatus 202 does not function. Only the thin film layer needs to be deposited.

Thus, on the outer peripheral surface of the can roller 201, a cylindrical continuous body of a laminated body is formed. This is divided in the radial direction (for example, divided into eight every 45 °), detached from the can roller 201, and pressed by heating and pressing, respectively, to obtain a plate-shaped laminated body element. Thereafter, depending on the use of the laminate, the laminate may be cut or provided as necessary.

As an example, a case where a chip capacitor is manufactured from the laminate of the present invention will be described.

FIG. 17 is a partial perspective view showing an example of a schematic configuration of the flat plate-shaped laminated body element obtained as described above. In the figure, the direction of the arrow 401 indicates the moving direction (circumferential direction) on the can roller 201.

The stacked mother element 400 shown in FIG.
04b, a reinforcing layer 403b, a laminate portion 402 composed of a resin thin film layer and a metal thin film layer, a reinforcing layer 403a, and a protective layer 40.
4a are laminated on the can roller 201 in this order.

Thereafter, the chip capacitor is cut at the cut surface 405a, an external electrode is formed on the cut surface, and further cut at a portion corresponding to the cut surface 405b to obtain a chip capacitor as shown in FIG. In this example, the laminated body portion 402 is a chip capacitor having the configuration shown in FIG. 1, and the reinforcing layers 403a and 403b are each a chip capacitor having the configuration shown in FIG.

By appropriately changing the position where the patterning material is applied and the position of the cut surface 405a, a chip capacitor having a different laminated form can be obtained. For example, as shown in FIG. 18, a laminated mother element in which a protective layer 504b, a reinforcing layer 503b, a laminated portion 502 composed of a resin thin film layer and a metal thin film layer, a reinforcing layer 503a, and a protective layer 504a are laminated in order, Cutting is performed at the cut surface 505a to form external electrodes on the cut surface, and further at a position corresponding to the cut surface 505b to obtain a chip capacitor as shown in FIG. In this example, the laminate portion 502
And the reinforcing layers 503a and 503b are chip capacitors each having the configuration of FIG.

In the apparatus shown in FIG. 12, the laminated body is formed on the cylindrical can roller 201, but the support for forming the laminated body is not limited to this. For example, as shown in FIG. 19, a belt-like support member 22 orbiting between two rolls
A laminate can also be formed on the substrate 1. As the belt-like support 221, a support made of metal, resin, cloth, or a composite thereof can be used.

In addition, a rotating disk can be used as a support. In this case, when forming the electrically insulating part,
It is formed concentrically.

[0111]

(Example 1) A chip capacitor as shown in FIG. 11 was manufactured using the apparatus shown in FIG.

The production method is as follows.

The inside of the vacuum vessel 204 was set at 2 × 10 ⁻⁴ Torr, and the outer peripheral surface of the can roller 201 was maintained at 5 ° C.

First, a portion to be a protective layer was laminated on the outer peripheral surface of the can roller 201. Dimethylol tricyclodecane diacrylate was used as a protective layer material, which was vaporized and deposited on the outer peripheral surface of the can roller 201 by the resin thin film forming apparatus 202. An apparatus shown in FIG. 13 was used as a resin thin film forming apparatus, and an electron beam irradiation apparatus was used as a charged particle beam irradiation apparatus. The driving conditions were 3 kV2 mA. Next, using an ultraviolet curing device as the resin curing device 206, the protective layer material deposited as described above is polymerized,
Cured. This operation was repeated by rotating the can roller 201, a protective layer having a thickness of 15 μm was formed on the outer peripheral surface of the can roller 201, and then a portion serving as a reinforcing layer was laminated. As the resin layer material, the same material as the above-described protective layer material is used, which is vaporized to form a resin thin film forming apparatus 20.
2 and deposited on the protective layer. An apparatus shown in FIG. 13 was used as a resin thin film forming apparatus, and an electron beam irradiation apparatus was used as a charged particle beam irradiation apparatus. The driving conditions were 3 kV2 mA. Next, using an ultraviolet curing device as the resin curing device 206, the resin layer material deposited as described above is polymerized,
Cured. The resin layer formed at this time is 0.4 μm. Thereafter, the surface was subjected to oxygen plasma treatment by the resin surface treatment device 207. Next, a patterning material was attached to a portion corresponding to the electric insulating band by the patterning material applying device 208. As a patterning material, a fluorine-based oil is used, which is vaporized to a diameter of 50 μm.
And attached in a 150 μm-wide band. Next, aluminum was vapor-deposited from the metal thin film forming apparatus 203. The deposition thickness is 300 Å and the film resistance is 3Ω / □. Thereafter, the remaining patterning material was removed by heating with a far-infrared heater and plasma discharge treatment using a patterning material removing device 209. The above operation was repeated 500 times by rotating the can roller 201 to form a reinforcing layer having a total thickness of 215 μm. In addition, of the patterning material applying device,
The movement in the direction perpendicular to the movement direction of the outer peripheral surface of the can roller 201 (the direction of the arrow 308 in FIG. 16) was performed using the apparatus shown in FIG. 16 in the following pattern. That is, when the can roller 201 makes one rotation, it is moved by 60 μm in a certain direction, and after the next one rotation, it is moved by 60 μm in the opposite direction to return to the original position. Hereinafter, this movement was repeated. Further, the distance D between the fine hole 231 of the patterning material applying apparatus and the surface to be adhered is D.
n was controlled so that 250 to 300 μm could always be maintained.

Next, a laminated portion composed of a resin thin film layer and a metal thin film layer was laminated. The same resin thin film layer material as that of the above-described protective layer and resin layer was used, and was vaporized and deposited on the reinforcing layer. An apparatus shown in FIG. 13 was used as a resin thin film forming apparatus, and an electron beam irradiation apparatus was used as a charged particle beam irradiation apparatus. The driving conditions were 3 kV2 mA. Next, using an ultraviolet curing device as the resin curing device 206, the resin thin film layer material deposited as described above was polymerized and cured. The resin thin film layer formed at this time has a thickness of 0.1 mm.
4 μm. Thereafter, the surface was subjected to oxygen plasma treatment by the resin surface treatment device 207. Next, the patterning material was applied to a portion corresponding to the electrically insulating portion by the patterning material applying device 208. As a patterning material, a fluorine-based oil is used, which is vaporized and ejected from a fine hole having a diameter of 50 μm to have a width of 0.15 m.
m. Next, the metal thin film forming apparatus 20
From 3 aluminum was metallized. Deposition thickness is 25
0 Å and film resistance 6 Ω / □. afterwards,
The patterning material removing device 209 removed remaining patterning material by heating with an infrared heater and plasma discharge treatment. The above operation is performed by
This was repeated 2,000 times by rotating 01 to form a laminate portion having a total thickness of 850 μm. Note that the direction perpendicular to the moving direction of the outer peripheral surface of the can roller 201 of the patterning material applying apparatus (the direction of arrow 308 in FIG. 16).
Was performed in the following pattern using the apparatus shown in FIG. That is, when the can roller 201 makes one rotation,
It is moved 1000 μm in a certain direction, and after the next one rotation, it is moved 1000 μm in the opposite direction to return to the original position. Hereinafter, this movement was repeated. The distance Dn between the fine hole 231 of the patterning material applying apparatus and the surface to be adhered is always 250 to
Control was performed so that 300 μm could be maintained.

Next, a thickness of 215 μm was formed on the surface of the element layer portion.
m of the reinforcing layer was formed. The forming method was exactly the same as the above-described method for forming the reinforcing layer.

Finally, a protective layer portion having a thickness of 15 μm was formed on the surface of the reinforcing layer. The formation method was exactly the same as the above-mentioned method for forming the protective layer.

Next, the obtained cylindrical laminate is divided into eight pieces in the radial direction (cut at every 45 °), removed, and pressed under heating to obtain a flat laminate body element as shown in FIG. Obtained. This was cut at the cut surface 405a, and the cut surface was metal-sprayed with brass to form external electrodes. Further, a conductive paste in which copper powder was dispersed in a thermosetting phenolic resin was applied to the metal sprayed surface, cured by heating, and further subjected to molten solder plating on the resin surface. Thereafter, cutting was performed at a portion corresponding to the cut surface 405b in FIG. 17, and the outer surface was coated by dipping in a silane coupling agent solution to obtain a chip capacitor as shown in FIG. In the obtained chip capacitor, in FIG. 11, the laminated body portion 101 had the laminated form shown in FIG. 1, and the reinforcing layer portions 102a and 102b had the laminated form shown in FIG.

The obtained chip capacitor is disassembled, and the surface of the resin thin film layer laminated on the metal thin film layer of the laminated body portion 101, the surface of the resin thin film layer laminated on the electrically insulating portion,
And the surface roughness of the metal thin film layer was measured to be 0.005 μm, 0.008 μm, and 0.005 μm, respectively.
Met. The width of the electrically insulating portion was 150 μm, and the displacement d of the lamination position of the electrically insulating portion of every other lamination unit was almost nil. Further, the width of the electric insulating band of the reinforcing layer was 150 μm, which was located substantially at the center in the width direction, and there was almost no displacement d1 between the lamination positions of the electric insulating bands of every other adjacent lamination unit. The degree of cure of the resin thin film layer, the resin layer of the reinforcing layer, and the protective layer of the laminate was 95%, 95%, and 90%, respectively.

The obtained chip capacitor has a thickness of 1.3 mm in the stacking direction, a depth of 1.6 mm, and a width (in the direction between both external electrodes) of 3.2 mm, and has a small capacity of 0.47 μF.
Met. The insulation resistance is 7.5 × 10 ¹⁰ Ω and the withstand voltage is 48
V. Further, fine irregularities were observed on the upper and lower surfaces in the laminating direction. This was mounted on a printed wiring board by soldering, but no problems such as missing external electrodes occurred.

(Examples 2 to 5, Comparative Example 1) Using the same apparatus as in Example 1, the material of the resin thin film layer, the lamination thickness, and the driving conditions of the electron beam irradiation apparatus were changed as shown in Table 1. Similarly, a chip capacitor was manufactured. However, in Example 3, in addition to the manufacturing conditions shown in Table 1, as a resin thin film forming apparatus, FIG.
In Example 3, all the shielding plates 217a, 217b, and 217c were removed. The characteristics of the obtained chip capacitors are also shown in Table 1.

[0122]

[Table 1]

As can be seen from Table 1, the laminate of Comparative Example 1 in which the reactive monomer as the resin thin film layer material was not charged was:
The surface roughness of the resin thin film layer and metal thin film layer increases,
It can be seen that the insulation resistance and the withstand voltage of the capacitor decrease.

On the other hand, as in Example 5, depending on the type of the resin, such as the difference in the resin viscosity, the surface roughness of the resin thin film layer and the metal thin film layer can be set to the value of the present invention without charging the reactive monomer. In some cases, a laminate within the range can be obtained. In this case, the insulation resistance and the withstand voltage of the capacitor are good.

When the driving power of the electron beam irradiation apparatus was increased in the order of the first, second and fourth embodiments, the charge amount of the reactive monomer was increased. The surface roughness of the layers becomes smaller in order, and the insulation resistance and the withstand voltage of the capacitor are improved.

Further, in the laminate of Example 3 manufactured by removing the shielding plate of the resin thin film manufacturing apparatus, the surface roughness (Ra) of the resin thin film layer and the metal thin film layer was within the numerical range of the present invention. It can be seen that abnormal protrusions are formed, and that the insulation resistance and the withstand voltage of the capacitor are slightly reduced.

[0127]

The laminate of the present invention is a laminate obtained by laminating a plurality of laminate units each composed of a resin thin film layer and a metal thin film layer, wherein the resin thin film layer has a surface roughness of 0.1 μm or less. Or the resin thin film layer does not contain a protrusion forming component, or the metal thin film layer has a surface roughness of 0.1 μm or less, regardless of the lamination thickness. Since the laminate has good characteristics and does not contain foreign matter in the laminate, it is possible to provide a laminate which can sufficiently respond to the demand for thinning and high performance of the laminate.

[Brief description of the drawings]

FIG. 1 is a sectional view in a thickness direction (stacking direction) schematically showing an example of a laminate of the present invention.

FIG. 2 is a cross-sectional view as viewed from a direction of an arrow II of FIG. 1;

FIG. 3 is a cross-sectional view in the thickness direction (lamination direction) schematically illustrating another example of the laminate of the present invention.

FIG. 4 is a cross-sectional view in the thickness direction (lamination direction) schematically showing still another example of the laminate of the present invention.

FIG. 5 is a cross-sectional view as seen from the direction of the arrows II-II in FIG. 4;

FIG. 6 is a sectional view in the thickness direction (stacking direction) schematically showing still another example of the laminate of the present invention.

FIG. 7 is a cross-sectional view in the thickness direction (stacking direction) schematically illustrating an example of a reinforcing layer stacked on the stack of the present invention.

FIG. 8 is a sectional view in the thickness direction (lamination direction) schematically showing another example of the reinforcing layer laminated on the laminate of the present invention.

FIG. 9 is a cross-sectional view in the thickness direction (stacking direction) schematically illustrating still another example of the reinforcing layer stacked on the stack of the present invention.

FIG. 10 is a cross-sectional view in the thickness direction (lamination direction) schematically showing still another example of the reinforcing layer laminated on the laminate of the present invention.

FIG. 11 is a schematic perspective view showing an example of a chip capacitor using the laminate of the present invention.

FIG. 12 is a schematic view schematically showing an example of a manufacturing apparatus for manufacturing a laminate of the present invention.

FIG. 13 is a schematic sectional view showing an internal structure of a resin thin film forming apparatus used in the manufacturing apparatus of FIG.

FIG. 14 is a schematic view schematically showing another example of the manufacturing apparatus for manufacturing the laminate of the present invention.

FIG. 15 is a schematic front view of a patterning material applying apparatus used in the manufacturing apparatus of FIG.

FIG. 16 is a schematic view showing an example of an apparatus for retreating the patterning material applying apparatus and moving the position where the patterning material is attached.

FIG. 17 is a partial perspective view illustrating an example of a schematic configuration of a flat-plate stacked mother element.

FIG. 18 is a partial perspective view showing another example of the schematic configuration of the flat laminated mother element.

FIG. 19 is a schematic view schematically showing still another example of the manufacturing apparatus for manufacturing the laminate of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Laminated body 11, 11a Resin thin film layer 12, 12a First metal thin film layer 13, 13a Electrically insulating portion 14, 14a Second metal thin film layer 15, 15a Lamination unit 20 Laminated body 21, 21a, 21b Resin thin film layer 22, 22a, 22b First metal thin film layer 23, 23a, 23b Electrically insulating portion 24, 24a, 24b Second metal thin film layer 25, 25a, 25b Stack unit 30 Stack 31, 31a Resin thin film layer 32, 32a Metal thin film layers 33, 33a Electrically insulating portions 34, 34a Laminated unit 40 Laminated body 41, 41a, 41b Resin thin film layers 42, 42a, 42b Metal thin film layers 43, 43a, 43b Electrically insulating portions 44, 44a, 44b Laminated unit Reference Signs List 50 reinforcement layer 51 resin layer 52 first metal layer 53 second metal layer 54 electric insulating band 55 laminated unit 60 reinforcement layer Reference Signs List 70 reinforcing layer 71 resin layer 72 metal layer 73 electric insulating band 74 laminated unit 80 reinforcing layer 81, 82, 83 electric insulating band 100 chip capacitor 101 laminated body portion 102a, 102b reinforcing layer 103a, 103b protective layer 104a, 104b external electrode 201 Can rollers 202, 202 ', 202 "Resin thin film forming device 203 Metal thin film forming device 204 Vacuum container 205 Vacuum pump 206 Resin curing device 207 Resin surface treatment device 208 Patterning material applying device 209 Patterning material removing device 211 Raw material supply pipe 212 Heating plate A 213 Heating drum 214 Heating plate B 215 Heating plate C 216 Cup 217a, 217b, 217c Shielding plate 218 Peripheral wall 219 Charged particle beam irradiation device 220 Charged particle beam irradiation device 221 Belt-like support 231 Pores 232 Arrow 301 Movable base 302 Actuator A 303 Arrow (moving direction) 304 Gap measuring device 305 Gap measuring circuit 306 Fixed base 307 Actuator B 308 Arrow (moving direction) 309 Rotation detecting circuit 400 Stack mother element 401 Arrow 402 Stack Part 403a, 403b Reinforcement layer 404a, 404b Protective layer 405a, 405b Cut plane 500 Stacked mother element 501 Arrow 502 Stacked part 503a, 503b Reinforcement layer 504a, 504b Protective layer 505a, 505b Cut plane

 ────────────────────────────────────────────────── ─── Continued on the front page (72) Inventor Nobuki Sunaru 1006 Kazuma Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.

Claims (39)

[Claims] 1. A laminate comprising a plurality of laminated units composed of a resin thin film layer and a metal thin film layer, wherein the resin thin film layer has a surface roughness of 0.1 μm or less. Laminate. 2. A laminate comprising a plurality of laminated units composed of a resin thin film layer and a metal thin film layer, wherein the resin thin film layer does not contain a projection forming component. . 3. A laminate comprising a plurality of laminated units composed of a resin thin film layer and a metal thin film layer, wherein the metal thin film layer has a surface roughness of 0.1 μm or less. Laminate. 4. The laminate according to claim 1, wherein the surface roughness of the resin thin film layer is 0.04 μm or less. 5. The laminate according to claim 3, wherein the surface roughness of the metal thin film layer is 0.04 μm or less. 6. The laminate according to claim 1, wherein the thickness of the resin thin film layer is 1 μm or less. 7. The laminate according to claim 1, wherein the thickness of the resin thin film layer is 0.7 μm or less. 8. The laminate according to claim 1, wherein the thickness of the metal thin film layer is 100 nm or less. 9. The laminate according to claim 1, wherein the metal thin film layer has a film resistance of 2 Ω / □ or more. 10. The laminate according to claim 1, wherein (thickness of the resin thin film layer) / (thickness of the metal thin film layer) ≦ 20. 11. The laminate according to claim 1, wherein the degree of cure of the resin thin film layer is 50 to 95%. 12. The method according to claim 1, wherein the metal thin film layer is made of aluminum, copper, zinc, nickel, a compound thereof, an oxide thereof, or an oxide of these compounds. Laminate. 13. The metal thin-film layer according to claim 1, wherein the metal thin-film layer is separated into two or more metal thin-film layers by a strip-shaped electrically insulating portion present on the resin thin-film layer. Laminate. 14. The stacked body according to claim 13, wherein the stacking positions of the electrically insulating portions of every other stacked unit are not the same in the entire stacked body. 15. The lamination according to claim 1, wherein the metal thin film layer is laminated on a portion other than the strip-shaped electrically insulating portion existing at one end on the resin thin film layer. body. 16. The laminate according to claim 15, wherein the width of the electrically insulating portion of every other laminate unit is not the same in the entire laminate. 17. The method according to claim 1, wherein the surface roughness of the resin thin film layer in the portion where the strip-shaped electrically insulating portion exists is not more than twice the surface roughness of the resin thin film layer in the portion where the metal thin film layer exists. The laminate according to claim 13 or 15, wherein 18. A reinforcing layer formed by laminating a plurality of lamination units each composed of a resin layer and a metal layer laminated on one surface of the resin layer on at least one side. 4. The laminate according to any one of items 3 to 3. 19. The laminate according to claim 18, wherein the thickness of the reinforcing layer (the thickness on one side when laminated on both sides) is 20 μm or more. 20. The laminate according to claim 18, wherein the metal layer is separated into two or more metal layers by a band-shaped electric insulating band existing on the resin layer. 21. The laminate according to claim 20, wherein two or more strip-shaped electrical insulation strips are present on the resin layer. 22. The laminate according to claim 20, wherein the electric insulating band is located at a substantially central surface of the resin layer. 23. The laminate according to claim 20, wherein the lamination positions of the electric insulating bands are not the same in the entire reinforcing layer. 24. The laminate according to claim 18, wherein the metal layer is laminated on a portion other than the band-shaped electric insulating band existing at one end on the resin layer. 25. The laminate according to claim 24, wherein the width of the electrically insulating band is not the same throughout the reinforcing layer. 26. The laminate according to claim 18, wherein the material of the resin layer is different from the material of the resin thin film layer. 27. The laminate according to claim 18, wherein the degree of cure of the resin layer is 50 to 98%. 28. The laminate according to claim 18, wherein the thickness of the resin layer is larger than the thickness of the resin thin film layer. 29. The laminate according to claim 18, wherein the thickness of the metal layer is larger than the thickness of the metal thin film layer. 30. The laminate according to claim 1, wherein a protective layer is laminated on at least one side. 31. The laminate according to claim 30, wherein the thickness of the protective layer (the thickness on one side when laminated on both sides) is 2 μm or more. 32. The laminate according to claim 30, wherein the material of the protective layer is different from the material of the resin thin film layer. 33. The laminate according to claim 30, wherein the degree of curing of the protective layer is 50 to 98%. 34. The laminate according to claim 30, wherein the protective layer is colored. 35. The laminate according to claim 30, wherein the protective layer is transparent. 36. The laminate according to claim 1, wherein external electrodes are formed on both opposing side surfaces of the laminate. 37. The laminate according to claim 36, wherein the external electrode comprises a plurality of layers. 38. A capacitor comprising the laminate according to claim 1. Description: 39. The capacitor according to claim 38, wherein the capacitor is a chip capacitor.