JP3391677B2 - Laminates and capacitors - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laminated body composed of a dielectric layer and a metal thin film layer. In particular, the present invention relates to a laminated body that can be suitably used for electronic parts such as capacitors.

[0002]

2. Description of the Related Art Today's electronic components are becoming more and more demanding for miniaturization and higher performance, and capacitors are no exception. The capacitance of a capacitor is proportional to the area of the dielectric if the dielectric constant of the dielectric is the same,
It is inversely proportional to the thickness of the dielectric layer. Therefore, in order to maintain or increase the capacity of the capacitor while reducing the size of the capacitor, it is effective means to reduce the thickness of the dielectric layer and to increase the effective area of the capacitance generating portion.

A laminated body for a film capacitor is known as a laminated body composed of a dielectric layer and a metal thin film layer used in electronic parts such as capacitors. This is polyester (PEN, PET, etc.), polyolefin (PP
Etc.), a metallized film obtained by laminating a metal thin film of aluminum or the like by a vacuum vapor deposition method, sputtering, or the like on a resin film of PPS or the like.

However, the thickness of the resin film is limited in terms of its manufacturing process or subsequent handling and processability of the film, and thus there is a limit to its thinning.
The film thickness for film capacitors currently in use is at most about 1.2 μm, and both the thinning of the dielectric layer and the increase in the effective area of the capacitance generation part while maintaining the volume of the capacitor are at their limits. This has hindered both the miniaturization and high capacity of film capacitors.

On the other hand, in a laminated body composed of a dielectric layer and a metal thin film layer, a capacitor having a dielectric layer thickness of about 1 μm has been proposed by a manufacturing method completely different from the conventional film capacitor (special feature). Kokoku 63-31929, U.S.P. 5,125,138).

[0006]

However, the capacitor disclosed in Japanese Patent Publication No. 63-319929 has a structure in which the metal thin film layer (electrode layer) is tilted in the stacking direction so as to be in close contact with the side of the capacitor to form an electrode. Therefore, there is a problem that the metal thin film layer is easily broken at the inclined portion of the metal thin film layer.
In addition, there is a problem that the external shape is largely different from that of the conventional chip-type film capacitor, and special consideration is required for mounting.

On the other hand, U.S.P. S. P. No. 5,125,138 discloses a laminated body in which a metal thin film layer (electrode layer) is exposed at a side portion of the laminated body without being inclined. However, in such a laminated body, when viewed as a whole laminated body, a portion where the number of laminated metal thin film layers is small has a large difference in laminated thickness from other portions, and as a result, a laminated portion of the portion where the number of laminated metal thin film layers is small is laminated. A recess is formed on the upper surface in the direction. When the laminated body is mounted on the printed board by soldering, the recessed portion deteriorates handleability and adversely affects wettability of solder. In addition, since the dielectric layer and the metal thin film layer around the concave portion are inclined or curved, the laminated thickness becomes thin, and when used as a capacitor, the withstand voltage is reduced, the pinhole of the dielectric layer, and the conductivity of the metal thin film layer are reduced. It causes defects. further,
Such recesses also make it difficult to manufacture the laminate itself. In such a recess, the thickness of the dielectric layer becomes thin (for example, 1 μm).
And less, and the number of layers increases (for example, 100 layers or more,
In particular, it occurs more remarkably as the number of layers increases to 1000 or more).
Therefore, with such a laminated body, it is still difficult to realize the miniaturization and high capacity of the capacitor.

Therefore, the object of the present invention is to prevent breakage of the metal thin film layer in the laminate of the dielectric layer and the metal thin film layer, and when used as a capacitor, the appearance is the same as a conventional film capacitor. Since the shapes and structures are similar, no special consideration is required for mounting,
So, yet compact, it is to provide a laminate and capacitors can both be the requirement that high capacity.

[0009]

The present invention has the following constitution in order to achieve the above object.

That is, the laminate of the present invention comprises a dielectric layer having a thickness of 1 μm or less, a first metal thin film layer laminated on one surface of the dielectric layer, and a first metal thin film layer distinguished by a strip-shaped electrically insulating portion. A laminated body formed by laminating 100 or more laminated units including two metal thin film layers, wherein the electrically insulating portions of the adjacent laminated units have different laminating positions, and the electrical conductivity of every other laminated unit is increased. The stacking position of the insulating portion is not the same in the entire stack.

The laminated body of the present invention is laminated on a dielectric layer having a thickness of 1 μm or less and on one surface of the dielectric layer except a strip-shaped electrically insulating portion existing at one end thereof. A laminated body formed by laminating 100 or more laminated units each including a metal thin film layer, wherein the electrically insulating portions of the adjacent laminated units are laminated on opposite sides, and every other one is laminated. The width of the electrically insulating portion of the laminated unit is not the same in the entire laminated body.

The capacitor of the present invention is characterized by using the above-mentioned laminated body.

[0013]

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described below with reference to the drawings.

(Embodiment 1) FIG. 1 shows a sectional view in the thickness direction (stacking direction) of an example of the stack of the present invention.

The laminated body 11 of the present invention comprises a dielectric layer 12 and
A plurality of laminated units 15 composed of a first metal thin film layer 13 and a second metal thin film layer 14 laminated on the dielectric layer 12 are laminated. First metal thin film layer 13 and second
The metal thin film layer 14 is distinguished by a strip-shaped electrically insulating portion 16.

Further, it is necessary that the laminated positions of the electrically insulating portions of the adjacent laminated units are different. That is, FIG.
As shown in, when the lamination unit 15a is laminated adjacent to the lamination unit 15, the electrically insulating portion 16 of the lamination unit 15 and the electrically insulating portion 16a of the lamination unit 15a have different lamination positions. It is necessary. in this way,
By sequentially laminating the laminated units in which the positions of the electrically insulating portions are different, the capacitor can be formed when the external electrode is formed on the side portion of the laminated body (see FIG. 11). That is, an external electrode (not shown) that connects the first metal thin film layer 13 of the laminated unit 15 and the first metal thin film layer 13a of the laminated unit 15a adjacent thereto to substantially the same potential, and the laminated unit 15 The second metal thin film layer 14 and the second of the laminated unit 15a
An external electrode (not shown) that connects the metal thin film layer 14a and the metal thin film layer 14a to the same potential is provided, and a potential difference is applied between the both external electrodes. At this time, since the electrically insulating portions 16 and 16a of the laminated unit 15 and the laminated unit 15a adjacent thereto are arranged at different positions, the first metal thin film layer 13 of the laminated unit 15 and the first thin film layer 15a of the laminated unit 15a are arranged. The second metal thin film layer 14a is used as an electrode, and the portion of the dielectric layer 12a sandwiched between the first metal thin film layer 13 and the second metal thin film layer 14a is a dielectric (capacity generating portion). Is formed. Therefore, the difference in the stacking position of the electrically insulating portions of the adjacent stacking units means that the stacking positions are different to the extent that the capacitance generating portion of the capacitor can be formed as described above. From this point of view, it is preferable to arrange the electrically insulating portion so that the area of the capacitance generating portion is as large as possible.

In the above description, a portion of the dielectric layer 12a other than the portion sandwiched between the first metal thin film layer 13 and the second metal thin film layer 14a does not contribute to the capacitance formation of the capacitor. . At the same time, the second metal thin film layer 14 of the lamination unit 15 and the first metal thin film layer 13 of the lamination unit 15a
a does not function as an electrode of the capacitor. However, the second metal thin film layer 14 of the laminated unit 15 and the first metal thin film layer 13a of the laminated unit 15a are
It is significant in increasing the adhesion strength of the external electrodes. That is,
The adhesion strength of the external electrode depends largely on the connection strength with the metal thin film layer, and the connection strength with the dielectric layer does not contribute much. Therefore, even if it is a metal thin film layer that does not contribute to the generation of capacitance of the capacitor, the existence of the metal thin film layer significantly improves the adhesion strength of the external electrode when the capacitor is formed. The presence of such a metal thin film layer has a particularly important meaning in the case of a very small laminated body such as the present invention. The external electrodes are formed by metal spraying or the like, but the particles of the sprayed metal at this time are relatively large, and in the case of a laminate having an extremely thin dielectric layer as in the present invention, it is difficult to penetrate between the metal thin film layers. . Moreover, since the laminated body is small, the exposed metal thin film portion is small. Therefore, increasing the contact area with the external electrode as much as possible is extremely important from the viewpoint of securing the adhesion strength of the external electrode.

The shape of the electrically insulating portion is a band having a constant width W from the viewpoint of ease of manufacturing. In FIG.
The sectional view seen from the II line arrow direction is shown. The width W of the electrically insulating portion is not particularly limited, but is 0.03 to 0.5 m.
m, further 0.05 to 0.4 mm, especially 0.1 to 0.3 m
It is preferable to set the thickness to about m from the viewpoints of ensuring the capacity generating portion of the capacitor (increasing the capacity), ensuring electrical insulation, and facilitating manufacturing.

In the laminated body of the present invention, the electrically insulating portion has a strip shape, and the laminated positions of the electrically insulating portions of every other laminated unit are all present at the same position when viewed as a whole laminated body. It is necessary not to do it. That is, for example, as shown in FIG. 1, the electrically insulating portion 1 of the laminated unit 15a.
With respect to 6a, the position of the electrically insulating portion 16b of the stacked unit is not the same as that of the electrically insulating portion 16a, but is displaced by d in the width direction of the electrically insulating portion. Alternatively, the positions of the electrically insulating portions of the one laminated unit may be the same, and the positions of the electrically insulating portions of the three laminated units may be shifted in the width direction of the electrically insulating portion.

For comparison, FIG. 3 shows an example of a cross-sectional view in the thickness direction (stacking direction) of a stack in which d = 0 is always set. Figure 3
As apparent from the above, since the electrically insulating portions 31a and 31b do not have the metal thin film layer, the laminated thickness of this portion is reduced in the entire laminated body, and the concave portions 32a and 32 are formed on the upper surface of the laminated body.
b will occur. When the laminated body is mounted on the printed circuit board by soldering, the recess may have poor handling property. Moreover, when such a recess occurs, as the depth of the recess increases, it becomes difficult to deposit a patterning material, which will be described later, on the bottom of the recess in the process of manufacturing the laminate, and a good electrical conductivity with a certain width is obtained. It becomes difficult to form the electrically insulating portion. Further, as the concave portion is formed, the dielectric layer and the metal thin film layer on both sides of the electrically insulating portion laminated on the concave portion are inclined, so that the dielectric layers 33a and 33b and the metal thin film layer 34a are inclined. Three
The laminated thickness at 4b is locally reduced. If the laminated thickness of the dielectric layer is locally reduced, when the laminated body is used as a capacitor, the withstand voltage of the capacitor is lowered due to the presence of the portion, and a short circuit occurs due to a pinhole in the dielectric layer. Further, when the laminated thickness of the metal thin film layer is locally thinned, the withstand current characteristics are likely to be deteriorated at that portion.

Therefore, the lower limit of the displacement amount d of the electrically insulating portion in FIG. 1 is preferably W / 20 or more, more preferably W / 10 or more, where W is the width of the strip-shaped electrically insulating portion. Is.

On the other hand, if the displacement amount d is too large, the effect of eliminating the concave portion on the upper surface of the laminated body is not remarkable, and the size of the capacitance generating portion as the capacitor becomes small.
Therefore, the upper limit of the shift amount d is preferably 4 W or less, more preferably 2 W or less.

Further, the above deviation amount d is W / 20 to 4W.
The maximum value of the variation in the stacking position of the electrically insulating parts of every other stacking unit (maximum deviation) when the entire stack is viewed, whether the range is satisfied or not satisfied. It is preferable that the width, D) in FIG. 1, has a lower limit of 6 W / 5 or more, particularly 3 W / 2 or more, and an upper limit of 5 W or less, particularly 4 W or less. When the maximum deviation width D is less than this lower limit value, as described with reference to FIG.
32b is generated, making it difficult to attach the patterning material, lowering the withstand voltage of the capacitor, pinholes in the dielectric layers 33a and 33b, and 34 in the metal thin film layer.
It becomes easy to cause deterioration of the withstand current characteristics of a and 34b. If the maximum deviation width D exceeds this upper limit value, not only the effect of eliminating the concave portion on the upper surface of the laminate is not remarkable, but also the size of the capacitance generating portion as the capacitor is reduced.

The stacking positions of the electrically insulating portions of every other stacking unit may be regularly displaced or irregularly displaced (excluding manufacturing errors). Good.

The first metal thin film layers (for example, 13 and 13a) and / or the second metal thin film layers (for example, 14 and 14a) of the adjacent laminated units may not be directly electrically connected. preferable. Directly connecting (contacting) the metal thin film layers means that there is no dielectric layer to be interposed therebetween, which means that the metal thin film layers are inclined toward the connection portion. This is because the metal thin film layer becomes thin and is easily broken.

FIG. 4 shows a sectional view in the thickness direction (stacking direction) of another example of the stack of the present invention.

The laminated body 40 of this example is formed by laminating a plurality of laminated units 44 each including a dielectric layer 41 and a metal thin film layer 42 laminated on one surface of the dielectric layer. The metal thin film layer 42 does not exist in the strip-shaped electrically insulating portion 43 that exists at one end of one surface of the dielectric layer.

Furthermore, it is necessary that the electrically insulating portions of adjacent laminated units are located on opposite sides. That is,
As shown in FIG. 4, when the laminated unit 44a is laminated adjacent to the laminated unit 44 and the electrically insulating portion 43 of the laminated unit 44 is present at the right end of the dielectric layer 41,
The electrically insulating portion 43a of the laminated unit 44a is the dielectric layer 41.
It must exist at the left end of a. In this way, by sequentially stacking the stacking units so that the positions of the electrically insulating portions are located on the opposite sides, the capacitors are formed when the external electrodes are formed on the sides of the stack (see FIG. 17). Can be made. That is, one of the external electrodes is connected to the laminated unit 4
4 is connected to the metal thin film layer 42, the other external electrode is connected to the metal thin film layer 42a of the adjacent laminated unit 44a, and a potential difference is applied between both external electrodes. At this time, the metal thin film layer 42 of the laminated unit 44 and the metal thin film layer 42a of the laminated unit 44a are respectively used as electrodes, and the metal thin film layer 42 and the metal thin film layer 42 are used.
A capacitor having a portion sandwiched between a and a as a dielectric (capacity generating portion) is formed. From this viewpoint, it is preferable to make the width of the electrically insulating portion as small as possible so that the area of the capacitance generating portion becomes as large as possible.

The shape of the electrically insulating portion is a band having a constant width W from the viewpoint of ease of manufacturing. In FIG.
2 is a cross-sectional view taken along the line II-II of FIG. The width W of the electrically insulating portion is not particularly limited, but is 0.03 to 0.5 m.
m, further 0.05 to 0.4 mm, especially 0.1 to 0.3 m
It is preferable to set the thickness to about m from the viewpoints of increasing the capacity of the capacitor, ensuring electrical insulation, and facilitating manufacturing.

In the laminated body of the present invention, it is necessary that the widths of the strip-shaped electrical insulators of every other laminated unit are not the same when viewed as the entire laminated body. That is, as shown in FIG. 4, with respect to the electrically insulating portion 43 of the laminated unit 44,
The width of the electrically insulating portion 43b of one stacked unit is different from that of the electrically insulating portion 43. Alternatively, the width of the electrically insulating part of one stacked unit should be the same,
The width of the electrically insulating portion of the three laminated units may be changed.

When the widths of the electrically insulating portions are all the same, the end portions where the electrically insulating portions are present have a small number of laminated metal thin film layers. The number is reduced, and a remarkable concave portion is formed on the upper surface of the laminated body. When the solder is mounted on the printed circuit board, the recessed portion may have poor handleability and adversely affect the wettability of the solder. Moreover, when such a recess occurs, as the depth of the recess increases, it becomes difficult to deposit a patterning material, which will be described later, on the bottom of the recess in the process of manufacturing the laminate, and a good electrical conductivity with a certain width is obtained. It becomes difficult to form the electrically insulating portion. Further, as the concave portion is generated, the dielectric layer and the metal thin film layer on the side of the electrically insulating portion laminated on the concave portion are inclined, so that the laminated thickness of the dielectric layer and the metal thin film layer is locally increased. Becomes thin. When the laminated thickness of the dielectric layer is locally thinned, when the laminated body is used as a capacitor, the withstand voltage of the capacitor is lowered due to the presence of that portion,
In addition, a short circuit occurs due to a pinhole in the dielectric layer. Further, when the laminated thickness of the metal thin film layer is locally thinned, the withstand current characteristics are likely to be deteriorated at that portion.

Therefore, as shown in FIG. 4, when the average value of the width of the electrically insulating portion of every other laminated unit is WAVE, the maximum value is WMAX, and the minimum value is WMIN in the entire laminated body, (WMAX- WMIN) / WAVE is preferably WAVE / 5 or more, more preferably WAVE / 3 or more.

On the other hand, if the variation in the width of the electrically insulating portion becomes large and (WMAX-WMIN) / WAVE becomes too large, not only the effect of eliminating the concave portion on the upper surface of the laminated body becomes unnoticeable, but also the capacitance generated as a capacitor is generated. The size of the part becomes smaller. Therefore, the upper limit of (WMAX-WMIN) / WAVE is preferably WAVE or less, more preferably WAVE / 2.
It is the following.

The change in the width of every other electrically insulating portion may be regular or irregular (excluding manufacturing errors).

In any of the laminated bodies shown in FIGS. 1 and 4, the thickness of the dielectric layer (thickness at the capacitance generating portion) T1
(FIG. 1) and T3 (FIG. 4) are 1 μm or less. It is more preferably 0.7 μm or less, and particularly preferably 0.4 μm or less. By reducing the thickness of the dielectric layer (capacity generating portion), it is possible to obtain a capacitor having a large capacity when used as a capacitor.

The first metal thin film layer and the second metal thin film layer of the laminate of FIG.
The thickness T2 of the metal thin film layer and the thickness T4 of the metal thin film layer of the laminated body of FIG. 4 are not particularly limited, but are 100 to 500 angstroms, particularly 200 to 400 angstroms, and the film resistance is 10 Ω / □ or less, further 1 It is preferably -8Ω / □, and particularly preferably 2-6Ω / □. The thicknesses of the two metal thin films in FIG. 1 may be different, but it is preferable that they are the same because the thickness uniformity of the entire laminate can be ensured.

The lamination unit of the laminate of FIGS. 1 and 4 may be appropriately determined according to the application of the laminate. Preferably 10
By stacking 0 or more layers, the area occupied by the capacitor on the circuit board can be reduced. For more than that, it is not preferable that the number of laminated layers is large, and the laminated layers may be formed according to the required capacitor capacity. The larger the number of laminated layers, the larger the capacity of the capacitor when used as a capacitor. Further, since the dielectric layer of the present invention is thin, the total thickness does not become so thick even if the number of laminated layers is increased, and it has the same capacitance and the same electrostatic capacity as the conventional film capacitor in the same volume. If the capacity is small, it is possible to obtain a smaller capacitor.

The thickness T1 (FIG. 1) and T3 (FIG. 4) of the dielectric layer of each laminated unit and the thickness T2 (FIG. 1) of the metal thin film layer,
The ratios T1 / T2 and T3 / T4 of T4 (Fig. 4) are both 20
In the following, if it is set to 15 or less, when the metal thin film layers facing each other are electrically short-circuited due to a pinhole or the like in the dielectric layer, the metal thin film layers are burned or melted due to overcurrent,
When the self-healing function of removing defects is developed,
This is preferable because the volume occupied by defects inside the element is also small, and the degree of deterioration of the characteristics is reduced under the environment where moisture resistance characteristics and the like are required.

The material of the dielectric layer is not particularly limited as long as it can be laminated to a thickness of 1 μm or less and can function well as a dielectric. For example, an acrylate resin or a vinyl resin is a main component. Is preferred. Specifically, a polymer of a polyfunctional (meth) acrylate monomer or a polyfunctional vinyl ether monomer is preferable, and among them, a polymer such as dicyclopentadiene dimethanol diacrylate, cyclohexane dimethanol divinyl ether monomer or a hydrocarbon group is substituted. Polymers of monomers are preferred in terms of electrical properties.

As the material of the metal thin film layer, for example, A
It is preferably at least one selected from the group consisting of 1, Cu, Zn, Sn, Au, Ag, and Pt. Among them, Al is preferable in terms of adhesiveness and economical efficiency. In some cases, it may be preferable to oxidize the surface of the resin layer in order to improve the moisture resistance of the metal thin film layer.

Surface roughness Ra of dielectric layer (10-point average roughness)
Is preferably 0.1 μm or less, and particularly preferably 0.02 μm or less. The surface roughness Ra (ten-point average roughness) of the metal thin film layer is preferably 0.1 μm or less, and particularly preferably 0.02 μm or less. If the surface roughness is too large, an electric field may be concentrated on the minute protrusions on the surface, and the dielectric layer may be destroyed or the metal thin film layer may be burned out. In a conventional film capacitor, external particles (for example, inorganic particles such as silica or organic particles) are included in the film in order to improve the slippage of the film to ensure transportability and prevent blocking between the films. It was mixed to ensure a certain surface roughness. As long as the production method described below is adopted, the laminate of the present invention does not need to be mixed with external particles for the above reason, and thus a laminate having good electric characteristics can be obtained. The surface roughness Ra (ten-point average roughness) of the present invention is measured using a diamond needle having a tip diameter of 10 μm and a measurement load of 10 mg.
It was measured with a contact-type surface roughness meter.

The degree of curing of the dielectric layer is 50% or more, particularly 50 to 75% in the state of the laminated body immediately after the formation of the dielectric layer, and 90% or more in the final state such as a capacitor.
It is preferable in terms of handling property and stability of properties. The degree of cure means, for example, the degree of polymerization and / or crosslinking when a resin is used as the dielectric layer. If the degree of curing is less than the above range, the metal thin film layer may be easily deformed or the metal thin film layer may be broken or short-circuited when an external force or the like is applied in the process of manufacturing the laminate or the process of mounting the laminate. On the other hand, when the degree of curing is larger than the above range, the sprayed metal particles in the case of forming the external electrode are less likely to enter between the metal thin film layers to weaken the adhesion strength of the external electrode, or the can roller in the manufacturing process of the laminate described later. A problem such as cracking may occur when the continuous body of the cylindrical laminated body is removed from the machine, or when a flat laminated body mother element is obtained by pressing. The degree of cure of the present invention is determined by taking the ratio of the absorbance of the C = O group and the C = C group (1600 cm ^-1 ) with an infrared spectrophotometer and taking the value of the ratio of each monomer to the cured product to determine the reduced absorbance. The value obtained by subtracting 1 from was defined as the degree of cure.

(Embodiment 2) Next, the case where a reinforcing layer is laminated on at least one side of a laminate will be described. The reinforcing layer prevents the above-mentioned laminated body part from being damaged by a heat load or an external force during a manufacturing process of the laminated body or an electronic component using the laminated body, particularly a capacitor, or a process of mounting the laminated body on a printed circuit board or the like. It is effective in preventing. Further, since the reinforcing layer has a metal layer as described later, it is effective in increasing the adhesion strength of the external electrode (see FIGS. 11 and 17). That is, the adhesion strength of the external electrode depends on the connection strength with the metal thin film layer, and the connection strength with the dielectric layer does not contribute much. Therefore, by using the reinforcing layer including the metal layer, the adhesion strength of the external electrode when the capacitor is formed is significantly improved. The reinforcing layer is
For example, when an external electrode is formed and used as a capacitor, it may function as a capacitance generating portion of the capacitor, but if it does not function, designing of the capacitor becomes easier.

The reinforcing layer has the above effect if it is provided on at least one side of the above-mentioned laminated body, but if it is provided on both sides, it is more effective for protecting the laminated body and improving the adhesion strength of the external electrodes.

The reinforcing layer may be laminated in contact with the above laminated body, or may be laminated with another layer interposed.

In order for the reinforcing layer to fully exhibit the above effects, its thickness (thickness on one side as a whole) is 20 μm or more,
Further, it is preferably 50 to 500 μm, and particularly preferably 100 to 300 μm.

FIG. 6 is a sectional view in the thickness direction (stacking direction) of an example in which the reinforcing layers 50a and 50b are stacked on both surfaces of the stack 11 of FIG. 1 described in the first embodiment.

The reinforcing layer shown in FIG. 6 includes a resin layer 51, and a first metal layer 52 and a second metal layer 5 laminated on one surface of the resin layer 51.
The laminated unit 54 composed of 3 and 3 is laminated at least one layer. The first metal layer 52 and the second metal layer 53 are distinguished from each other by an electric insulating band 55.

The metal layer is divided into a first metal layer 52 and a second metal layer 53 by an electrically insulating band 55. Without the electrical insulation band, when the external electrode (see FIGS. 11 and 17) is provided, both external electrodes are short-circuited via the metal layer.

The position of the electrical insulation band is not particularly limited, but as shown in FIG. 6, it is preferable to dispose the electrical insulation band at the substantially central portion of the reinforcing layer. When the laminate 11 is arranged at substantially the same position as the electrically insulating portion, the recess formed on the top surface of the laminate becomes large, and when solder mounting on a printed circuit board, the handleability deteriorates and the insulating property during soldering also increases. May have an adverse effect. Moreover, when such a recess occurs, as the depth of the recess increases, it becomes more difficult to deposit a patterning material, which will be described later, on the bottom of the recess. It becomes difficult to form the band. Further, as the concave portion is generated, the dielectric layer and the metal thin film layer on both sides of the electrically insulating portion laminated on the concave portion are inclined, and therefore the laminated thickness is reduced and the dielectric strength of the capacitor is reduced. It is easy to cause deterioration, pinholes in the dielectric layer, and deterioration in withstand current characteristics of the metal thin film layer.

The shape of the electrically insulating band is not particularly limited as long as it electrically insulates the first metal layer 52 and the second metal layer 53, but in the present embodiment, ease of manufacture and the like. From the viewpoint of the above, a belt-like material having a constant width W ₁ is used. In Figure 7,
FIG. 7 is a cross-sectional view as seen from the direction of arrows along the line III-III in FIG. 6.

As for the reinforcing layer, at least one or more laminated units 54 may be laminated, but when two or more laminated units are laminated,
When viewed as the entire reinforcing layer (the entire reinforcing layer on one side when laminated on both surfaces of the laminate 11), it is preferable that the laminated positions of the electrical insulating bands are not the same. For example, it is preferable to shift the stacking positions of the electric insulating bands of the adjacent stacking units.
When the electrical insulating strip has a strip shape having a constant width W ₁ , FIG.
As shown in, the displacement amount d ₁ of the stacked position of the electrically insulating bands of adjacent stacked unit preferably set to W _1/20 or more. The lower limit of the displacement amount d ₁ is preferably W _1/15 or more, particularly preferably W _1/10 or more, the upper limit is preferably 4W ₁ or less, particularly preferably 2W ₁ or less. In addition, the stacking positions of the electric insulating strips of the adjacent stacking units should be the same,
It is also possible to shift the stacking positions of the electrical insulation bands of every other (or every two or more) stacking units by the above displacement amount d ₁ .

When the displacement amount d ₁ is less than the lower limit value, a concave portion is formed in the electrically insulating band portion on the surface of the laminated body, which may deteriorate the handleability when soldering is mounted on the printed board. Moreover, when such a recess occurs, as the depth of the recess increases, it becomes more difficult to deposit a patterning material described below on the bottom of the recess, and a good electrical insulation band or electrical insulation having a constant width is obtained. It becomes difficult to form the part. Further, as the concave portion is generated, the dielectric layer and the metal thin film layer on both sides of the electrically insulating portion laminated on the concave portion are inclined, and therefore the laminated thickness is reduced and the dielectric strength of the capacitor is reduced. It is easy to cause deterioration, pinholes in the dielectric layer, and deterioration in withstand current characteristics of the metal thin film layer.

If the deviation amount d ₁ is too large, not only the effect of eliminating the concave portion on the upper surface of the laminate is not remarkable, but also the laminating position of the electric insulation band coincides with the laminating position of the electrically insulating portion of the laminate 1. In that case, the above-mentioned problem occurs due to the formation of recesses on the surface of the laminate.

Further, the maximum value (maximum deviation width) D ₁ of the variation in the stacking position of the electrical insulation band when viewed as the entire reinforcing layer (the entire reinforcing layer on one side when laminated on both sides of the laminate 11) D ₁
(See FIG. 6), the lower limit is 6W _1/5 or more, particularly 3W _1/2
As described above, the upper limit is preferably 5 W ₁ or less, and particularly preferably 4 W ₁ or less. If the maximum deviation width D ₁ is less than the lower limit value, a concave portion is formed on the upper surface of the laminated body, which causes the above problem.
When the deviation width D ₁ exceeds this upper limit value, not only the effect of eliminating the concave portion on the upper surface of the laminate is not remarkable, but also the lamination position of the electric insulating band coincides with the lamination position of the electrically insulating portion of the laminate 1. In that case, the above-mentioned problems occur due to the formation of recesses on the surface of the laminate.

FIG. 8 is a cross section in the thickness direction (stacking direction) of an example in which reinforcing layers 60a and 60b having a stacking form different from that of FIG. 6 are stacked on both surfaces of the stack 11 of FIG. 1 described in the first embodiment. It is a figure.

The reinforcing layer shown in FIG. 8 is formed by laminating at least one laminating unit 64 including a resin layer 61 and a metal layer 62 laminated on one surface of the resin layer. No metal layer is present in the strip-shaped electrically insulating strip portion 63 existing at one end of the surface of the resin layer. Without the electrical insulation band, when the external electrode (see FIGS. 11 and 17) is provided, both external electrodes are short-circuited via the metal layer.

The shape of the electric insulating strip is not particularly limited,
In the present embodiment, a strip having a certain width is used from the viewpoint of ease of manufacturing and the like. FIG. 9 shows a cross-sectional view as seen from the direction of arrows IV-IV in FIG.

As for the reinforcing layer, it is sufficient that at least one layer of the laminated unit 64 is laminated, but when two or more layers are laminated,
It is preferable that the widths of the electrical insulating bands are not the same when viewed as the entire reinforcing layer (the entire reinforcing layer on one side when laminated on both surfaces of the laminate 11). For example, as shown in FIG. 8, with respect to a certain electric insulation band, the width of the electric insulation band of the adjacent laminated unit is changed, and further, the width of the electric insulation band of the adjacent laminated unit is changed. The width of the obi is gradually changed. Alternatively, the width of the electrical insulation band of two consecutive (or more) laminated units may be the same width, and the width of the electrical insulation band of the third (or more) laminated unit may be changed. Good.

If all the widths of the electrical insulating strips are the same, the number of metal layers stacked is small at the end where the electrical insulating strips are present, and therefore the stacking thickness of this portion decreases when viewed as a whole stack, A noticeable recess is formed on the top surface of the layered structure. When the solder is mounted on the printed circuit board, the recessed portion may have poor handleability and adversely affect the wettability of the solder. Moreover, when such a recess occurs, as the depth of the recess increases, it becomes difficult to deposit a patterning material, which will be described later, on the bottom of the recess in the process of manufacturing the laminate, and a good electrical conductivity with a certain width is obtained. It becomes difficult to form the insulating band and the electrically insulating portion. Further, as the concave portion is generated, the laminated body portion 11 laminated thereon is formed.
The dielectric layer and the metal thin film layer on the side of the electrically insulating portion are inclined, so that the laminated thickness of the dielectric layer and the metal thin film layer is locally thinned. If the laminated thickness of the dielectric layer is locally reduced, when the laminated body is used as a capacitor, the withstand voltage of the capacitor is lowered due to the presence of the portion, and a short circuit occurs due to a pinhole in the dielectric layer. Further, if the laminated thickness of the metal thin film layer is locally thinned, a conductive defect or the like is likely to occur at that portion.

Therefore, as shown in FIG. 8, the entire reinforcing layer is
(If laminated on both sides of the laminate 11, the entire reinforcing layer on one side
Body), the average value of the width of the electrical insulation band is W₁AVE, max
Value is W ₁MAX, the minimum value is W₁When set to MIN, (W₁MAX-W
₁MIN) / W₁AVE is W₁AVE / 5 or more is preferable,
More preferably W₁AVE / 3 or higher.

On the other hand, there are large variations in the width of the electrically insulating portion.
Kikuru, (W₁MAX-W₁MIN) / W ₁AVE becomes too large
The effect of eliminating the recesses on the top surface of the laminate is not significant.
Yes. Therefore, (W₁MAX-W₁MIN) / W₁AVE upper limit
Is preferably W₁AVE or less, more preferably W₁AVE / 2
It is the following.

The change in the width of the electrical insulating band may be regular or irregular (excluding manufacturing errors).

Thickness of the resin layer of the reinforcing layer T5 (FIG. 6), T7
(FIG. 8) is the thickness T of the dielectric layer of the laminate of FIG. 1 or FIG.
It is preferably thicker than 1 (FIG. 1) and T3 (FIG. 4). Also, the thicknesses T6 (Fig. 6) and T8 (Fig. 8) of the metal layer of the reinforcing layer.
Is preferably thicker than the thickness T2 (FIG. 1) or T4 (FIG. 4) of the metal thin film layer of the laminated body of FIG. 1 or 4. As described above, by using the reinforcing layer in which the thickness of each layer is increased, the adhesion strength of the external electrode can be increased when the external electrode (see FIGS. 11 and 17) described later is provided. The external electrode is formed by thermal spraying or the like, but the particles of this thermal sprayed metal are relatively coarse, and it is difficult for the particles to sufficiently penetrate between the metal thin film layers of the laminated bodies 11 and 40. However, the thickness of the dielectric layer cannot be increased from the viewpoint of ensuring the capacitance when the capacitor is used. Therefore, by increasing the thickness of the resin layer, the penetration of the sprayed metal can be facilitated and the adhesion strength of the external electrode can be easily enhanced. In addition, since the tensile strength increases as the thickness of the metal layer exposed on the side surface increases, the adhesion strength of the external electrode can be increased by increasing the thickness of the metal layer.

Specifically, the thicknesses T5 and T7 of the resin layer are
It is preferably 0.1 to 1 μm, particularly 0.1 to 0.6 μm. The metal layers have thicknesses T6 and T8 of 100 to 50.
It is preferably 0 angstrom, particularly 200 to 400 angstrom, and the film resistance is 1 to 10 Ω / □, especially 2 to 6 Ω / □. Although the first metal layer and the second metal layer in FIG. 6 may have different thicknesses, it is preferable that they have the same thickness because the thickness uniformity of the entire laminate can be secured.

The materials of the resin layer and the metal layer of the reinforcing layer are not particularly limited, but materials used for the dielectric layer and the metal thin film layer, respectively, are preferable in terms of manufacturing efficiency. On the other hand, for the purpose of adjusting the adhesion strength with the external electrodes, or for adjusting the hardness or mechanical strength of the entire laminate,
Of course, it is possible to use materials different from those used for the dielectric layer and the metal thin film layer.

The degree of curing of the resin layer of the reinforcing layer is 50% or more, particularly 50 to 75% immediately after the reinforcing layer is formed, and 90% or more in the final state of a capacitor or the like. It is preferable in terms of stability of characteristics.
If the degree of curing is smaller than the above range, the layer will be easily deformed when a press in the manufacturing process of the laminated body or an external force in the mounting process of the laminated body is applied. On the other hand, when the degree of curing is larger than the above range, the sprayed metal particles in the case of forming the external electrode are less likely to penetrate between the metal layers to weaken the adhesion strength of the external electrode, or from the can roller in the manufacturing process of the laminate described later. When removing the continuous body of the cylindrical laminated body, or
A problem such as cracking may occur when a flat laminated body mother element is pressed.

Incidentally, in FIGS. 6 and 8, the laminated body 1 of FIG.
A reinforcing layer can be similarly provided by using the laminated body 40 of FIG. 4 instead of 1. In that case, the above description can be applied to the components of the laminated body 40 of FIG. 4 as they are, if necessary.

(Third Embodiment) Next, a case where an outer resin layer is provided on at least one surface of the laminate will be described.

FIG. 10 is a cross-sectional view in the thickness direction (stacking direction) of an example in which the resin outer layers 65a and 65b are stacked on both surfaces of the stack 11 of FIG.

The resin outer layer is formed in the process of manufacturing a laminated body or an electronic component using the laminated body, particularly a capacitor, or in the process of mounting the laminated body on a printed circuit board or the like.
This is effective in preventing the portion of the laminated body 11 from being damaged by heat load or external force.

If the resin outer layer is provided on at least one surface of the laminate 11, the above-mentioned effect is exhibited, but if it is provided on both surfaces, the laminate 11 is more effectively protected.

The thickness of the resin outer layer is not particularly limited and can be appropriately determined depending on the environment to which the laminate is exposed.
In order to sufficiently exhibit the above effects, it is preferably 2 μm or more, more preferably 3 to 100 μm, and particularly preferably 5 to 20 μm.

In the example shown in FIG. 10, the resin outer layer is directly provided on the laminate 11, but the second embodiment is provided between the laminate 11 and the resin outer layer.
It is also possible to laminate via the reinforcing layer described in the above.
According to such an embodiment, not only the protective function of the laminated body 11 is improved, but also the adhesion strength of the external electrode (see FIG. 11) can be increased. Moreover, you may laminate | stack via a layer other than a reinforcement layer.

The material of the resin outer layer is not particularly limited, but if it is used as the material for the dielectric layer and / or the resin layer, the manufacturing efficiency is improved. On the other hand, in order to impart a specific function to the resin outer layer, a material different from the material used for the dielectric layer and / or the resin layer can be used. For example,
It is preferable to use an epoxy resin because the adhesiveness with the reinforcing layer is enhanced.

Further, the resin outer layer can be colored in a specific color. As a result, the recognition accuracy of pattern recognition when mounting on a printed wiring board as an electronic component is improved, and it is easy to distinguish each product. For coloring, for example, a coloring agent such as a pigment may be mixed, or the outer surface may be coated with paint or the like. Further, the resin outer layer can be made transparent if necessary.

The degree of curing of the resin outer layer is 50% or more, particularly 50 to 75% in the state of the laminate immediately after the resin outer layer is formed, and 90% or more in the final state such as a capacitor.
It is preferable in terms of handling property and stability of properties. If the degree of curing is smaller than the above range, the layer will be easily deformed when a press in the manufacturing process of the laminated body or an external force in the mounting process of the laminated body is applied. On the other hand, if the degree of cure is greater than the above range, when removing the cylindrical continuous body of the laminated body from the can roller in the later-described laminated body manufacturing process,
Alternatively, a problem such as cracking may occur when the plate-shaped laminated body mother element is pressed.

In addition, in FIG. 10, a laminated body 40 of FIG. 4 may be used in place of the laminated body 11 of FIG. 1 to similarly provide an outer resin layer. In that case, the above description can be applied to the components of the laminated body 40 of FIG. 4 as they are, if necessary.

(Embodiment 4) Next, the case where external electrodes are formed on the side surfaces of the laminate will be described.

FIG. 11 is a schematic perspective view showing an example in which the external electrodes 71a and 71b are formed on the side surfaces of the laminated body. Figure 1
In the laminated body to which the external electrode 1 is provided, the reinforcing layers 73a and 73b are laminated on both surfaces of the laminated body portion 72, and the resin outer layers 74a and 74b are further laminated thereon. The laminated body portion 72 is the laminated body 11 described in FIG. 1 of the first embodiment.
6 is used as the reinforcing layers 73a and 73b, and the resin outer layers 65a and 65b described in FIG. 10 of the third embodiment are used as the resin outer layers 74a and 74b. Are used respectively.

The external electrodes 71a and 71b are electrically connected to the first metal thin film layer and the second metal thin film layer of the laminated body 72, respectively.

The external electrodes can be formed by metal spraying brass, for example. At this time, the sprayed metal species may be changed to form an external electrode having two or more layers. For example, after spraying a metal having a good adhesion strength with the laminate as a base layer, a metal having good adhesion to various metals or resins to be contacted (laminated) on the upper layer is selected as an upper layer. Can be sprayed.

Further, in consideration of solderability at the time of mounting, etc., hot-dip solder plating, molten tin plating, electroless solder plating, etc. may be applied. At that time, as a base layer, a layer obtained by applying a conductive paste in which copper powder or the like is dispersed in a thermosetting phenolic resin onto a metal sprayed layer and heat-cured, or a metal sprayed layer of an alloy of copper / phosphorus / silver Etc. may be formed in advance.

A bump electrode may be provided on the external electrode. This makes mounting on the circuit board easier.
The bump electrodes can be provided by appropriately selecting from known materials and shapes.

Furthermore, a necessary exterior can be provided depending on the application. For example, for the purpose of improving the moisture resistance of the laminate and protecting the exposed metal thin film layer and / or the metal layer, a surface treatment agent such as a silane coupling agent is coated to a thickness of about several tens of angstroms, or a metal thin film is used. On the surface where the layer is exposed, light or thermosetting resin with a thickness of several hundred μm
It is possible to provide a layer which is applied and cured to an extent.

The laminate thus obtained can be used in applications such as chip capacitors, chip coils, chip resistors, and composite element parts thereof, among which electronic parts such as capacitors can be preferably used. . In particular, since the laminated body of the present invention is a small-capacity, high-capacity capacitor, it has a high practical value when used as a chip capacitor.

Note that the laminated body 40 in FIG. 4 can be used instead of the laminated body 11 in FIG. 1 as the laminated body 72 in FIG. In that case, the above description may be omitted from FIG.
It can be directly applied by substituting the constituent elements of the laminated body 40. Further, as the reinforcing layers 73a and 73b, the reinforcing layer 5 of FIG.
The reinforcing layers 60a and 60b of FIG. 8 may be used instead of 0a and 50b. In that case, the above description can be applied to the components of the reinforcing layers 60a and 60b of FIG. 8 as they are, if necessary.

(Embodiment 5) Next, a method for manufacturing a laminate of the present invention will be described.

FIG. 12 is a schematic view schematically showing an example of a manufacturing apparatus for carrying out the method for manufacturing a laminated body according to the present invention.

A metal deposition source 84 is provided below the can roller 81 rotating in the direction of the arrow in the figure at a constant angular velocity or peripheral velocity.
On the other hand, the resin evaporation source 82 is arranged on the downstream side in the rotation direction of the can roller 81, and the patterning material application device 83 is arranged on the upstream side.

Further, in this example, the patterning material removing device 87 is provided between the metal evaporation source 84 and the resin evaporation source 82, and the resin curing device 88 and the resin surface are provided between the resin evaporation source 82 and the patterning material applying device 83. Although the processing devices 89 are provided respectively, they may be provided as needed and are not essential in the present invention.

These devices are housed in a vacuum container 85, and the inside thereof is kept vacuum by a vacuum pump 86.

The outer peripheral surface of the can roller 81 is finished to be smooth, preferably a mirror surface, preferably -20.
It is cooled to -40 ° C, particularly preferably -10 to 10 ° C. The rotation speed can be set freely, but 15 to 70 rp
It is about m.

The metal evaporation source 84 enables metal vapor deposition toward the surface of the can roller 81, and forms the metal thin film layer of the laminate and the metal layer of the reinforcing layer. As the vapor deposition metal, for example, Al, Cu, Zn, Sn, Au, Ag, Pt
At least one selected from the group consisting of is used.
Note that the metal thin film may be formed by a known means such as sputtering or ion plating instead of vapor deposition.

The resin evaporation source 82 evaporates and vaporizes the reactive monomer resin toward the surface of the can roller 81, and the resin is deposited to form the dielectric layer, the resin layer of the reinforcing layer, and the resin outer layer. .

The deposited reactive monomer resin is polymerized and / or cross-linked by the resin curing device 88, if necessary,
It is cured to a desired degree of curing to form a thin film. As the resin curing device, for example, an electron beam irradiation device or an ultraviolet irradiation device can be used.

The resin thin film thus formed is surface-treated by a resin surface treatment device 89, if necessary. For example, an oxygen plasma treatment or the like can be performed to activate the surface of the resin layer and improve the adhesiveness to the metal thin film.

The patterning material applying device 83 is for depositing the patterning material in a predetermined shape on the surface of the resin thin film. No metal thin film is formed at the location where the patterning material is deposited. As a patterning material,
For example, oil can be used. The means for applying the patterning material is a non-contact adhesion means such as a method of spraying a vaporized and vaporized patterning material from a nozzle to liquefy the resin thin film surface, or a method of spraying a liquid patterning material, a reverse coat, a die coat. However, in the present invention, the non-contact adhesion means is preferable in that the external force is not applied to the resin surface, and among them, the evaporated patterning material is liquefied on the resin thin film surface because of its relatively simple structure. The method is preferred.

FIG. 13 is a schematic perspective view of a patterning material applying apparatus for spraying evaporated oil to apply a strip-shaped oil film on the surface of a resin thin film, as an example of the patterning material applying apparatus. The surface 91 of the patterning material application device 83 is arranged so as to be perpendicular to the normal line of the outer peripheral surface of the can roller 81. Nozzles 92 for ejecting vaporized oil are arranged on the surface 91 at a predetermined interval and in a predetermined number. The shape of the nozzle 92 is not only circular as shown in FIG. 13, but also elliptical, rectangular, or a plurality of circular, elliptical or rectangular shapes arranged in the moving direction of the can roller surface. Good.

The patterning material applied by the patterning material applying device 83 is removed by the patterning material removing device 87 as needed. Most of the patterning material deposited by the patterning material application device re-evaporates and disappears when the metal thin film is formed. However, some remain after the metal thin film layer is formed, causing problems such as roughened laminated surface, pinholes in the dielectric layer or the metal thin film layer (layer missing), and destabilization of the laminated region of the metal thin film layer. . Originally, the patterning material should have the minimum necessary amount of adhesion so as not to remain after the formation of the metal thin film layer, but if it is insufficient even slightly, the non-laminated portion of the metal thin film layer is not formed as intended, Its control is extremely difficult. Therefore, it may be preferable to remove the patterning material remaining after the metal thin film layers are stacked and before the dielectric layers are stacked.

The means for removing the patterning material is not particularly limited. For example, when the patterning material is oil, it can be removed by heating and evaporation by a heater, decomposition and removal by plasma irradiation, or a combination thereof. At this time, oxygen plasma, argon plasma, nitrogen plasma or the like can be used for plasma irradiation, and oxygen plasma is particularly preferable among them.

In the laminated body of the present invention, a step of depositing a resin material by using a resin evaporation source 82 to form a dielectric layer, and a patterning material applying device 83 deposits the patterning material in a band shape on the dielectric layer. It is manufactured by making the step of performing and the step of laminating the metal thin film layer by the metal vapor deposition source 84 as one unit and repeating this a predetermined number of times.

At this time, the 2n-th (n is a natural number) patterning material adhesion position is made different from the 2n-1th patterning material adhesion position, and the 2n-th patterning material adhesion positions are not all set to the same position. Also,
Make sure that the 2n-1th patterning material deposition positions are not all at the same position. As a result, the electrically insulating portion is formed in a strip shape on the non-end portion of the dielectric layer, the stacking positions of the electrically insulating portions of the adjacent stacking units are different, and the stacking position of the electrically insulating portion of every other stacking unit is different. However, it is possible to manufacture a laminated body in which the laminated body is not the same. Alternatively, the electrically insulating portion is formed in a strip shape at one end of the dielectric layer, and the electrically insulating portions of the adjacent laminated units are laminated so as to be located on the opposite sides to each other. It is possible to manufacture a laminated body in which the widths of parts are not the same in the entire laminated body.

Further, when the deposition width of the band-shaped patterning material is W, the 2n + 1-th patterning material deposition position is shifted within a range of W / 20 to 4W with respect to the 2n-1st patterning material deposition position. , And 2n +
It is preferable to shift the second patterning material deposition position with respect to the 2nth patterning material deposition position within the range of W / 20 to 4W. As a result, when the width of the strip-shaped electrically insulating portion is W, the displacement amount of the stacking position of the electrically insulating portion of every other stacking unit is W / 20 or more, 4
A laminate having W or less can be manufactured.

Further, the maximum value of the variation of the 2n-th time patterning material adhesion position and the maximum value of the 2n-1-th time of the patterning material adhesion position are both 6 W / 5 to 5 W (W is a band-shaped patterning). (Adhesion width of material) is preferable. As a result, it is possible to manufacture a laminated body in which the maximum value of the variation in the laminated position of the electrically insulating portion of every other laminated unit is 6 W / 5 or more and 5 W or less when viewed as the entire laminated body.

In the manufacturing process of the laminated body of the present invention, the laminated thickness becomes thicker as the laminated units are successively laminated. Therefore, when the patterning material is directly adhered by coating or the like, it is not contacted. Even if it is present, it is preferable to retract the patterning material application device 83 as the stacking proceeds. That is, in FIG. 12, it is preferable to stack while maintaining the distance Dn between the outer peripheral surface of the stack being formed on the can roller 81 and the nozzle end of the patterning material application device at a constant interval.
This is because the patterning material diffuses with a certain directivity, particularly when vaporized oil is sprayed and deposited, so that the deposition width fluctuates due to the variation of the distance Dn, and the electrically insulating portion having a predetermined width. This is because it cannot be obtained stably.

The retreat of the patterning material application device and the change of the patterning material deposition position can be realized by, for example, the device shown in FIG.

First, the retraction of the patterning material application device is performed as follows. That is, the actuator A102 is fixed on the movable base 101, and the patterning material application device 83 is attached to the moving end of the actuator A102. The patterning material application device 83
It is movably installed on the movable base 101 in the direction of arrow 103 by an actuator A102. The patterning material application device 83 is provided with a gap measuring device 104 that measures a distance from the surface of the can roller 81 (the outer peripheral surface of the laminate in the process of forming the laminate). As the gap measuring device 104, for example, a non-contact distance measuring device using a laser can be used. Gap measuring device 104
Always measures the distance between the surface of the can roller 81 and the outer peripheral surface of the laminated body during manufacturing of the laminated body, and the signal is sent to the gap measuring circuit 105. Gap measurement circuit 105
Always checks whether or not the distance between the nozzle end of the patterning material application device 83 and the surface of the can roller 81 (the outer peripheral surface of the laminate in the process of forming the laminate) is within a predetermined range. When it is determined that is smaller than the predetermined range, the actuator A 102 is instructed to retract the patterning material application device 83 by a predetermined amount, and based on this, the patterning material application device 83 retracts by a predetermined amount. Thus, the patterning material application device 83
The stacking proceeds while the distance Dn between the nozzle end and the outer peripheral surface of the stack on the can roller 81 is always maintained at a constant interval.

The gap measuring device 10 as described above is used.
4 and the gap measuring circuit 105 is not performed, and the can roller 81 is sequentially moved backward by a preset amount based on the stack thickness according to the rotation speed (for example, one rotation) of the can roller 81. Good. In addition, the distance measurement by the gap measuring device 104 may be used together for confirmation, and fine adjustment may be appropriately performed.

Next, the change of the attachment position of the patterning material is performed as follows. That is, the actuator B107 is fixed on the fixed base 106, and the movable base 101 is attached to the moving end of the actuator B107. The movable base 101 is an actuator B1.
07, it is movably installed on the fixed base 106 in the direction of arrow 108. The rotation of the can roller 81 is monitored by a rotation detector (not shown), and a rotation signal S1 is sent to the rotation detection circuit 109 every time the can roller 81 makes one rotation. Whenever the rotation detection circuit 109 detects the rotation signal S1 a predetermined number of times (for example, once), the rotation detection circuit 109 moves the movable base 101 to the arrow 10 with respect to the actuator B107.
It is instructed to move in a predetermined direction in eight directions by a predetermined amount, and based on this, the movable base 101, that is, the patterning material application device 83 moves in a predetermined direction in the direction of the arrow 108 by a predetermined amount. Thus, the deposition position of the patterning material is changed by a predetermined amount every time the can roller 81 rotates a predetermined number of times, in the direction perpendicular to the rotational movement direction of the surface of the can roller 81.

Through the above steps, the cylindrical continuous body of the laminated body in which the dielectric layer and the metal thin film layer distinguished by the electrically insulating portion are sequentially laminated is formed on the outer peripheral surface of the can roller 81. When the lamination of a predetermined number of times is completed, the cylindrical continuous body of the laminated body is divided in the radial direction (for example, 8 divisions at every 45 °), removed from the can roller 81, and subjected to heating / pressing press, respectively, to obtain a flat plate A layered body mother element is obtained.

FIG. 15 is a partial perspective view showing a schematic structure of the flat plate-shaped laminated body mother element thus obtained. In the figure,
The direction of arrow 111 indicates the moving direction (circumferential direction) on the can roller 81.

As shown, the laminated body mother element 110 is
A dielectric layer 112 and a metal thin film layer 113 distinguished by an electrically insulating portion 114 are sequentially laminated. After that, by cutting at the cut surfaces 115a and 115b,
A laminated body as shown in FIG. 1 is obtained.

Further, as shown in FIG. 16, the laminated body mother element 110 ′ obtained in the same manner has cutting planes 116 a, 116.
By changing to b and cutting, a laminated body as shown in FIG. 4 is obtained.

When laminating the reinforcing layer as shown in the second embodiment, in the apparatus shown in FIG. 12, the patterning material is placed at the desired laminating position of the electric insulating band at the beginning or the end of the laminating. The patterning material application device may be moved (moved to a predetermined position in the direction of arrow 108 in FIG. 14) so as to be applied, and the can roller 81 may be rotated a predetermined number of times. In order to make the thickness of the resin layer and / or the metal layer different from the thickness of the dielectric layer and / or the metal thin film layer, the rotation speed of the can roller 81 is adjusted, or the resin evaporation source 82 and / or This can be easily realized by providing a shield plate on the metal vapor deposition source 84 and stacking a resin layer or a metal layer for each rotation.

When laminating the resin outer layer as shown in the third embodiment, the metal vapor deposition source 84 is shielded or the metal vapor deposition is stopped at the beginning or the end of the lamination in the apparatus shown in FIG. In this state, the can roller 81 is rotated a predetermined number of times.
It can be realized by rotating the resin and laminating only the resin layer.

In the apparatus shown in FIG. 12, the laminated body is formed on the cylindrical can roller 81, but the support body on which the laminated body is formed is not limited to this, and may be any one that rotates in a vacuum apparatus. Absent. For example, the laminate can be formed on a belt-shaped support that circulates between a plurality of rolls. As the belt-shaped support, a support made of metal, resin, cloth, or a composite thereof can be used. A rotating disk can also be used. In this case, when forming the electrically insulating portion, it is formed in a concentric shape.

As described above, according to the method for producing a laminated body of the present invention, the laminated body of the present invention can be efficiently produced at a low cost by a simple method.

[0120]

EXAMPLES Next, the present invention will be described based on specific examples.

Example 1 A laminate was manufactured using the apparatus shown in FIG. The inside of the vacuum container 85 is 2 × 10 ⁻⁴ Torr
The outer circumference of the can roller 81 is maintained at 5 ° C.

First, a portion to be an outer resin layer was laminated on the outer peripheral surface of the can roller 81. Dicyclopentadiene dimethanol diacrylate was used as the resin outer layer material, and this was vaporized and deposited on the outer peripheral surface of the can roller 81. Next, an ultraviolet curing device is used as the resin curing device 88, and the resin outer layer material deposited as described above is polymerized,
Cured. This operation is repeated by rotating the can roller 81 so that the outer surface of the can roller 81 has a thickness of 1 mm.
An outer resin layer having a thickness of 5 μm was formed, and then a portion to be a reinforcing layer was laminated. As the resin layer material, the same material as the above resin outer layer material was used, and this was vaporized and deposited on the resin outer layer. Next, an ultraviolet curing device was used as the resin curing device 88, and the resin layer material deposited as described above was polymerized and cured. The resin layer formed at this time has a thickness of 0.6 μm. Thereafter, the surface of the resin was treated with oxygen plasma by the resin surface treatment device 89. Next, the patterning material applying device 83 made the patterning material adhere to the portion corresponding to the electrical insulating band. Fluorine-based oil was used as a patterning material, which was vaporized and ejected from a nozzle having a diameter of 50 μm to be attached in a band shape having a width of 150 μm.
Next, aluminum was vapor-deposited from the metal evaporation source 84. Deposition thickness is 300 Å, film resistance 4Ω
/ □. After that, the patterning material removing device 87 removed the remaining patterning material by heating with a far infrared heater and plasma discharge treatment. The above operation is performed by rotating the can roller 81.
Repeated times to form a reinforcing layer having a total thickness of 315 μm. The movement of the patterning material application device in the direction perpendicular to the movement of the outer peripheral surface of the can roller 81 (the direction of the arrow 108 in FIG. 14) is performed by using the device shown in FIGS. 13 and 14.
The pattern was as follows. That is, the can roller 81 is 1
When it rotates, it moves 60 μm in a certain direction, moves 60 μm in the same direction after the next one rotation, and moves 60 μm in the opposite direction after the next one rotation.
This movement is repeated below, where one cycle is a movement of 60 μm in the same direction after the next one rotation. Further, the distance Dn between the nozzle 92 of the patterning material application device and the adhered surface was controlled so as to always maintain 250 to 300 μm.

Next, a laminate portion consisting of the dielectric layer and the metal thin film layer was laminated. The same material as the material for the outer resin layer and the resin layer was used as the dielectric layer material, and this was vaporized and deposited on the resin layer. Next, an ultraviolet curing device was used as the resin curing device 88, and the dielectric layer material deposited as described above was polymerized and cured. The dielectric layer formed at this time is 0.4 μm. Thereafter, the surface of the resin was treated with oxygen plasma by the resin surface treatment device 89. Next, the patterning material applying device 83 made the patterning material adhere to the portion corresponding to the electrically insulating portion. Fluorine-based oil was used as a patterning material, and this was vaporized and ejected from a nozzle having a diameter of 50 μm to give a width of 15
It was applied in a band shape of 0 μm. Next, aluminum was vapor-deposited from the metal evaporation source 84. The vapor deposition thickness is 300 Å, and the film resistance is 4 Ω / □. After that, the patterning material removing device 87 removed the remaining patterning material by heating with an infrared heater and plasma discharge treatment. The above operation is repeated about 2000 times by rotating the can roller 81, and the total thickness 86
A 0 μm laminated portion was formed. Note that the patterning material application device moves in the direction perpendicular to the movement direction of the outer peripheral surface of the can roller 81 (direction of arrow 108 in FIG. 14) using the device shown in FIGS. I went there. That is, when the can roller 81 makes one rotation, it moves in a certain direction by 1000 μm, after the next one rotation in the opposite direction by 940 μm, and after the next one rotation in the opposite direction by 1000 μm.
.mu.m, and after the next one rotation, move 940 .mu.m in the opposite direction,
After the next one rotation, it moves in the reverse direction by 1000 μm, after the next one rotation, it moves in the reverse direction by 1060 μm, in the next one rotation, it moves in the reverse direction by 1000 μm, and then in the reverse direction after the next one rotation, 1060 μm
This movement was repeated below, with the movement of moving m as one cycle. The distance Dn between the nozzle 92 of the patterning material application device and the adhered surface is always 250 to 300.
It was controlled so that μm could be maintained.

Next, a thickness of 315 μm was formed on the surface of the laminated body portion.
m reinforcement layer was formed. The forming method was exactly the same as the forming method of the reinforcing layer.

Finally, a resin outer layer having a thickness of 15 μm was formed on the surface of the reinforcing layer. The forming method was exactly the same as the forming method of the resin outer layer.

Next, the obtained cylindrical laminated body was divided into eight pieces in the radial direction (cut at intervals of 45 °), removed, and pressed under heating to form a flat laminated body mother element as shown in FIG. (However, actually, the reinforcing layer and the resin layer are laminated on the upper and lower surfaces). This is cut at the cutting surface 115a,
An external electrode was formed by metal spraying brass on the cut surface. In addition, copper, N
i, applying a conductive paste in which a silver alloy or the like is dispersed,
The resin was cured by heating, and the surface of the resin was plated with molten solder. After that, it was cut at a portion corresponding to the cut surface 115b in FIG. 15, dipped in a silane coupling agent solution to coat the outer surface, and a chip capacitor as shown in FIG. 11 was obtained.

Electrical of Capacitance Generating Part as Capacitor
The width of the insulating part is 150 μm, and every other laminated unit
The amount of deviation d of the laminated position of the electrically insulating portion is 60 μm, and the laminated body
Electrical insulation of every other laminated unit when viewed as a whole
The maximum deviation width D of the laminated position of the minute was 270 μm. Well
Also, the width of the electrical insulation band of the reinforcing layer is 150 μm,
Located in the approximate center, the electrical insulation band of adjacent laminated units
Deviation of stacking position d ₁Is 60 μm, and the entire reinforcing layer is seen
The maximum deviation D of the laminated position of the electrical insulation strip when₁Is 27
It was 0 μm.

The obtained chip capacitor had a thickness in the stacking direction of about 1.5 mm, a depth of about 1.6 mm, and a width (direction between both external electrodes) of about 3.2 mm.
It was μF. The withstand voltage was 50V. In addition, there is almost no unevenness on the upper and lower surfaces in the stacking direction, and the step is 10 μm.
It was m or less. This was mounted on a printed wiring board by soldering, but there were no problems such as missing external electrodes. Furthermore, when the chip capacitor was disassembled and the surface roughness Ra of the surface of the dielectric layer and the surface of the metal thin film layer was measured, they were 0.005 μm and 0.005 μm, respectively. The degree of cure of the dielectric layer, the resin layer, and the resin outer layer was 95%, 95%, and 90%, respectively.

(Example 2) In Example 1, the conditions for depositing the patterning material on the laminated body portion including the dielectric layer and the metal thin film layer were changed as follows. That is, the nozzle diameter of the patterning material application device is changed to 75 mm, and the width 2
The patterning material was applied in the form of a band of 00 mm. The movement of the patterning material applying device in the direction perpendicular to the movement direction of the outer peripheral surface of the can roller 81 (the direction of arrow 108 in FIG. 14) was performed in the following pattern using the device shown in FIGS. 13 and 14. That is, when the can roller 81 makes one rotation, it moves in a certain direction by 1000 μm, after the next one rotation in the opposite direction by 940 μm, and after the next one rotation in the opposite direction by 1000 μm.
.mu.m, and after the next one rotation, move 940 .mu.m in the opposite direction,
After the next one rotation, it moves in the reverse direction by 1000 μm, in the next one rotation in the reverse direction by 1060 μm, in the next one rotation by the reverse direction by 1000 μm, and in the next one rotation after the reverse direction, 1060 μm.
This movement was repeated below, with the movement of moving m as one cycle.

A laminated body mother element as shown in FIG. 16 was obtained in the same manner except the above (however, actually, the reinforcing layer and the resin layer were laminated on the upper and lower surfaces). This is cut surface 11
It cut | disconnected by 6a, the brass was metal-sprayed on the cut surface, and the external electrode was formed. Further, a conductive paste in which copper powder was dispersed in a thermosetting phenolic resin was applied to the surface of the metal sprayed, and was cured by heating, and then the surface of the resin was subjected to molten solder plating. After that, it was cut at a position corresponding to the cut surface 116b in FIG. 16, dipped in a silane coupling agent solution to coat the outer surface, and a chip capacitor 70 ′ as shown in FIG.

The average value WAVE of the width of the electrically insulating portion of the capacitance generating portion as the capacitor is 140 μm and the maximum value WMAX.
Was 200 μm and the minimum value WMIN was 80 μm.

The obtained chip capacitor had a thickness in the stacking direction of about 1.5 mm, a depth of about 1.6 mm, and a width (direction between both external electrodes) of about 3.2 mm.
It was μF. The withstand voltage was 50V. Also, almost no unevenness was observed on the upper and lower surfaces in the stacking direction. This was mounted on a printed wiring board by soldering, but there were no problems such as missing external electrodes. Despite the fact that the number of metal thin film layers connected to the external electrodes is considerably smaller than in Example 1, sufficient adhesion strength of the external electrodes was obtained because the distance between the metal thin film layers was wide and the sprayed metal particles were It is considered that the metal layer of the reinforcing layer contributed in addition to the fact that the metal layer could sufficiently penetrate between the metal thin film layers. Further, when the chip capacitor was disassembled and the surface roughness Ra of the surface of the dielectric layer and the surface of the metal thin film layer was measured, 0.005 μm in order,
It was 0.005 μm. The hardening degree of the dielectric layer, the resin layer, and the resin outer layer is 95%, 95%, and 90%, respectively.
%Met.

(Comparative Example 1) A chip capacitor was prepared in the same manner as in Example 1 except that there was no deviation in the laminated position of the electrically insulating portion of the laminated body portion, and no deviation of the laminated position of the electrical insulating band of the reinforcing layer. Manufactured.

The obtained chip capacitor has a thickness in the stacking direction of about 1.5 mm, a depth of about 1.6 mm, and a width (direction between both external electrodes) of about 3.2 mm. On the upper surface in the stacking direction, recesses were found at two locations corresponding to the electrically insulating portion of the laminate and one location corresponding to the electrical insulating band of the reinforcing layer. The former had a depth of 30 μm, and the latter had a depth of about 30 μm. The capacitance of the capacitor was 0.40 μF, which did not satisfy the required specifications. It is speculated that the capacitance is smaller than that in Example 1 because a part of the metal thin film layer is broken due to the recess formed in the electrically insulating portion. The withstand voltage was 16 V, which did not satisfy the required specifications. It is speculated that the withstand voltage is lower than in Example 1 because the thickness of the dielectric layer is locally thinned due to the concave portion formed in the electrically insulating portion. This was mounted on a printed wiring board by soldering, but the solder wettability was slightly inferior due to the concave portion on the surface. No problems such as missing external electrodes occurred.

(Comparative Example 2) The manufacturing conditions of Example 2 were changed to obtain a chip capacitor 70 "as shown in Fig. 18. The manufacturing conditions are as follows. The movement pattern of the outer peripheral surface of the can roller 81 in the vertical direction (direction of arrow 108 in FIG. 14) was changed so that the widths of the electrically insulating portions were all the same, and the reinforcing layer was provided. A resin outer layer is directly provided on the upper and lower sides of the laminated body portion 72 ″ which functions as a capacitor without being provided.
Same as Example 2 except that 4a and 74b were laminated.

The obtained chip capacitor had a thickness in the stacking direction of 0.9 mm (thicker than that of Example 1 due to the absence of the reinforcing layer), a depth of 1.6 mm, and a width (direction between both external electrodes) 3.2.
However, as shown in FIG. 18, the recesses 120a and 120b are formed in both end portions where the number of stacked metal thin film layers on the upper surface is small.
Was occurring. The depth of the recess was 30 μm. The capacitance of the capacitor was 0.40 μF, which did not satisfy the required specifications. Although the conditions such as the thickness of the dielectric layer and the number of laminations were the same as those in Example 2, the capacitance was smaller than that of the capacitor of Example 2. This is a portion corresponding to the recesses 120a and 120b.
It is considered that this is because there is a step in the metal thin film layer as shown in (3) and a part of the metal thin film layer is broken at this portion. The withstand voltage was 16 V, which did not satisfy the required specifications. It is speculated that the withstand voltage is lower than that in Example 2 because the thickness of the dielectric layer is locally thinned due to the recess formed in the electrically insulating portion. In addition, when this chip capacitor was mounted on a printed wiring board by soldering, there were some cases in which a missing external electrode or a defective electrical connection occurred. It is considered that this is because the metal layer of the reinforcing layer portion that contributes to the adhesion strength with the external electrode is not present in this example as compared with Example 2, and thus sufficient adhesion strength was not obtained. further,
The solder wettability was slightly inferior due to the recesses on the surface.

[0137]

The laminate of the present invention has a dielectric layer having a thickness of 1 μm or less, a first metal thin film layer laminated on one surface of the dielectric layer, and a first metal thin film layer distinguished by a strip-shaped electrically insulating portion. A laminated body formed by laminating 1000 or more laminated units each composed of two metal thin film layers, wherein the electrically insulating portions of the adjacent laminated units have different laminating positions and the electrical conductivity of every other laminated unit. By making the stacking position of the insulating part not the same in the entire stack, it is difficult for the metal thin film layer to break, and when used as a capacitor, the external shape and structure are similar to conventional film capacitors. Therefore, it does not require special consideration for mounting, and it has achieved miniaturization and high capacity.

[0138]

[Brief description of drawings]

FIG. 1 is a sectional view in the thickness direction (stacking direction) of an example of a stack of the present invention.

FIG. 2 is a cross-sectional view as seen from a direction of an arrow I-I in FIG.

FIG. 3 is a sectional view in the thickness direction (stacking direction) of an example of a stack other than the present invention.

FIG. 4 is a sectional view in the thickness direction (stacking direction) of another example of the stack of the present invention.

5 is a cross-sectional view as seen from the direction of arrows along the line II-II in FIG.

FIG. 6 is a cross-sectional view in the thickness direction (stacking direction) of an example of a stack of the present invention in which reinforcing layers are stacked on both sides.

FIG. 7 is a cross-sectional view as seen from the direction of arrow III-III in FIG.

FIG. 8 is a sectional view in the thickness direction (stacking direction) of another example of the stack of the present invention in which reinforcing layers are stacked on both sides.

9 is a cross-sectional view as seen in the direction of arrows IV-IV in FIG.

FIG. 10 is a cross-sectional view in the thickness direction (laminating direction) of an example of a laminate of the present invention in which resin outer layers are laminated on both sides.

FIG. 11 is a schematic perspective view showing an example in which external electrodes are formed on the side surface of the laminate of the present invention.

FIG. 12 is a schematic view schematically showing an example of a manufacturing apparatus for carrying out the method for manufacturing a laminated body of the present invention.

FIG. 13 is a schematic perspective view of an example of a patterning material application device.

FIG. 14 is a schematic view showing an example of an apparatus for retracting the patterning material application apparatus and changing the deposition position of the patterning material.

FIG. 15 is a partial perspective view showing an example of a schematic configuration of a flat plate mother element.

FIG. 16 is a partial perspective view showing another example of the schematic configuration of the flat plate-shaped mother element.

FIG. 17 is a schematic perspective view of a chip capacitor according to a second embodiment.

FIG. 18 is a schematic perspective view of a chip capacitor according to a comparative example 2.

[Explanation of symbols]

11 laminate 12, 12a Dielectric layer 13, 13a First metal thin film layer 14, 14a Second metal thin film layer 15, 15a Multilayer unit 16, 16a, 16b Electrically insulating part 31a, 31b Electrically insulating portion 32a, 32b recess 33a, 33b Dielectric layer 34a, 34b Metal thin film layer 40 laminate 41, 41a Dielectric layer 42, 42a metal thin film layer 43, 43a, 43b Electrically insulating part 44, 44a Lamination unit 50a, 50b Reinforcing layer 51 resin layer 52 First Metal Layer 53 Second metal layer 54 stacking unit 55 Electric insulation 60a, 60b Reinforcing layer 61 resin layer 62 metal layer 63 electrical insulation 64 stacked units 65a, 65b Resin outer layer 70, 70 ', 70 "chip capacitors 71a, 71b External electrodes 72, 72 ', 72 "laminate 73a, 73b Reinforcing layer 74a, 74b Resin outer layer 81 Can Roller 82 Resin evaporation source 83 Patterning material application device 84 Metal evaporation source 85 vacuum container 86 vacuum pump 87 Patterning material removing device 88 Resin curing device 89 Resin surface treatment equipment 91 faces 92 nozzles 101 movable base 102 Actuator A 103 arrow (moving direction) 104 Gap measuring device 105 Gap measurement circuit 106 fixed base 107 Actuator B 108 arrow (moving direction) 109 rotation detection circuit 110, 110 'Laminated mother element 111 arrow 112 Dielectric layer 113 Metal thin film layer 114 Electrical insulation 115a, 115b Cut surface 116a, 116b Cut surface 120a, 120b recess

─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Nobuki Sunagari 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (56) References JP-A-9-190946 (JP, A) JP-A-2-43042 (JP, A) JP-A-57-91516 (JP, A) JP-A-55-79867 ( JP, A) JP 9-195048 (JP, A) JP 63-70411 (JP, A) Jpn 44-1450 (JP, Y2) (58) Fields investigated (Int.Cl. ⁷ , DB name) B32B 1/00-35/00 H01G 4/00-4/40 C23C 14/00-14/58

Claims (26)

(57) [Claims] 1. A dielectric layer having a thickness of 1 μm or less, and a first metal thin film layer and a second metal thin film layer which are laminated on one surface of the dielectric layer and are distinguished by a strip-shaped electrically insulating portion. A laminated body formed by laminating 100 or more laminated units, wherein all the electrically insulating portions have the same width, and the electrically insulating portions of the adjacent laminated units have different laminating positions, and A laminated body, wherein the laminated positions of electrically insulating portions of every other laminated unit are not the same in the entire laminated body. 2. When the width of the strip-shaped electrically insulating portion is W, the displacement amount of the stacking position of the electrically insulating portion of every other stacking unit is W / 20 or more and 4 W or less. The laminated body according to claim 1. 3. When the width of the strip-shaped electrically insulating portion is W, the maximum value of the variation in the width direction of the stacking position of the electrically insulating portion of every other stacking unit is the entire stack. And 6 W / 5 or more and 5 W or less, The layered product according to claim 1 characterized by things. 4. The laminated body according to claim 1, wherein the first metal thin film layers or the second metal thin film layers of the adjacent laminated units are not directly electrically connected to each other. 5. A dielectric layer having a thickness of 1 μm or less, and a metal thin film layer laminated on one surface of the dielectric layer except a strip-shaped electrically insulating portion existing at one end thereof. A laminated body in which 100 or more laminated units are laminated, and the electrically insulating portions of the adjacent laminated units are laminated so as to be located on opposite sides to each other. A laminate, wherein the widths of the parts are not the same in the entire laminate. 6. The average value of the width of the electrically insulating portion of every other laminated unit is WAVE, the maximum value is WMAX, and the minimum value is WMIN.
When it is set, (WMAX-WMIN) / WAVE is WAVE / 5 or more and WAVE or less, The laminated body of Claim 5 characterized by the above-mentioned. 7. The (dielectric layer thickness) / (metal thin film layer thickness) is 20 or less.
The laminated body according to. 8. The dielectric layer mainly contains an acrylate resin or a vinyl resin, as claimed in claim 1 or 5.
The laminated body according to. 9. The surface roughness Ra of the surface of the dielectric layer is 0.1 μm.
It is m or less, The laminated body of Claim 1 or 5 characterized by the above-mentioned. 10. The surface roughness Ra of the metal thin film layer surface is 0.
It is 1 micrometer or less, The laminated body of Claim 1 or 5 characterized by the above-mentioned. 11. The laminate according to claim 1, wherein the dielectric layer has a curing degree of 50% or more. 12. A reinforcing layer is laminated on at least one side of the laminate, and the reinforcing layer is laminated on a resin layer and one surface of the resin layer, and is distinguished by an electric insulation band.
The laminated body according to claim 1 or 5, wherein at least one or more laminated units each consisting of the metal layer and the second metal layer are laminated. 13. The laminate according to claim 12, wherein the electrically insulating band is provided at a substantially central portion of the laminate. 14. The laminated body according to claim 12, wherein two or more laminated units constituting the reinforcing layer are laminated, and the laminated position of the electric insulating band is not the same in the entire reinforcing layer. 15. A strip the electrically insulating band having a constant width W _1, and stacking position of the electrically insulating bands of adjacent stacked units, characterized in that it displaced W _1/20 or more The laminated body according to claim 14. 16. The reinforcing unit is composed of two or more laminated units, and the electric insulating band is in the form of a band having a constant width W ₁ , and the electric insulating band is the entire electric insulating layer. the laminate according to claim 12 in which the stacking position of the band, the maximum value of the variation in the width direction, characterized in that at 6W _1/5 or more. 17. A reinforcement layer is laminated on at least one side of the laminate, and the reinforcement layer is a resin layer and an electric insulation present on one surface of the resin layer and at one end of the surface of the resin layer. The laminated body according to claim 1 or 5, wherein at least one or more laminated units each including a metal layer laminated on a portion excluding the band are laminated. 18. The laminated body according to claim 17, wherein two or more laminated units constituting the reinforcing layer are laminated, and the width of the electric insulating band is not the same in the entire reinforcing layer. 19. When the average value of the width of the electric insulation band is W ₁ AVE, the maximum value is W ₁ MAX, and the minimum value is W ₁ MIN, (W ₁ MAX-
W ₁ MIN) / W ₁ AVE is W ₁ AVE / 5 or more, The laminated body of Claim 17 characterized by the above-mentioned. 20. The laminate according to claim 12, wherein the resin layer is thicker than the dielectric layer. 21. The laminate according to claim 12, wherein the metal layer has a thickness larger than that of the metal thin film layer. 22. The laminate according to claim 1, which has an outer resin layer on at least one side of the laminate. 23. The laminated body according to claim 1, wherein external electrodes electrically connected to the metal thin film layer are provided on opposite side surfaces of the laminated body. 24. A capacitor comprising the laminated body according to claim 1 or 5. 25. The capacitor according to claim 24, wherein the capacitor is a chip capacitor. 26. A dielectric layer having a thickness of 1 μm or less;
It is laminated on one side of the electric layer and has a strip-shaped electrically insulating part.
From the first metal thin film layer and the second metal thin film layer which are distinguished from each other
Is a laminated body formed by laminating 100 or more laminated units
The widths of all the electrically insulating parts are the same,
The laminated position of the electrically insulating portion of the laminated unit is different.
And the electrical insulation part of every other laminated unit
The stacking positions are not the same in the entire stack,
A laminated body characterized by being present.