JPH11145769A - Crystal resonator package product and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily adjust a frequency after a crystal resonator has been sealed by jointing a transparent and flat lid formed of glass to a base substrate for sealing the crystal resonator. SOLUTION: This crystal resonator sandwiched by electrodes is jointed into the recessed part 23a of the base substrate 23, and seal glass 22 is jointed on the upper face of the outer peripheral part of the base substrate 23. Thus, the crystal resonator is sealed between the lid 21 and the base substrate 23. The frequency of the crystal resonator is inspected, and the frequency of the crystal resonator which requires adjustment is adjusted by having it irradiated with laser beams from the outer side of the transparent glass lid and cutting the electrode. Thus, the lid 21 seals the crystal resonator and the frequency is adjusted by using the laser beam from the outside via the transparent glass lid 21. Consequently, the yield of a final product is drastically improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a crystal resonator package product and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG. 6 and FIG.
No. 87. FIG. 6 shows an example of a conventional crystal resonator package product. In FIG. 6, 1 is a metal stem and 3 is a metal cap (lid). In this conventional example, a quartz oscillator is sealed in a cylindrical metal cap 3.

FIG. 7 shows another example of a conventional crystal resonator package product. In FIG. 7, 11 is a small hole, 12 is a metal lid, 13 is a cylindrical glass pipe, 14 is a low melting point glass (adhesive), and 15 is a cap (lid) made of the metal lid 12 and the glass pipe 13. ), 16 is a cylindrical metal stem, 18 is a quartz oscillator, and 19 is a trimming electrode. The steps for manufacturing the crystal resonator pipe product of FIG. 7 are as follows. First, the glass pipe 13 of the cylindrical cap 15 is joined to a cylindrical metal stem 16 to which a quartz oscillator piece is attached in a vacuum, and the joined portion is bonded with a low-melting glass 14 to form a quartz oscillator. 18 are formed. At this time, the gas generated from the low melting point glass 14 is
Once inside, the metal lid 1 of the cap 15
All are discharged to the outside from the small holes provided in the second hole. Thereafter, high-purity solder (not shown) is melted to close the hole portion 11 and the crystal resonator piece is completely sealed. And
A laser beam is radiated from the outside through a glass pipe 13 to form a trimming electrode 1 formed on the quartz resonator blank.
By cutting 9, the frequency is finely adjusted (laser trimming).

[0004]

In the prior art shown in FIG. 6, since the cylindrical metal cap 3 is used to seal the quartz-crystal vibrating piece, the quartz-crystal vibrating piece is sealed after the sealing. It is impossible at all to adjust the frequency from outside.
Therefore, even if it is necessary to adjust the frequency of the crystal resonator piece after sealing due to heat at the time of sealing the metal cap 3 or the like, external adjustment cannot be performed. There is a problem that the yield of the product is deteriorated due to the processing.

In the other conventional example described with reference to FIG. 7, since the cap 15 is formed in a cylindrical shape composed of a cylindrical glass pipe 13 and a metal lid 12, it cannot be placed horizontally. However, since it has a cylindrical shape, even if it is used upright, it is elongated in the longitudinal direction and has poor stability. In the example shown in FIG. 7, the entire package cannot be reduced in thickness because the height is large. (In view of the current demand for flattening and thinning of portable products, the total thickness of crystal resonator package products is 1.0 mm or less is required).

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and it has been made possible to make a crystal resonator package product thinner and capable of being placed horizontally, and to seal the crystal resonator. It is an object of the present invention to provide a crystal resonator package product capable of performing frequency adjustment after stopping and improving the yield of a final product, and a method of manufacturing the same.

[0007]

A crystal resonator package product according to the present invention for solving the above problems has a crystal resonator sandwiched between electrodes and a concave portion for mounting the crystal resonator. A substantially flat base substrate;
A transparent glass flat lid joined to the base substrate to seal the quartz oscillator.

In the method for manufacturing a crystal resonator package product according to the present invention, the step of mounting the crystal resonator sandwiched between the electrodes in a recess formed in a substantially flat base substrate, and sealing the crystal resonator. To stop, a transparent glass flat lid is joined to the base substrate,
Sealing the quartz oscillator, inspecting the frequency of the quartz oscillator, and irradiating a laser beam from the outside of the transparent lid to partially cut the electrode, thereby obtaining the quartz oscillator. Adjusting the frequency of the child.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 FIG. FIGS. 1A and 1B are views showing a lid used in the first embodiment of the present invention, wherein FIG. 1A is a plan view thereof, and FIG. 1B is a sectional side view taken along line AA ′. In FIG. 1, 21 is a flat lid made of transparent glass, and 22 is a seal glass printed on the outer periphery of the lid 21.

FIGS. 2A and 2B are views showing the overall configuration of the first embodiment of the present invention, wherein FIG. 2A is a plan view thereof, and FIG. 2B is a sectional view taken along the line BB 'of FIG. In FIG. 2, 23 is a ceramic (alumina) base substrate, 23a is a concave portion formed in the center of the upper surface of the base substrate 23, a concave portion for mounting a quartz oscillator, and 24 is inside the concave portion 23a. This is the electrode pad formed on the substrate.

Next, the manufacturing process of the first embodiment will be described with reference to FIG. First, the crystal unit sandwiched between the electrodes is bonded into the recess 23a of the base substrate 23 (step 31). Then, the quartz glass is sealed between the lid 21 and the base substrate 23 by joining the seal glass 22 to the upper surface of the outer peripheral portion of the base substrate 23 (step 32). Thereafter, the frequency of the crystal unit is inspected (step 33). If the frequency of the crystal unit needs to be adjusted, the electrode is cut by irradiating a laser beam from outside the lid made of a transparent glass to cut the electrode. The frequency is adjusted (step 34).

As described above, according to the first embodiment, after the quartz resonator is sealed by the lid 21, the frequency of the quartz resonator is controlled by a laser beam from outside through the transparent glass lid 21. Since we are making adjustments,
Eventually, the number of defective crystal resonators will be reduced, and the yield of final products will be greatly improved. Further, in the first embodiment, as shown in FIG.
In addition, since the crystal resonator is sealed by the flat lid 21, the overall shape of the crystal resonator package product is flat and thin, and recent horizontal installation is possible, making it flat and thin. It will also be able to respond to the demands of products that have been standardized.

Embodiment 2 FIG. Next, a second embodiment of the present invention will be described with reference to FIGS. FIG. 4 shows the second embodiment.
(A) is a plan view showing a lid used for
(B) is a side view thereof. In the second embodiment, the lid 41 is formed of a flat plate made of transparent glass, but the seal glass is not printed on the outer periphery of the lid 41 (the seal glass is not joined). Different from 1. In the second embodiment, as shown in FIG. 5, after a seal glass 42 is applied to the upper surface of the outer peripheral portion of the base substrate 23, a quartz oscillator is mounted in the concave portion 23a of the ceramic base substrate 23. The base substrate 23 and the lid 41 are formed by the applied seal glass 42.
Are bonded to seal the crystal unit.
Even in the case of the second embodiment, since the structure of the manufactured final product is substantially the same as that of the first embodiment, it is possible to produce substantially the same effect as that of the first embodiment.

[0014]

As described above, in the crystal resonator package product according to the present invention, since the lid is made of transparent glass, after the crystal resonator is sealed, external parts are inserted through the transparent lid. It is possible to adjust the frequency of the crystal oscillator by irradiating the laser beam from the substrate. Therefore, the number of defective crystal oscillators is reduced, and the yield of final products can be greatly improved.

Further, in the present invention, the quartz resonator is sealed by the flat base substrate and the flat lid, so that the whole quartz resonator package product is flat and can be placed horizontally. And it becomes thinner. Therefore, it is possible to provide a crystal resonator package product that can sufficiently respond to recent demands for products that can be placed horizontally and that are flattened and thinned.

In the method of manufacturing a crystal resonator package product according to the present invention, after sealing the crystal resonator, a laser beam is irradiated from the outside via a transparent glass lid, and the frequency of the crystal resonator is reduced. Is adjusted, the number of defective crystal resonators eventually decreases, and the yield of crystal resonator packaged products can be greatly improved.

[Brief description of the drawings]

FIGS. 1A and 1B are views showing a lid and a seal glass used in a first embodiment of the present invention, wherein FIG.
Is a sectional view taken along the line AA ′.

FIG. 2A is a plan view illustrating a crystal resonator package product according to the first embodiment, and FIG. 2B is a cross-sectional view taken along the line BB ′.

FIG. 3 is a flowchart illustrating a manufacturing method according to the first embodiment.

4A and 4B are views showing a lid used in a second embodiment of the present invention, wherein FIG. 4A is a plan view and FIG. 4B is a side view.

FIG. 5 is a central sectional view showing a crystal resonator package product according to the second embodiment.

FIG. 6 is a diagram showing an example of a conventional crystal resonator package product.

FIG. 7 is a diagram showing another example of a conventional crystal resonator package product.

[Explanation of symbols]

 21, 41 lid 22, 42 seal glass 23 base substrate 23a recess 24 electrode pad

Claims (2)

[Claims] 1. A substantially flat base substrate formed with a quartz oscillator sandwiched between electrodes, a concave portion for mounting the quartz oscillator, and the base for sealing the quartz oscillator. A crystal resonator package product comprising: a transparent glass plate-shaped lid bonded to a substrate. 2. A method for manufacturing a crystal resonator package product, comprising: mounting a crystal resonator sandwiched between electrodes in a recess formed in a substantially flat base substrate; and sealing the crystal resonator. Bonding a transparent glass flat lid to the base substrate, inspecting the frequency after sealing the quartz oscillator, and performing a laser from outside the transparent lid. Adjusting the frequency of the crystal resonator by irradiating light to partially cut the electrode, thereby manufacturing a crystal resonator package product.