JPH11145575A - Mounting structure for component of electronic apparatus and electrical apparatus to substrate - Google Patents

Mounting structure for component of electronic apparatus and electrical apparatus to substrate

Info

Publication number
JPH11145575A
JPH11145575A JP30676197A JP30676197A JPH11145575A JP H11145575 A JPH11145575 A JP H11145575A JP 30676197 A JP30676197 A JP 30676197A JP 30676197 A JP30676197 A JP 30676197A JP H11145575 A JPH11145575 A JP H11145575A
Authority
JP
Japan
Prior art keywords
substrate
component
lead terminal
parts
electronic apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP30676197A
Other languages
Japanese (ja)
Inventor
Keiki Urusu
敬喜 瓜巣
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Funai Electric Co Ltd
Original Assignee
Funai Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Funai Electric Co Ltd filed Critical Funai Electric Co Ltd
Priority to JP30676197A priority Critical patent/JPH11145575A/en
Publication of JPH11145575A publication Critical patent/JPH11145575A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
    • H05K3/308Adaptations of leads

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a mounting structure for a component of an electronic apparatus and an electrical apparatus to a substrate, wherein with few number of part items and simple structure, the components of the electronic apparatus and electrical apparatus are installed upright on a substrate, while contact to an adjoining part or readjustment after installment is reduced. SOLUTION: Appropriate lower parts of lead terminal parts 2 and 3 of a part 1 of an electronic apparatus and electrical apparatus are wound into flat spiral shape, lower parts of the lead terminal parts 2 and 3 are inserted in fitting holes 5 and 6 of a substrate 4, and wound parts 7 and 8 are engaged with edge part upper surfaces 9 of the fitting holes 5 and 6, so that the part 1 fits upright on the substrate 4.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【発明の属する技術分野】本発明は、電子機器、電気機
器の部品のリード端子部を基板に設けられた取付孔に挿
入して取り付けるようにした電子機器、電気機器の部品
の基板への取付構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device and a component of an electric device which are inserted into a mounting hole provided on a substrate and mounted on the substrate. Regarding the structure.

【従来の技術】従来の電子機器、電気機器の部品の基板
への取付構造として、例えば、実公昭63−42737
号に記載されたアンテナ保持構造がある。このアンテナ
保持構造は、図3、図4に示すように、アンテナ14の
基端部側にラセン部14a及び係合曲部14bを設け、
このラセン部14aは印刷配線基板11に突出させたピ
ン13に被嵌し、係合曲部14bはピン13から所定距
離を配して穿設させた印刷配線基板11の係合孔12b
に係合して、印刷配線基板11にアンテナ14を保持す
るようにしている。
2. Description of the Related Art As a conventional structure for mounting components of electronic equipment and electric equipment to a substrate, for example, Japanese Utility Model Publication No. 63-42737.
There is an antenna holding structure described in the issue. In this antenna holding structure, as shown in FIGS. 3 and 4, a spiral portion 14a and an engagement curved portion 14b are provided on the base end side of the antenna 14,
The spiral portion 14a is fitted on a pin 13 protruding from the printed wiring board 11, and the engaging curved portion 14b is formed with an engaging hole 12b formed on the printed wiring board 11 at a predetermined distance from the pin 13.
And the antenna 14 is held on the printed wiring board 11.

【発明が解決しようとする課題】ところが、上記従来の
アンテナ保持構造においては、ピン13等を必要とする
ために部品点数が多く、且つピン13等を必要とすると
ともにアンテナ14の基端部側にラセン部14a及び係
合曲部14bを設けなくてはならないために構造が複雑
であるという問題があった。本発明は、上記従来の問題
を解消し、部品点数が少なくて構造が簡単でありなが
ら、電子機器、電気機器の部品を真っ直ぐの状態で基板
に立設でき、隣接する部品への接触や取付けした後の手
直し作業を軽減できる電子機器、電気機器の部品の基板
への取付構造を提供することを目的としている。
However, in the above-described conventional antenna holding structure, the number of parts is large because the pins 13 and the like are required, and the pins 13 and the like are required. In this case, there is a problem that the structure is complicated because the spiral portion 14a and the engaging curved portion 14b must be provided. The present invention solves the above-mentioned conventional problems, and enables electronic equipment and electric equipment parts to be erected on a substrate in a straight state while having a small number of parts and a simple structure, and to contact or mount adjacent parts. It is an object of the present invention to provide an electronic device and a structure for attaching components of an electric device to a substrate, which can reduce the rework after the above operation.

【課題を解決するための手段】上記目的を達成するため
に、請求項1に記載の発明は、電子機器、電気機器の部
品のリード端子部を基板に設けられた取付孔に挿入して
取り付けるようにした取付構造において、前記部品のリ
ード端子部の下部適宜箇所を平坦な渦巻状に巻設し、リ
ード端子部の下部を前記基板の取付孔に挿入し、前記巻
設部を取付孔の縁部上面に係止して前記部品を前記基板
に立設して取り付けるようにした。
In order to achieve the above object, according to the first aspect of the present invention, a lead terminal portion of a component of an electronic device or an electric device is inserted into a mounting hole provided on a substrate and mounted. In the mounting structure as described above, an appropriate portion below the lead terminal portion of the component is wound in a flat spiral shape, the lower portion of the lead terminal portion is inserted into the mounting hole of the substrate, and the winding portion is formed in the mounting hole. The component is fixed to the upper surface of the edge portion, and the component is erected on the substrate and attached.

【発明の実施の形態】以下、本発明の実施の形態につい
て、図を参照しつつ説明する。図1は本発明の実施の形
態の電子機器、電気機器の部品の基板への取付構造にお
ける部品を基板に取り付ける直前の状態を示す概略斜視
図、図2は取付け完了時の状態を示す正面縦断面図であ
る。本実施形態の電子機器、電気機器の部品の基板への
取付構造は、図1に示すように、コンデンサー等の電子
機器、電気機器の部品1の両側から下向きに延設された
リード端子部2、3の下部適宜箇所を平坦な渦巻状に巻
設している。そして、図2に示すように、この部品1の
リード端子部2、3の下端部を、基板4に形成された取
付孔5、6に挿入し、リード端子部2、3の巻設部7、
8を取付孔5、6の縁部上面9に係止して、部品1を基
板4に立設して取り付けるようにしている。尚、部品1
のリード端子部2、3の下端部は、基板4の裏面側で半
田付けHで固定すればよい。この部品1は、図2に示す
ように、そのリード端子部2、3の巻設部7、8が基板
4の縁部上面9に、平坦な状態で係止され、且つ巻設部
の弾性によって、基板4上に真っ直ぐの状態を常に保持
して立設される。従って、部品1が倒れにくいので、隣
接する部品(図示略)に接触することがなく、取付けし
た後の手直しを軽減できる。更に、他の部品を必要とし
ないので、部品点数が少なくて構造が簡単である。ま
た、平坦な渦巻状の巻設部7、8を部品1のリード端子
部2、3における所定の高さ位置に設けることによっ
て、基板4の上面からの部品1の高さを所定の高さ位置
に位置決めできる。尚、上記実施形態では、電子機器、
電気機器の部品1としてコンデンサについて説明した
が、部品1としてはこれに限らず、リード端子部2、3
を有する他の部品にも適用できるものである。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view showing a state immediately before components are mounted on a substrate in a structure for mounting components of an electronic device and an electric device on a substrate according to an embodiment of the present invention, and FIG. FIG. As shown in FIG. 1, the mounting structure of the components of the electronic device and the electric device to the substrate according to the present embodiment includes a lead terminal portion 2 extending downward from both sides of the component 1 of the electronic device and the electric device such as a capacitor. The lower part of 3 is wound in a flat spiral shape. Then, as shown in FIG. 2, the lower ends of the lead terminal portions 2 and 3 of the component 1 are inserted into mounting holes 5 and 6 formed in the substrate 4, and the winding portions 7 of the lead terminal portions 2 and 3 are inserted. ,
The component 8 is engaged with the upper surface 9 of the edge of the mounting holes 5 and 6 so that the component 1 is mounted on the substrate 4 in an upright position. In addition, part 1
The lower ends of the lead terminal portions 2 and 3 may be fixed by soldering H on the back surface side of the substrate 4. As shown in FIG. 2, this component 1 has the winding portions 7 and 8 of the lead terminal portions 2 and 3 fixed to the upper surface 9 of the edge of the substrate 4 in a flat state, and the elasticity of the winding portion. As a result, a straight state is always maintained on the substrate 4 to be set up. Therefore, since the component 1 is hard to fall down, it does not come into contact with an adjacent component (not shown), and rework after mounting can be reduced. Further, since no other parts are required, the number of parts is small and the structure is simple. Further, by providing the flat spiral winding portions 7 and 8 at predetermined height positions in the lead terminal portions 2 and 3 of the component 1, the height of the component 1 from the upper surface of the substrate 4 is set to a predetermined height. Can be positioned in position. In the above embodiment, the electronic device,
Although the capacitor has been described as the component 1 of the electric device, the component 1 is not limited to this, and the lead terminals 2, 3
It can also be applied to other parts having

【発明の効果】以上説明したように、請求項1に記載の
発明によれば、他の部品を必要としないので、部品点数
を少なくでき、且つ部品のリード端子部の下部適宜箇所
を平坦な渦巻状に巻設するだけでよいので、構造が簡単
である。更に、平坦な渦巻状の巻設部を基板上面に係止
することによって、電子機器、電気機器の部品を真っ直
ぐの状態で基板に立設でき、隣接する部品への接触や取
付けした後の手直し作業を軽減できる。また、平坦な渦
巻状の巻設部を部品のリード端子部における所定の高さ
位置に設けることによって、巻設部を基板の上面に係止
した状態で基板の上面からの部品の高さを所定の高さ位
置に位置決めできる。
As described above, according to the first aspect of the present invention, since no other parts are required, the number of parts can be reduced, and an appropriate portion below the lead terminal portion of the part is flattened. The structure is simple because it only needs to be wound spirally. Furthermore, by locking the flat spiral wound portion on the upper surface of the board, the components of the electronic device and the electric device can be erected on the board in a straight state, and contact with adjacent components or rework after mounting. Work can be reduced. Also, by providing a flat spiral wound portion at a predetermined height position in the lead terminal portion of the component, the height of the component from the upper surface of the board can be reduced in a state where the wound portion is locked on the upper surface of the board. It can be positioned at a predetermined height position.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の実施の形態の電子機器、電気機器の部
品の基板への取付構造における部品を基板に取り付ける
直前の状態を示す概略斜視図である。
FIG. 1 is a schematic perspective view showing a state immediately before components are mounted on a substrate in a structure for mounting components of an electronic device and an electric device on a substrate according to an embodiment of the present invention.

【図2】電子機器、電気機器の部品を基板に立設して取
り付けた状態を示す縦断面図である。
FIG. 2 is a vertical cross-sectional view showing a state in which components of an electronic device and an electric device are mounted upright on a substrate.

【図3】従来のアンテナ保持構造の斜視図である。FIG. 3 is a perspective view of a conventional antenna holding structure.

【図4】従来のアンテナ保持構造の縦断面図である。FIG. 4 is a longitudinal sectional view of a conventional antenna holding structure.

【符号の説明】[Explanation of symbols]

1 電子機器、電気機器の部品 2、3 リード端子部 4 基板 5、6 取付孔 7、8 巻設部 9 縁部上面 DESCRIPTION OF SYMBOLS 1 Electronic device, parts of an electric device 2, 3 Lead terminal part 4 Substrate 5, 6 Mounting hole 7, 8 Winding part 9 Edge upper surface

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】電子機器、電気機器の部品のリード端子部
を基板に設けられた取付孔に挿入して取り付けるように
した取付構造において、 前記部品のリード端子部の下部適宜箇所を平坦な渦巻状
に巻設し、リード端子部の下部を前記基板の取付孔に挿
入し、前記巻設部を取付孔の縁部上面に係止して前記部
品を前記基板に立設して取り付けるようにしたことを特
徴とする電子機器、電気機器の部品の基板への取付構
造。
1. A mounting structure in which a lead terminal portion of a component of an electronic device or an electric device is inserted into a mounting hole provided in a substrate and mounted, wherein a suitable portion under the lead terminal portion of the component is flatly swirled. So that the lower part of the lead terminal portion is inserted into the mounting hole of the substrate, the winding portion is locked on the upper surface of the edge of the mounting hole, and the component is mounted upright on the substrate. A structure for attaching components of an electronic device and an electric device to a substrate.
JP30676197A 1997-11-10 1997-11-10 Mounting structure for component of electronic apparatus and electrical apparatus to substrate Pending JPH11145575A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP30676197A JPH11145575A (en) 1997-11-10 1997-11-10 Mounting structure for component of electronic apparatus and electrical apparatus to substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30676197A JPH11145575A (en) 1997-11-10 1997-11-10 Mounting structure for component of electronic apparatus and electrical apparatus to substrate

Publications (1)

Publication Number Publication Date
JPH11145575A true JPH11145575A (en) 1999-05-28

Family

ID=17960982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP30676197A Pending JPH11145575A (en) 1997-11-10 1997-11-10 Mounting structure for component of electronic apparatus and electrical apparatus to substrate

Country Status (1)

Country Link
JP (1) JPH11145575A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004068921A3 (en) * 2003-01-27 2005-02-10 Bosch Gmbh Robert Electronic component

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004068921A3 (en) * 2003-01-27 2005-02-10 Bosch Gmbh Robert Electronic component

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