JPH11126866A - Semiconductor device with part-mounting pad - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the fixing effect of an external part by having the mounting area of a required printed wiring board reduced. SOLUTION: This semiconductor device comprises a plurality of pads 4a, 4b, 9a and 9b provided out the upper surface of a package 1 mounting a bare chip 2, leads 3 for connecting the bare chip 2 with the pads 4a, 4b, leads 5 for connecting the output pins 6a, 6b of the package 1 with the pads 4a, 4b, a lead 8 for connecting the bare chip 2 with the pad 9a, and a lead 11 for connecting the pad 9b with an output pin 12 of the package 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device with a component mounting pad, and more particularly to a semiconductor device with a component mounting pad that can use the upper surface of a package for external components.

[0002]

2. Description of the Related Art A conventional semiconductor device with a component mounting pad will be described in detail with reference to the drawings.

FIG. 2 is a top view showing an example of the prior art. In the semiconductor device shown in FIG. 2, a bare chip 2 is mounted at the center of a package 101, and leads 6a, 6b, 12
Etc. A capacitor 7 for noise suppression (hereinafter referred to as a bypass capacitor) and a damping resistor 13 for waveform shaping are provided on a printed wiring board outside the package 101 by a pad 10.
2a, 102b and 103a are provided and mounted there.

[0004]

In the above-mentioned conventional semiconductor device, since external parts are attached to the outside of the integrated circuit device, the mounting area of the printed wiring board becomes large, and the distance between the bare chip and the external parts becomes long. Therefore, there is a disadvantage that the intended mounting effect of the external component is reduced.

[0005]

According to a first aspect of the present invention, a semiconductor device with a component mounting pad includes a plurality of pads for mounting external components on an upper surface of the semiconductor device.

According to a second aspect of the present invention, there is provided a semiconductor device with a component mounting pad, comprising a plurality of pads provided on an upper surface of a package on which a bare chip is mounted, leads for connecting the bare chip and the pad, output pins and the pad of the package. And a lead to be connected.

[0007]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a top view showing an embodiment of the present invention. The semiconductor device with a component mounting pad shown in FIG. 1 has a plurality of pads 4a, 4b, 9a, 9b provided on the upper surface of a package 1 on which a bare chip 2 is mounted, and leads for connecting the bare chip 2 and the pads 4a, 4b. 3, a lead 5 connecting the output pins 6a, 6b of the package 1 to the pads 4a, 4b, a lead 8 connecting the bare chip 2 and the pad 9a, and connecting the pad 9b to the output pin 12 of the package 1. It is configured to include the lead 11.

A pass capacitor 7 is mounted on the pads 4a and 4b, and a damping resistor 13 is mounted on the pads 9a and 9b.

[0010]

According to the semiconductor device with the component mounting pad of the present invention, since the component mounting pad is provided on the upper part of the package of the integrated circuit device, it is not necessary to dispose the component mounting pad on the printed wiring board side. In addition, the size of the printed wiring board can be reduced, and the external component can be arranged close to the bare chip, so that the effect expected for the mounted component can be increased.

[Brief description of the drawings]

FIG. 1 is a top view showing an embodiment of the present invention.

FIG. 2 is a top view showing an example of the related art.

[Explanation of symbols]

 Reference Signs List 1 package 2 bare chip 3 lead 4a pad 4b pad 5 lead 6a output pin 6b output pin 7 pass capacitor 8 lead 9a pad 9b pad 11 lead 12 output pin 13 damping resistor 101 package 102a pad 102b pad 103a pad 103b pad

Claims (2)

[Claims] 1. A semiconductor device with a component mounting pad, comprising a plurality of pads for mounting external components on an upper surface of the semiconductor device. 2. A semiconductor device comprising: a plurality of pads provided on an upper surface of a package on which a bare chip is mounted; leads for connecting the bare chips to the pads; and leads for connecting output pins of the package to the pads. Semiconductor device with component mounting pad.