JPH11125656A - Inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To automate the work of installation and taking out of inspecting objects, by making an inspecting object container open state by the rotation of a pushing member when a movable member is it the state close to the main part, and making the inspecting object push to the conductive sheet member. SOLUTION: When a movable member 24 is at an open position close to a positioning/guide support member 22 and a socket body 10, a semiconductor element 6 of the inspecting object is positioned and mounted in the opened part of the positioning/guide support member 22. At this moment, each electrode of the semiconductor element 6 is made to touch a corresponding conduction part of a conductive sheet member 14. Then, the movable member 24 is elevated to the testing elevation. At this moment, the touching part 16c of each pushing member 16 is rotated by the energized force of a coil spring 18 and pushes the semiconductor element 6 toward the conductive sheet member 14. Each nail part 34 becomes in a coupling state to corresponding upper nail part 30 and inspection is conducted. A tested semiconductor element 6 is taken out of the space surrounded by the opening 24h and a guide parts 28A and 28B by the carriage arm and a next new semiconductor element 6 to be tested is installed in the same manner.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an inspection apparatus used for a non-destructive test of an electronic circuit on an object having an electronic circuit therein.

[0002]

2. Description of the Related Art Various tests are performed on a semiconductor integrated circuit mounted on an electronic device or the like before mounting to remove potential defects. The test is performed nondestructively by applying voltage stress, operating at a high temperature, and storing at a high temperature corresponding to a thermal and mechanical environment test. Among the various tests, a burn-in test is performed as an operation test for a certain period of time under a high temperature condition that is effective for removing an initial operation defective integrated circuit.

[0003] An inspection apparatus used for this burn-in test is, for example, a printer which is provided on a frame, has a predetermined test voltage, and has an input / output section for sending out an abnormality detection signal indicating a short circuit or the like from an inspection object. A socket body having a housing portion for housing a semiconductor element which is arranged at a predetermined position on a wiring board and on which a semiconductor integrated circuit as an object to be inspected is formed, and which is in contact with an upper surface of the semiconductor element and which has a predetermined pressure; A cover member that has an abutting portion for pressing the element and covers an upper portion of the socket body; and a hook member that engages with both the cover member and the socket body to fix the cover member to the socket body. ing.

[0004] One end of the cover member is rotatably supported by a support shaft provided at one edge of the socket body and is connected to the socket body.

[0005] Terminals extending in four directions from each side of the semiconductor element mounted in the accommodating portion of the socket body correspond to respective connection terminals of the printed wiring board by positioning the outer shell of the semiconductor element. Touched.
Further, a portion of each connection terminal that contacts the semiconductor element is formed, for example, in an arc shape and has elasticity. Each connection terminal is connected to an input / output unit via a printed wiring network. As a result, the terminals of the semiconductor element and the respective connection terminals of the printed wiring board are brought into conduction with a predetermined urging force being applied to each terminal of the semiconductor element.

In such a configuration, when the cover member is open with respect to the socket body, the semiconductor element is mounted in the housing portion of the socket body, and thereafter the cover member is closed and the hook member is closed. When the terminals of the semiconductor element and the connection terminals of the printed wiring board are brought into conduction by being engaged, a predetermined test voltage is supplied to the input / output unit of the printed wiring board, for example, a burn-in test is performed. Become.

[0007]

In a production line equipped with the above-described inspection apparatus, a semiconductor element as an object to be inspected is mounted in a housing, and a series of steps from the end of the test to the removal of the semiconductor element are performed. Automatic and efficient work is required as the number of inspection objects increases.

However, the work of mounting the object to be inspected into the housing of the socket body or the operation of removing the object to be inspected from the housing of the socket main body is not performed by the above-described apparatus. Since opening and closing operations and hook member attachment / detachment are involved, automation is not easy.

In view of the above problems, the present invention is an inspection apparatus used for a non-destructive test of an electronic circuit in an object having an electronic circuit therein. An object of the present invention is to provide an inspection apparatus capable of easily automating a series of operations from mounting an inspection object to removing an inspected inspection object.

[0010]

In order to achieve the above object, an inspection apparatus according to the present invention provides an inspection apparatus which is electrically connected to an electrode of an inspection object having an electronic circuit via a conductive sheet member. A main unit having an input / output unit for supplying an inspection signal to the inspection object arranged in the object housing unit and transmitting an output signal from the inspection object; an inspection object housing unit of the main body unit and the outside. A movable member having an opening for communicating with the main body and being disposed so as to be close to or separated from the main body; A plurality of pressing members that selectively press against the main body, and when the movable member is brought into the proximity state with respect to the main body, the pressing member is rotated in one direction in accordance with the movement of the movable member to be inspected. The object storage section is opened and the movable member is A pressing control mechanism configured to rotate the pressing member in the other direction when the separated state is set, so as to press the test object arranged in the test object storage portion against the conductive sheet member. Be composed.

The pressing control mechanism includes a pressing member having one end contacting the movable member and the other end selectively contacting the conductive sheet member, and a supporting member rotatably supporting the pressing member. And urging means for urging the pressing member to rotate in another direction.

Further, the movable member may be arranged such that a peripheral portion of the opening is movably supported by a guide portion provided around the object-to-be-inspected accommodation portion of the main body portion and is arranged so as to be close to or separated from the main body portion. Good.

[0013]

FIG. 2 schematically shows an entire configuration of an example of an inspection apparatus according to the present invention.

In FIG. 2, a printed wiring board 2 having an input / output section 2A for supplying a predetermined test voltage and transmitting an abnormality detection signal indicating a short circuit or the like from each test object, respectively, and a printed wiring board 2 A plurality of, for example, a total of 40 semiconductor devices as inspection objects, each of which is arranged in a predetermined position on the upper and lower sides, for example, a total of 40 semiconductor devices as inspection objects; I have.

As shown in FIG. 1, the object-to-be-inspected accommodating member 4 has an input / output terminal portion 12P disposed at a predetermined position on the printed wiring board 2 and connected to each terminal portion of the printed wiring board 2. A conductive sheet member 14 for selectively conducting between an input / output terminal portion 12P provided on the substrate portion 12 of the socket body portion 10 and each electrode of the semiconductor element 6 described below; The semiconductor device 6 is placed on the upper surface of the sheet member 14, and the respective electrodes of the semiconductor element 6 are aligned with the terminals of the conductive sheet member 14 to accommodate the semiconductor element 6 and a movable member 24 described later.
A positioning / guide support member 22 for slidably guiding the
A movable member 24 movably arranged above and below the positioning / guide support member 22 for selectively rotating a pressing member 16 to be described later;
And a pressing member 16 for pressing each of the electrodes against the terminal portion of the conductive sheet member 14 as main elements.

The semiconductor element 6 as an object to be inspected is, for example, a surface-mounted bare chip. A plurality of bump-shaped electrodes to be connected to the conductive portions of the conductive sheet member 14 are formed over the entire surface of the substantially square semiconductor element 6 facing the conductive sheet member 14 described below.

The socket body 10 is made of a heat-resistant plastic material, for example, polyphenylene sulfide (P).
PS). In the socket body 10, for example, the upper end of the input / output terminal section 12P made of brass, beryllium copper, or gold is, as shown in FIG. 1 and FIG. It reaches the substrate section 12 provided within 10 g. The input / output terminal portion 12P is provided with, for example, 300 connection pins so as to surround the entire periphery of the substrate portion 12 with a predetermined width. Its input / output terminal 12P
Are provided vertically and horizontally at predetermined intervals. In the input / output terminal portion 12P, connection pins in a predetermined area are used for input signals, and connection pins in other areas are used for output signals. Each connection pin of the input / output terminal portion 12P is electrically connected to the terminal group 12SP through a conductor (not shown). The terminal group 12SP is provided in a substantially central part of the substrate part 12 corresponding to a position where the semiconductor element 6 and each conductive part 14C of the conductive sheet member 14 are arranged.

As a result, the signal from the input / output terminal section 12P is supplied to the conductive section 14C of the conductive sheet member 14 through the terminal group 12SP, and the signal from the conductive section 14C of the conductive sheet member 14 is transmitted to the terminal group 12SP. Is transmitted to the input / output terminal unit 12P through the interface.

In the substrate portion 12, through holes 10a are provided at four positions so as to surround the terminal group 12SP. In the through hole 10a, a conductive portion 14C of the conductive sheet member 14 and a positioning / guide support member 2 described later are provided.
A positioning pin 26 for positioning the second substrate portion 12 with respect to the terminal group 12SP is press-fitted.

As shown in FIGS. 1 and 5, positioning / guide support members 22 are provided on opposite sides of the outer shell of the socket body 10 surrounding the board section 12, respectively.
The to-be-engaged portion 10e to be engaged with the claw portion 32 is formed at two locations along the side thereof at a predetermined interval. Also,
A groove 10d is provided between the engaged portions 10e.

As shown in FIG. 5, a conductive portion which is selectively pressed into a conductive state by being pressed with a predetermined pressure is provided at a substantially central portion of the conductive sheet member 14 made of a resin material in a thin plate shape. 14C is an electrode of the semiconductor element 6, and
It is formed corresponding to the terminal group 12SP of the substrate unit 12. Further, positioning pins 26 are provided around the conductive portion 14C.
Are provided at positions corresponding to the positioning pins 26. Thus, the conductive sheet member 1
4 is regulated by the positioning pins 26, so that the conductive portion 14C of the conductive sheet member 14 is properly positioned with respect to the terminal group 12SP of the substrate portion 12.

The conductive portion 14C of the conductive sheet member 14 is
It is made and formed of a composite conductive material, for example, one composed of silicone rubber and metal particles. As the composite conductive material, an anisotropic conductive rubber is used. Anisotropic conductive rubber is
It is a material that has conductivity in the thickness direction and does not have conductivity in the direction along the plane. In addition, anisotropic conductive rubber has
There are a dispersion type in which the conductive portions are dispersed in rubber having an insulating property, and an uneven distribution type in which a plurality of conductive portions are partially distributed, and any type may be used.

Since the conductive portion 14C is made of such anisotropic conductive rubber, each electrode of the semiconductor element 6 and the terminal portion 1 are formed.
Since the 2SP and the 2SP are connected by surface contact, contact failure is avoided, and damage to the terminal section 12SP due to contact with the electrode of the semiconductor element 6 is avoided.

Although one conductive sheet member 14 is provided for each socket body 10 in the above-described example, the present invention is not limited to this example. Thus, one socket may be provided across a plurality of socket bodies 10.

As shown in FIGS. 1 and 3, the substantially square movable member 24 has an upper surface and a lower surface parallel to each other, and is made of, for example, a heat-resistant plastic material such as polyphenylene sulfide (PPS). It is molded with. At a substantially central portion of the movable member 24, a relatively large opening 22h is provided so as to face a housing portion 22s of the positioning / guide support member 22 described later. A recess 24ha is provided in each of the opposing portions of the peripheral edge forming the opening 24h. Around the opening 24h in the upper surface, circular concave portions 24g with which the respective ends of the arms 40 described later are engaged are provided at four corners.

Also, rectangular through holes 24a are provided at two locations at a predetermined interval between the two concave portions 24g on each side of the movable member 24. Further, a claw portion 34 protruding toward the positioning / guide support member 22 is provided at a central portion between the two through holes 24 a on each side of the movable member 24.

The four pawls 34 are respectively engaged with the corresponding upper pawls 30 on the positioning / guide support member 22. Base end portion 24 of each claw portion 34 in movable member 24
Through holes 24b are formed in portions where N is connected. The opening 24h of the movable member 24 is fitted to the guide portions 28A and 28B of the positioning / guide support member 22 so as to be able to move up and down.

A portion of the lower surface of the movable member 24 facing each recess 24g and the positioning / guide support member 22
As shown in FIG. 6, return springs 36 for urging the movable member 24 in a direction away from the flat surface of the positioning / guide support member 22,
Are provided at four locations.

The positioning / guide support member 22 mounted on the upper surface of the conductive sheet member 14 is formed of, for example, a heat-resistant plastic material, for example, polyphenylene sulfide (PPS) into a substantially square flat plate. I have.

The positioning / guide support member 22 and the movable member 24 described above are utilized by using the conductive sheet member 14 as described above.
And the main component is formed of a molding material having a relatively low volume resistivity, that is, a material having excellent electrical conductivity, such that the socket body 10 is molded of polyphenylene sulfide (PPS). Therefore, the influence of electrical noise in the inspection apparatus can be significantly reduced.

As shown in FIG.
As shown in FIGS. 4 and 6, a substantially square opening 22 s is provided in a central portion of the conductive sheet member 14 as a housing portion for housing the semiconductor element 6 corresponding to the conductive portion 14 </ b> C. ing.

The opening 22s is formed such that the outer peripheral portion of the semiconductor element 6 is fitted with a predetermined gap between the peripheral edge and the outer peripheral surface of the semiconductor element 6. An arc portion 22c is provided at each corner of the opening 22s.

At four corners around the opening 22s, there are provided through holes 22 into which positioning pins 26 are fitted.
d is provided corresponding to the through hole 14 a of the conductive sheet member 14.

Thus, the positioning / guide supporting member 22
Is positioned with respect to the conductive sheet member 14, and the positioning of the electrodes of the semiconductor element 6 mounted on the opening 22s with respect to the conductive portion 14C of the conductive sheet member 14 is appropriately performed.

Further, a pair of guide portions 28 opposing each other across the opening 22s are formed on the flat surface around the opening 22s.
A and 28B are provided at four locations so as to protrude toward the movable member 24.

Each of the guides 28A and 28B is formed integrally with a flat surface on the periphery of the opening 22s. As shown in FIG. 1 and FIG.
One outer surface GS at A and 28B respectively
The movable member 24 is slidably engaged with the periphery of the opening 24h.

Accordingly, the movable member 24 is guided by the guide portions 28A and 28B so as to be able to move up and down.
Also, the size of the opening 24h of the movable member 24 is
Since the size is larger than the size of the opening 22s formed inside 8A and 28B, the degree of freedom in setting the size of the opening 22s is increased.

Bearing holes 28a and 28 into which both ends of the support shaft 20 are press-fitted are respectively inserted into the guide portions 28A and 28B.
8b are provided along opposing sides of the positioning / guide support member 22, respectively. Bearing hole 28a
And the position of 28b are, for example, the pressing members 16 described later.
Are set in accordance with the turning radius of the opening and the relative position of the opening 22s to the pressing member 16.

Between the guides 28A and 28B,
A pressing member 16 rotatably supported by the support shaft 20 is provided. As shown in FIGS. 1 and 4, the pressing member 16 has an opening 22 s of the positioning / guide support member 22.
A contact portion 16C having one end portion selectively engaging with a peripheral edge of the semiconductor device 6 and contacting the surface of the semiconductor element 6 mounted thereon;
One end of the contact portion 16C, an arm portion 16A provided parallel to the center axis of the support shaft 20 and having one end contacting the lower surface of the movable member 24, the other end of the contact portion 16C and the arm portion 1
And a connecting portion 16B for connecting the other end of 6A.

The arm portion 16A has two engaging pieces which are arranged to face each other along the center axis of the support shaft 20.

The connecting portion 16B has a through hole 16b into which the support shaft 20 is fitted, and is formed in a U-shape. Connecting part 16
B has a contact portion 16C via a collar member CO.
A coil spring 18 for urging the semiconductor device 6 in the direction in which it contacts the surface of the semiconductor element 6 mounted in the opening 22s is provided.

An elongated hole 22n is provided at a position below the arm 16A on the flat surface of the positioning / guide support member 22 to avoid interference with the arm 16A when the pressing member 16 is rotated. Have been.

An upper claw portion 30 protrudes toward the movable member 24 on each side of the positioning / guide support member 22 outside the guide portions 28A and 28B corresponding to the claw portion 34 of the movable member 24. Is provided. Also,
As shown in FIG. 4, each side has a lower projection projecting toward the vicinity of the outer peripheral portion of the socket main body 10 corresponding to the engaged portion 10 e of the socket main body 10 with the upper claw 30 interposed therebetween. Claw portions 32 are provided at two places. Further, openings 22H are formed near the base end of the lower claw 32 connected to the flat surface at positions corresponding to the engaged portions 10e of the socket body 10, respectively.

As a result, the positioning / guide support member 22 positioned with the conductive sheet member 14 placed on the substrate portion 12 of the socket body 10 interposed between the lower claws 32
Is fixed to the socket body 10 by engaging with the engaged portions 10e of the socket body 10.

Further, as shown in FIG.
When the test position 4 is a test position separated from the positioning / guide support member 22, one end of each of the contact portions 16 </ b> C of the four pressing members 16 is connected to each of the semiconductor elements 6 according to the urging force of the coil spring 18. It is in contact with the surface of four sides. Thereby, the conductive part 14C of the pressed conductive sheet member 14 is pressed.
Becomes conductive.

On the other hand, as shown in FIG.
When the position 4 is lowered from the position shown in FIG. 1 to the open position close to the positioning / guide support member 22, one end of the contact portion 16C of the pressing member 16 is
A is rotated by being pressed by the movable member 24 to be separated from the surface of the semiconductor element 6 and mounted to the opening 22s or rotated to a position where it does not interfere with the semiconductor element 6 taken out from the opening 22s. You.

When testing the semiconductor element 6 with this configuration, first, as shown in FIG. 8, the tip of the arm 40 of the working robot (not shown) is inserted into the recess 24 g of the movable member 24. Each claw portion 34 is pressed downwardly against the biasing force of the return spring 36 and
And each upper claw portion 30 is disengaged. In the open position where the movable member 24 is close to the positioning / guide support member 22 and the socket body 10, the semiconductor element 6 as the object to be inspected is suction-held by the transfer arm 42 of the transfer robot (not shown). Movable member 24
Are transported to a position directly above the opening 24h of the positioning / guide support member 22 and the opening 24h.

Next, the semiconductor element 6 sucked and held by the transfer arm 42 is lowered through a space surrounded by the opening 24h of the movable member 24 and the guides 28A and 28B to open the opening of the positioning / guide support member 22. It is positioned and mounted in the part 22s. At this time, each electrode of the semiconductor element 6 is connected to the conductive portion 14C of the conductive sheet member 14.
Are respectively abutted.

Subsequently, as shown in FIG. 1, the movable member 24 is raised from the open position to the test position by the urging force of the return spring 36 while the tip of the arm 40 of the working robot is in contact with the recess 24g. I'm sullen. At that time, the contact portion 16C of each pressing member 16 is rotated at the same timing by the urging force of the coil spring 18 to press the semiconductor element 6 toward the conductive sheet member 14. In addition, each claw portion 34 corresponds to each corresponding upper claw portion 3.
The engagement state is set to 0.

As a result, the position of the movable member 24 is restricted to the predetermined test position, and the semiconductor element 6 is moved to the four pressing members 1.
Each side is reliably pressed by one end of 6, and as a result, the semiconductor element 6 is pressed uniformly to the conductive sheet member 14 with a predetermined pressure. For example, the conductive portion 14C of the conductive sheet member 14 is compressed at a predetermined ratio with respect to the initial thickness to be in a conductive state.
At this time, the required pressing force is distributed to four places, so that the spring constant of one coil spring 18 can be set relatively small.

When a test signal is supplied to the input / output section 2A of the printed wiring board 2 while the movable member 24 is maintained at the test position, the test signal is supplied through the input / output terminal section 12P of the socket body 10. Is supplied to the semiconductor element 6 and the abnormality of the circuit is detected,
The abnormality detection signal from the semiconductor element 6 is supplied to an external failure diagnosis device through the input / output unit 2A.

When the inspection of the semiconductor element 6 is completed, the tip of the arm 40 in the working robot is taken out of the movable member 24 for removing the semiconductor element 6 and mounting a new semiconductor element 6 in the same manner as described above. And the claw portions 34 and the upper claw portions 30 are disengaged by being pressed downward against the urging force of the return spring 36. The tested semiconductor element 6 is taken out by the transfer arm 42 through the space surrounded by the opening 24h and the guides 28A and 28B, and a new semiconductor element 6 to be tested is opened by the opening 24h and the movable member 24. Through the space surrounded by the guides 28A and 28B, the carrier 22 is easily mounted to the opening 22s of the positioning / guide support member 22.

When the conductive sheet member 14 is replaced with a new conductive sheet member 14, the positioning / guide support member 22 is replaced by a two-dot chain line as shown in FIG.
Of each of the engaged portions 10 of the socket body 10
The positioning / guide support member 22 is detached from the socket main body 10 while being disengaged from the socket e.
When the lower claws 32 of the positioning / guide support member 22 are disengaged from the engaged portions 10e of the socket body 10, a jig 38 shown in FIG. 9 is used.

The jig 38 shown in FIG. 9 is made of, for example, a thin steel plate of stainless steel. The jig 38 includes a substantially square flat portion 38B and a plurality of protruding pieces 38A which are connected to each side of the flat portion 38B and are bent so as to be parallel to each other in one direction.
It is comprised including.

A total of eight projecting pieces 3, two on each side
8A are provided corresponding to the through holes 24a of the movable member 24, respectively. The width of the substantially rectangular projecting piece 38A is slightly smaller than the longitudinal length of the through hole 24a of the movable member 24 and the longitudinal length of the opening 22H of the positioning / guide support member 22. You. The length of the protruding pieces 38A is, for example, as shown by a two-dot chain line in FIG. 7, in which each protruding piece 38A is inserted into the through hole 24a of the movable member 24 and the opening 22H of the positioning / guide support member 22. In this case, the length of the leading end is sufficiently long to reach the engagement position between the lower claw portion 32 and the engaged portion 10e.

By using such a jig 38, each lower claw portion 32 of the positioning / guide support member 22 is connected to the socket body 1
In order to be disengaged from each of the engaged portions 10e, the distal end of each of the projecting pieces 38A of the jig 38 is connected to the through hole 24a of the movable member 24 and the positioning / guide support member 22.
The lower claw 32 is bent outward and is disengaged as shown by a dashed line in FIG. 7 by being inserted between the lower claw 32 and the engaged portion 10e through the opening 22H. You.

In the future, semiconductor devices as inspection objects will tend to be operated at lower voltages and higher frequencies, and it will be important to take measures against static electricity and noise for the semiconductor devices.

In the case of a conventional spring pin type socket, the resin material of the socket main body has a sufficient insulating property such as a volume resistivity of about 10 ¹⁶ (Ω) in order to secure the insulating property between the pins. Things are used. This is disadvantageous for static electricity and noise.

On the other hand, in one example of the above-described inspection apparatus according to the present invention, as can be seen from the structure of the socket body 10, the insulating properties are not limited to the conductive sheet member 14 and the substrate 1.
2, the socket body 10 and the positioning / guide support member 22 themselves do not particularly affect the insulation.

Therefore, the socket body 10 and the positioning / guide support member 22 can be made of a conductive plastic of about 10 ⁸ (Ω) or less. The fact that the socket main body 10 and the positioning / guide support member 22 as the housing can be formed of conductive plastic as described above has a very great advantage that measures against static electricity and shielding can be taken for the inspection object. Becomes

[0061]

According to the inspection apparatus of the present invention, when the movable member is brought close to the main body, the pressing member is moved in accordance with the movement of the movable member. Since the object to be inspected is rotated in one direction to open the object to be inspected, the object to be inspected can be mounted on or taken out of the object to be inspected accommodating part of the main body through the opening.

When the movable member is separated from the main body, the pressing member is rotated in the other direction to move the test object arranged in the test object storage portion to the conductive sheet member. Thus, a series of operations from mounting the inspection object to removing the inspected inspection object can be easily automated.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an inspection object storage member to which an example of an inspection apparatus according to the present invention is applied.

FIG. 2 is a configuration diagram showing a schematic configuration of an example of an inspection device according to the present invention.

FIG. 3 is a plan view of the example shown in FIG.

FIG. 4 is a plan view of the example shown in FIG. 1 as viewed from below the lower surface side of the movable member.

FIG. 5 is a plan view seen from above along the line VV in the example shown in FIG. 1;

FIG. 6 is a side view of the example shown in FIG. 1;

FIG. 7 is a sectional view of the example shown in FIG. 1;

FIG. 8 is a diagram provided for explanation of the operation in the example shown in FIG. 1;

FIG. 9 is a front view showing a jig used in the example shown in FIG. 1;

[Explanation of symbols]

 Reference Signs List 6 semiconductor element 10 socket body part 12 substrate part 14 conductive sheet member 16 pressing member 18 coil spring 20 support shaft 22 positioning / guide support member 24 movable member 24h, 22s opening 28A, 28B guide

Claims (3)

[Claims] An inspection signal is supplied to an inspection object disposed in an inspection object housing portion, which is electrically connected to an electrode of the inspection object having an electronic circuit via a conductive sheet member. A main body having an input / output section for transmitting an output signal from the test object, and an opening for communicating the test object housing part of the main body with the outside, and being capable of approaching or separating from the main body; A plurality of pressing members rotatably supported by the main body and selectively pressing the test object disposed in the test object storage portion against the conductive sheet member. When the movable member is brought close to the main body, the pressing member is rotated in one direction in response to the movement of the movable member, and the inspection object housing portion is opened. When the movable member is separated from the main body. A pressing control mechanism for rotating the pressing member in the other direction to place the test object disposed in the test object storage portion against the conductive sheet member. Inspection equipment. 2. The pressing control mechanism includes a pressing member having one end abutting on the movable member and the other end selectively abutting on the conductive sheet member, and rotatably supporting the pressing member. The inspection apparatus according to claim 1, further comprising: a supporting member configured to perform the pressing, and a biasing unit configured to bias the pressing member to rotate in the other direction. 3. The movable member, wherein a peripheral portion of the opening is movably supported by a guide portion provided around an object-to-be-inspected accommodation portion of the main body, and is movable toward and away from the main body. The inspection device according to claim 1, wherein the inspection device is arranged.