JPH11122033A - Antenna system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To incorporate an antenna system in a portable telephone set housing and to adapt it to plural communication systems by providing antenna element patterns which radiate and receive electromagnetic waves of plural frequency bands on the main surface of a dielectric substrate made of only a low-dielectric constant material. SOLUTION: On the main surface of the dielectric substrate 101, the plural antenna element patterns 110 and 120 are formed which radiate and receive electromagnetic waves of plural frequency bands. A ground conductor 130 is provided almost on substantially the all entire surface opposite from the surface where the antenna element patterns are formed and a shield function for an internal circuit is provided to make the device small-sized. The plural antenna elements 110 and 120 have independent feed parts 111 and 121 and execute input and output signals, so that a high frequency circuit part of each system can be connected by a method similar to a single communication system. The feed parts 111 and 121 can be provided with dedicated filters as patterns and signal removing performance for bands other than the required bands can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an antenna device that can be used in a high-frequency circuit section of a portable wireless device such as a portable telephone, and for example, an antenna device that can be built in a portable telephone housing and can support a plurality of communication systems. About.

[0002]

2. Description of the Related Art In recent years, a large number of portable telephones which can use a plurality of communication systems have been developed. Its configuration is, for example, 900
This is a system (dual system) in which a / 800 MHz band communication system and a 1.5 GHz band communication system can communicate with an integrated mobile phone.

[0003] The dual system is not limited to a combination of systems having different frequencies, but analog systems and digital systems, digital systems and digital systems, large power systems and small power systems (each uses a different frequency band. ) Are being studied.

[0004] In order to cope with a plurality of communication systems in the above-mentioned conventional mobile telephone, for example, a method using a demultiplexing filter as shown in FIG. 10 and a method using a switch as shown in FIG. Was used.

In the method using a demultiplexing filter, FIG.
For example, when two communication systems 61 and 62 are used, the transmission frequency band f1 and the reception frequency band f2 of one system 61 and the frequency band of the transmission frequency band f3 and the reception frequency band f4 of the system 62 are used. However, the demultiplexing filter 10 enables the antenna 1 to be shared.

However, the system 61 and the system 62 have duplexers (devices for separating transmission and reception signals, for example, duplexers) 11 and 12 respectively. The situation will be described with reference to FIG.
3. The receiving unit 14 has nodes 17 and 1
8 and the signals of the respective frequency bands f1 and f2 flow in the manner indicated by the arrows. Next, the duplexer 11 is connected to the demultiplexing filter 10 by the node 23, outputs the signal of the frequency band f1, and inputs the signal of the frequency band f2. Similarly, in the system 62, the transmitting unit 15 and the receiving unit 16 are connected to the duplexer 12 at the nodes 19 and 20, respectively, and the signals of the respective frequency bands f3 and f4 flow in the manner indicated by the arrows. The duplexer 12 is then connected to the distributor 10 by a node 24 and outputs a signal of the frequency band f3,
4 is input. The demultiplexing filter 10 connected to the input and output of the system 61 and the system 62 is an antenna 1
And the node 25, and the transmission frequency band f
1 and f3 are output, and signals in the reception frequency bands f2 and f4 are input. As described above, two communication systems can be shared by the antenna 1.

[0007] The demultiplexing filter 10 is usually constituted by a combination of a high-pass filter and a low-pass filter, and an isolator for preventing mutual signal leakage or the like is provided between ports connected to the system 61 and the system 62. It has the characteristic of ration.

On the other hand, FIG. 11 shows the demultiplexing filter 1 described above.
The part where 0 is present is replaced with switch 5.
The circuit configuration is the same as when the demultiplexing filter 10 is used. However, when the switch is used, the operation of the system 61 and the system 62 is an intermittent operation as compared with the case where the demultiplexing filter is used. Therefore, when the switch 5 is used, the system is limited to a digital system that performs an intermittent operation.

[0009]

The above-mentioned prior art has the following problems. In each of the above-mentioned conventional examples, one antenna device is used and shared and used in the frequency bands of a plurality of systems. However, a wide band enough for one antenna 1 to cover the above-mentioned plurality of bands. It was difficult to optimize the radiation efficiency (increase the efficiency).

[0010] In addition, a rod-shaped rod antenna is generally used as the antenna device used in the above configuration.
For example, it is impossible to use a chip antenna or the like using a ceramic dielectric that can be built in the housing of a mobile phone disclosed in Japanese Patent Application Laid-Open No. 9-93016 because the corresponding band is narrow. In particular, in the case of a chip antenna, the smaller the size is, the smaller the band in which the radiation efficiency of the antenna device is optimal tends to be.

Therefore, it has been difficult to incorporate an antenna into the housing of a mobile phone using a plurality of communication systems.

The present invention has been made in view of these disadvantages, and it is an object of the present invention to provide an antenna device that can be built in a housing of a mobile phone and can support a plurality of communication systems.

[0013]

Means for Solving the Problems The present invention has the following configuration to achieve the above object.

In the antenna device according to the first aspect, a plurality of antenna element patterns for radiating or receiving electromagnetic waves in a plurality of frequency bands are provided on a main surface of a dielectric substrate.

According to a second aspect of the present invention, the ground conductor is provided on substantially the entire surface of the dielectric substrate of the antenna device opposite to the surface on which the antenna element pattern is formed.

According to a third aspect of the present invention, in the antenna device, the plurality of antenna element patterns have independent feed portions, respectively.
Signals are input and output from the plurality of power supply units.

According to a fourth aspect of the present invention, there is provided an antenna device, wherein a filter for passing each frequency band to each feeder of the plurality of antenna element patterns is provided on a dielectric substrate constituting the antenna device, and the filter is provided through the filter. It is used to input and output signals.

According to a fifth aspect of the present invention, in the antenna device, the filter is formed as a pattern on a dielectric substrate constituting the antenna device.

According to a sixth aspect of the present invention, in the antenna device, an impedance adjuster for passing signals in each frequency band is provided on a feeder of each of the plurality of antenna element patterns on a dielectric substrate constituting the antenna. And one signal input / output unit via the impedance adjustment unit.

According to a seventh aspect of the present invention, in the antenna device, the impedance adjusting section is formed as a pattern on a dielectric substrate constituting the antenna device.

According to an eighth aspect of the present invention, the width of the radiation electrode pattern on the low frequency side of the plurality of electromagnetic wave radiation patterns is wider than that of the radiation electrode pattern on the high frequency side.

According to a ninth aspect of the present invention, the antenna device forms a part or the whole of a top plate portion of a shield housing provided in a high-frequency circuit unit such as a wireless device.

According to a tenth aspect of the present invention, the dielectric substrate constituting the antenna device has a relative permittivity of 5 or less.

According to an eleventh aspect of the present invention, the substrate material of the dielectric substrate is made of a low dielectric constant material made of only a resin material.

(1) In the present invention, the above-mentioned claims 1 to 3
The substrate material of the dielectric substrate is weight average absolute molecular weight 1000
A resin composition comprising one or more resins of 10,000,000 or less, wherein the sum of the number of carbon atoms and hydrogen atoms of the composition is 99% or more, and one It is preferable to use a heat-resistant low-dielectric polymer material in which parts or all have a chemical bond with each other, from the viewpoint of obtaining the dielectric substrate having a low dielectric constant.

(2) The dielectric material according to (1), which has the above-mentioned molecular weight and the like, and is a heat-resistant low-dielectric polymer material, wherein the chemical bond is cross-linked, block-polymerized, or graft-polymerized. It is preferable to use a heat-resistant low-dielectric polymer material that is at least one member selected from the group consisting of obtaining high strength and avoiding softening due to heat when mounting the top plate by soldering.

(3) The dielectric material of (1) or (2) has the molecular weight and the cross-linked structure, and the resin composition has a non-polar α-olefin polymer segment and / or A non-polar conjugated diene-based polymer segment and a vinyl aromatic-based polymer segment are chemically bonded copolymers, and a dispersed phase formed by one segment is a continuous phase formed by the other segment. It is preferable from the viewpoints of strength and heat resistance that it is made of a heat-resistant low-dielectric polymer material that is a thermoplastic resin exhibiting a multiphase structure that is finely dispersed.

(4) The dielectric material of (3) is:
It is preferable that the non-polar α-olefin polymer segment and the vinyl aromatic polymer segment are made of a heat-resistant low-dielectric polymer material which is a copolymer in which a chemical bond is formed.

(5) The heat-resistant material according to (3) or (4), wherein the vinyl aromatic polymer segment is a vinyl aromatic copolymer segment containing a divinylbenzene monomer. It is preferable to be made of a low dielectric polymer material.

(6) Preferably, the dielectric material of (4) or (5) is made of a heat-resistant low-dielectric polymer material which is a copolymer chemically bonded by graft polymerization.

(7) The above-mentioned dielectric materials (1) to (6) are obtained by adding a non-polar α-olefin polymer containing a monomer of 4-methylpentene-1 to a resin composition. It is preferred to be made of a conductive low dielectric polymer material.

[0032]

6 (A) and 6 (B) show an embodiment of the present invention in which a top plate portion of a shield case 42 which covers a high frequency circuit portion 45 of a motherboard 41 of a portable telephone is used as an antenna device 100. It is a perspective view and a sectional view showing

In the antenna device 100 according to the present invention, a plurality of antenna element patterns 110 and 120 corresponding to respective frequency bands used by a plurality of communication systems are formed on one surface of a dielectric substrate 101. A ground conductor 130 is formed on substantially the entire other surface of the substrate 101 to form an integrated planar antenna device 100.
In order for the antenna device to be built in the housing of the mobile phone, the entire top plate of the shield housing 42 formed on the high-frequency circuit 45 forming the mobile phone on the surface where the ground conductor 130 of the antenna device is formed It is configured as a part.

With the above configuration, it is possible to incorporate the antenna device 100 into the housing of the portable telephone and to cope with a plurality of communication systems.

The plurality of antenna element patterns 110 and 120 formed on the dielectric substrate 101 of the antenna device 100 according to the present invention
Since the antennas 10 and 120 can be adjusted so as to optimize the radiation efficiency with respect to the transmission or reception frequency band of each communication system, one antenna can be used in a plurality of system bands as shown in the conventional example. As compared with the case of using, the loss of the energy of the signal (radio wave) can be reduced and the transmission and reception can be performed efficiently.

In a normal antenna device, the radiation pattern (directivity of the radiated radio wave) changes depending on the frequency band of the radiated radio wave. This is because it largely depends on the wavelength of the radiated radio wave and the size and shape of the antenna element of the antenna device. Therefore, in a mobile phone in which a plurality of communication systems having frequencies different from each other by about two times are combined, the wavelength of the frequency handled is also about two times different, so that when the same antenna is used, its radiation pattern also changes.

However, the antenna device 100 according to the present invention
Since the antenna element patterns 110 and 120 of the antenna device 100 can be adjusted in each frequency band, it is possible to form almost the same radiation pattern in different frequency bands. In addition, since the area for receiving an incoming radio wave can be made larger than that of a miniaturized antenna such as the above-described chip antenna, the reception efficiency of the antenna with respect to the incoming radio wave can be increased. Thereby, it is possible to improve the receiving sensitivity of the portable telephone device to the incoming radio wave.

On the other hand, when the antenna element patterns 110 and 120 corresponding to a plurality of frequency bands are formed as conductor patterns on the dielectric substrate 101, signals in the frequency bands of the respective communication systems are respectively associated with the corresponding antenna element patterns 110 and 120. An input / output unit, which is a part for supplying to the H.120, is required.

Therefore, in the antenna device according to the present invention,
As the first embodiment, the configuration shown in FIG. 1 (the same symbols as those described above in the drawings indicate the same components) is adopted. That is, the antenna device 30 is provided with the antenna element patterns 31 and 33 for two communication systems on the dielectric substrate 35, respectively, and the feeding portions 32 of the antenna element patterns 31 and 33, respectively.
34 are independent input / output terminals, and the duplexers 11, 1 of each communication system (system 61 and system 62) are used.
The configuration is such that nodes 21 and 22 through which two input / output signals flow are connected.

According to this method, even if the transmission radio wave radiated from the antenna element of one communication system of the antenna device of the present invention is received by the antenna element of the other communication system, the other antenna element first has The signal in the frequency band outside each communication system is first attenuated by the antenna gain in the frequency band of the signal emitted from one antenna and then further attenuated by the out-of-band attenuation characteristic of the duplexer in the other system. Can be avoided. That is, the signal between the mutual communication systems can have isolation characteristics.

Next, in the second embodiment, the configuration shown in FIG. 2 (the same symbols as those shown in the figures represent the same components) is adopted. That is, in the antenna device 50, the antenna element patterns 51 and 53 are provided on the dielectric substrate 55 for two communication systems, respectively, and a signal is input to each of the feed sections 52 and 54 of the antenna element patterns 51 and 53 to each antenna element. One of the circuits for output (circuits or circuit elements for impedance adjustment) 56 and 57 is connected, and the other of each of the circuits 56 and 57 is connected to one another.
The input / output terminals 58 are provided.

The input / output terminal is connected to the demultiplexing filter 10 at the node 25, and supplies respective transmission / reception signals to the system 61 and the system 62 as shown in the conventional example.

As described above, since the dielectric substrate 55 constituting the antenna device 50 according to the present invention is formed of a flat plate having a large area, the circuits 56 and 57 can be provided on the dielectric substrate 55. It is. Although depending on the frequency to be handled, the circuits 56 and 57 can be formed in a pattern on the dielectric substrate 55 in a high frequency band.

On the other hand, in general, in order to efficiently radiate radio waves from the antenna devices 30 and 50 to the space, it is necessary to design the impedance of the antenna element patterns 31, 33, 51 and 53 so as to approach the spatial impedance.
Therefore, it is necessary to design the impedance to be high to some extent.

As described above, the antenna device 3 according to the present invention
Reference numerals 0 and 50 denote an antenna element pattern 3 on which a ground conductor is formed over substantially one surface and a radio wave is radiated.
1, 33, 51 and 53 are formed on the surface opposite to the surface on which the ground conductor is formed.

However, in the case of the above configuration, if the distance between the ground conductor and the antenna element patterns 31, 33, 51, 53, that is, the thickness of the substrates 35, 55 of the antenna devices 30, 50 is too small, the impedance of the antenna element becomes too small. Will drop. That is, the impedance in the high frequency band decreases due to an increase in the capacitance (ground capacitance) of the antenna element with respect to the ground conductor.

Therefore, the antenna device 3 according to the present invention
For 0 and 50, the relative permittivity of the substrates 35 and 55 holding the ground conductor and the antenna element pattern is preferably 5 or less. In general, the impedance of the pattern as described above depends on the dielectric constant of the material of the substrates 35 and 55, the thickness of the substrates 35 and 55,
Further, a conductor pattern 31 as an antenna element pattern,
The width and thickness of the conductor patterns 33, 51, 55 are determined by the width and thickness of the conductor patterns. A sufficient impedance of the antenna element pattern to emit radio waves can be obtained.

Therefore, the antenna devices 30, 5 according to the present invention
0 prevents lowering of the impedance of the antenna element patterns 31, 33, 51, 53, and the substrate 35, 55
Can be mounted as the whole or a part of the top plate of the shield housing of the high-frequency circuit section of the mobile phone described above.

Further, the ground conductor surfaces of the antenna devices 30 and 50 of the present invention can function as a top plate of the shield housing 42, and the housing 4 of a mobile phone or the like shown in FIG.
There is no increase in the overall value of 0.

Further, the substrates 35 and 55 of the above-described antenna devices 30 and 50 according to the present invention preferably have a relative dielectric constant of 5 or less, but a resin material is suitable as a substrate material. Because the substrate made of resin uses metal copper foil as the conductor pattern, the actual resistance loss due to the conductor material in the high frequency band is smaller than that of the conductor pattern made of sintered conductor formed on the ceramic substrate. This is because it is suitable for the antenna device.

On the other hand, the antenna devices 30, 5 according to the present invention
It is preferable that the material of the substrates 35 and 55 of 0 has a relative dielectric constant of 5 or less. However, in order to obtain the antenna device having the above configuration, it is more preferable to further reduce the relative dielectric constant of the substrate material. And the thickness of the substrate can be further reduced.

Therefore, the antenna device 30 according to the present invention,
The substrates 35 and 55 have a structure in which the glass cloth included in the substrate is not included in the substrate in order to reduce the strength required for a general resin substrate and the thermal expansion coefficient, and the substrate used in the antenna device is used. Has a reduced dielectric constant.

This is because the glass cloth generally has a relative dielectric constant of 5 or more, and even if the resin material has a relative dielectric constant of 5 or less, the dielectric constant of the entire substrate increases due to the mixture with the glass cloth. This is because

Therefore, the antenna devices 30 and 5 according to the present invention
In the case of 0, the dielectric constant is low and the strength is sufficient, and the conductive patterns 31 and 3 formed on the surfaces of the substrates 35 and 55 are further reduced.
The resin material described below is used as a resin material having sufficient adhesive strength to 3, 51 and 53 and also having solder heat resistance.

The heat-resistant low-dielectric polymer material of the present invention is a resin composition comprising one or more resins having a weight-average absolute molecular weight of 1,000 or more, and comprises carbon atoms and hydrogen atoms. The sum of the numbers is 99% or more, and some or all of the resin molecules are chemically bonded to each other.

By using such a resin composition having a weight-average absolute molecular weight, the strength, adhesion to metal, and heat resistance when used as a heat-resistant low-dielectric polymer material are sufficient. On the other hand, if the weight average absolute molecular weight is less than 1,000, mechanical properties, heat resistance, etc. become insufficient, which is not suitable. Particularly preferably 3000 or more, most preferably 50 or more.
00 or more. The upper limit of the weight average absolute molecular weight at this time is not particularly limited, but is usually about 10,000,000.

The reason why the sum of the number of carbon atoms and the number of hydrogen atoms in the resin composition of the present invention is set to 99% or more is to make the existing chemical bond a non-polar bond, thereby providing heat resistance. Dielectric loss characteristics when used as a low dielectric polymer material can be sufficiently reduced.

On the other hand, when the sum of the number of carbon atoms and hydrogen atoms is less than 99%, particularly when the number of atoms forming polar molecules such as oxygen atoms and nitrogen atoms is more than 1%, It is not suitable because the electrical characteristics, especially the dielectric loss tangent, are high.

Specific examples of the resin constituting the polymer material include low-density polyethylene, ultra-low-density polyethylene,
Ultra low density polyethylene, high density polyethylene, low molecular weight polyethylene, ultra high molecular weight polyethylene, ethylene
Non-polar α-olefin homo- or copolymers (hereinafter also referred to as (co) polymers) such as propylene copolymer, polypropylene, polybutene, and poly-4-methylpentene, butadiene, isoprene, pentadiene, hexadiene, heptadiene, octadiene Phenylbutadiene, (co) polymers of each monomer of conjugated diene such as diphenylbutadiene, styrene, nucleus-substituted styrene, for example, methylstyrene, dimethylstyrene, ethylstyrene, isopropylstyrene, chlorostyrene, α-substituted styrene, for example (co) polymers of each monomer of carbon ring-containing vinyl such as α-methylstyrene, α-ethylstyrene, divinylbenzene, vinylcyclohexane and the like.

In the above description, polymers of non-polar α-olefin monomers, conjugated diene monomers, and carbon ring-containing vinyl monomers are mainly exemplified.
Olefin monomer and conjugated diene monomer, non-polar α-
Copolymers obtained from monomers of different compound types, such as an olefin monomer and a carbon ring-containing vinyl monomer, may be used.

As described above, a resin composition is composed of one or more of these polymers, that is, resins, and some or all of these resin molecules are chemically bonded to each other. There must be. Therefore, some may be in a mixed state.

By having a chemical bond in at least a part of the material, the strength, adhesion to metal, and heat resistance when used as a heat-resistant low-dielectric polymer material are sufficient. On the other hand, when it is a mere mixture and has no chemical bond, it is insufficient from the viewpoint of heat resistance and mechanical properties.

The form of the chemical bond in the present invention is not particularly limited, and examples thereof include a crosslinked structure, a block structure, and a graft structure. A known method may be used to generate such a chemical bond. Preferred embodiments of the graft structure and the block structure will be described later. As a specific method for generating a crosslinked structure, thermal crosslinking is preferable,
The temperature at this time is preferably about 50 to 300 ° C. Other examples include cross-linking by electron beam irradiation. The presence or absence of a chemical bond according to the present invention can be confirmed by determining the degree of crosslinking and, in the case of a graft structure, the graft efficiency and the like. It can also be confirmed by a transmission electron microscope (TEM) photograph or a scanning electron microscope (SEM) photograph. In contrast, a simple mixture (blend polymer)
Does not show compatibility between the two polymers such as the graft copolymer, and the dispersed particles have a large particle size.

The resin composition in the present invention is a copolymer in which a non-polar α-olefin polymer segment and a vinyl aromatic copolymer segment are chemically bonded. A preferred example is a thermoplastic resin having a multiphase structure in which the formed dispersed phase is finely dispersed in the continuous phase formed from the other segment.

The non-polar α-olefin polymer which is one of the segments in the thermoplastic resin having the specific multiphase structure as described above refers to a non-polar α-olefin polymer obtained by high-pressure radical polymerization, medium-low pressure ionic polymerization or the like. It must be a homopolymer of an α-olefin monomer or a copolymer of two or more non-polar α-olefin monomers. Copolymers with polar vinyl monomers are unsuitable because of their high dielectric loss tangent.

Examples of the non-polar α-olefin monomer of the above polymer include ethylene, propylene, butene-1, hexene-1, octene-1, and 4-methylpentene-1. Butene-1, 4
-Methylpentene-1 is preferred because the resulting nonpolar α-olefin polymer has a low dielectric constant.

Specific examples of the non-polar α-olefin (co) polymer include low-density polyethylene, ultra-low-density polyethylene, ultra-low-density polyethylene, high-density polyethylene, low-molecular-weight polyethylene, ultra-high-molecular-weight polyethylene,
Ethylene-propylene copolymer, polypropylene, polybutene, poly-4-methylpentene and the like can be mentioned. These non-polar α-olefin (co) polymers can be used alone or in combination of two or more.

The preferred molecular weight of such a nonpolar α-olefin (co) polymer is 1000 in terms of weight average absolute molecular weight.
That is all. There is no particular upper limit, but 1000
It is about ten thousand.

On the other hand, the vinyl aromatic polymer which is one of the segments in the thermoplastic resin having a specific multiphase structure is a non-polar polymer, and specifically, styrene,
Nuclear-substituted styrene such as methylstyrene, dimethylstyrene, ethylstyrene, isopropylstyrene, chlorostyrene, α-substituted styrene such as α-methylstyrene, α-ethylstyrene, o-, m-, p-divinylbenzene (preferably m-styrene) -, P-divinylbenzene, particularly preferably p-divinylbenzene). Such non-polarity is achieved by introducing a monomer having a polar functional group by copolymerization.
This is because the dielectric loss tangent becomes high and is not suitable.

The vinyl aromatic polymers can be used alone or in combination of two or more. Among them, the vinyl aromatic copolymer is preferably a vinyl aromatic copolymer containing a divinylbenzene monomer from the viewpoint of improving heat resistance.

Specific examples of the vinyl aromatic copolymer containing divinylbenzene include styrene, nucleus-substituted styrene such as methyl styrene, dimethyl styrene, ethyl styrene, isopropyl styrene, chlorostyrene, and α-substituted styrene such as α-substituted styrene. -A copolymer of monomers such as methylstyrene and α-ethylstyrene and a monomer of divinylbenzene.

The ratio between the divinylbenzene monomer and the other vinyl aromatic monomer as described above is not particularly limited. However, in order to satisfy the solder heat resistance, the divinylbenzene monomer is used. Is preferably 1% by weight or more. The divinylbenzene monomer may be 100% by weight, but the upper limit is preferably 90% by weight in view of synthesis.

The molecular weight of the vinyl aromatic polymer as one of the segments is 10% in terms of weight average absolute molecular weight.
It is preferably at least 00. The upper limit is not particularly limited, but is about 10 million.

The thermoplastic resin having a specific multiphase structure of the present invention has an olefin polymer segment of 5 to 95% by weight, preferably 40 to 90% by weight, most preferably 50% by weight.
~ 80% by weight. Accordingly, the content of the vinyl polymer segment is 95 to 5% by weight, preferably 60 to 50% by weight.
10 to 10% by weight, most preferably 50 to 20% by weight. When the number of the olefin-based polymer segments is small, the molded product becomes brittle, which is not preferable. Further, when the number of the olefin-based polymer segments increases, the adhesion to the metal is low, which is not preferable.

The weight average absolute molecular weight of such a thermoplastic resin is 1,000 or more. The upper limit is not particularly limited, but is about 10,000,000 from the viewpoint of moldability.

Specific examples of the copolymer having a structure in which the olefin polymer segment and the vinyl polymer segment are chemically bonded include a block copolymer and a graft copolymer. Above all, a graft copolymer is particularly preferred because of ease of production. These copolymers may include an olefin-based polymer or a vinyl-based polymer without departing from the characteristics of the block copolymer, the graft copolymer, and the like.

The method for producing the thermoplastic resin having a specific multiphase structure of the present invention may be any of chain transfer method and ionizing radiation irradiation method which are well known as a grafting method. Most preferred is the method described below. This is because the grafting efficiency is high and secondary aggregation due to heat does not occur, so that the expression of performance is more effective and the production method is simple.

Hereinafter, the method for producing a graft copolymer which is a thermoplastic resin having a specific multiphase structure of the present invention will be described in detail.

That is, 100 parts by weight of an olefin polymer are suspended in water, and the vinyl aromatic monomers 5 to 4 are separately added.
To 100 parts by weight, 0.1 to 10 parts by weight of one or more kinds of radically polymerizable organic peroxides represented by the following chemical formulas 1 or 2 is added to 100 parts by weight of the vinyl monomer. And a decomposition temperature for obtaining a half-life of 10 hours of 40 to
A solution prepared by dissolving a radical polymerization initiator at 90 ° C. in an amount of 0.01 to 5 parts by weight with respect to a total of 100 parts by weight of a vinyl monomer and a radically polymerizable organic peroxide is added. Is heated under conditions under which decomposition of the olefin-based polymer does not substantially occur, and the vinyl monomer, the radically polymerizable organic peroxide and the radical polymerization initiator are impregnated into the olefin-based polymer, and the temperature of the aqueous suspension is increased. Then, a vinyl monomer and a radical polymerizable organic peroxide are copolymerized in an olefin copolymer to obtain a graft precursor.

Next, the grafting precursor was added in an amount of 100 to 300.
The graft copolymer of the present invention can be obtained by kneading while melting at a temperature of ° C. At this time, the graft copolymer can be obtained by separately mixing an olefin polymer or a vinyl polymer with the grafting precursor and kneading the mixture under melting. Most preferred is a graft copolymer obtained by kneading a grafting precursor.

[0081]

Embedded image In Chemical Formula 1, R ₁ represents a hydrogen atom or an alkyl group having 1 to 2 carbon atoms, R ₂ represents a hydrogen atom or a methyl group, R ₃ and R ₄ each represent an alkyl group having 1 to 4 carbon atoms,
R ₅ represents an alkyl group, a phenyl group, an alkyl-substituted phenyl group or a cycloalkyl group having 3 to 12 carbon atoms having 1 to 12 carbon atoms. m1 is 1 or 2.

[0082]

Embedded image In Chemical Formula 2, R ₆ represents a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, R ₇ represents a hydrogen atom or a methyl group, R ₈ and R ₉ each represent an alkyl group having 1 to 4 carbon atoms,
R ₁₀ represents an alkyl group having 1 to 12 carbon atoms, a phenyl group, an alkyl-substituted phenyl group, or a cycloalkyl group having 3 to 12 carbon atoms. m2 is 0, 1 or 2.

Specific examples of the radical polymerizable organic peroxide represented by Chemical formula 1 include t-butylperoxyacryloyloxyethyl carbonate; t-amylperoxyacryloyloxyethyl carbonate. T-hexylperoxyacryloyloxyethyl carbonate; 1,1,
3,3-tetramethylbutyl peroxyacryloyloxyethyl carbonate; cumyl peroxyacryloyloxyethyl carbonate; p-isopropylcumylperoxyacryloyloxyethyl carbonate; t-butyl Peroxymethacryloyloxyethyl carbonate;
t-amyl peroxymethacryloyloxyethyl carbonate; t-hexylperoxymethacryloyloxyethyl carbonate; 1,1,3,3-tetramethylbutylperoxymethacryloyloxyethyl carbonate;
Cumyl peroxymethacryloyloxyethyl carbonate
P-isopropylcumylperoxymethacryloyloxyethyl carbonate; t-butylperoxymethacryloyloxyethylcarbonate-carbonate; t-amylperoxyacryloyloxyethoxyethylcarbonate
G; t-hexylperoxyacryloyloxyethoxyethyl carbonate; 1,1,3,3-tetramethylbutylperoxyacryloyloxyethoxyethyl carbonate; cumylperoxyacryloyloxyethoxyethyl ethyl carbonate Carbonate; p-isopropylcumylperoxyacryloyloxyethoxyethyl ether carbonate; t-butylperoxymethacryloyloxyethoxyethyl ether
T-amylperoxymethacryloyloxyethoxyethyl carbonate; t-hexylperoxymethacryloyloxyethoxyethyl carbonate;
1,3,3-tetramethylbutyl peroxymethacryloyloxyethoxyethyl carbonate; cumyl peroxymethacryloyloxyethoxyethyl carbonate; p
-Isopropylcumylperoxymethacryloyloxyethoxyethyl carbonate; t-butylperoxyacryloyloxyisopropylcarbonate; t-amylperoxyacryloyloxyisopropylcarbonate;
t-hexyl peroxyacryloyloxyisopropyl carbonate; 1,1,3,3-tetramethylbutylperoxyacryloyloxyisopropyl carbonate;
Cumyl peroxyacryloyloxyisopropyl carbonate; p-isopropylcumylperoxyacryloyloxyisopropyl carbonate; t-butylperoxymethacryloyloxyisopropyl carbonate; t-
Amyl peroxymethacryloyloxy isopropyl car
Bonnet; t-hexyl peroxymethacryloyloxyisopropyl carbonate; 1,1,3,3-tetramethylbutylperoxymethacryloyloxyisopropyl carbonate; cumyl peroxymethacryloyloxyisopropyl carbonate And p-isopropylcumylperoxymethacryloyloxyisopropylcarbonate.

Further, as the compound represented by the formula 2,
t-butylperoxyallylcarbonate; t-amylperoxyallylcarbonate; t-hexylperoxyallylcarbonate; 1,1,3,3-tetramethylbutylperoxyallylcarbonate P-menthaneperoxyallylcarbonate; cumylperoxyallylcarbonate; t-butylperoxymethallylcarbonate; t-amylperoxymethallylcarbonate; t
Hexyl peroxymethallyl carbonate; 1,1,
3,3-tetramethylbutyl peroxymethallyl carbonate; p-menthane peroxymethallyl carbonate
G; cumyl peroxymethallyl carbonate; t-butyl peroxyallyloxyethyl carbonate; t-amyl peroxyallyloxyethyl carbonate; t-hexyl peroxyallyloxyethyl carbonate T-butylperoxymetalaryloxyethyl carbonate; t-
Amyl peroxymetalaryloxyethyl carbonate; t-
Hexyl peroxymetalaryloxyethyl carbonate;
t-butyl peroxyallyloxyisopropyl carbonate; t-amylperoxyallyloxyisopropyl carbonate; t-hexylperoxyallyloxyisopropyl carbonate; t-butylperoxymetalloxyisopropyl carbonate G; t-amyl peroxy metalaryloxy isopropyl carbonate; t-hexyl peroxy metalaryloxy isopropyl carbonate;

Among them, t-butylperoxyacryloyloxyethyl carbonate; t-butylperoxymethacryloyloxyethyl carbonate; t-butylperoxyallylcarbonate; t-butylperoxy Methallyl carbonate. The graft efficiency of the thus obtained graft copolymer is 20 to 100% by weight. The grafting efficiency can be determined by extracting the ungrafted polymer with a solvent and determining the ratio.

The thermoplastic resin having a specific multiphase structure of the present invention is preferably a graft copolymer of the above-mentioned non-polar α-olefin polymer segment and vinyl aromatic polymer segment. In such a graft copolymer, a non-polar conjugated diene-based polymer segment may be used instead of or in addition to the non-polar α-olefin-based polymer segment. As the nonpolar conjugated diene-based polymer, those described above can be used, and they may be used alone or in combination of two or more.

The non-polar α-olefin-based polymer in the above graft copolymer may contain a conjugated diene monomer, and the non-polar conjugated diene-based polymer may contain α-olefin.
An olefin monomer may be contained. In the present invention, the obtained graft copolymer can be further crosslinked using divinylbenzene or the like. Particularly, a graft copolymer containing no divinylbenzene monomer is preferable from the viewpoint of improving heat resistance.

On the other hand, the thermoplastic resin having a specific multiphase structure of the present invention may be a block copolymer,
Examples of the block copolymer include a block copolymer containing at least one polymer of a vinyl aromatic monomer and at least one polymer of a conjugated diene.
It may be a linear type or a radial type, that is, a type in which a hard segment and a soft segment are radially bonded.

The polymer containing a conjugated diene may be a random copolymer with a small amount of a vinyl aromatic monomer.
The vinyl aromatic monomer may be gradually increased in one block.

The structure of the block copolymer is not particularly limited, and may be any of (AB) _n type, (AB) _n -A type or (A, B) _n -C type. . Where A
Represents a polymer of a vinyl aromatic monomer, B represents a polymer of a conjugated diene, C represents a residue of a coupling agent, and n represents an integer of 1 or more.

In this block copolymer, it is also possible to use a block copolymer in which the conjugated diene moiety has been hydrogenated. In such a block copolymer, instead of the above nonpolar conjugated diene-based copolymer,
Alternatively, in addition to the above, the above-mentioned non-polar α-olefin-based polymer may be used.
It may contain olefin monomers,
The non-polar α-olefin-based polymer may contain a conjugated diene monomer. The ratio of each segment in the block copolymer and the preferred embodiment are the same as those of the graft copolymer.

The resin composition of the present invention, preferably a thermoplastic resin having a specific multiphase structure (particularly preferably a graft copolymer), is added with 4-methylpentene-1 in order to improve heat resistance. It is preferable to add a nonpolar α-olefin-based polymer containing a monomer.

In the present invention, 4-methylpentene-
The non-polar α-olefin polymer containing one monomer may be contained in the resin composition without forming a chemical bond, but in such a case, the addition is not necessarily required. Not done. However, it may be further added to obtain predetermined characteristics.

In such a nonpolar α-olefin copolymer containing a monomer of 4-methylpentene-1, 4-
The proportion of the monomer of methylpentene-1 is preferably at least 50% by weight. The non-polar α-olefin copolymer may include a conjugated diene monomer.

In particular, the non-polar α-olefin-based copolymer containing a monomer of 4-methylpentene-1 includes poly (4-methylpentene-1), which is a homopolymer of 4-methylpentene-1.
Methylpentene-1 is preferred. Poly 4-methyl pentene-1 is crystalline poly 4-methyl pentene-1, and is obtained by polymerizing propylene dimer 4-methyl pentene-1 by using a Ziegler-Natta catalyst or the like. Tactic poly-4-methylpentene-1
Is preferred.

The ratio of poly-4-methylpentene-1 to a thermoplastic resin having a specific multiphase structure is not particularly limited.
In order to satisfy heat resistance and adhesion to metal, poly 4
The proportion of -methylpentene-1 is preferably from 10 to 90% by weight. When the proportion of poly-4-methylpentene-1 is small, the solder heat resistance tends to be insufficient. Also poly 4
When the ratio of -methylpentene-1 increases, the adhesion to metal tends to be insufficient. Poly 4-methylpentene-1
Instead, the amount of addition when the copolymer is used may be in accordance with this.

The softening point of the resin composition of the present invention (including those to which a non-polar α-olefin polymer containing a monomer of 4-methylpentene-1 is added) is from 200 to 260 ° C.
Sufficient solder heat resistance can be obtained by appropriately selecting and using.

The heat-resistant low-dielectric polymer material of the present invention can be obtained by, for example, a method of molding a resin material composed of the above resin composition into a desired shape such as a thin film (film) by hot pressing or the like. In addition, it is melted and mixed with another thermoplastic resin by a shearing force, for example, a roll mixer, a Banbury mixer, a kneader, a single-screw or twin-screw extruder, and molded into a desired shape. It can also be obtained by a method or the like. The resin material used for the substrate of the present invention is, as a film, or a bulk or a molded article having a predetermined shape,
And it can be used in various forms such as as a film lamination.

Accordingly, it is possible to form the antenna device of the present invention, that is, a part and all of the top plate portion of the shield housing of the high frequency part of the mobile phone.

For example, a metal conductor layer which is a metal conductor film such as copper is laminated between the films and / or the outermost layer,
A multilayer substrate can be obtained by heat fusion. Also in this case, a film having good adhesion to the metal conductor film can be obtained. In this case, a film having a thickness of 50 μm or more can be obtained by molding or the like.
000 μm. That is, the thickness includes a so-called substrate. The thickness of the copper foil preferably used as the antenna element pattern or the metal conductor film used as the ground conductor is 18 to 35 μm. And the thickness of the whole board | substrate is 0.1-1.6 mm normally including the thing of a lamination type. However, depending on the case, the thickness may be larger than that, and the thickness may be about 10.0 mm.

When the metal conductor layer is formed in a pattern, the metal conductor film may be patterned into a predetermined shape and then adhered. However, when the metal conductor film and the electrical insulating film are brought into close contact with each other by lamination, the outermost metal conductor layer may be patterned and then adhered, or may be removed by etching and then patterned. Further, the metal conductor layer may be formed by a vacuum evaporation method or the like.

The content of the resin material in the reinforcing filler-containing film used for the substrates 35 and 55 is suitably from 10 to 70% by weight. This has sufficient strength, low dielectric properties,
It becomes a heat-resistant film or substrate. Such a content is realized by maintaining an amount (10% by weight or more) at which a resin material, that is, the resin material itself can be heat-sealed as a resin paste when laminating a film or a substrate. It may be something.

As the molding method for forming the resin material of the present invention into a predetermined shape, there have already been mentioned the molding method, the compression method, the extrusion method, and the like. A method that can be molded at low cost may be selected according to the purpose of use.

In the electrical performance of the heat-resistant low-dielectric polymer material of the present invention, particularly, the frequency band is 60 MHz or more,
Especially in a high frequency band of 60 MHz to 10 GHz,
Low-dielectric electric insulating material having a dielectric constant (ε) of 1 or more, particularly 2.0 to 3.0, and a dielectric loss tangent (tan δ) of 0.01 or less, usually 0.001 to 0.01. Can be obtained, and by using a reinforcing filler-containing electric insulating substrate to be an electric element, the substrate strength is improved,
The coefficient of expansion can be made smaller than that of the low dielectric electric insulating substrate itself, and the thermal conductivity can be improved.

The insulating resistivity of the polymer material of the present invention is 2 to 5 × 10 ¹⁴ Ωcm or more in normal volume resistivity. In addition, the dielectric breakdown strength is strong, and shows excellent characteristics of 15 KV / mm or more, particularly 18 to 30 KV / mm.
Further, the polymer material of the present invention has excellent heat resistance and can withstand the heating temperature at the time of soldering. Therefore, it is preferable to use it not only for a board or an electronic component but also for a housing or a casing that requires such processing.

The antenna device according to the present invention configured as described above has other effects. At present, the effects of radio waves from mobile phones on living organisms are being discussed.However, conventional mobile phones using chip antennas have an antenna inside the housing and the directivity of the antenna is omnidirectional. There is a risk that radio waves radiated from the telephone may be radiated with high energy to the head of the person who uses the telephone. On the other hand, when the antenna is provided outside the housing of the mobile phone, the above problem can be avoided to some extent.

On the other hand, in the antenna device according to the present invention, the directivity (gain) of the antenna having the ground conductor is low, and
Since the directivity (gain) tends to concentrate on the side where the antenna element pattern is located, if the side with the ground conductor of the antenna device according to the present invention comes to the side of the head of the person using the mobile phone, There is an advantage that the head of the person who uses the mobile phone can be protected from radio waves radiated from the phone, as compared with a case where an antenna is provided outside the housing of the phone.

[0108]

Embodiments of the present invention will be described below with reference to the drawings. (First Embodiment) FIG. 3 is a perspective view showing a first embodiment of the above-described antenna device according to the present invention, and FIG. 4 is an exploded perspective view showing its structure. The antenna device 100 according to the present embodiment is an antenna device corresponding to two communication systems, in which antenna element patterns 110 and 120 are formed on one surface of a dielectric substrate 101 and a ground covering almost the entire surface is provided on the other surface. A conductor 130 is formed.

The antenna element patterns 110 and 120
Forms an inverted F-type antenna that is generally called, and has feed portions 111 and 121 and ground portions 112 and 122, respectively. The power supply units 111 and 121 are connected to electrodes 115 and 125 serving as terminals for input and output of signals by respective systems by through-hole electrodes 113 and 123 formed on the dielectric substrate 101 and electrically connecting the front and back surfaces, respectively. I have. These electrodes 115 and 125 are connected to the ground conductor 1.
30 and isolated. The electrodes 115 and 125 have terminals 11 for connection to a high-frequency circuit section of a mobile phone.
6, 126 are provided. Further, the grounding portion 11
Reference numerals 2 and 122 are respectively connected to the ground conductor 130 by through-hole electrodes 114 and 124 formed in the dielectric substrate 101.

Next, a structure for mounting the antenna device 100 having the above-described configuration according to the present invention on a portable telephone will be described. FIG. 5 shows a state where the antenna device 100 shown in FIGS. 3 and 4 is mounted on a mobile phone.

In FIG. 5, reference numeral 40 denotes a housing of the mobile phone, and shows a situation in which a motherboard 41 on which components for operating the mobile phone are mounted is mounted inside the housing 40. Usually, on the motherboard 41, FIG.
The high-frequency circuit section 45 shown in FIG. 2 is formed, and the portion is covered with a metal plate or a resin-plated metal cap, that is, the shield casings 42 and 43 cover the high-frequency circuit section 45 and are electromagnetically shielded. It has a structure.

As shown in FIGS. 6A and 6B, a high-frequency circuit section 45 is provided on the motherboard 41, and the high-frequency circuit section 45 is formed of a metal (or resin-plated metal) shield case 42, 43 is used to cover and shield from both sides of the high-frequency circuit section 45.

However, one of the metal shield casings 43 has a top plate portion, while the other metal shield casing 4
Reference numeral 2 does not have a top plate portion, and has only a wall portion covering the periphery. As shown in FIG. 6, the antenna element patterns 110 and 120 formed on the surface of the antenna device 100 according to the embodiment of the present invention are mounted on the shield housing 42 in this state from above such that the antenna element patterns 110 and 120 face outward.

At this time, it is necessary that the ground conductor 130 formed on the back surface of the antenna device 100 be electrically connected to the shield housing 42. As a method therefor, the ground conductor 130 of the antenna device 100 and the shield case 42 may be soldered, crimped by tightening screws, crimped by a fitting structure, or the like.

The connection terminals 116 and 126 provided at the power supply unit of the antenna device 100 are connected to the transmission / reception input / output terminals of the respective communication systems of the high-frequency circuit unit 45. With the above configuration, the ground conductor 130 of the antenna device 100 can function as a part of the shield configuration of the high-frequency circuit unit 45.

On the other hand, the material of the dielectric substrate 101 of the antenna device 100 of this embodiment was manufactured as follows.
In a 5-liter stainless steel autoclave, 2000 g of pure water was added, and 2.5 g of polyvinyl alcohol was dissolved as a suspending agent.

990 g of a styrene monomer, 10 g of divinylbenzene, and 5 g of benzoyl peroxide as a polymerization initiator were charged and stirred therein. Then autocle
The temperature was raised to 80-85 ° C. and maintained at that temperature for 7 hours to complete the polymerization.
A divinylbenzene copolymer was obtained. This resin was hot-pressed at 220 ° C. using a hot-press forming machine to produce the substrate 101 of the antenna device 100. At this time, a copper foil of about 10 to 35 μm is simultaneously pressed on both surfaces of the substrate 101 to adhere the copper foil to the substrate surface.

The substrate 101 having the copper foil adhered to both sides obtained as described above is placed on a required portion through-hole electrode 11.
Holes are formed with a drill or the like for forming 3, 114, 123, and 124, and the holes are plated with copper. Note that since the present substrate does not contain glass cloth, holes can be formed by punching.

Thereafter, an etching resist is applied to the entire substrate 101 by spraying or the like. Next, exposure and etching are performed on the antenna element patterns 110 and 120, the ground conductor 130 pattern, the power supply sections 111 and 121 pattern, and the like formed on the plate by photolithography. If necessary, a protective film such as a resin is formed on the conductor pattern. However, the protective film is removed at locations where electrical connection is required so that the conductor pattern is exposed. Thus, the antenna device of the present embodiment is completed. At this time, the relative dielectric constant of the substrate was 2.59 in the 1 GHz band, and the dielectric loss (dielectric loss tangent tan δ) was 4.5 × 10 ⁻⁴ . The ratio of the sum of the number of carbon atoms and the number of hydrogen atoms of the substrate 101 is 99% or more.

The substrate 101 had an Izod impact value of 1 kg · cm / cm ² ,
There is no problem with the solder heat resistance of 0 ° C.

There is no problem in the processability of the substrate constituting the antenna device, and the bonding strength of the conductor pattern (copper foil) formed on the substrate surface is sufficiently strong.

In the present embodiment, the resin material used for the substrate 101 of the antenna device 100 does not include glass cloth or the like for lowering the dielectric constant. It is about 59. Thereby, the thickness of the substrate 101 can be reduced.

However, the strength is not a problem as compared with a substrate including a glass cloth used for the wiring substrate 101, and the thermal expansion of the substrate does not greatly affect the radiation efficiency and frequency characteristics of the antenna device. Did not. (Second Embodiment) FIG. 7 is a perspective view showing a second embodiment of the above-described antenna device according to the present invention, and FIG. 8 is an exploded perspective view showing its structure. The antenna device 200 shown in FIGS. 7 and 8 is an antenna device corresponding to two communication systems, in which antenna element patterns 210 and 220 are formed on one surface of a dielectric substrate 201 and substantially the entire surface is provided on the other surface. Is formed.

The antenna element patterns 210 and 220
Forms an inverted-F type antenna generally called, and has feed portions 211 and 221 and ground portions 212 and 222, respectively. The power supply units 211 and 221 are circuit elements for adjusting the impedance of a signal passing therethrough, such as a coil 213 and a capacitor 223 which are circuit elements.
Are formed on the dielectric substrate 201, and the through-hole electrodes 215, 2 electrically connect the front and back surfaces of the dielectric substrate 201 to each other.
25 land electrodes 214, 224.

The land electrodes 214 and 224 are connected to the electrodes 217 and 227 on the back surface of the dielectric substrate 201 by through-hole electrodes 215 and 225.
7 is connected by a connection electrode 218 on the back surface of the dielectric substrate 201, and the electrode 227 is connected to an electrode 228 serving as an input / output terminal. The electrode 228 serving as the input / output terminal is connected to a high-frequency circuit section of the mobile phone.

The grounding portions 212 and 222 are respectively provided with through-hole electrodes 216 and 216 formed on the dielectric substrate 201.
226 are connected to the ground conductor 230 respectively. The method of mounting the antenna device 200 on the mobile phone according to the second method according to the present invention is the same as the method according to the first embodiment, and a description thereof will be omitted.

The material of the dielectric substrate 201 and the method of manufacturing the same are also the same as those in the first embodiment, so that the description will be omitted. (Other Embodiments) Although the embodiments have been described above, the present invention can be implemented as follows. (1) In the first and second embodiments, the antenna device is mounted so as to cover the entire top plate portion of the shield case. However, the antenna device may be mounted so as to cover a part thereof. That is, for example, when the antenna device is smaller than the top plate of the shield housing, the portion not covered by the antenna device has the top plate made of the material of the shield housing itself. (2) In the first and second embodiments, the configuration of the antenna of the antenna device is described as an inverted-F antenna. However, the antenna device according to the present invention is not limited to the above configuration, and can be formed on a flat plate. An antenna device having a simple configuration may be used. (3) In the first embodiment, the signals of the power supply units 111 and 121 of the antenna device 100 are directly connected to the high-frequency circuit unit of the mobile phone, but the passband is adjusted as shown in FIG. 140 and 141 are provided on the substrate 101 constituting the antenna device 100 and
One of the ports of the filters 140 and 141 may be connected to the ports 11 and 121, respectively, and the other port of the filter may be connected to the high-frequency circuit section of the mobile phone through an electrode 128 serving as a common input / output terminal.

The filter is preferably provided on the side where the ground conductor 130 is formed. In FIG. 9, 14
Reference numerals 2 and 143 denote mounting portions of filters 140 and 141 provided on the back surface of the substrate 101, and electrodes 144, 145 and 146 denote electrodes provided on the back surface of the substrate 101 separately from the ground conductor 130, respectively. 121 and an electrode connected to the electrode 128. The filter may be formed in an electrode pattern on the substrate 101 depending on the frequency to be handled. If the filter is formed in the electrode pattern, the filter can be made thinner and can be mounted on a device. (4) Although the pattern width of the antenna element pattern provided for a plurality of communication systems handled in the first and second embodiments was not specified in detail, the pattern width of the antenna element pattern on the low frequency side was changed to the high frequency side. It is also possible to make the antenna element pattern wider than the pattern width of the antenna element pattern to avoid lowering the impedance of the antenna element pattern on the high frequency side. (5) The following configuration is also possible as a combination of other compositions of the substrate material of the antenna device.

In a stainless steel autoclave having a volume of 5 liters, 2500 g of pure water is added, and 2.5 g of polyvinyl alcohol is dissolved as a suspending agent. In this, polypropylene "J Alloy 15" was used as an olefin polymer.
0G "(trade name, manufactured by Nippon Polyolefin Co., Ltd.) 700
g, stir and disperse. Separately, 1.5 g of benzoyl peroxide as a radical polymerization initiator, 9 g of t-butylperoxymethacryloyloxyethyl carbonate as a radical polymerizable organic peroxide, and 300 g of styrene as a vinyl aromatic monomer were dissolved. This solution is poured and stirred into the autoclave.

Then, the autoclave is heated to 60 to 65 ° C. and stirred for 2 hours to impregnate the polypropylene with a vinyl monomer containing a radical polymerization initiator and a radically polymerizable organic peroxide. Then, when the temperature is 80-
The temperature is raised to 85 ° C. and maintained at that temperature for 7 hours to complete the polymerization. After filtration, washing and drying are performed to obtain a grafted precursor. Next, the grafting precursor is extruded at 200 ° C. with a Labo Plastomill single-screw extruder (manufactured by Toyo Seiki Seisaku-sho, Ltd.), and a grafting reaction is performed to obtain a graft copolymer. This is hot pressed to form a substrate. (6) The following configuration is also possible as a combination of other compositions of the substrate material of the antenna device.

In a stainless steel autoclave having a volume of 5 liters, 2500 g of pure water is added, and 2.5 g of polyvinyl alcohol is dissolved as a suspending agent. In this, polypropylene "J Alloy 15" was used as an olefin polymer.
0G "(trade name, manufactured by Nippon Polyolefin Co., Ltd.) 800
g was stirred and dispersed. Separately, 1.5 g of benzoyl peroxide as a radical polymerization initiator, 6 g of t-butylperoxymethacryloyloxyethyl carbonate as a radical polymerizable organic peroxide, 100 g of divinylbenzene, and 100 g of styrene as a vinyl aromatic monomer
Was dissolved in the above mixture, and this solution was charged into the autoclave and stirred. Next, the autoclave is set at 60-65.
C. and stirred for 2 hours to impregnate the polypropylene with a vinyl monomer containing a radical polymerization initiator and a radically polymerizable organic peroxide.

Next, the temperature is raised to 80 to 85 ° C., and the temperature is maintained for 7 hours to complete the polymerization, followed by washing and drying to obtain a graft precursor. Next, the grafting precursor is extruded at 200 ° C. with a Labo Plastomill single-screw extruder (manufactured by Toyo Seiki Seisaku-sho, Ltd.), and a grafting reaction is performed to obtain a graft copolymer. This is hot pressed to form a substrate. (7) In addition, the following configuration is also possible as a combination of other compositions of the substrate material of the antenna device.

Park Mill D was added to 1000 g of polyethylene “G401” (trade name, manufactured by Nippon Polyolefin Co., Ltd.).
After blending 10 g (trade name, manufactured by NOF Corporation),
Cylinder-screw diameter 30 set to 140 ° C
mm coaxial twin-screw extruder, and after extrusion, granulate to obtain a thermo-crosslinkable polyethylene resin. 2700 g of poly 4-methylpentene-1 "TPX RT18" (trade name, manufactured by Mitsui Petrochemical Industry Co., Ltd.) and 300 g of the heat-crosslinkable polyethylene resin are melt-mixed. The method of melt mixing is
After dry blending each resin, cylinder-temperature 260
The mixture is supplied to a coaxial twin-screw extruder having a screw diameter of 30 mm set at a temperature of ° C., followed by extrusion and granulation to obtain a resin. This is hot pressed to form a substrate.

[0134]

As described above, the present invention has the following effects.

According to the first aspect, since a plurality of antenna element patterns for radiating or receiving electromagnetic waves in a plurality of frequency bands are provided on the main surface of the dielectric substrate, the antenna device has a flat structure. In addition, it is possible to obtain an antenna which can cope with a plurality of communication systems and has higher radiation efficiency (reception sensitivity) than a conventional chip antenna in each frequency band. Further, since the antenna device is realized as a flat plate, an antenna device having high efficiency and capable of being built in the mobile phone housing can be obtained. According to claims 2 to 11, the following effects can be further obtained.

According to the second aspect, the ground conductor is provided on substantially the entire surface of the dielectric substrate of the antenna device opposite to the surface on which the antenna element pattern is formed. can get.

According to claim 3, each of the plurality of antenna element patterns has an independent power supply unit, and inputs and outputs signals from the plurality of power supply units. The circuit units can be connected in the same manner as in a single communication system.

According to the fourth aspect, a filter for passing each frequency band to each feeding section of the plurality of antenna element patterns is provided on a dielectric substrate constituting the antenna device, and a signal is transmitted through the filter. Since the input and output are performed, the removal performance of the signal outside the necessary band is improved, and the signal countermeasure of the unnecessary band in the high frequency circuit becomes easy.

According to the fifth aspect, since the filter is formed as a pattern on the dielectric substrate constituting the antenna device, the antenna device of the fourth aspect can be formed thin, and can be easily mounted on a device. Becomes

According to the sixth aspect, an impedance adjusting section for passing a signal in each frequency band is provided on each of the feed sections of the plurality of antenna element patterns on a dielectric substrate constituting the antenna apparatus. Since the signal is connected to one signal input / output unit via the impedance adjustment unit, only one connection is required, and assembly is simplified.

According to the seventh aspect, since the impedance adjusting section is formed as a pattern on the dielectric substrate constituting the antenna device, the antenna device according to the sixth aspect can be formed thin. Mounting to equipment becomes easy.

According to the eighth aspect, since the width of the radiation electrode pattern on the low frequency side of the plurality of electromagnetic wave radiation patterns is wider than that of the radiation electrode pattern on the high frequency side, the width is adapted to each frequency band. Impedance is obtained and efficiency is improved.

According to the ninth aspect, the antenna device constitutes a part or the whole of a top plate portion of a shield housing provided in a high-frequency circuit unit such as a wireless device. It can be incorporated as a part of a mobile phone, and the size of a mobile phone or the like does not need to be increased.

In the antenna device according to the tenth aspect, since the relative permittivity of the dielectric substrate constituting the antenna device is set to 5 or less, the thickness of the substrate constituting the antenna device can be reduced. Since the device is mounted, it is not necessary to increase the size of the mobile phone or the like.

In the antenna device according to the eleventh aspect, since the substrate material of the dielectric substrate is made of a low dielectric constant material made of only a resin material, the same effect as that of the tenth aspect is obtained, and the above-described substrate is used as the substrate. If a resin material such as a cross-linked, graft-polymerized, or block-polymerized structure is used, sufficient strength can be obtained and the dielectric constant can be reduced without containing glass cloth, and the substrate can be made thinner.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating a structure of an antenna device according to a first embodiment of the present invention and a method of using the same.

FIG. 2 is a diagram illustrating a structure of an antenna device according to a second embodiment of the present invention and a method of using the same.

FIG. 3 is a perspective view of a first embodiment of the antenna device according to the present invention.

FIG. 4 is an exploded perspective view illustrating the structure of the first embodiment of the antenna device according to the present invention.

FIG. 5 is a perspective view illustrating a mounting state of the antenna device of FIGS. 3 and 4 in a mobile phone according to the present invention.

FIG. 6A is a perspective view illustrating a state in which the antenna device according to the present invention is mounted on a high-frequency circuit unit included in a mobile phone, and FIG. 6B is a cross-sectional view thereof.

FIG. 7 is a perspective view of a second embodiment of the antenna device according to the present invention.

FIG. 8 is an exploded perspective view showing a second embodiment of the antenna device according to the present invention.

FIG. 9 is an exploded perspective view showing another embodiment of the antenna device according to the present invention.

FIG. 10 is a circuit block diagram of a mobile phone compatible with a plurality of communication systems in the related art, illustrating a case where a demultiplexing filter is used.

FIG. 11 is a circuit block diagram of a conventional mobile phone compatible with a plurality of communication systems, illustrating a case where a switch is used.

[Explanation of symbols]

10: distribution filter, 11, 12: duplexer (duplexer), 13, 15: transmission unit, 14, 16: reception unit, 17
-22: node, 23, 24: connection part, 30, 50, 1
00, 200: antenna device, 31, 33, 51, 5
3, 110, 120, 210, 220: antenna element pattern, 32, 34, 52, 54, 111, 121, 2,
11, 221: feeding unit, 35, 55, 101, 201:
Dielectric substrate, 40: mobile phone housing, 41: motherboard, 56, 57: input / output circuit, 58: input / output terminal, 6
1: System 1, 62: System 2, 130, 230:
Ground conductor, 140, 141: filter, 213: coil, 223: capacitor

Claims (11)

[Claims] 1. An antenna device comprising: a plurality of antenna element patterns for radiating or receiving electromagnetic waves in a plurality of frequency bands provided on a main surface of a dielectric substrate. 2. The antenna device according to claim 1, wherein a ground conductor is provided on substantially the entire surface of the dielectric substrate of the antenna device opposite to the surface on which the antenna element pattern is formed. Antenna device. 3. The antenna device according to claim 1, wherein each of the plurality of antenna element patterns has an independent feeder, and inputs and outputs signals from the plurality of feeders. Antenna device. 4. The antenna device according to claim 1, wherein each of the feeding portions of the plurality of antenna element patterns includes a filter for passing each frequency band. An antenna device provided on a dielectric substrate for inputting and outputting signals via the filter. 5. The antenna device according to claim 4, wherein the filter is formed as a pattern on a dielectric substrate constituting the antenna device. 6. The antenna device according to claim 1, wherein the plurality of antenna element patterns include an impedance adjustment unit for passing a signal of each frequency band to each feed unit. An antenna device provided on a dielectric substrate constituting the antenna device and connected to one signal input / output unit via the impedance adjustment unit. 7. The antenna device according to claim 6, wherein said impedance adjusting section is formed as a pattern on a dielectric substrate constituting said antenna device. 8. The antenna device according to claim 1, wherein the width of the radiation electrode pattern on the low frequency side of the plurality of electromagnetic wave radiation patterns is equal to the width of the radiation electrode pattern on the high frequency side. An antenna device characterized by having a wider width. 9. The antenna device according to claim 1, wherein said antenna device partially or entirely covers a top plate of a shield housing provided in a high-frequency circuit unit such as a wireless device. An antenna device comprising: 10. The antenna device according to claim 1, wherein a relative permittivity of a dielectric substrate constituting said antenna device is 5 or less. 11. The antenna device according to claim 1, wherein the substrate material of said dielectric substrate is made of a low dielectric constant material made of only a resin material. apparatus.