JPH11120629A - Production of optical information recording medium - Google Patents

Production of optical information recording medium

Info

Publication number
JPH11120629A
JPH11120629A JP27862897A JP27862897A JPH11120629A JP H11120629 A JPH11120629 A JP H11120629A JP 27862897 A JP27862897 A JP 27862897A JP 27862897 A JP27862897 A JP 27862897A JP H11120629 A JPH11120629 A JP H11120629A
Authority
JP
Japan
Prior art keywords
substrate
sputtering
film
thin
recording medium
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27862897A
Other languages
Japanese (ja)
Inventor
Haruo Kunitomo
晴男 国友
Kenji Kono
賢治 河野
Mitsutoshi Ogawa
光敏 小川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Chemical Corp
Original Assignee
Mitsubishi Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Chemical Corp filed Critical Mitsubishi Chemical Corp
Priority to JP27862897A priority Critical patent/JPH11120629A/en
Publication of JPH11120629A publication Critical patent/JPH11120629A/en
Pending legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To produce an optical disk having good characteristics without deformation with high productivity by forming a thin film by sputtering on a thin plastic substrate for an optical disk, and immediately after that, by blowing the film surface with a cooling gas. SOLUTION: A dye layer is formed, for example, by spin coating on the recording side of a thin substrate such as a polycarbonate having about 0.6 mm thickness. Then a reflection film of >=40 nm film thickness is formed by sputtering. Since the substrate is thin and the one surface of the substrate is exposed to radiation heat from a sputtering target or to plasma heat for sputtering discharge, the substrate can not endure the heat. It is found by detecting the substrate with several reflection type optical sensors, that the substrate produces warpage with several or more degrees just after films are formed. To stabilize the substrate, a nozzle is disposed near the substrate on the film forming side to blow a cooling gas from which dust is removed. The gas temp. is preferably 15 to 30 deg.C and the blowing rate is preferably 10 to 30 m/sec.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、光ディスクの製造
方法に関し、詳しくはデジタルビデオディスク(DV
D)等の製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing an optical disk, and more particularly, to a digital video disk (DV).
D) and the like.

【0002】[0002]

【従来の技術】従来、コンパクトディスク(CD)及び
追記型コンパクトディスク(CD−R)を製造する場
合、厚みが略1.2mmの基板の片面にアルミ合金、銀
あるいは金といった金属反射膜をスパッタ法により形成
せしめた後、その上に紫外線硬化樹脂からなる保護コー
ト剤をスピンコーティング法により塗布し、紫外線照射
により硬化せしめるのが一般的である。
2. Description of the Related Art Conventionally, when manufacturing a compact disc (CD) and a write-once compact disc (CD-R), a metal reflective film such as aluminum alloy, silver or gold is sputtered on one side of a substrate having a thickness of about 1.2 mm. After forming by a method, a protective coating agent made of an ultraviolet curable resin is generally applied thereon by a spin coating method and cured by irradiation with ultraviolet light.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、DVD
は薄肉の基板を貼り合わせた構造とされており、基板同
士を貼り合わせる工程の手前までは、厚さが略0.6m
mと薄い基板を取り扱わねばならず、成形工程から貼り
合わせ直前まで反りを抑制しつつ作業するのは大変困難
である。
SUMMARY OF THE INVENTION However, DVD
Has a structure in which thin substrates are bonded together, and has a thickness of approximately 0.6 m before the step of bonding the substrates.
It is necessary to handle substrates as thin as m, and it is very difficult to work while suppressing warpage from the molding process to immediately before bonding.

【0004】成形直後から生じる基板の反りを、反射膜
の形成あるいは紫外線硬化型樹脂を使用した保護コーテ
ィング工程で矯正するのは至難の技である。また、基板
が薄肉であることからスパッタリング時の加熱や紫外線
照射工程での加熱で、更に熱変形するということもあ
る。すなわち反射膜のスパッタリング成膜工程では膜が
形成される基板の片側面にスパッタリングターゲットか
らの輻射熱やスパッタ放電そのもののいわゆるプラズマ
熱が加わるため基板はそれらの熱に抗しきれず、スパッ
タリングによる成膜直後は数度以上の反りが容易に測定
される。
[0004] It is extremely difficult to correct the warpage of a substrate immediately after molding by forming a reflective film or a protective coating process using an ultraviolet curable resin. In addition, since the substrate is thin, the substrate may be further thermally deformed by heating during sputtering or heating in an ultraviolet irradiation step. In other words, in the sputtering film forming process of the reflective film, the radiant heat from the sputtering target and the so-called plasma heat of the sputter discharge itself are applied to one side of the substrate on which the film is formed. Is easily measured for warpage of several degrees or more.

【0005】また紫外線照射による紫外線硬化樹脂の硬
化工程にしても、基板の片面すなわち保護コーティング
が処された面に紫外線発生ランプからの輻射熱や紫外線
の吸収による基板の温度上昇が生じることにより、硬化
工程直後の基板は、スパッタ工程同様の大きな反りが観
られる。このように反りのある基板を搬送するのは容易
ではない。
[0005] Further, even in the curing step of an ultraviolet curable resin by irradiation of ultraviolet light, the temperature of the substrate rises due to the radiant heat from the ultraviolet ray generating lamp or the absorption of ultraviolet rays on one side of the substrate, that is, the surface on which the protective coating is applied. A large warpage similar to the sputtering process is observed on the substrate immediately after the process. It is not easy to transport a warped substrate.

【0006】通常ディスクはテーブルの回転やウオーキ
ングビーム等の手法によって搬送され、次工程に進む。
この時、各搬送ステージにおける基板の検知方法として
は、光センサーを用いて行うのが一般的であるが、基板
の反りが大きいと受光部に戻ってくる反射光の光量が不
足し、検知ミスが生じることがある。
[0006] Usually, the disk is conveyed by a method such as rotation of a table or a walking beam, and proceeds to the next step.
At this time, the method of detecting the substrate at each transport stage is generally performed using an optical sensor. However, if the substrate is warped excessively, the amount of reflected light returning to the light receiving unit is insufficient, and a detection error is detected. May occur.

【0007】すなわち反射膜の付いた基板を光で検知す
るには、透過光では、膜厚が大きい場合透過光量が小さ
くなり検知ミスの恐れがあるため通常は反射光を用いる
がこの時、基板の反りが大きいと、反射光は受光部から
外れた位置に進むため光量不足となり検知ミスが発生す
る。また加わった熱によって反った基板は温度低下と同
時に、元の形状に戻る可逆的現象が観察されるが、搬送
中に何らかの物理的な力が加わると、元の形状に戻らな
い非可逆的な現象が生じることがある。
That is, in order to detect a substrate provided with a reflective film with light, transmitted light is usually used because the amount of transmitted light is small when the film thickness is large and there is a risk of detection error. If the warpage is large, the reflected light travels to a position deviating from the light receiving unit, so that the amount of light becomes insufficient and a detection error occurs. In addition, a reversible phenomenon is observed in which the substrate warped due to the applied heat returns to its original shape at the same time as the temperature decreases, but if any physical force is applied during transport, it will not return to its original shape, and it will A phenomenon may occur.

【0008】すなわち基板の搬送は、一般的に内周部も
しくは外周部の非成膜領域を支持して突き上げたり、回
転させるなど物理的移動による力を基板に与えるが、D
VD用の0.6mm厚薄肉基板の場合は、熱によって生
じた反りが元に戻りつつある不安定な状態で、上記のよ
うな力が加わった場合、新たな歪みが生じるなどで反り
が元に戻らず変形することがある。
That is, when a substrate is transported, a force due to physical movement such as pushing up or rotating a non-film-forming region in the inner or outer periphery is generally applied to the substrate.
In the case of a 0.6 mm thick thin substrate for VD, the warpage caused by heat is returning to its original state, and when the above-mentioned force is applied, the warpage is caused by a new strain. It may be deformed without returning to.

【0009】[0009]

【課題を解決するための手段】本発明者らは上記問題点
を解決するために鋭意検討した結果、特に基板の変形の
大きいスパッタリング直後の基板の変形を良好に防止す
ることにより安定して光学的情報記録用媒体を製造し得
ることを見いだし、本発明を完成した。本発明の要旨
は、光ディスク用薄肉プラスチック基板スパッタリング
による薄膜を形成するに際し、スパッタリングにより薄
膜を形成後、膜面側に冷却ガスを吹き付けることを特徴
とする光学的情報記録用媒体の製造方法に存する。
Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, the present invention has succeeded in stably preventing the deformation of the substrate immediately after sputtering, in which the deformation of the substrate is large, thereby stably achieving an optical system. It has been found that a medium for recording information can be manufactured, and the present invention has been completed. The gist of the present invention resides in a method for manufacturing an optical information recording medium, characterized in that when forming a thin film by sputtering a thin plastic substrate for an optical disk, after forming the thin film by sputtering, a cooling gas is blown to the film surface side. .

【0010】[0010]

【発明の実施の形態】本発明に於いてプラスチック基板
としてはポリカーボネート、ポリメチルメタクリレー
ト、非晶質ポリオレフィン等の透明性に優れた熱可塑性
樹脂が用いられる。特にポリカーボネートが好適であ
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, a thermoplastic resin having excellent transparency, such as polycarbonate, polymethyl methacrylate, and amorphous polyolefin, is used as a plastic substrate. Particularly, polycarbonate is preferable.

【0011】基板の厚みとしては0.5mm以上0.7
mm以下程度の薄肉の基板が対象となる。DVD−Re
cordable(DVD−R)で通常用いられる基板
は0.58mm以上0.63mm未満のもので、基板の
形状は中心孔を有する円形であるが中心孔の径は、通常
15mm以上15.2mm未満とされる。また、基板の
直径としては119.7mm以上120.3mm以下と
される。
The thickness of the substrate is 0.5 mm or more and 0.7
The target is a thin substrate of about mm or less. DVD-Re
The substrate usually used in cordable (DVD-R) is 0.58 mm or more and less than 0.63 mm, and the shape of the substrate is a circle having a center hole, but the diameter of the center hole is usually 15 mm or more and less than 15.2 mm. Is done. The substrate has a diameter of 119.7 mm or more and 120.3 mm or less.

【0012】基板には、DVD−Rの場合は、例えばス
ピンコート法によって色素層が記録面側に形成される。
この場合の色素としては、630〜660nmの波長の
光を吸収することにより分解する色素が好んで用いら
れ、例えばシアニン系、フタロシアニン系、アゾ系とい
った色素が用いられる。スパッタリングによって形成さ
れる反射膜の種類としては、金、銀、アルミニウム及び
これらを主成分とする合金が挙げられる。
In the case of a DVD-R, a dye layer is formed on the recording surface of the substrate by, for example, a spin coating method.
As the dye in this case, a dye that decomposes by absorbing light having a wavelength of 630 to 660 nm is preferably used. For example, a dye such as a cyanine-based, phthalocyanine-based, or azo-based dye is used. Examples of the type of the reflective film formed by sputtering include gold, silver, aluminum, and alloys containing these as main components.

【0013】反射膜の膜厚としては40nm以上が好ま
しい。基板が薄肉であることからスパッタリング時の加
熱により、基板が変形する。すなわち反射膜のスパッタ
リング成膜工程では膜が形成される基板の片側面にスパ
ッタリングターゲットからの輻射熱やスパッタ放電その
もののいわゆるプラズマ熱が加わるため基板はそれらの
熱に抗しきれず、スパッタリングによる成膜直後は数度
以上の反りが容易に観測される。
The thickness of the reflection film is preferably 40 nm or more. Since the substrate is thin, the substrate is deformed by heating during sputtering. In other words, in the sputtering film forming process of the reflective film, the radiant heat from the sputtering target and the so-called plasma heat of the sputter discharge itself are applied to one side of the substrate on which the film is formed. Is easily observed warpage of several degrees or more.

【0014】このため、基板を安定化する必要があり、
本発明では、この安定化のために基板に冷却ガスを吹き
付ける。基板成膜面側に吹き付けるガスの種類としては
窒素、アルゴンといった不活性ガスや空気が好ましい
が、ダストを含まないことが重要である。そのためにコ
ンマ数ミクロンの大きさの埃を除去するフィルターを通
過させたガス(クリーンガス)が好ましく用いられる。
Therefore, it is necessary to stabilize the substrate,
In the present invention, a cooling gas is blown to the substrate for this stabilization. An inert gas such as nitrogen or argon or air is preferable as a type of gas blown to the substrate film forming surface side, but it is important that dust is not included. For this purpose, a gas (clean gas) passed through a filter for removing dust having a size of a few microns is preferably used.

【0015】ダストが成膜面に付着した場合、通常ダス
ト付着エリアの記録信号は、信号再生時にエラーとなる
ため、ダストは十分少ない状態で製造する必要がある。
ここでガスの吹き付け方法としてはできるだけノズルと
基板の距離が小さい方が冷却効果が高く好ましい。ガス
の温度としては、通常15℃〜30℃である。
When dust adheres to the film formation surface, a recording signal in an area where dust normally adheres causes an error at the time of signal reproduction. Therefore, it is necessary to manufacture dust in a sufficiently small state.
Here, as the gas spraying method, it is preferable that the distance between the nozzle and the substrate is as small as possible because the cooling effect is high. The temperature of the gas is usually 15 ° C to 30 ° C.

【0016】ガスは冷却器を用いて室温より低くするの
が好ましいが、低過ぎると基板が急激に収縮し、非可逆
的変形をもたらすることがあるため好ましくない。また
ガスの温度が高過ぎた場合は、冷却能力が不足し、反り
が元に戻らないまま次のステーションに移動してしまう
ため好ましくない。ガスの吹き付け速度としては、5〜
50m/秒が通常の範囲である。
The gas is preferably cooled below room temperature by using a cooler. However, if the temperature is too low, the substrate shrinks rapidly, which may cause irreversible deformation. If the temperature of the gas is too high, the cooling capacity is insufficient, and the gas moves to the next station without returning to its original state, which is not preferable. As the gas blowing speed,
50 m / sec is a normal range.

【0017】好ましくは10〜30m/秒である。風速
が上記範囲より小さい場合冷却能力が小さすぎ、反りを
戻す効果があまり発揮されない。逆に、吹き付け速度を
上記範囲を超えるほど大きくしても、効果はあまり変わ
らない。
Preferably, the speed is 10 to 30 m / sec. If the wind speed is lower than the above range, the cooling capacity is too small, and the effect of returning the warp is not so much exhibited. Conversely, even if the blowing speed is increased beyond the above range, the effect does not change much.

【0018】むしろ製造装置内のダストを巻き上げ基板
を汚染することがあり好ましくない。スパッタリングに
より昇温した基板を搬送する搬送ステージに基板検知用
の反射型光センサーを複数個設置するのが良い。反射膜
の付いた基板を光で検知するには、透過光では、膜厚が
大きい場合透過光量が小さくなり検知ミスの恐れがある
ため通常は反射光を用いるが、スパッタリングにより昇
温した基板は反りが大きいので、反射光は受光部から外
れた位置に進むため光量不足となり検知ミスが発生す
る。従って、搬送ステージに基板検知用の反射型光セン
サーを複数個設置するのが良い。
[0018] Rather, dust in the manufacturing apparatus may be rolled up and contaminate the substrate, which is not preferable. It is preferable to provide a plurality of reflective optical sensors for detecting a substrate on a transfer stage for transferring a substrate heated by sputtering. In order to detect a substrate with a reflective film with light, when the transmitted light is too thick, the amount of transmitted light is small and there is a risk of detection error. Since the warp is large, the reflected light proceeds to a position deviated from the light receiving unit, and thus the amount of light is insufficient, and a detection error occurs. Therefore, it is preferable to provide a plurality of reflective optical sensors for detecting a substrate on the transfer stage.

【0019】基板検知用の光センサーとは、例えば赤色
光を出射及び受光する部品構成を有し、出射部と受光部
が一体化したものや、分離したものなどあるが前者の場
合は検知対象の物体に反射した光を受ける方式である。
対して後者は例えば透明性の基板の検知のために、通常
出射部と受光部が基板を挟むように対峙して設置され
る。
An optical sensor for detecting a substrate has, for example, a component configuration for emitting and receiving red light, and includes an integrated portion and a separated portion of an emitting portion and a light receiving portion. This is a method of receiving light reflected on an object.
On the other hand, for the latter, for example, for detection of a transparent substrate, the light-emitting portion and the light-receiving portion are usually arranged to face each other with the substrate interposed therebetween.

【0020】また紫外線照射による紫外線硬化樹脂の硬
化工程にしても、基板の片面すなわち保護コーティング
が処された面に紫外線発生ランプからの輻射熱や紫外線
の吸収による基板の温度上昇が生じ、硬化工程直後の基
板は、スパッタ工程同様の大きな反りが観測される。従
って、この硬化工程直後の搬送ステージにも基板検知用
の反射型光センサーを複数個設置するのが良い。
In the curing process of the ultraviolet curable resin by the irradiation of ultraviolet rays, the temperature of the substrate rises due to the radiation heat from the ultraviolet ray generating lamp or the absorption of the ultraviolet rays on one surface of the substrate, that is, the surface on which the protective coating is applied. A large warpage similar to the sputtering process is observed for the substrate. Therefore, it is preferable to provide a plurality of reflection-type optical sensors for detecting a substrate on the transfer stage immediately after the curing step.

【0021】[0021]

【実施例】以下に、実施例を示すが、本発明は、その要
旨を越えない限り以下の実施例に限定されるものではな
い。 実施例1 光学的情報記録用媒体を製造する装置の反射層用スパッ
タリング槽の搬出側ディスク搬送ステージにエアーブロ
ーノズルを設置し、スパッタ直後の搬送ステージ上の基
板に25℃・20m/秒のエアーを吹き付けるようにし
た。また、キーエンス社製ディスク検出センサー(長距
離限定反射型 PS−49)も2個設置した。
EXAMPLES Examples will be shown below, but the present invention is not limited to the following examples without departing from the gist of the invention. Example 1 An air blow nozzle was installed on the unloading side disk transfer stage of a sputtering tank for a reflective layer of an apparatus for manufacturing an optical information recording medium, and air at 25 ° C. and 20 m / sec was applied to the substrate on the transfer stage immediately after sputtering. Was sprayed. In addition, two Keyence disk detection sensors (long-distance limited reflection type PS-49) were also installed.

【0022】基板には略80nmの金反射膜がスパッタ
リングにより成膜されており、ディスクの成膜面が冷却
されるようノズル位置が調整されている。金反射膜の成
膜前後(スパッタリングの前後)におけるTangen
tialTiltのσ値の変化量はr=40mmにおい
て0.001度であり、冷却の効果が認められた。
An approximately 80 nm gold reflection film is formed on the substrate by sputtering, and the nozzle position is adjusted so that the film formation surface of the disk is cooled. Tangen before and after deposition of gold reflective film (before and after sputtering)
The amount of change in the σ value of tialTilt was 0.001 degrees at r = 40 mm, and the cooling effect was recognized.

【0023】ここでσは以下の式で定義される。 σ=√[{nΣX2−(ΣX)2}/{n(n−1)}] n:データの個数 X:データ自身 センサーでの検知ミスは100枚搬送中一枚も無かっ
た。 比較例1 実施例1においてエアーブローを行わなかったことを除
いて同等の試験を行ったところ、金の成膜前後における
Tangential Tiltのσ値の変化量はr=
40mmにおいて0.007度であった。また100枚
搬送中検知ミスは一枚も無かった。 比較例2 実施例1においてセンサーを1個にしたところ100枚
搬送中スパッタ後の搬送ステージにおいて3枚検出不能
エラーが発生し、ラインが一時停止した。
Here, σ is defined by the following equation. σ = {[{n} X 2 − ({X) 2 } / {n (n−1)}] n: Number of data X: Data itself There was no detection error in the sensor during transport of 100 sheets. Comparative Example 1 The same test was performed as in Example 1 except that air blowing was not performed, and the change in the σ value of the Tangential Tilt before and after gold deposition was r =
It was 0.007 degrees at 40 mm. There was no detection error during transport of 100 sheets. Comparative Example 2 When one sensor was used in Example 1, an error in which three sheets could not be detected occurred on the transfer stage after sputtering during transfer of 100 sheets, and the line was temporarily stopped.

【0024】[0024]

【発明の効果】本発明の製造方法により変形がなく、良
好な特性を有する光学的情報記録用媒体を生産性高く製
造できる。
According to the manufacturing method of the present invention, an optical information recording medium having good characteristics without deformation can be manufactured with high productivity.

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 光ディスク用薄肉プラスチック基板にス
パッタリングによる薄膜を形成するに際し、スパッタリ
ングにより薄膜を形成後、膜面側に冷却ガスを吹き付け
ることを特徴とする光学的情報記録用媒体の製造方法。
1. A method for manufacturing an optical information recording medium, comprising: forming a thin film on a thin plastic substrate for an optical disk by sputtering, followed by blowing a cooling gas on the film surface side after forming the thin film by sputtering.
【請求項2】 スパッタリングにより昇温した基板を搬
送する搬送ステージに基板検知用の反射型光センサーを
複数個設置したことを特徴とする請求項1に記載の光学
的情報記録用媒体の製造方法。
2. The method for manufacturing an optical information recording medium according to claim 1, wherein a plurality of reflective optical sensors for detecting a substrate are provided on a transfer stage for transferring a substrate heated by sputtering. .
JP27862897A 1997-10-13 1997-10-13 Production of optical information recording medium Pending JPH11120629A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27862897A JPH11120629A (en) 1997-10-13 1997-10-13 Production of optical information recording medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27862897A JPH11120629A (en) 1997-10-13 1997-10-13 Production of optical information recording medium

Publications (1)

Publication Number Publication Date
JPH11120629A true JPH11120629A (en) 1999-04-30

Family

ID=17599934

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27862897A Pending JPH11120629A (en) 1997-10-13 1997-10-13 Production of optical information recording medium

Country Status (1)

Country Link
JP (1) JPH11120629A (en)

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