JPH11118877A - Ic testing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC testing device capable of enhancing yields. SOLUTION: An IC testing device has a contact block 1 sucking an IC 2, a pressure sensor 3 detecting the pressure applied to the IC 2 and then outputting the detection result as a pressure detection signal Sp, a contact arm 5 moving the contact block 1 in the direction of the arrow X via the contact arm 5, an IC socket 6 to which the IC 2 is attached, and a CPU 7 controlling each part of the device. The CPU 7 controls and drives a stepping motor 4 so that the pressure obtainable from the pressure detection signal Sp equals the proper pressure.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an integrated circuit (IC).
(Circuit Circuit) for testing electrical characteristics.

[0002]

2. Description of the Related Art In recent years, BGA (Ball Grid Array) type IGAs have been developed due to the miniaturization of ICs built in various electronic devices as their size has been reduced.
C is used. This BGA type IC is a QFP (quad flat package) type IC in which spherical solders (hereinafter, referred to as balls) are arranged in an array on the back surface of a printed wiring board, and these are used instead of leads. It has the advantage of being more compact.

In the process of manufacturing a BGA type IC (hereinafter simply referred to as an IC), the IC which has been completely assembled is used.
An IC test apparatus is used for performing an electrical characteristic test of an IC after inserting it into an IC socket. The IC test apparatus includes a contact block for adsorbing an IC, an IC socket disposed below the contact block, a stepping motor for moving the contact block in the direction of the IC socket, and an IC for controlling the IC via the IC socket. And an IC tester for testing the characteristic.

In the above configuration, when the stepping motor is driven while the IC is attracted to the contact block, the ball bump of the IC is inserted into the contact pin of the IC socket with a constant pressing force. Next, the electrical characteristics of the IC are tested by an IC tester.

[0005]

The conventional IC
In the test apparatus, the ball bump is inserted into the contact pin with a constant pressing force regardless of the thickness of the IC. However, in the conventional IC test apparatus, when the thickness tolerance of the IC is large, even if the ball bump is inserted into the contact pin with a constant pressing force, a poor contact between the ball bump and the contact pin due to insufficient pressing force. As a result, there is a problem that the yield is deteriorated. On the other hand, in the conventional IC test apparatus, if the pressing force is too high, the ball bumps are crushed by the repulsive force of the contact pins, and the yield is deteriorated due to poor appearance. The present invention has been made under such a background, and an object of the present invention is to provide an IC test apparatus capable of improving the yield.

[0006]

According to a first aspect of the present invention, there is provided an IC socket in which an IC is mounted, pressing means for inserting the IC into the socket with a predetermined pressing force, and
Pressing force detecting means for detecting the pressing force acting on C;
And a control unit for controlling the driving of the pressing unit until an appropriate pressing force which does not cause a contact failure between the IC and the socket and the detection result of the pressing force detection result coincide with each other. According to a second aspect of the present invention, in the IC test apparatus according to the first aspect, there is provided a thickness detecting unit for detecting a thickness of the IC, and the control unit is configured to connect the IC with the socket. The driving control of the pressing unit is performed until an appropriate pressing force according to the detection result of the thickness detecting unit and a detection result of the pressing force detection result, at which no contact failure occurs between them, match. According to a third aspect of the present invention, there is provided the IC test apparatus according to the first or second aspect, further comprising: a test unit that performs an electrical characteristic test on the IC via the IC socket. If the test result of the test means is a contact failure while the proper pressing force is acting on the IC, detection of the limit pressing force at which the ball bump of the IC does not collapse and the pressing force detection result are detected. It is characterized in that the driving of the pressing means is further controlled until the result matches.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION

<First Embodiment> An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a block diagram showing the configuration of the IC test apparatus according to the first embodiment of the present invention. In this figure, reference numeral 1 denotes a contact block for adsorbing a BGA type IC2. 3 is contact block 1 and IC
2 is a pressure sensor interposed therebetween, detects a pressing force applied to IC2, and outputs a detection result as a pressing force detection signal Sp.
Output as

Reference numeral 4 denotes a stepping motor provided above the contact block 1,
The contact block 1 is moved in the arrow X direction shown in FIG. At the tip of the contact arm 5,
A contact block 1 is attached. 6 denotes an IC disposed below the contact block 1 (IC2).
The IC 2 is mounted on the IC socket 6. That is, the contact pins of IC2
C2 ball bumps are inserted.

Reference numeral 7 denotes a CPU (central processing unit) for controlling each unit of the apparatus. The operation of the CPU 7 will be described later in detail. Reference numeral 8 denotes a first memory for storing data of an appropriate pressing force to be applied to the IC 2 when the IC 2 is mounted on the IC socket 6 (hereinafter, referred to as appropriate pressing force data Dt). Here, the above-mentioned appropriate pressing force is a pressing force of such a magnitude that no contact failure occurs between the ball bump and the contact pin when the IC 2 having the average thickness is mounted on the IC socket 6. . Further, the appropriate pressing force data Dt is data obtained in advance by an experiment or the like.

Reference numeral 9 denotes a ball-crush limit pressing force data Dg.
This is a second memory for storing (> appropriate pressing force data Dt). Here, the above-mentioned ball crush limit pressure data Dg
Means data on the limit value of the pressing force at which the ball bump of the IC 2 is not broken. That is, the ball bump of the IC 2 is not crushed by the pressing force of the above limit value. Reference numeral 10 denotes an IC tester that performs an electrical characteristic test on the IC 2 mounted on the IC socket 6.

Next, the operation of the IC test apparatus according to the first embodiment will be described. In FIG. 1, the CPU
When the drive signal Sm is output from the step 7 to the stepping motor 4, the stepping motor 4 is driven to rotate, and the contact arm 5, the contact block 1 and the IC 2 are gradually moved downward in FIG. When the IC 2 contacts the pressure sensor 3, a pressing force acts on the IC 2. This pressing force is detected by the pressure sensor 3, and the pressure sensor 3
From the CPU 7 detects the pressing force detection signal Sp
Output to Then, as the pressing force increases, IC2
Are inserted into the contact pins of the IC socket 6. That is, the insertion depth of the ball bump increases.

Then, the CPU 7 generates a pressing force detection signal Sp.
When the pressing force obtained from the above corresponds to the appropriate pressing force obtained from the appropriate pressing force data Dt, the output of the drive signal Sm is stopped. As a result, the driving of the stepping motor 4 is stopped, and an appropriate pressing force acts on the IC 2.

Next, when a test start signal is output from the CPU 7 to the IC tester 10, the IC tester 10 performs an electrical characteristic test of the IC 2 via the IC socket 6. And
The IC tester 10 performs another test when the continuity test of the IC 2 is good, that is, when there is no poor contact between the ball bumps of the IC 2 and the contact pins of the IC socket 6.

However, the continuity test of the IC 2 is defective,
That is, when a contact failure occurs between the ball bump of the IC 2 and the contact pin of the IC socket 6, the IC tester 10 temporarily stops the test and then outputs a contact failure signal to C.
Output to PU7. Thereby, the CPU 7 outputs the drive signal Sm to the stepping motor 4 until the pressing force obtained from the pressing force detection signal Sp matches the pressing force of the limit value obtained from the ball pressing limit pressing data Dg.

As a result, a pressing force equal to or more than the proper pressing force acts on the IC 2. When the pressing force acting on the IC 2 matches the limit value obtained from the ball-crushing limit pressing force data Dg, the CPU 7 stops driving the drive signal Sm and sends a test start signal to the IC tester 10 again. Output. Thereby, the IC tester 10 again
A continuity test is performed on the IC 2 via the IC socket 6.

As described above, according to the IC test apparatus according to the first embodiment described above, the IC
Since the ball bump is inserted into the contact pin of the IC socket 6, the contact failure can be prevented, and the yield can be improved. Further, according to the IC test apparatus according to the first embodiment described above, since the pressing force larger than the ball crush limit pressing force does not act on the ball bump, it is possible to prevent the crush of the pop bump due to the excessive pressing force, As a result, the effect that the yield can be improved can be obtained.

<Second Embodiment> FIG. 2 is a block diagram showing the configuration of an IC test apparatus according to a second embodiment of the present invention. In this figure, parts corresponding to the respective parts in FIG. 1 are denoted by the same reference numerals, and description thereof is omitted. In FIG. 2, a laser displacement gauge 11 is newly provided.
The content stored in the first memory 8 is the first memory 8 shown in FIG.
Is different from the stored contents.

The laser displacement meter 11 shown in FIG. 2 detects the thickness of the IC 2 and outputs the detection result as a thickness detection signal S.
Output to the CPU 7 as t. Further, the first memory 8 stores appropriate pressing force data Dt of a plurality of appropriate pressing forces corresponding to a plurality of thicknesses of the plurality of ICs 2. The plurality of appropriate pressing force data Dt are data obtained in advance through experiments and the like.

Next, the operation of the IC test apparatus according to the second embodiment will be described. In FIG. 2, first,
The laser displacement meter 11 outputs a thickness detection signal St indicating the thickness of the IC 2 to the CPU 7. This allows the CPU
7 reads out from the first memory 8 the thickness detection data Dt corresponding to the thickness obtained from the thickness detection signal St.

Next, when the drive signal Sm is output from the CPU 7 to the stepping motor 4, the stepping motor 4
Is rotated, and the ball bumps of the IC 2 are inserted into the contact pins of the IC socket 6 with the increase in the pressing force on the IC 2 through the above-described operation. That is, the insertion depth of the ball bump increases.

Then, the CPU 7 generates a pressing force detection signal Sp.
When the pressing force obtained from the above corresponds to the appropriate pressing force obtained from the appropriate pressing force data Dt, the output of the drive signal Sm is stopped. As a result, the driving of the stepping motor 4 is stopped, and an appropriate pressing force acts on the IC 2.

Next, when a test start signal is output from the CPU 7 to the IC tester 10, the IC tester 10 performs an electrical characteristic test of the IC 2 via the IC socket 6. here,
If the continuity test of the IC 2 is defective, that is, if a contact failure occurs between the ball bumps of the IC 2 and the contact pins of the IC socket 6, the IC tester 10 temporarily stops the test and then outputs a contact failure signal to the CPU 7. . Accordingly, the CPU 7 outputs the drive signal Sm to the stepping motor 4 until the pressing force obtained from the pressing force detection signal Sp matches the pressing force of the limit value obtained from the ball crush limit pressing data Dg.

As a result, a pressing force equal to or more than the proper pressing force acts on IC2. Then, when the pressing force acting on the IC 2 matches the limit value obtained from the ball-crushing limit pressing force data Dg, the CPU 7 stops driving the driving signal Sm and performs a test in the same manner as the above-described operation. The start signal is output to the IC tester 10 again.

As described above, according to the IC test apparatus according to the second embodiment described above, since the appropriate pressing force data Dt suitable for the thickness of the IC 2 is used, the contact failure can be further reduced. As a result, the yield can be further improved.

[0025]

As described above, according to the first aspect of the present invention, since an appropriate pressing force that does not cause a contact failure to the IC is applied, the yield can be improved. can get. According to the second aspect of the present invention, since an appropriate pressing force is applied to the IC according to the thickness of the IC, it is possible to reduce poor contact due to the difference in thickness, and to reduce the yield. The effect of being able to further improve is obtained. Further, claim 3
According to the invention described in (1), since a pressing force larger than the limit pressure at which the ball is not crushed acts on the ball bump of the IC, the crushing of the pop bump due to the excessive pressing force can be prevented, and the yield can be reduced. The effect of being able to improve is obtained.

[Brief description of the drawings]

FIG. 1 is a block diagram illustrating a configuration of an IC test apparatus according to a first embodiment of the present invention.

FIG. 2 is a block diagram showing a configuration of an IC test apparatus according to a second embodiment.

[Explanation of symbols]

 Reference Signs List 1 contact block 2 IC 3 pressure sensor 4 stepping motor 5 contact arm 6 IC socket 7 CPU 8 first memory 9 second memory 10 IC tester 11 laser displacement meter

Claims (3)

[Claims] 1. An IC socket in which an IC is mounted, pressing means for inserting the IC into the socket with a predetermined pressing force, pressing force detecting means for detecting the pressing force acting on the IC, and the IC An IC test apparatus comprising: a control unit that controls the driving of the pressing unit until an appropriate pressing force that does not cause a contact failure between the socket and the socket matches a detection result of the pressing force detection result. . 2. The apparatus according to claim 1, further comprising: a thickness detecting unit configured to detect a thickness of the IC, wherein the control unit detects a result of the thickness detecting unit that prevents a contact failure between the IC and the socket. 2. The IC test apparatus according to claim 1, wherein the control unit controls the driving of the pressing unit until a corresponding appropriate pressing force matches the detection result of the pressing force detection result. 3. A test means for performing an electrical characteristic test on the IC via the IC socket, wherein the control means controls the test means while the proper pressing force is acting on the IC. If the test result is a contact failure, the pressing means is further driven and controlled until the pressing force at the limit value at which the ball bump of the IC does not collapse and the detection result of the pressing force detection result coincide with each other. The IC test apparatus according to claim 1.