JPH11116923A - Rubber-based pressure-sensitive adhesive composition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a rubber-based pressure-sensitive adhesive compsn. improved in adhesive power, initial tackiness, and shearing stress by compounding an elastomer component comprising a natural rubber and/or a polyisoprene rubber and a block copolymer having styrene polymer blocks and isoprene polymer blocks with a thermally reactive phenol resin and a polyisocyanate compd. SOLUTION: An elastomer component in an amount of 100 pts.wt., comprising 20-90 wt.% rubber consisting of a natural rubber and/or a polyisoprene rubber having a Mooney viscosity [ML1+4 (100 deg.C)] of 20-120 and 80-10 wt.% block copolymer consisting of 50-10 wt.% styrene polymer blocks and 50-90 wt.% isoprene polymer blocks is compounded with 2-40 pts.wt. thermally reactive phenol resin, 0.1-60 pts.wt., pref. 0.5-30 pts.wt., polyisocyanate compd., and if necessary 8-200 pts.wt., pref. 20-100 pts.wt. tackifier.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a rubber-based pressure-sensitive adhesive composition and, more particularly, to reduce metal contamination and is therefore advantageous for fixing abrasives such as polishing cloths and polishing pads in the manufacture of semiconductor devices and the like. The present invention relates to a rubber-based pressure-sensitive adhesive composition which can be used for a pressure-sensitive adhesive. Therefore, the pressure-sensitive adhesive composition of the present invention is used for fixing an abrasive to be used on a surface plate of a polishing apparatus when polishing a surface of a wafer or an integrated circuit (IC) in a process of manufacturing a semiconductor device. When used, the adhesive can provide sufficient adhesive strength, initial adhesive strength, and shear stress for fixing the abrasive, and can easily remove the fixed abrasive, and further, due to the use of the composition. The object to be polished is not contaminated with metal.

[0002]

2. Description of the Related Art Conventionally, in the manufacture of semiconductor devices, the operation of polishing the surface of a silicon wafer, an IC, or the like with an abrasive is often performed. Here, the abrasive is, for example, a soft or viscoelastic abrasive cloth, for example, artificial leather,
It is a polishing pad or the like, and is used by being fixed to a polishing plate made of stainless steel or the like of a polishing apparatus. In order to fix the abrasive to the surface plate, a double-sided tape, for example, a double-sided tape in which an acrylic adhesive is applied to a substrate or a double-sided tape in which a rubber-based adhesive is applied to a substrate is usually used. The properties required of double-sided tape for applying abrasives or similar adhesives include, for example, appropriate adhesiveness to various adherends, excellent initial adhesiveness, and high shear during polishing. Abrasion resistance (sometimes in the presence of heat generated during polishing) and the ability to peel off the abrasive with an appropriate force without leaving adhesive residue when peeling. Also, as a recent trend, in consideration of the fact that the presence of a small amount of metal or the like has a great effect on the characteristics of semiconductor devices, the used abrasive should not contain substances that may cause contamination of metal or the like. Is eagerly awaited. However, conventional double-sided tapes for attaching abrasives have not yet sufficiently satisfied many requirements imposed thereon. In addition, other adhesives and adhesive tapes using it,
When used for the purpose of attaching abrasives as described above, they cannot be used satisfactorily without problems.

[0003] For example, JP-A-6-158008 discloses a rubber-based elastomer having a double bond, a heat-reactive phenol resin, and an organometallic compound such as a metal alcoholate and / or a chelated metal alcohol as a crosslinking catalyst. Patent Document 1 discloses a pressure-sensitive adhesive composition characterized by containing a rate, and a pressure-sensitive adhesive tape formed by forming the composition on one or both surfaces of a support. This pressure-sensitive adhesive composition can exhibit excellent adhesive strength and cohesive strength, not only at normal temperature but also at high temperature, so that an adhesive tape using the same can be used, for example, when soldering a printed circuit board. Can be advantageously used as a masking tape. However, when this adhesive tape is used for the purpose of attaching an abrasive, the metal of the organometallic compound used as a catalyst contaminates the abrasive, and it is not possible to avoid adverse effects on the characteristics of the semiconductor device to be manufactured. .

[0004] Japanese Patent Application Laid-Open No. Hei 7-126590 discloses that
Adhesive force, in order to improve the cohesive force without lowering the adhesive force, natural rubber or polyisoprene rubber as a main component, a specific aliphatic petroleum-based tackifying resin and terpene phenol-based tackifying resin for this. A rubber-based pressure-sensitive adhesive composition characterized by being blended is disclosed. Although this adhesive composition is noteworthy in that it can obtain a remarkably excellent balance of adhesive strength, adhesive strength and cohesive strength, further improvements in adhesive properties are required in view of the purpose of attaching abrasives. Can be In the case of this adhesive composition, it is not necessary to use a metal compound at the time of its preparation, so that contamination of the abrasive can be avoided.

Further, JP-A-7-278509 discloses that the weight average molecular weight is 100,000 to 500,000.
A rubber-based hot melt pressure-sensitive adhesive formed by mixing a rubber and a tackifying resin is applied to a substrate, and a method for producing a rubber-based pressure-sensitive adhesive tape, which comprises irradiating the pressure-sensitive adhesive layer with an electron beam, is disclosed. ing. When this method is used, effects such as simplification of the production process because no solvent is used, and good preservability and coatability since no crosslinking agent is added can be obtained. However, this adhesive tape also does not sufficiently satisfy the required adhesive properties such as holding power in view of the purpose of attaching the abrasive, and the crosslinking of rubber molecules depends on electron beam irradiation. However, an increase in manufacturing cost due to the introduction of an electron beam irradiation device or the like cannot be avoided.

[0006]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems of the prior art, and in particular, to fix an abrasive used in the manufacture of a semiconductor device to a surface plate of a polishing apparatus. It is intended to be used for, sufficient adhesion strength is obtained even immediately after attaching to the abrasive,
When used in the form of an adhesive tape, an improved pressure-sensitive adhesive composition capable of peeling the tape without adhesive residue when the tape is peeled off and having no possibility of metal contamination on a wafer, an IC, etc. To provide.

[0007]

According to the present invention, there is provided an elastomer component comprising a natural rubber and / or a polyisoprene rubber and a block copolymer having a styrene polymer block and an isoprene polymer block. A rubber-based pressure-sensitive adhesive composition containing a tackifier comprising a heat-reactive phenol resin, wherein 20 to 90% by weight of the total amount of the elastomer component is the natural rubber and / or polyisoprene rubber; and 80 to 10% by weight of the total amount of the elastomer component is the block copolymer, and 2 to 40 parts by weight based on 100 parts by weight of the elastomer component is the heat-reactive phenol resin. This can be achieved by a rubber-based pressure-sensitive adhesive composition further comprising an isocyanate compound. .

In the adhesive composition according to the present invention, a block copolymer having a styrene polymer block and an isoprene polymer block, a natural rubber and / or a polyisoprene rubber are used without using a metal compound as a component of the system. The mixture is used as a base polymer, and a tackifier made of a heat-reactive phenol resin is further blended with the mixture to carry out a crosslinking reaction to constitute an adhesive composition. The adhesive composition thus obtained has a predetermined adhesive force required for fixing the abrasive during polishing of a silicon wafer, an IC, and the like, which is the object of the present invention, and excellent initial adhesive force, cohesive force, and the like. It has removability. Further, since the adhesive composition further contains a polyisocyanate compound, it is possible to provide an adhesive composition having improved cohesive strength and an excellent balance of properties.

Further, according to another aspect of the present invention,
The rubber-based pressure-sensitive adhesive composition of the present invention is characterized by being coated on one or both surfaces of a substrate, and particularly a silicon wafer, an adhesive tape useful for fixing an abrasive when polishing an IC or the like. Provided.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION As described above, a rubber-based pressure-sensitive adhesive composition according to the present invention comprises a natural rubber and / or a polyisoprene rubber and a block copolymer having a styrene polymer block and an isoprene polymer block. An elastomer component containing coalescing is used as a main component. here,
The natural rubber and the polyisoprene rubber can be used as they are, or those which are modified as necessary, for example, which are generally used in rubber-based adhesive compositions. For example, natural rubber may be synthetic or crosslinked. Natural rubber and / or polyisoprene rubber are used in order to obtain a good balance between excellent cohesive strength and adhesive strength.
_When defined at _{1 + 4} (100 ° C.), it is preferably in the range of 20 to 120. In order to obtain a Mooney viscosity in such a range, the natural rubber and the polyisoprene rubber may be used alone, or may be used by mixing both at an appropriate ratio. If the Mooney viscosity is less than 20, the resulting adhesive composition has a small cohesive force,
On the other hand, when it exceeds 120, the adhesive strength becomes small.

The block copolymer used in combination with natural rubber and / or polyisoprene rubber to constitute the elastomer component is, as described above, a block copolymer having a styrene polymer block and an isoprene polymer block. Polymer (hereinafter also referred to as "SIS")
It is. SIS reduces the amount of tackifiers (also referred to as tackifier resins) that have been used in large amounts in conventional adhesive compositions, in particular, to achieve high adhesion with less use of tackifiers. It is effective for Also, SIS
Is also known in the art as a rubber-based elastomer and is readily available commercially.
Commercially available SIS includes, for example, "Clayton 1107" (trade name) manufactured by Shell Chemical Company. In SIS, the two components constituting it, namely, the mixing ratio of the styrene polymer block and the isoprene polymer block are as follows:
It can be varied widely as long as it does not adversely affect the purpose of use as described above. The blending amount of the styrene polymer block is usually 5 based on the total amount of SIS.
It is 0 to 10% by weight, preferably 30 to 10% by weight. The amount of the isoprene polymer block is usually 50 to 90% by weight, preferably 70 to 90% by weight, based on the total amount of SIS.

[0012] In the elastomer component constituting the adhesive composition of the present invention, usually 20 to 90% by weight of the total amount thereof
Is the natural rubber and / or polyisoprene rubber and 80 to 10% by weight of the block copolymer, SIS
It is. The natural rubber and / or polyisoprene rubber is preferably 20 to 80% by weight, more preferably 30 to 70% by weight, while SIS is
Preferably it is 80 to 20% by weight, more preferably 70 to 30% by weight. Here, when the ratio of SIS to the total of the elastomer component is less than 10% by weight, S
If the effect of adding IS is lost, and if it exceeds 80% by weight, the removability is reduced.

According to the present invention, in order to obtain a high shearing force and a holding force in the obtained adhesive composition and to enhance heat resistance and insulation properties, a pressure-sensitive adhesive comprising a heat-reactive phenol resin is further added to the above-mentioned elastomer component. An imparting agent is blended. The heat-reactive phenol resin that can be used as the tackifier herein is not particularly limited. For example, p-alkylphenol, p-allylphenol, resol-type phenol resin such as p-terpenephenol, or a modified product thereof. Is included. These heat-reactive phenolic resins may be used alone or as a mixture of two or more resins. These resins are commercially easily available, and examples thereof include, for example, "Tack roll 201", "Tack roll 250-1", "Tack roll 250-11", and "Tack roll 5000" manufactured by Sumitomo Chemical Co., Ltd. (All trade names), "Sumilite Resin PR-22193" (trade name) manufactured by Sumitomo Durez Co., Ltd., and "Quinton C-100" (trade name) manufactured by Zeon Corporation.

The amount of the heat-reactive phenol resin to be added to the elastomer component can be widely varied as long as the desired effect is not impaired. The range is 40 parts by weight, preferably 5 to 30 parts by weight, more preferably 8 to 25 parts by weight.
If the amount of the heat-reactive phenolic resin is less than 2 parts by weight, the cohesive strength becomes insufficient. On the other hand, if it exceeds 40 parts by weight, the cohesive strength becomes too high and the adhesive strength is extremely reduced. become.

The rubber-based pressure-sensitive adhesive composition according to the present invention may optionally contain, in addition to the above-mentioned tackifier comprising a heat-reactive phenol resin, other conventional tackifiers. You may. The use of such an additional tackifier is particularly effective in obtaining a high adhesive strength and improving heat resistance. Examples of suitable additional tackifiers include, but are not limited to, those listed below, rosin-based resins, polyterpene-based resins, aliphatic-based petroleum resins, aromatic-based petroleum resins, cumarone-indene-based resins. Resins, terpene phenol resins, styrene resins, alkylphenol resins and the like are included. These additional tackifiers may be used alone or as a mixture of two or more resins.

The amount of such an additional tackifier with respect to the elastomer component can be varied widely as long as the desired effect is not impaired. However, the natural rubber and / or SIS of the elastomer component can be used. Although it is restricted by the type and compounding ratio, the type of the thermoreactive phenol resin which is the main tackifier,
Usually, 8 to 20 parts by weight per 100 parts by weight of the elastomer component
It is in the range of 0 parts by weight, preferably in the range of 20 to 100 parts by weight. When the amount of the additional tackifier is less than 8 parts by weight, the adhesive strength is reduced, and when the amount exceeds 200 parts by weight,
Cohesive strength and adhesive strength decrease.

In the rubber-based pressure-sensitive adhesive composition according to the present invention, a tackifier comprising the above-mentioned elastomer component, a thermoreactive phenol resin, and an additional tackifier, particularly for the purpose of improving cohesive strength. It is essential to add a polyisocyanate compound in addition to the agent. Examples of polyisocyanate compounds that can be advantageously used herein include, but are not limited to, those listed below.
Other isocyanate adducts such as tolylene diisocyanate, diphenylmethane diisocyanate, diphenyl ether diisocyanate, hexamethylene diisocyanate or these isocyanate compounds and a formula R-OH (wherein R is a monovalent, aromatic, alicyclic or aliphatic And a block compound obtained by reacting the compound with the compound of formula (I). These polyisocyanate compounds may be used alone or as a mixture of two or more compounds.

The amount of the polyisocyanate compound to be added to the elastomer component can be widely varied as long as the desired effect is not impaired. 60 parts by weight, preferably 0.5-3
The range is 0 parts by weight. If the blending amount of the polyisocyanate compound is less than 0.1 part by weight, the intended purpose cannot be improved in cohesive strength, and if it exceeds 60 parts by weight, the adhesive strength and the adhesive strength are reduced. .

Further, the rubber-based pressure-sensitive adhesive composition according to the present invention may contain a conventional additive, if necessary, as generally used in this technical field. Examples of suitable additives include, for example, softeners such as petroleum softeners such as process oils and vegetable oil softeners such as tall oil, fillers such as clay, coloring agents such as pigments, antioxidants, Antioxidants, plasticizers, surfactants, thickeners and others can be mentioned.

The rubber-based pressure-sensitive adhesive composition of the present invention can be prepared using techniques commonly used in this technical field. Generally, the adhesive composition of the present invention can be prepared by mixing and kneading the various components described above in an arbitrary mixing order. Appropriate mixing equipment or kneading equipment, such as a high-speed mixer, a kneader, a homomixer, and a planetary mixer. More specifically, for example, natural rubber and / or polyisoprene rubber and SI
After dissolving S and the heat-reactive phenol resin in an appropriate organic solvent, a crosslinking reaction is carried out under high temperature and high pressure, and then the obtained elastomer solution is added with a tackifier other than the heat-reactive phenol resin and other The desired adhesive composition can be obtained by mixing, sufficiently mixing and kneading the additives. According to another method, instead of dissolving various components in an organic solvent to prepare an elastomer solution, a form such as an aqueous dispersion or a paste may be applied.

Although the rubber-based pressure-sensitive adhesive composition of the present invention can be used in various forms generally practiced in this technical field, it is preferable that
It can be used in the form of an adhesive tape. A preferred pressure-sensitive adhesive tape is constituted so as to include a substrate and the adhesive composition of the present invention coated on one or both surfaces thereof.
Suitable substrates include, but are not limited to, those commonly used in adhesive tapes, such as polyester films, polymer films such as polyimide films, paper, woven fabrics, nonwoven fabrics, and metal foils. ,
Others can be mentioned. Further, examples of suitable coating apparatuses include a knife coater, a bar coater, a roll coater, a die coater, and the like.
In the obtained pressure-sensitive adhesive tape, the thickness of the pressure-sensitive adhesive layer composed of the adhesive composition of the present invention can be widely changed depending on the use of the pressure-sensitive adhesive tape and other factors, but is usually about 10 to 10. 100 μm.

Although the pressure-sensitive adhesive composition of the present invention and the pressure-sensitive adhesive tape prepared using the same can be used for bonding purposes in various fields, the preferred field of application is in the field of semiconductor device manufacturing. Yes, and above all,
This is a field of fixing a polishing cloth, a polishing pad, and the like used in a polishing process. The operation of fixing a polishing cloth, a polishing pad, or the like to a surface plate of a polishing apparatus using the adhesive composition or the adhesive tape of the present invention can be performed according to a generally performed operation.

[0023]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail with reference to embodiments.
I will tell. The present invention is not limited to these examples.
Please understand that it is not.Example 1 Kneading natural rubber (pale crepe) with mixing roll
And Mooney viscosity ML _{1 + 4}Element whose (100 ° C) is 60
A kneaded rubber was prepared. Next, 60 parts by weight of mastication
System, 40 parts by weight of SIS, Shell
1107 "(trade name), 60 parts by weight of terpene-based adhesive
Ys resin Px1 made by Yashara Chemical Co., Ltd.
000 "(trade name) and 20 parts by weight of polymerized rosin-based adhesive
Granted resin, Rika Hercules Co., Ltd.
(Trade name) was dissolved in 400 parts by weight of toluene.
After uniformly dissolving the above components, 15
Parts by weight of heat-reactive phenolic resin, manufactured by Hitachi Chemical
Add “Hitanol 2500” (trade name) and add a reaction vessel
The crosslinking reaction was allowed to take place within 90 minutes. Pressure sensitive bonding
A solution of the agent composition was obtained.

Next, the solution of the pressure-sensitive adhesive composition obtained in the above step is applied on a 25 μm-thick polyethylene terephthalate film so that the film thickness after drying becomes 40 μm, and the solution is applied at 70 ° C. for 5 minutes. It was dried by heating. The desired pressure-sensitive adhesive tape was obtained. Example 2 The procedure described in Example 1 was repeated. However, in this example, a polyisocyanate compound as an additional component,
"Coronate L" (trade name) manufactured by Nippon Polyurethane Co., Ltd. was blended in the pressure-sensitive adhesive composition in an amount of 5 parts by weight. The desired pressure-sensitive adhesive tape was obtained. Example 3 The procedure described in Example 2 was repeated. However, in this example, the natural rubber was increased from 60 parts by weight to 80 parts by weight,
Also, the SIS was reduced from 40 parts by weight to 20 parts by weight.
The desired pressure-sensitive adhesive tape was obtained. Example 4 The procedure described in Example 2 was repeated. However, in this example, the natural rubber was reduced from 60 parts by weight to 20 parts by weight,
The SIS was increased from 40 parts by weight to 80 parts by weight.
The desired pressure-sensitive adhesive tape was obtained. Comparative Example 1 The method described in Example 1 was repeated. However, in this example, SIS was not used for comparison.

100 parts by weight of natural rubber (pale crepe) and 20 parts by weight of zinc white “special No. 3” are kneaded with a mixing roll to give a Mooney viscosity ML _{1 + 4} (100 ° C.) of 60.
Was prepared. Then, 120 parts by weight of masticated rubber, 60 parts by weight of a terpene-based tackifying resin, "Ys resin Px1000" (trade name) manufactured by Yashara Chemical Co., and 20 parts by weight of a polymerized rosin-based tackifying resin, manufactured by Rika Hercules "Polypale resin" (product name)
Was dissolved in 400 parts by weight of toluene. After uniformly dissolving the above components, 15 parts by weight of a heat-reactive phenol resin, "Hitanol 2" manufactured by Hitachi Chemical Co., Ltd. was added to the obtained solution.
500 "(trade name) and a crosslinking reaction was carried out in a reaction vessel for 75 minutes. A solution of the pressure sensitive adhesive composition was obtained.

Next, the solution of the pressure-sensitive adhesive composition obtained in the above step is applied on a 25 μm-thick polyethylene terephthalate film so that the film thickness after drying becomes 40 μm, and the resultant is applied at 70 ° C. for 5 minutes. It was dried by heating. A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 2 The procedure described in Comparative Example 1 was repeated. However, in this example, the zinc white “* 3” was not used in the preparation of the masticated rubber. A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 3 The method described in Comparative Example 2 was repeated. However, in this example, the reaction time was extended from 75 minutes to 150 minutes.
A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 4 The method described in Comparative Example 2 was repeated. However, in this example, the amount of the terpene-based tackifying resin was increased from 60 parts by weight to 80 parts by weight. A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 5 The procedure described in Comparative Example 2 was repeated. However, in this example, the blending amount of the thermoreactive phenol resin was increased from 15 parts by weight to 20 parts by weight. A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 6 The procedure described in Example 1 was repeated. However, in this example, for comparison, the natural rubber was increased from 60 parts by weight to 90 parts by weight, and the SIS was reduced from 40 parts by weight to 10 parts by weight. A pressure-sensitive adhesive tape for comparison was obtained. Comparative Example 7 The procedure described in Example 1 was repeated. However, in this example, for comparison, the natural rubber was reduced from 60 parts by weight to 10 parts by weight, and the SIS was increased from 40 parts by weight to 90 parts by weight. A pressure-sensitive adhesive tape for comparison was obtained. Test for evaluating the properties of the pressure-sensitive adhesive tape For each of the pressure-sensitive adhesive tape prepared in Examples 1 to 4 and the pressure-sensitive adhesive tape for comparison prepared in Comparative Examples 1 to 7, the adhesive force, the holding force, and the adhesive force (tack) were measured. Characteristics) and a metal content were subjected to characteristic evaluation tests. The procedure of each test is as follows. Measurement of adhesion: Measurement was performed according to the guidelines described in JIS Z-0237. SU with 25mm width test adhesive tape
The adhesive force (g / 25 mm width) was measured when the sample was adhered to a stainless steel plate of S-430 and peeled at a temperature of 20 ° C. at a peeling angle of 180 ° and a speed of 30 cm / min. Measurement of holding force: Two test tapes were prepared, and the adhesive surfaces of each tape were stuck together in an area of 9 mm × 12 mm. In an atmosphere of 40 ° C, one end of one test tape was
The load (kg) was applied, and the time (minutes) from when the adhesive state was released to when the test tape dropped was measured up to 500 minutes. Measurement of adhesive strength: A plate with a smooth surface and no tackiness is arranged at an angle of 24 degrees with respect to the horizontal plane, and the test tape is fixed on the surface of the inclined plate and the subsequent horizontal plane with the adhesive side up. did. Next, a wheel made of Delrin (trade name: acetal resin) having a diameter of 81.3 mm and a width of 19 mm from a height of 130 mm (height from the horizontal surface to the adhesive surface) was rolled on the adhesive surface of the test tape, The test tape was rolled on the adhesive surface on a horizontal surface. From the ground point of the wheel, that is, where the inclined plate meets the horizontal plane,
The distance (mm) to the position where the rolling wheel stopped was measured using a ruler, and used as a measure of the adhesive force (tackiness). Measurement of metal content: metal elements Al and C contained in the pressure-sensitive adhesive compositions prepared in the respective Examples and Comparative Examples
d, Co, Cr, Cu, Fe, Mn, Ni, Pb, S
Quantitative analysis of n, V and Zn was performed by ICP (Inductivity Coup).
led Plasma) emission analysis. Regarding the content of metal elements, those whose total amount is 100 ppm or less are acceptable (OK), and those that exceed 100 ppm are not acceptable (NG)
And

The results of the above evaluation tests are shown in Table 1 below. In this table, the compositions of the pressure-sensitive adhesive compositions prepared in the respective Examples and Comparative Examples are also shown for reference.

[0028]

[Table 1]

As can be seen from the results shown in Table 1 above, in Example 1, the metal compound was crosslinked with the thermoreactive phenol resin in the absence of the metal compound catalyst. Comparable favorable results could be obtained when using a catalyst. That is, in Example 1, as a result of blending SIS in an appropriate amount, good results were obtained in all of the adhesive force, the holding force, and the adhesive force, and at that time, a large decrease in productivity was caused. There was nothing. Further, since the metal is not contained in the adhesive composition of Example 1, even if the pressure-sensitive adhesive tape prepared therefrom is used for fixing the abrasive during polishing of the semiconductor device, no problem of metal contamination is caused. Was.

In Example 2, a polyisocyanate compound was further added to the adhesive composition prepared in Example 1, so that the holding power could be particularly improved.
At that time, it was possible to obtain sufficiently satisfactory adhesive strength and adhesive strength. Furthermore, in Examples 3 and 4, since each component was blended in the stated amount and further a polyisocyanate compound was blended, it was possible to obtain the adhesive strength, the holding power and the adhesive strength in a well-balanced form.

In contrast to the good results obtained in Examples 1 to 4, in Comparative Example 1, although there is no particular problem in terms of the adhesive performance, metal contamination is present, so that metal contamination is possible. Sex could not be dispelled. Also,
In Comparative Examples 2 to 6, insufficient adhesive strength was recognized, and in Comparative Example 7, problems of poor removability and poor holding power due to excessively high adhesive strength occurred.

[0032]

As described above, according to the present invention, there is little metal contamination, and therefore, a rubber which can be advantageously used for fixing a polishing material such as a polishing pad or a polishing pad in the manufacture of a semiconductor device or the like. A pressure-sensitive adhesive composition can be provided. Therefore, the pressure-sensitive adhesive composition of the present invention is used for fixing an abrasive to be used on a surface plate of a polishing apparatus when polishing a surface of a wafer or an integrated circuit (IC) in a process of manufacturing a semiconductor device. When used, it can provide sufficient adhesive strength, initial adhesive strength, and shear stress for fixing the abrasive, and it is easy to remove the fixed abrasive, and the abrasive itself Is not contaminated with metal.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI C09J 175/04 C09J 175/04

Claims (2)

[Claims] 1. A rubber containing an elastomer component containing a natural rubber and / or a polyisoprene rubber, a block copolymer having a styrene polymer block and an isoprene polymer block, and a tackifier made of a thermoreactive phenol resin. In the pressure-sensitive adhesive composition, 20 to 90% by weight of the total amount of the elastomer component is the natural rubber and / or polyisoprene rubber, and 80 to 10% by weight of the total amount of the elastomer component is the block copolymer weight. The elastomer component 1
The rubber-based pressure-sensitive adhesive composition, wherein the amount of the heat-reactive phenol resin is 2 to 40 parts by weight based on 00 parts by weight, and the composition further comprises a polyisocyanate compound. 2. The rubber-based pressure-sensitive adhesive composition according to claim 1, wherein the amount of the polyisocyanate compound is 0.1 to 60 parts by weight based on 100 parts by weight of the elastomer component.