JPH11111706A - Material supplying equipment - Google Patents

Material supplying equipment

Info

Publication number
JPH11111706A
JPH11111706A JP28913397A JP28913397A JPH11111706A JP H11111706 A JPH11111706 A JP H11111706A JP 28913397 A JP28913397 A JP 28913397A JP 28913397 A JP28913397 A JP 28913397A JP H11111706 A JPH11111706 A JP H11111706A
Authority
JP
Japan
Prior art keywords
inert gas
liquid
raw material
gas
vaporizer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP28913397A
Other languages
Japanese (ja)
Other versions
JP3533513B2 (en
Inventor
Kuniaki Horie
邦明 堀江
Tsutomu Nakada
勉 中田
Hidenao Suzuki
秀直 鈴木
Hiroyuki Kamiyama
浩幸 上山
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ebara Corp
Original Assignee
Ebara Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ebara Corp filed Critical Ebara Corp
Priority to JP28913397A priority Critical patent/JP3533513B2/en
Priority to US08/974,512 priority patent/US6195504B1/en
Priority to TW086117253A priority patent/TW565626B/en
Priority to EP97120370A priority patent/EP0849375B1/en
Priority to KR1019970061338A priority patent/KR100507961B1/en
Priority to DE69722359T priority patent/DE69722359T2/en
Publication of JPH11111706A publication Critical patent/JPH11111706A/en
Priority to US09/663,358 priority patent/US6282368B1/en
Priority to US09/662,897 priority patent/US6269221B1/en
Application granted granted Critical
Publication of JP3533513B2 publication Critical patent/JP3533513B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To improve the vaporization efficiency, by melting an inert gas into a liquid material, and thereafter heating the liquid material to a temperature equal to or greater than its vaporizing temperature so as to vaporize it. SOLUTION: In inert gas melting means 30, an inert gas is introduced into a liquid material container 12 from a pressurized gas introducing pipe 32, thereby melting the inert gas into a liquid material 10 stored in the container 12. The pressurized material 10 is sent to a vaporizer 14 at a flowrate set by a mass flow controller 34. The material 10 is exposed to a low pressure by the vaporizer 14, and is sequentially vaporized while heated by the heating section of the vaporizer 14. Since the amount of inert gas dissolved decreases with increasing temperature, the inert gas is separated. Since the inert gas is separated within the material 10, the generation of turbulances in the material 10 is promoted, causing the material 10 to come in contact with the heating walls, and decreasing the partial pressure of a material gas in the vaporizer 14 so as to promote the vaporization. As a result, the vaporization efficiency is improved.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、原料供給装置に係
り、特に、チタン酸バリウム/ストロンチウム等の高誘
電体又は強誘電体薄膜を基板上に気相成長させる気相成
長装置に使用される原料供給装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a raw material supply apparatus, and more particularly to a raw material supply apparatus for use in a vapor growth apparatus for growing a high dielectric or ferroelectric thin film such as barium titanate / strontium on a substrate. The present invention relates to a raw material supply device.

【0002】[0002]

【従来の技術】近年、半導体産業における集積回路の集
積度の向上はめざましく、現状のメガビットオーダか
ら、将来のギガビットオーダを睨んだDRAMの研究開
発が行われている。かかるDRAMの製造のためには、
小さな面積で大容量が得られるキャパシタ素子が必要で
ある。このような大容量素子の製造に用いる誘電体薄膜
として、誘電率が10以下であるシリコン酸化膜やシリ
コン窒化膜に替えて、誘電率が20程度である五酸化タ
ンタル(Ta25)薄膜、あるいは誘電率が300程度で
あるチタン酸バリウム(BaTiO3)、チタン酸ストロン
チウム(SrTiO3)又はこれらの混合物であるチタン酸
バリウムストロンチウム等の金属酸化物薄膜材料が有望
視されている。
2. Description of the Related Art In recent years, the degree of integration of integrated circuits in the semiconductor industry has been remarkably improved, and research and development of DRAMs from the current megabit order to the future gigabit order have been conducted. To manufacture such a DRAM,
A capacitor element that can obtain a large capacity with a small area is required. A tantalum pentoxide (Ta 2 O 5 ) thin film having a dielectric constant of about 20, instead of a silicon oxide film or a silicon nitride film having a dielectric constant of 10 or less, as a dielectric thin film used for manufacturing such a large-capacity element. Also, metal oxide thin film materials such as barium titanate (BaTiO 3 ), strontium titanate (SrTiO 3 ) having a dielectric constant of about 300, or barium strontium titanate which is a mixture thereof are considered to be promising.

【0003】このような素材の成膜を行なう方法とし
て、化学気相成長(CVD)が有望とされており、この
場合、最終的に成膜室内で原料ガスを基板に安定的に供
給する必要がある。原料ガスは、常温で固体のBa(D
PM)2 ,Sr(DPM)2 などを液状化し、さらに気化
特性を安定化するためにテトラヒドロフラン(THF)
などの有機溶剤を混合させたものを加熱して気化するよ
うにしている。
As a method for forming such a material, chemical vapor deposition (CVD) is promising. In this case, it is necessary to supply a source gas stably to a substrate in a film formation chamber. There is. The raw material gas is Ba (D
To liquefy PM) 2 , Sr (DPM) 2, etc., and to further stabilize the vaporization characteristics, tetrahydrofuran (THF)
A mixture of such organic solvents is heated and vaporized.

【0004】図8に示すのはこのような気相成長装置の
一例であり、液体原料10を貯蔵する液体原料容器12
と、液体原料容器12の液体原料10の液面をHe等の
非溶解性のガスで加圧する加圧装置18と、該加圧装置
18により液体原料配管16を介して送られた液体原料
を加熱し気化する気化器14とを備えている。気化器1
4で加熱気化させた原料ガスは、原料ガス配管22を介
して成膜室20に供給され、一定の温度に加熱した基板
Wに噴射されてその表面に金属酸化物薄膜を気相成長さ
せる。成膜室20内の反応後のガスは真空ポンプ24等
で真空排気されている。
FIG. 8 shows an example of such a vapor phase growth apparatus, in which a liquid source container 12 for storing a liquid source 10 is provided.
A pressurizing device 18 for pressurizing the liquid surface of the liquid raw material 10 in the liquid raw material container 12 with a non-soluble gas such as He, and a liquid raw material sent through the liquid raw material pipe 16 by the pressurizing device 18. And a vaporizer 14 for heating and vaporizing. Vaporizer 1
The source gas heated and vaporized in 4 is supplied to the film forming chamber 20 through the source gas pipe 22, and is injected to the substrate W heated to a certain temperature to vapor-grow a metal oxide thin film on the surface thereof. The gas after the reaction in the film forming chamber 20 is evacuated by a vacuum pump 24 or the like.

【0005】ここにおいて、気化器14で円滑な気化を
行い、また気化した原料ガスをスムーズに成膜室20に
送るため、気化器14の上流側に不活性ガス導入管26
を接続して気化器14にAr等の不活性ガスを導入して
いる。これにより、原料ガスの気化器14内の分圧を低
下させて液体原料の蒸発を促進するようにしている。
Here, in order to perform smooth vaporization in the vaporizer 14 and to smoothly send the vaporized source gas to the film forming chamber 20, an inert gas introduction pipe 26 is provided upstream of the vaporizer 14.
And an inert gas such as Ar is introduced into the vaporizer 14. Thereby, the partial pressure of the source gas in the vaporizer 14 is reduced to promote the evaporation of the liquid source.

【0006】[0006]

【発明が解決しようとする課題】しかしながら、上記の
ような従来の技術においては、気化器で導入される不活
性ガスが逆に液体原料と気化器の加熱壁の間の接触を妨
げるように作用し、意図したような気化効率の向上とい
う効果を得ることができないといった問題があった。
However, in the prior art as described above, the inert gas introduced into the vaporizer acts to prevent contact between the liquid source and the heating wall of the vaporizer. However, there is a problem that the intended effect of improving the vaporization efficiency cannot be obtained.

【0007】本発明は上記に鑑み、気化過程で原料ガス
の分圧を下げて、効率的に気化を促進できるようにした
原料供給装置を提供することを目的とする。
SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to provide a raw material supply apparatus capable of lowering the partial pressure of a raw material gas in a vaporization process so as to efficiently promote vaporization.

【0008】[0008]

【課題を解決するための手段】請求項1に記載の発明
は、液体原料に不活性ガスを溶解させるガス溶解部と、
前記液体原料を気化温度以上に加熱して気化させる気化
部と、前記液体原料を、溶解ガスを溶存させた状態で前
記ガス溶解部から前記気化部まで供給する液体原料供給
配管を有することを特徴とする原料供給装置である。
According to the first aspect of the present invention, there is provided a gas dissolving section for dissolving an inert gas in a liquid raw material,
A vaporizer for heating the liquid raw material to a temperature higher than the vaporization temperature to vaporize the liquid raw material, and a liquid raw material supply pipe for supplying the liquid raw material from the gas dissolving part to the vaporizing part in a state in which a dissolved gas is dissolved. Is a raw material supply device.

【0009】これにより、気化部において液体原料が加
熱されると、原料の気化と同時に、溶解度が低下して不
活性ガスが分離される。気化とガスの分離とはほぼ同じ
ところで起きるので、原料ガスの分圧が確実に低下し、
また、液体原料と加熱部との接触を妨害することもな
く、気化効率を向上させることができる。
Thus, when the liquid raw material is heated in the vaporization section, the raw material is vaporized and at the same time, the solubility is reduced and the inert gas is separated. Since vaporization and gas separation occur at almost the same place, the partial pressure of the raw material gas is surely reduced,
Further, the vaporization efficiency can be improved without hindering the contact between the liquid raw material and the heating unit.

【0010】請求項2に記載の発明は、前記ガス溶解部
において前記不活性ガスの圧力を6kgf/cm2G以上とす
ることを特徴とする請求項1に記載の原料供給装置であ
る。
[0010] The invention according to claim 2 is the raw material supply apparatus according to claim 1, wherein the pressure of the inert gas in the gas dissolving section is set to 6 kgf / cm 2 G or more.

【0011】請求項3に記載の発明は、前記液体原料供
給配管と前記気化部の間に圧力遮断手段を設けたことを
特徴とする請求項1に記載の原料供給装置である。これ
により、気化器の直前まで、あるいは気化器内が原料の
保通あるいは冷却部と加熱部(気化部)に分かれている
ような場合においてその加熱部直前まで不活性ガスの溶
解を維持し、気化器で一気に分離させることにより、気
化効率を向上させる。
The invention according to claim 3 is the raw material supply apparatus according to claim 1, wherein a pressure cutoff means is provided between the liquid raw material supply pipe and the vaporizing section. In this way, the dissolution of the inert gas is maintained until immediately before the vaporizer, or in the case where the inside of the vaporizer is separated into a cooling section and a heating section (vaporization section) for keeping the raw material or just before the heating section, The vaporization efficiency is improved by being separated at a stretch by a vaporizer.

【0012】請求項4に記載の発明は、前記ガス溶解部
に、液体原料と不活性ガスの接触を促進する気液接触機
構を設けたことを特徴とする請求項1に記載の原料供給
装置である。気液接触機構としては、液体内で不活性ガ
スをバブリングさせる、液体を撹拌する、液体を不活性
ガス中で噴霧する等の手段が考えられる。
According to a fourth aspect of the present invention, in the gas supply unit, the gas dissolving section is provided with a gas-liquid contact mechanism for promoting contact between the liquid raw material and the inert gas. It is. As the gas-liquid contact mechanism, means such as bubbling an inert gas in the liquid, stirring the liquid, and spraying the liquid in the inert gas can be considered.

【0013】[0013]

【発明の実施の形態】以下、本発明の実施の形態を図面
を参照して説明する。図1は、本発明の第1の実施の形
態を示すもので、液体原料10を貯蔵する液体原料容器
12には、内部の液体原料10中に不活性ガスを溶解さ
せる不活性ガス溶解手段30が設けられている。液体原
料容器12の下流側には気化器14、成膜室20とが、
それぞれ液体原料配管16、原料ガス配管22でそれぞ
れ連結されている。気化器14は、液体原料の気化温度
以上でに加熱される加熱部を有しており、これは、例え
ば、多孔質体や細管の壁などの形態を採る。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows a first embodiment of the present invention. A liquid material container 12 for storing a liquid material 10 has an inert gas dissolving means 30 for dissolving an inert gas in the liquid material 10 therein. Is provided. On the downstream side of the liquid source container 12, a vaporizer 14 and a film forming chamber 20 are provided.
They are connected by a liquid source pipe 16 and a source gas pipe 22, respectively. The vaporizer 14 has a heating unit that is heated at a temperature equal to or higher than the vaporization temperature of the liquid raw material, and takes a form of, for example, a porous body or a thin tube wall.

【0014】不活性ガス溶解手段30は、加圧ガス導入
管32から液体原料容器12内に、例えば6kgf/cm2
以上に加圧したN2やAr等の不活性ガスを導入するよ
うに構成されている。気体の液体中への溶解量は気体の
圧力に比例し、温度に反比例する。従って、低温の液体
原料容器において不活性ガスに加える圧力を調整するこ
とにより、液体原料10中への溶解量を調節することが
できる。
The inert gas dissolving means 30 is, for example, 6 kgf / cm 2 G from the pressurized gas introducing pipe 32 into the liquid raw material container 12.
The pressurized inert gas such as N 2 or Ar is introduced. The amount of gas dissolved in a liquid is proportional to gas pressure and inversely proportional to temperature. Therefore, by adjusting the pressure applied to the inert gas in the low-temperature liquid source container, the amount dissolved in the liquid source 10 can be adjusted.

【0015】液体原料配管16には、MFC(マス・フ
ロー・コントローラ)34が設置され、このMFC34
の下流側には、開閉弁36とオリフィス38または逆止
弁が液体原料10の流れ方向に沿って順次配置されてい
る。MFC34は、開度の設定に従い決まる一定流量の
液体原料を下流側に流す自動弁であり、その2次側のオ
リフィス38あるいは逆止弁等によりその上流側は一定
圧力以上が保持されており、不活性ガスが液体原料10
から分離しない非分離領域を構成している。不活性ガス
が早期に分離すると、ガスが凝集してしまい、本発明の
意図する効果が薄れてしまう。
An MFC (mass flow controller) 34 is installed in the liquid raw material pipe 16.
An on-off valve 36 and an orifice 38 or a check valve are sequentially arranged along the flow direction of the liquid raw material 10 on the downstream side of. The MFC 34 is an automatic valve for flowing a liquid material of a constant flow rate determined according to the setting of the opening degree to the downstream side. Inert gas is liquid source 10
, And constitutes a non-separable region that is not separated from. If the inert gas is separated at an early stage, the gas will aggregate and the intended effect of the present invention will be diminished.

【0016】次に、上記実施の形態の作用について説明
する。不活性ガス溶解手段30において、加圧ガス導入
管32から不活性ガスを例えば6kgf/cm2G 以上の高圧
で液体原料容器12内に導入することによって、液体原
料容器12内に貯蔵された液体原料10中にAr等の不
活性ガスが溶解する。不活性ガスは、液体原料10中に
均一に溶解し、加圧された液体原料10は、MFC34
で設定された流量で気化器14に送られる。
Next, the operation of the above embodiment will be described. In the inert gas dissolving means 30, an inert gas is introduced into the liquid source container 12 from the pressurized gas introduction pipe 32 at a high pressure of, for example, 6 kgf / cm 2 G or more, so that the liquid stored in the liquid source container 12 is An inert gas such as Ar is dissolved in the raw material 10. The inert gas is uniformly dissolved in the liquid raw material 10, and the pressurized liquid raw material 10
Is sent to the vaporizer 14 at the flow rate set in the step (1).

【0017】気化器14には、成膜室20を介した真空
ポンプ24の作用により所定の低圧になっており、か
つ、ヒータにより原料気化温度以上に加熱されている。
液体原料10は気化器において低圧にさらされ、その加
熱部において加熱されて順次気化するとともに、温度上
昇に伴い不活性ガスの溶存量が減少するので、不活性ガ
スを分離する。
The vaporizer 14 has a predetermined low pressure by the action of a vacuum pump 24 through a film forming chamber 20, and is heated to a temperature equal to or higher than the vaporization temperature of a raw material by a heater.
The liquid raw material 10 is exposed to a low pressure in a vaporizer, is heated in a heating section thereof, and is sequentially vaporized. Since the dissolved amount of the inert gas decreases as the temperature rises, the inert gas is separated.

【0018】この不活性ガスの分離は液体原料10中で
起こるため、液体原料における乱流の生成を促し、液体
原料を加熱壁に接触させるように作用するとともに、気
化器14における原料ガスの分圧を下げて気化を促進す
る。分離した溶存不活性ガスはキャリアガスとして機能
し、気化した液体原料と混合しつつ下流の低圧に吸引さ
れて迅速に排除される。また不活性ガスの分離は液体原
料10中のいたるところで細かく発生するため、原料液
とキャリアガスの比接触面積は非常に大きくキャリアガ
スの効果を促進できる。
Since the separation of the inert gas occurs in the liquid raw material 10, the generation of turbulence in the liquid raw material is promoted to act to bring the liquid raw material into contact with the heating wall. Reduce pressure to promote vaporization. The separated dissolved inert gas functions as a carrier gas, is mixed with the vaporized liquid raw material, is sucked into the downstream low pressure, and is quickly eliminated. In addition, since the separation of the inert gas occurs finely everywhere in the liquid raw material 10, the specific contact area between the raw material liquid and the carrier gas is very large, and the effect of the carrier gas can be promoted.

【0019】この原料ガスと不活性ガスの混合ガスは、
保温された原料ガス配管22を介して成膜室20に送ら
れ、成膜室20において一定の温度に加熱された基板W
に向けて噴射される。これにより、基板Wの表面に金属
酸化物薄膜が気相成長し、成膜室20内の反応ガスは真
空ポンプ24により排気される。
The mixed gas of the raw material gas and the inert gas is
The substrate W sent to the film formation chamber 20 via the kept source gas pipe 22 and heated to a constant temperature in the film formation chamber 20
Injected toward. As a result, the metal oxide thin film grows on the surface of the substrate W in vapor phase, and the reaction gas in the film forming chamber 20 is exhausted by the vacuum pump 24.

【0020】なお、溶存する不活性ガスの量は限度があ
り、これが充分でない場合には、図6に示す従来例と同
様に、気化器14の内部にこの入口側から不活性ガスを
別途導入するようにしたり、気化後の原料ガスを成膜室
20に送る不活性ガスが不足するような場合には、気化
器14の出口側から原料ガス配管22内に不活性ガスを
別途導入するようにしても良い。
The amount of dissolved inert gas is limited, and if the amount is not sufficient, an inert gas is separately introduced into the vaporizer 14 from the inlet side as in the conventional example shown in FIG. In the case where the amount of the inert gas for sending the vaporized source gas to the film forming chamber 20 becomes insufficient, the inert gas is separately introduced into the source gas pipe 22 from the outlet side of the vaporizer 14. You may do it.

【0021】図2は、本発明の第2の実施の形態を示す
もので、これは、液体原料容器12と気化器14とを結
ぶ液体原料配管16中に、開閉弁36を挟んでその上流
側に送液ポンプ40を、下流側に抵抗体としての逆止弁
42又はオリフィス38をそれぞれ配置したものであ
る。この実施の形態においても、不活性ガス溶解手段3
0によってAr等の不活性ガスが高圧で溶解した液体原
料10がポンプで吸引されて気化器14に送られる。液
体原料の高圧は逆止弁42に至るまで維持されており、
従って、送液ポンプ40中で不活性ガスが分離されてキ
ャビテーションを起こすことはない。
FIG. 2 shows a second embodiment of the present invention, which is provided in a liquid source pipe 16 connecting the liquid source container 12 and the vaporizer 14 with an opening / closing valve 36 interposed therebetween. A liquid feed pump 40 is disposed on the side, and a check valve 42 or an orifice 38 as a resistor is disposed on the downstream side. Also in this embodiment, the inert gas dissolving means 3
With 0, the liquid raw material 10 in which an inert gas such as Ar is dissolved at a high pressure is sucked by a pump and sent to the vaporizer 14. The high pressure of the liquid material is maintained up to the check valve 42,
Therefore, the inert gas is not separated in the liquid sending pump 40 and cavitation does not occur.

【0022】図3は、本発明の第3の実施の形態を示す
もので、これは、不活性ガス溶解手段50が、液体原料
容器12の底壁を貫通する加圧ガス配管52の先端に取
り付けられた多孔質体54によって構成されているもの
である。これにより、不活性ガスの溶解がより円滑に行
われる。
FIG. 3 shows a third embodiment of the present invention, in which an inert gas dissolving means 50 is provided at the tip of a pressurized gas pipe 52 penetrating the bottom wall of the liquid material container 12. It is constituted by the attached porous body 54. Thereby, dissolution of the inert gas is performed more smoothly.

【0023】図4は、本発明の第4の実施の形態を示す
もので、これは、液体原料容器12に、液体原料10を
撹拌させる撹拌羽根62と、この撹拌羽根62を回転さ
せるモータ64とを備えた撹拌装置60を付設したもの
である。これにより、液体原料10を撹拌羽根62で強
制的に撹拌させて、不活性ガスの液体原料10中への溶
解を促進させることができる。
FIG. 4 shows a fourth embodiment of the present invention, in which a liquid source container 12 has stirring blades 62 for stirring the liquid source 10 and a motor 64 for rotating the stirring blades 62. And a stirrer 60 having the following. Accordingly, the liquid material 10 can be forcibly stirred by the stirring blades 62, and the dissolution of the inert gas into the liquid material 10 can be promoted.

【0024】図5は、本発明の第5の実施の形態を示す
もので、これは、液体原料容器12と気化器14とを結
ぶ液体原料配管16に、ポンプ40と開閉弁36との間
で該配管16から分岐して液体原料容器12に戻る分岐
管70を設け、この分岐管70の先端に開閉弁72を介
して液分散部74を設けたものである。液体原料配管1
6内の開閉弁36を閉じ、分岐管70内の開閉弁72を
開いてポンプ40を作動すると、液体原料10は液分散
部74で噴霧され、不活性ガスの溶解を促進することが
できる。
FIG. 5 shows a fifth embodiment of the present invention. In this embodiment, a liquid source pipe 16 connecting the liquid source container 12 and the vaporizer 14 is connected between a pump 40 and an on-off valve 36. A branch pipe 70 branched from the pipe 16 and returning to the liquid source container 12 is provided, and a liquid dispersion section 74 is provided at the tip of the branch pipe 70 via an on-off valve 72. Liquid material piping 1
When the pump 40 is operated by closing the on-off valve 36 in 6 and opening the on-off valve 72 in the branch pipe 70, the liquid raw material 10 is sprayed in the liquid dispersion part 74, and the dissolution of the inert gas can be promoted.

【0025】開閉弁36の2次側に原料液を気化器側へ
定量送液するために、図6に示すマスフローコントロー
ラ、または図7に示す定量ポンプを設置すれば、原料液
を気化器側へ送液している間も、常時前述した作用(不
活性ガス溶解の促進)を実施することができる。
If a mass flow controller as shown in FIG. 6 or a metering pump as shown in FIG. 7 is provided on the secondary side of the on-off valve 36 for quantitatively sending the raw material liquid to the vaporizer side, the raw material liquid is supplied to the vaporizer side. The above-described action (promotion of inert gas dissolution) can be constantly performed even while the liquid is being supplied.

【0026】[0026]

【発明の効果】以上説明したように、本発明によれば、
原料ガスの分圧を確実に低下させ、また、液体原料と加
熱部との接触を妨害することもなく、効率的に気化を促
進できる。従って、高・強誘電体を気相成長により成膜
する場合に用いて有用な技術を提供することができる。
As described above, according to the present invention,
The partial pressure of the raw material gas is reliably reduced, and the vaporization can be efficiently promoted without obstructing the contact between the liquid raw material and the heating unit. Therefore, it is possible to provide a useful technique used when a high-ferroelectric substance is formed by vapor phase growth.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の第1の実施の形態を示す図である。FIG. 1 is a diagram showing a first embodiment of the present invention.

【図2】本発明の第2の実施の形態を示す図である。FIG. 2 is a diagram showing a second embodiment of the present invention.

【図3】本発明の第3の実施の形態の要部を示す図であ
る。
FIG. 3 is a diagram showing a main part of a third embodiment of the present invention.

【図4】本発明の第4の実施の形態の要部を示す図であ
る。
FIG. 4 is a diagram showing a main part of a fourth embodiment of the present invention.

【図5】本発明の第5の実施の形態の要部を示す図であ
る。
FIG. 5 is a diagram showing a main part of a fifth embodiment of the present invention.

【図6】本発明の第6の実施の形態の要部を示す図であ
る。
FIG. 6 is a diagram showing a main part of a sixth embodiment of the present invention.

【図7】本発明の第7の実施の形態の要部を示す図であ
る。
FIG. 7 is a diagram showing a main part of a seventh embodiment of the present invention.

【図8】従来例を示す図である。FIG. 8 is a diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

10 液体原料 12 液体原料容器 14 気化器 16 液体原料配管 20 成膜室 30,50 不活性ガス溶解手段 32,52 加圧ガス導入管 34 MFC(自動弁) 38 オリフィス(抵抗体) 42 逆止弁(抵抗体) 60 撹拌装置 70 分岐管 74 液分散部 DESCRIPTION OF SYMBOLS 10 Liquid raw material 12 Liquid raw material container 14 Vaporizer 16 Liquid raw material piping 20 Film formation chamber 30, 50 Inert gas melting means 32, 52 Pressurized gas introduction pipe 34 MFC (automatic valve) 38 Orifice (resistor) 42 Check valve (Resistor) 60 Stirrer 70 Branch pipe 74 Liquid dispersion part

───────────────────────────────────────────────────── フロントページの続き (72)発明者 上山 浩幸 東京都大田区羽田旭町11番1号 株式会社 荏原製作所内 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Hiroyuki Ueyama 11-1 Haneda Asahimachi, Ota-ku, Tokyo Inside Ebara Corporation

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 液体原料に不活性ガスを溶解させるガス
溶解部と、 前記液体原料を気化温度以上に加熱して気化させる気化
部と、 前記液体原料を、溶解ガスを溶存させた状態で前記ガス
溶解部から前記気化部まで供給する液体原料供給配管を
有することを特徴とする原料供給装置。
A gas dissolving unit for dissolving an inert gas in a liquid raw material; a vaporizing unit for heating the liquid raw material to a temperature higher than a vaporization temperature to vaporize the liquid raw material; A raw material supply device comprising a liquid raw material supply pipe for supplying from a gas dissolving section to the vaporizing section.
【請求項2】 前記ガス溶解部において前記不活性ガス
の圧力を6kgf/cm2G以上とすることを特徴とする請求
項1に記載の原料供給装置。
2. The raw material supply apparatus according to claim 1, wherein the pressure of the inert gas in the gas dissolving section is 6 kgf / cm 2 G or more.
【請求項3】 前記液体原料供給配管と前記気化部の間
に圧力遮断手段を設けたことを特徴とする請求項1に記
載の原料供給装置。
3. The raw material supply apparatus according to claim 1, wherein a pressure cut-off means is provided between the liquid raw material supply pipe and the vaporizing section.
【請求項4】 前記ガス溶解部に、液体原料と不活性ガ
スの接触を促進する気液接触機構を設けたことを特徴と
する請求項1に記載の原料供給装置。
4. The material supply device according to claim 1, wherein a gas-liquid contact mechanism for promoting contact between the liquid material and the inert gas is provided in the gas dissolving section.
JP28913397A 1996-11-20 1997-10-06 Raw material supply device Expired - Fee Related JP3533513B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP28913397A JP3533513B2 (en) 1997-10-06 1997-10-06 Raw material supply device
TW086117253A TW565626B (en) 1996-11-20 1997-11-19 Liquid feed vaporization system and gas injection device
US08/974,512 US6195504B1 (en) 1996-11-20 1997-11-19 Liquid feed vaporization system and gas injection device
KR1019970061338A KR100507961B1 (en) 1996-11-20 1997-11-20 Liquid raw material gasification system and gas injection device
EP97120370A EP0849375B1 (en) 1996-11-20 1997-11-20 Liquid feed vaporization system and gas injection device
DE69722359T DE69722359T2 (en) 1996-11-20 1997-11-20 Device for vaporizing liquids and gas injection device
US09/663,358 US6282368B1 (en) 1996-11-20 2000-09-15 Liquid feed vaporization system and gas injection device
US09/662,897 US6269221B1 (en) 1996-11-20 2000-09-15 Liquid feed vaporization system and gas injection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28913397A JP3533513B2 (en) 1997-10-06 1997-10-06 Raw material supply device

Publications (2)

Publication Number Publication Date
JPH11111706A true JPH11111706A (en) 1999-04-23
JP3533513B2 JP3533513B2 (en) 2004-05-31

Family

ID=17739193

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28913397A Expired - Fee Related JP3533513B2 (en) 1996-11-20 1997-10-06 Raw material supply device

Country Status (1)

Country Link
JP (1) JP3533513B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023062889A1 (en) * 2021-10-14 2023-04-20 信越化学工業株式会社 Film deposition device and manufacturing method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023062889A1 (en) * 2021-10-14 2023-04-20 信越化学工業株式会社 Film deposition device and manufacturing method

Also Published As

Publication number Publication date
JP3533513B2 (en) 2004-05-31

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