JPH1095110A - Ink-jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure the reliability of head assembling and to make the efficiency of the assembly improved, by a method in which in a joint between a vibrating plate which transmits the displacement of electromechanical transducer elements to an ink liquid chamber and a support plate which supports the vibration plate, an area for the main bonding of both and an area for the provisional bonding are provided. SOLUTION: In an actuator unit, two rows of lamination type piezoelectric elements are arranged on an insulating substrate, and a frame member (supports) 13 consisting of resin, ceramic, etc., which surrounds each piezoelectric element is bonded by an adhesive. Pressurized liquid chambers which are ink liquid chambers having a deformable diaphragm part which faces each driving part are formed by a vibrating plate, a liquid chamber forming member, and a nozzle plate. In the frame member 13, recessions are formed at four corners, the recession is made to be an area for provisional bonding, and the other surface is made to be an area 51 for main bonding between the frame member 13 and the vibrating plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink jet head, and more particularly, to an ink jet head having a vibration plate joined to a support.

[0002]

2. Description of the Related Art An ink jet recording apparatus has almost no vibration and noise during recording, and is particularly easy to colorize.
In addition to a printer that outputs data from a digital processing device such as a computer, it is also used for facsimile machines, copiers, and the like. An ink jet head used in such an ink jet recording apparatus records an image on a recording medium by ejecting ink droplets from nozzles by driving actuator elements such as a piezoelectric element and a heating resistor in accordance with a recording signal. It is what you do.

[0003] As such an ink jet head,
For example, as described in Japanese Patent Application Laid-Open No. 8-142324, a plurality of piezoelectric elements are joined in a plurality of rows on a substrate, and a frame member located around the piezoelectric elements is joined. And a diaphragm having a diaphragm portion laminated and joined on the frame member, and a pressurized liquid chamber (ink liquid chamber) which is pressurized by the piezoelectric element through the diaphragm portion on the diaphragm, and ink is supplied to the liquid chamber. There is a configuration in which a liquid chamber forming member that forms an ink supply path for supplying ink is laminated, and a nozzle plate having a nozzle formed thereon is further laminated on the liquid chamber forming member.

In such an ink jet head in which an electromechanical transducer is used as an actuator element and its displacement is applied to an ink liquid chamber via a vibration plate, it is necessary to assemble each part with high precision and to achieve high density. As the integration increases, the piezoelectric elements, ink chambers, nozzles, and vibrating plates (deformed portions) are positioned with higher accuracy, and if they are not joined and assembled securely, the ejection characteristics will be degraded. Cannot be secured.

Conventionally, as a method for joining an ink-jet head, as described in Japanese Patent Application Laid-Open No. 60-183157, when a head, a drive circuit portion of the head, and a support of the head and the drive circuit portion are joined, A method is known in which a through hole is provided in a support, and an adhesive is injected into the through hole to join these three members.

[0006]

However, when the above-described conventional joining method is applied to joining a diaphragm to a support (frame member), it is necessary to secure a joint area between the diaphragm and the support. Therefore, a sufficient joint strength cannot be obtained, which may adversely affect the deformation of the diaphragm.

Further, in the first place, in the conventional ink jet head, no consideration is given to the high density and high integration of the head, and there is a problem that the reliability of assembly and the efficiency of assembly are poor.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide an ink jet head which can ensure the assembling reliability of a head and improve the assembling efficiency.

[0009]

According to a first aspect of the present invention, there is provided an ink jet head having a plurality of nozzles by transmitting displacements of a plurality of electromechanical transducers to an ink liquid chamber via a diaphragm. In the ink jet head that ejects ink droplets from the above, a configuration is provided in which a main joining area and a temporary joining area are provided at a joint between the vibration plate and a support that supports the vibration plate.

A second aspect of the present invention is the ink jet head according to the first aspect, wherein a plurality of regions for performing the temporary bonding are provided.

According to a third aspect of the present invention, in the inkjet head of the first or second aspect, the area where the temporary bonding is performed is formed by a concave portion formed in at least one of the diaphragm and the support.

According to a fourth aspect of the present invention, in the ink jet head of the first or second aspect, the area for performing the temporary bonding and the area for performing the main bonding are grooves formed on at least one of the diaphragm and the support. The configuration was separated.

According to a fifth aspect of the present invention, in the ink jet head of the first or second aspect, the support is made of a material that transmits ultraviolet light.

[0014]

Embodiments of the present invention will be described below with reference to the accompanying drawings. 1 is an overall exploded perspective view showing an example of an ink jet head to which the present invention is applied, FIG. 2 is a perspective view of a main part of the head, FIG. 3 is a sectional view taken along line AA of FIG. 2, and FIG. It is sectional drawing which follows the BB line of FIG.

This ink jet head comprises an actuator unit 1, a liquid chamber unit 2, a head cover 3
And The actuator unit 1 includes a plurality of laminated piezoelectric elements 12 arranged in rows on an insulating substrate 11.
A frame member (support) 13 made of resin, ceramic, or the like surrounding the periphery of each of the two rows of piezoelectric elements is joined by an adhesive 14. The plurality of piezoelectric elements 12 are located between the piezoelectric elements 17 (to be referred to as “driving units”) to which a driving pulse for causing ink to be formed into droplets and fly is provided, and the driving units 17, 17.
The liquid chamber unit 2 is simply moved to the substrate 1 without receiving a drive pulse.
The piezoelectric elements (which are referred to as “non-driving parts”) 18 serving as liquid chamber support members fixed to 1 are alternately arranged.

The liquid chamber unit 2 is a liquid chamber forming member made of a photosensitive resin film (dry film resist) forming a pressurized liquid chamber (ink liquid chamber) flow path on a diaphragm 22 having a diaphragm 21 formed thereon. 23, and a nozzle plate 26 having a plurality of nozzles 25 formed on the liquid chamber forming member 23. Each of the driving units 1 is formed by the vibration plate 22, the liquid chamber forming member 23, and the nozzle plate 26.
A pressurized liquid chamber 2 which is a plurality of substantially independent ink liquid chambers each having a deformable diaphragm portion
Are formed, and the nozzles 25 are arranged so as to face the diaphragm portion 21 of the diaphragm 22, that is, the respective drive portions 17. The liquid chamber unit 2 has a high rigidity as a whole on the actuator unit 1 by bonding a required portion of the vibration plate 22 to each of the driving units 18 and the frame member 13 as a support by an adhesive 28. It is joined by.

The substrate 11 of the actuator unit 1 has a thickness of about 0.5 to 5 mm and is made of a material similar to a piezoelectric element, and can be cut together with the piezoelectric element by, for example, a diamond grindstone. Preferably, in this embodiment, a ceramic substrate, for example, a substrate of barium titanate, alumina, forsterite or the like is used.

As the piezoelectric element 12, a laminated piezoelectric element having ten or more layers is used. As shown in FIGS. 3 and 4, for example, this laminated piezoelectric element has a PZT (= Pb (Zr · Ti) O ₃ ) 30 having a thickness of 20 to 50 μm / one layer and a thickness of several μm.
/ 1 layer of internal electrodes 31 made of silver / palladium (AgPd). The drive voltage can be reduced by forming the piezoelectric element 12 as a stacked type having a thickness of 20 to 50 μm / 1 layer. For example, an electric field strength of 1000 V / mm can be obtained with a pulse voltage of 20 to 50 V. The material used for the piezoelectric element is not limited to the above, and an electromechanical conversion element such as a ferroelectric material such as BaTiO ₃ , PbTiO ₃ , and (NaK) NbO _{3 which is} generally used as a piezoelectric element material can be used. .

The internal electrodes 31 of each piezoelectric element 12 are left and right end electrodes 32 and 33 made of AgPd every other layer (the opposing surfaces of the two piezoelectric element rows are end electrodes 32, and the non-opposing surfaces are end electrodes. 33). On the other hand, as shown in FIG.
The common electrode pattern 34 and the individual electrode pattern 35 are provided by Au plating, AgPt paste printing, AgPd paste printing, or the like.

The facing end electrodes 32 of each piezoelectric element 12 in each row are connected to a common electrode pattern 34 via a conductive adhesive 36, while the non-facing end electrodes 23 of each piezoelectric element 12 in each row are connected. The conductive adhesive 36 is connected to the individual electrode pattern 35. Thereby, the driving unit 1
When a drive voltage is applied to the drive unit 7, an electric field is generated in the stacking direction, and the drive unit 17 is displaced in the stacking direction. In the common electrode pattern 34, the conductive portions are filled in the holes 13 a provided in the frame member 13 to conduct each pattern portion.

Next, the diaphragm 22 of the liquid chamber unit 2 is made of N manufactured by an electroforming method (electroforming).
As shown in FIG. 3, the liquid chamber forming member 23 has a flat surface, and the diaphragm region 22a and the bonding region 22b having different thicknesses are formed on the piezoelectric element 12 side in a direction perpendicular to the channel direction. And a relief region 22c, and a diaphragm portion 21 corresponding to the piezoelectric element 2 serving as the drive portion 17.

Here, the diaphragm region 22a is the thinnest region (thin portion) and has a thickness of 3 to 10 μm.
The diaphragm area of the diaphragm unit 21 (an elastic part which is deformed in accordance with the displacement of the driving unit 17) is set to about m. By setting the thickness of the diaphragm region 22a to 10 μm or less, the displacement of the driving unit 17 can be efficiently transmitted to the pressurized liquid chamber 27. The joining region 22b is the thickest region (thick portion), and is a joining region between the piezoelectric element 12 and the frame member 13, for example, 20 μm.
It is formed to a thickness of at least about. In this case, in a direction orthogonal to the channel direction, a portion corresponding to the non-driving portion 18 in each of the joining regions 22a is a beam portion 22e for joining the liquid chamber unit 2 to the non-driving portion 8. Further, the relief region 22c is a region having an intermediate thickness and is a region for avoiding contact with the driving unit 17.

The liquid chamber forming member 23 is formed between the upper surface of the vibration plate 22 and the lower surface of the nozzle plate 26 to form each pressurized liquid chamber 27 corresponding to each drive unit 17 as described above. A common liquid chamber 37 located on both sides of each pressurized liquid chamber 27 for supplying ink to the pressurized liquid chamber 27;
7 are formed as ink supply paths 38, 38 which also serve as fluid resistance portions communicating both sides with the common liquid chamber 37.
In the manufacturing process, a first layer 39 having a required liquid chamber pattern formed on the upper surface of the vibration plate 22 using a dry film resist (photosensitive resin film),
It has a two-layer structure in which a required liquid chamber pattern is formed on the side using a dry film resist and a second layer 40 is formed.

The nozzle plate 26 is provided with a number of nozzles 25 which are fine holes for causing ink droplets to fly, and the diameter of the nozzle 25 is 35 at the ink droplet outlet side.
The nozzle 25 is provided at a position facing the diaphragm 21 of the diaphragm 22 and at a position corresponding to the vicinity of the center of the pressurized liquid chamber 27. This nozzle plate 2
A water-repellent film 41, which is a water-repellent surface treatment film, is formed on the surface of No. 6, and a non-water-repellent surface 42 not subjected to water-repellent treatment is provided around the water-repellent film 41.

The nozzle plate 26 also uses a Ni (nickel) metal plate manufactured by an electroforming method (electroforming), like the diaphragm 22.
Si and other metal materials can also be used. In addition,
Actually, one inkjet head is manufactured by a configuration of 64 to 128 nozzles in which two rows of 32 to 64 nozzles 15 are arranged in one row. The quality of the nozzle plate 26 having the 64 to 128 nozzles 25 is as follows. It determines the droplet shape and flight characteristics of the ink and has a great effect on image quality.

As shown in FIG. 1, the substrate 11 is connected to a spacer member (head holder) 44 serving as a head support member.
A PCB substrate having a head driving IC and the like disposed and held in the spacer member 44 and each piezoelectric element 12 of the actuator unit 1 are supported and held on each of the electrode patterns 3.
4 and 35 are connected via an FPC cable 45 joined thereto.

A nozzle cover (head cover) 3
Is formed in a box shape that covers the peripheral portion of the nozzle plate 26 and the side surface of the head. An opening is formed corresponding to the water-repellent film 41 of the nozzle plate 26.
Is bonded to the non-water-repellent surface 42 with an adhesive. Further, this ink jet head is provided with ink supply holes 46 to 49 in the spacer member 44, the substrate 11, the frame member 13 and the vibration plate 22, respectively, for supplying ink from an ink cartridge (not shown) to the liquid chamber.

Next, the manufacturing process of the ink jet head will be described. This ink jet head is manufactured by separately assembling the actuator unit 1 and the liquid chamber unit 2 in advance, and then bonding and bonding the units 1 and 2 to each other. By adopting such a manufacturing process,
A non-defective product of the two units 1 and 2 can be selected and assembled, thereby improving the yield, and also having an actuator unit 1 in which dust is likely to be generated in the processing and assembling process, and a liquid chamber unit 2 in which dust should be completely prevented from adhering. Can be assembled in separate steps, so that the quality itself of the completed inkjet head is improved. Hereinafter, a specific description will be given.

First, the working and assembling steps of the actuator unit 1 are as follows. That is, after roughly patterning each electrode pattern for the common electrode and the individual electrode on the insulating substrate 11 in advance, two sheet-shaped or plate-shaped laminated piezoelectric elements are bonded and bonded using a positioning jig. . Then, the end face electrodes formed on both end faces of each piezoelectric element and each electrode pattern of the substrate 11 are electrically connected by a conductive adhesive.

Thereafter, the piezoelectric element plate is slit with a dicer on which a diamond grindstone is set, for example, with a width of about 100 μm per pitch to drive the drive unit 17.
And is divided into individual piezoelectric elements 12 serving as non-drive units 18. At this time, the individual piezoelectric elements are made completely independent by cutting by inserting a notch groove (slit groove) up to the substrate 11. Further, each electrode pattern on the substrate 11 is simultaneously cut and divided into individual piezoelectric elements.

Next, the substrate 11 after the processing of the piezoelectric element is completed
The frame member 13 is adhesively bonded to the
The common electrode patterns separated by applying a conductive adhesive in the holes 13a of No. 3 are connected to each other. Also,
The FPC cable 45 is joined to the electrode pattern of the substrate 11 by heat and pressure. The FPC cable 45 has a pattern that can selectively drive the drive unit 17, and its joint portion is plated in advance with solder. Finally, the capacitance of each piezoelectric element is measured.

On the other hand, the processing and assembling process of the liquid chamber unit 2 will be described. A diaphragm 22 having a diaphragm portion 21 made of a Ni (nickel) metal plate and a nozzle 25 using an electroforming method (electroforming) in advance. Is manufactured. And
A dry film resist having a thickness of about 20 to 50 μm, which is a photosensitive resin for forming the first layer 39 on the vibration plate 22, is laminated by heat and pressure, and is exposed to ultraviolet light using a mask according to a flow path pattern. To cure the exposed portions. Then, using a solvent capable of removing the unexposed portion, the unexposed portion is removed and developed to form a liquid chamber pattern of the first layer 39, washed with water, dried, and then completely cured by ultraviolet exposure and heat again. .

On the other hand, the second layer 40 is also provided on the nozzle plate 26.
Thickness of 40 to 100 μm which is a photosensitive resin for forming
The dry film resist of about m is laminated by heat and pressure, and exposed to ultraviolet light using a mask corresponding to the flow path pattern, the exposed portion is cured, and the unexposed portion is developed. Form a liquid chamber pattern, wash with water,
After drying, it is fully cured again by UV exposure and heat

Then, the corresponding surfaces of the first layer 39 and the second layer 40 made of the dry film resist formed on the vibration plate 22 and the nozzle plate 26 are joined to each other. This joining is performed using a positioning jig, and pressure and heating at a higher temperature than in the main curing are performed. Actually, in the above steps, assembling is performed using a plate having a head area corresponding to a plurality of heads.

Finally, the actuator unit 1 and the liquid chamber unit 2 completed as described above are assembled.
The outline of this joining process is as follows. After applying an adhesive for main joining and temporary joining to the actuator unit 1 and setting it in a joining device, the liquid chamber unit 2 is set in the joining device. Then, the relative positions (X, Y directions) of the actuator 1 and the liquid chamber unit 2 are aligned at the micron order level by the joining device, and the two units are brought into contact and joined while maintaining the positional relationship. Next, temporary bonding is performed by irradiating ultraviolet rays (UV light) on the bonding device to cure the temporary bonding adhesive, and then the bonded article is taken out of the bonding device and set in a pressing device. After that, it is put into a constant-temperature layer together with the pressurizing device in a pressurized state and thermally cured to complete.

An embodiment in which the present invention is applied to such an ink jet head will be described with reference to FIG. FIG. 5 is a perspective view of the frame member 13 according to the first embodiment of the present invention, and FIG. 6 is a perspective view of the liquid chamber unit 2 including the vibration plate 22. As shown in FIG.
The recesses 50 are formed at the four corners as shown in FIG.
Is a region where temporary bonding is performed (hereinafter, referred to as a “temporary bonding region”).
The other surface is a region where main joining of the frame member 13 and the diaphragm 22 is performed (hereinafter, referred to as “finally bonded region”).
51. On the other hand, diaphragm 2 constituting liquid chamber unit 2
Each of the members including the frame member 13 as shown in FIG.
The chamfered portion 60 is formed by cutting four corners corresponding to the concave portion 50 of FIG. In addition, the concave part 50 can also be provided in two places or three places.

The unit joining process when this embodiment is applied is as follows. Step 1 (adhesive application step) The actuator unit 1 is set on a screen printing machine. Next, the screen pattern mesh patterned into the same shape as the actuator unit 1 and the actuator unit 1 are aligned. Then, for example, a thermosetting epoxy-based adhesive as the adhesive 28 is applied to the surface of the piezoelectric element 12 of the actuator unit 1 and the main bonding area 51 of the frame member 13. Thereafter, a temporary bonding adhesive such as a UV (ultraviolet) curable adhesive is applied to the concave portion 50 which is a temporary bonding region of the frame member 13 using a coating device such as a dispenser.

After the application of the adhesive is completed, the actuator unit 1 is taken out, and the screen pattern mesh is washed. If the pot life of the adhesive used in this washing operation is short, curing starts in the application process. As a result, the screen pattern mesh is incompletely cleaned, causing mesh clogging. Therefore, the pot life of the thermosetting adhesive used is room temperature -20 ° C to +3.
Use one that lasts at least 1 hour at 0 ° C. Also, by using a one-part, medium-temperature curing type adhesive as the adhesive, the curing of the adhesive in the adhesive application step can be prevented.

Step 2 (Step of Aligning Units) The actuator unit 1 with the adhesive applied thereto and the liquid chamber unit 2 are set in a positioning and pressing device, and after the setting is completed, the relative positions of the actuator unit 1 and the liquid chamber unit 2 are set. The positions (X, Y directions) are aligned at the micron order level using a two-field microscope or the like, and both units are brought into contact with each other while maintaining the positional relationship, thereby positioning both units 1 and 2 as shown in FIG. And pressurize. At this time, the temporary bonding adhesive is pressed and attached to the end of the diaphragm 22.

Step 3 (Step of Temporary Fixing Between Units) As described above, when the actuator unit 1 and the liquid chamber unit 2 are positioned and pressurized on the bonding apparatus, the liquid chamber unit 2 cuts four corners and forms a chamfer. Since 60 is formed, the concave portion 50 of the frame member 13 and a part of the UV-curable adhesive for temporary bonding are exposed. Therefore, the UV applied to the concave portion 50 of the frame member 13
The curing adhesive is cured by directly irradiating UV light. Thereby, the actuator unit 1 and the liquid chamber unit 2
Are temporarily bonded to each other so that no displacement occurs. in this case,
Since the UV adhesive of the concave portion 50 also adheres to the end surface of the chamfered portion 60 of the vibration plate 22, the temporary bonding strength is improved.

Step 4 (Pressurizing Step) The head is taken out from the positioning / pressing device and set in the main bonding apparatus, and a predetermined load is applied to the bonding surface of each unit 1 and 2 from the vertical direction. Apply pressure. Step (adhesive curing step) The head is attached to the main bonding apparatus, and is put in a constant temperature layer at a constant temperature for a fixed time while being pressurized, and is cured by heating. After the heating, the head is taken out of the main bonding apparatus, and the bonding process is completed.

As described above, the actuator unit 1
And the liquid chamber unit 2 are separately assembled, and then the actuator unit 1 and the liquid chamber unit 2 are bonded to each other by using a thermosetting adhesive. The injection characteristics are stabilized, and the workability of the assembling work is also improved.

By providing an area for the main joining and an area for the temporary joining at the joint portion with the support for supporting the diaphragm, an adhesive for the temporary joining is applied in advance. As a result, the coating method is simplified and the number of steps is reduced, so that the cost can be reduced. In addition, since it is not necessary to apply the temporary bonding adhesive after high-precision positioning, there is no post-positioning work that may occur depending on the application conditions, and it is possible to avoid prevention of misalignment.

Further, by providing a plurality of regions where the temporary bonding is performed at the bonding portion of the support, it is possible to prevent displacement of the temporary bonding. That is, if the area of the temporary joining area is too large, the necessary joining strength of the main joining will be insufficient. Conversely, if it is too small, the temporary joining strength will be insufficient and a displacement after positioning will occur. Therefore, even if the area of each temporary bonding region is small, the temporary bonding strength can be significantly improved by providing a plurality of locations with a wide span.

Further, by providing a concave portion as a region for performing temporary bonding, mixing of the temporary bonding adhesive and the final bonding adhesive can be prevented, and a predetermined amount of the temporary bonding adhesive is held. As a result, the temporary joining strength can be improved. That is, when the adhesive for temporary bonding and the adhesive for final bonding are applied in the same manner to the flat bonding surface of the support, the adhesive for temporary bonding is spread out when the diaphragm is pressed, and the adhesive for final bonding is spread. There is a risk that the adhesive will not be applied properly, or the two types of adhesives will be mixed and normal curing cannot be performed, and the required strength may not be obtained. Can be avoided.

In the first embodiment, the four corners of the liquid chamber unit 2 are cut to form the chamfered portions 60 in order to irradiate the UV light. If a chamfer cannot be provided for reasons such as maintaining accuracy or a head configuration (such as the shape of a head cover), the frame member 13 is formed of a transparent material.

Thus, the support (frame member 13)
The UV curable adhesive can be cured by irradiating UV light from the side of the device, improving the assemblability and eliminating the need to guide the UV light to a narrow place when assembling with an automatic assembling device. The configuration is simplified. As the temporary bonding adhesive, it is necessary that the curing time is short and the process can quickly proceed to the main bonding, and a UV-curable adhesive is most suitable. In order to cure the UV-curable adhesive, it is necessary to irradiate UV light, and therefore, a coating structure must be selected. However, by using a transparent material for the support itself, it is possible to reduce restrictions on the coating structure. it can.

Next, a second embodiment of the present invention will be described with reference to FIG. In this embodiment, by forming grooves 54 facing two sides at four corners of the frame member 13,
The surface of the frame member 13 is temporarily bonded to the temporary bonding region 53 and the main bonding region 5.
It is divided into one. When the frame member 13 is used, the liquid chamber unit 2 does not have the chamfered portion 60 as shown in FIG. 6, that is, the liquid chamber unit 2 having the outer shape as shown in FIG. It is preferable to use Further, the groove portions 54 may be provided at two or three places, and the temporary bonding area may be set at two or three places.

When this frame member 13 is used,
This is suitable for a case where a temporary bonding is performed by applying a so-called instant adhesive (for example, a cyanoacrylate-based adhesive, trade name: Alon Alpha, etc.) to the temporary bonding region 53 that instantaneously cures. Such an instantly curing adhesive is
Since the viscosity is low and the permeability is high, if there is no groove 54, it penetrates and spreads, and there is a possibility that the adhesive strength in the main bonding area is reduced.

In this case, the main bonding area 51 and the temporary bonding area 53 of the frame member 13 have the same height, but a step may be provided depending on the kind of the adhesive used.

Next, a third embodiment of the present invention will be described with reference to FIG. In this embodiment, a plane circular groove 56 is formed at two places on the surface of the frame member 13 to divide the surface of the frame member 13 into a temporary bonding area 56 and a main bonding area 51. Even in this case, the same effect as in the above embodiment can be obtained.

In each of the above-described embodiments, an example has been described in which the region for performing the temporary bonding and the region for performing the final bonding are provided on the frame member. However, the region may be provided on the diaphragm or the liquid chamber unit side. It is easier to provide it on the member side.

[0053]

As described above, according to the ink jet head of the first aspect, at the joint between the vibration plate and the support for supporting the vibration plate, temporary bonding is performed with the region where the two are mainly joined. With the configuration with the area, the coating method is simplified, the number of steps is reduced, the assembly efficiency is improved,
Costs can be reduced. In addition, since it is not necessary to apply the temporary bonding adhesive after high-precision positioning, there is no post-positioning work that may occur due to application conditions, and it is possible to avoid prevention of misalignment,
The reliability of the head is improved.

According to the ink jet head of the second aspect, in the ink jet head of the first aspect, a plurality of regions for performing the temporary joining are provided, so that the temporary joining area can be increased and the position of the temporary joining can be increased. The displacement can be prevented, and the assembling reliability of the head is improved.

According to the ink jet head of the third aspect, in the ink jet head of the first or second aspect, the region where the temporary bonding is performed is constituted by the concave portion formed on at least one of the diaphragm and the support. A certain amount of the temporary bonding adhesive can be held while avoiding mixing of the bonding adhesive and the main bonding adhesive, and the temporary bonding strength is improved.

According to the ink jet head of the fourth aspect, in the ink jet head of the first or second aspect, the region where temporary bonding is performed and the region where main bonding is performed are grooves formed on at least one of the diaphragm and the support. Even if a low-viscosity, high-permeability temporary bonding adhesive is used, a certain amount of temporary bonding is avoided by avoiding mixing of the temporary bonding adhesive and the final bonding adhesive. Agent can be retained, and the temporary bonding strength is improved. .

According to the ink jet head of the fifth aspect, in the ink jet head of the first or second aspect, since the support is made of a material that transmits ultraviolet light, the adhesive for temporary bonding is bonded to the adhesive for ultraviolet curing. The assemblability when using an agent is greatly improved, and the structure of the apparatus when performing automatic assembly can be simplified.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of an inkjet head to which the present invention is applied.

FIG. 2 is a perspective view of the unit assembly of FIG. 1;

FIG. 3 is a sectional view taken along line AA of FIG. 2;

FIG. 4 is a sectional view taken along line BB of FIG. 2;

FIG. 5 is a perspective view of a frame member according to the first embodiment of the present invention.

FIG. 6 is a perspective view of a liquid chamber unit of the embodiment.

FIG. 7 is a perspective view showing an assembled state of the ink jet head of the embodiment.

FIG. 8 is a perspective view of a frame member according to a second embodiment of the present invention.

FIG. 9 is a perspective view of a frame member according to a third embodiment of the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Actuator unit, 2 ... Liquid chamber unit, 11
... substrate, 12 ... piezoelectric element, 13 ... frame member, 22 ...
Vibrating plate, 26 ... Nozzle plate, 50 ... Concave part, 51 ... Main joint area, 53,55 ... Temporary joint area, 54,56 ... Groove.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masayuki Iwase 1-3-6 Nakamagome, Ota-ku, Tokyo Inside Ricoh Company (72) Inventor Tsutomu Sasaki 1-3-6 Nakamagome, Ota-ku, Tokyo Share Inside Ricoh Company (72) Inventor Seiji Nagaba 1-3-6 Nakamagome, Ota-ku, Tokyo Stock Company Ricoh Company (72) Inventor Nobuyo Nakane 1-3-6 Nakamagome, Ota-ku, Tokyo Stock Company Ricoh Company

Claims (5)

[Claims] 1. An ink-jet head for ejecting ink droplets from a plurality of nozzles by transmitting displacements of a plurality of electromechanical transducers to an ink liquid chamber via a diaphragm, and supporting the diaphragm and the diaphragm. At the joint with the support,
An ink jet head having a region where main joining of both is performed and a region where temporary bonding is performed. 2. The ink-jet head according to claim 1, wherein a plurality of regions for performing said temporary bonding are provided. 3. The ink-jet head according to claim 1, wherein the area where the temporary bonding is performed comprises a recess formed in at least one of the diaphragm and the support. 4. The ink jet head according to claim 1, wherein the area for performing the temporary bonding and the area for performing the main bonding are separated by a groove formed in at least one of the diaphragm and the support. An ink jet head characterized by the following. 5. The ink jet head according to claim 1, wherein the support is made of a material that transmits ultraviolet light.