JPH1086362A - Ink jet head and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use an inexpensive base, prevent a diaphragm from being deformed and broken, and enable a variety of materials to be used, by including a process of forming a diaphragm on a base by a vapor-phase synthetic process. SOLUTION: A base 3 is set on a lower electrode 2 in a plasma CVD device, and a hydrocarbon gas is used as feed gas to form a rigid carbon membrane on the base 3 by a vapor-phase synthetic process. This rigid carbon membrane is used as a diaphragm for ink jet. A phase state in the feed gas is not always necessary to be gas at normal temperatures under normal pressures, and a liquid or a solid may also be usable if it can be gasified through melting, evaporation, sublimation, etc., by heating or by pressure reduction. By this method, an inexpensive base made of, for example, Si, etc., can be used, and neither deformation nor breakage is caused to the diaphragm. Further, controllability in the thickness of the diaphragm is improved, and a variety of materials can be used.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an ink-jet head and a method of manufacturing the same, and more particularly, to a vibration of an electrostatic or piezoelectric ink-jet head or an ink-jet head using both electrostatic and piezoelectric driving principles. The present invention relates to an ink jet head for high-quality printing such as color printing and a vibration plate suitable for use as a vibration plate such as a micropump or a pressure sensor and a method for manufacturing the same.

[0002]

2. Description of the Related Art Ink jet systems currently on the market or under development are classified into the following three systems. (1) A method disclosed in Japanese Patent Publication No. 61-59911, for example, in which the ink is rapidly heated by using a heating element to generate bubbles, thereby causing the ink to fly at the pressure. (2) For example, as disclosed in Japanese Patent Publication No. 2-51734, a method in which a piezoelectric element is used as a driving means and a thin diaphragm is displaced by the generated force to cause ink to fly. (3) A method in which an actuator using electrostatic force is used as a driving means and a thin diaphragm is displaced to fly ink, as shown in Japanese Patent Application Laid-Open No. 3-23437.

[0003] Of the above, (2) and (3) are common in that ink is ejected by displacing a thin diaphragm, and a thin diaphragm and a pressure generating chamber connected to the thin diaphragm are common parts in the structure. have. It goes without saying that the printing characteristics of both types greatly depend on the processing dimensional accuracy of the thin diaphragm and the pressure generating chamber connected thereto and the mechanical characteristics of the material, for example, Young's modulus, bending strength, toughness and the like. In other words, if the processing dimensional accuracy of the diaphragm and the pressure generating chamber and the mechanical properties of the material can be improved, the performance as an ink jet can be dramatically improved.

In the ink jet head according to the prior art, the manufacturing method, material and configuration of the diaphragm and the pressure generating chamber are described in, for example, JP-A-6-2342.
Japanese Patent Application Laid-Open No. 18-181 and Japanese Patent Application Laid-Open No. 6-71882, for example.

Japanese Unexamined Patent Publication No. 6-234218 discloses a ceramic green sheet having a thickness suitable for forming a diaphragm member and a ceramic green sheet having through holes corresponding to pressure chambers. Sheet and
A green sheet of a ceramic material provided with a through hole communicating with the common ink flow path and the pressure chamber is laminated and integrated and fired to produce a pressure generating basic unit. It uses zirconia.

Japanese Unexamined Patent Application Publication No. 6-71882 discloses that a diaphragm, a liquid chamber, and an ink flow path are formed by subjecting a Si substrate to alkali anisotropic etching.

[0007]

However, Japanese Patent Application Laid-Open No.
Japanese Patent Application Laid-Open No.-234218 discloses that a pressure generating chamber basic unit including a diaphragm is manufactured by laminating and integrating green sheets of a ceramic material, and the following problems arise. I was

(1) In the process of firing from the green sheet, the dimensions of the diaphragm or the like change due to the lamination change, or the diaphragm is warped or bent so that desired characteristics are not exhibited. In particular, the thickness of the diaphragm is 20
Since it is on the order of microns, it is difficult to control its thickness because it is thin, and sometimes it breaks.

(2) Since it is basically a sintering process of a ceramic material, the materials that can be manufactured are limited, and it is difficult to improve the characteristics. In the firing process, it is difficult to form a covalent material such as a carbide, a boride, and a nitride.

(3) Since a high temperature is required for the sintering process,
It is necessary to select a substrate. Inexpensive and easy-to-process substrates such as Si are difficult to use.

Further, in the apparatus disclosed in JP-A-6-71882, a diaphragm, a liquid chamber, and an ink flow path are formed by subjecting a Si substrate to an alkali anisotropic etch. Was a problem.

(1) In order to improve the processing (etch) accuracy, it is necessary to provide an etch stop layer, which complicates the process. (2) Since the diaphragm is limited to crystalline Si, there is a limit in physical properties. (3) The firing process of the piezoelectric body requires a high temperature,
The diaphragm i may be deformed, for example, warped or undulated.

In the method disclosed in Japanese Patent Application Laid-Open No. Hei 6-234218, in which a ceramic sheet is fired from a green sheet to provide through holes corresponding to a diaphragm member and a pressure chamber, the firing temperature is as high as 1000 ° C. or more. (In the case of a zirconia diaphragm, a temperature of 1250 ° C. or higher is usually required.) However, there are the problems as described above, and it has been difficult to manufacture a desired structure with a high yield.

[0014] Therefore, as a result of intensive research on the manufacturing process of a diaphragm and a pressure chamber, which can be used in a wide range of materials by being processed at a relatively low temperature, having excellent processing dimensional accuracy, the results of vapor phase synthesis have been shown. The method was found to be the optimal method. More specifically, a method of obtaining a dense film structure at a relatively low temperature, such as RF sputtering, magnetron sputtering, plasma CVD, ECR plasma CVD, microwave CVD, or ion plating, was suitable.

According to the above-mentioned method, although it depends on the substance to be synthesized, the film forming temperature is generally from room temperature to about 900 ° C., and various materials described later are at a much lower temperature than the sintering process. Since it can be formed, there is no need to select a base material that can withstand high temperatures, and an inexpensive base such as Si can be used.

Further, unlike the firing method from a green sheet, since the volume does not change in the forming process, the diaphragm is not deformed or broken. Further, since the thickness of the diaphragm can be uniquely controlled by the deposition time, the controllability is significantly improved as compared with the sintering method from a green sheet.

On the other hand, when the activity of the film-forming active species such as a normal vapor deposition method and a reactive vapor deposition method is lower than that of the above method, the structure of the obtained film is porous. As a result, the diaphragm is deformed or destroyed while repeatedly flying the ink. Alternatively, when a piezoelectric element as described later is formed on the vibration plate, it is necessary to anneal at 700 ° C. or higher in order to increase the piezoelectric constant. In this case, lead from the piezoelectric thin film is transferred to the vibration plate or the like. There is a problem that they are diffused, deteriorating the characteristics of the piezoelectric element, or causing peeling of the film.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned circumstances, and is directed to a method of manufacturing a diaphragm and a pressure chamber which are excellent in processing dimensional accuracy and can use a wide range of materials in an ink jet head and a method of manufacturing the same. An object of the present invention is to provide a process and a diaphragm material having excellent mechanical properties, and to provide a manufacturing process with simple steps and low manufacturing costs.

[0019]

The invention of claim 1 is characterized in that it includes a step of forming a diaphragm on a substrate by a vapor phase synthesis method, so that an inexpensive substrate can be used. Further, the diaphragm is not deformed or broken, and a wider range of materials can be used.

According to a second aspect of the present invention, there is provided a substrate forming an ink flow path, and a vibrating plate integrally formed with the base and constituting a part of the ink flow path. In the ink jet head formed on the substrate by a vapor phase synthesis method, the vibration plate is made of a hard carbon film containing carbon as a main constituent element, and has a large Young's modulus and a chemical property. It has excellent mechanical stability and high toughness.

According to a third aspect of the present invention, there is provided a substrate forming an ink flow path, and a vibrating plate integrally formed with the base and constituting a part of the ink flow path. In the ink jet head formed on the substrate by a vapor phase synthesis method, the diaphragm is made of a carbide, and has a higher Young's modulus, is chemically stable, and has a high ink resistance. Is also improved.

According to a fourth aspect of the present invention, there is provided a substrate forming an ink flow path, and a vibrating plate integrally formed with the base and constituting a part of the ink flow path. An ink jet head formed on the substrate by a vapor phase synthesis method, wherein the vibration plate is made of a nitride, and has a higher Young's modulus, is chemically stable, and has an ink resistance. It is also designed to improve the performance.

According to a fifth aspect of the present invention, there is provided a substrate forming an ink flow path, and a vibrating plate integrally formed with the base and constituting a part of the ink flow path. An ink jet head formed on the substrate by a vapor phase synthesis method, wherein the vibration plate is made of a composite of at least two kinds of carbides, and has a combination of characteristics of two kinds of materials. It is also a layer.

According to a sixth aspect of the present invention, there is provided a fuel cell system comprising: a base forming an ink flow path; and a diaphragm integrally formed with the base and constituting a part of the ink flow path. An ink jet head formed on the substrate by a vapor phase synthesis method, wherein the vibration plate is made of a laminate of at least two kinds of different materials, and has a property possessed by the two kinds of materials. This is to make a single layer.

The invention according to claim 7 includes a step of forming a thin film material by laminating a diaphragm constituting a part of the ink flow path and an electrode to which a voltage for driving the diaphragm is applied. In the method for manufacturing an ink jet head, the thin film material is formed by sequentially and continuously laminating the vibration plate and the electrode by a vapor phase synthesis method. The adhesive strength of the diaphragm is improved, and the diaphragm is not damaged during the process.

According to the invention of claim 8, a diaphragm which forms a part of the ink flow path and has a non-metallic element, and which is disposed to face the diaphragm and drives the diaphragm In the ink jet head having a counter electrode to which a voltage for applying is applied, the ratio of the non-metallic element of the diaphragm is reduced as approaching the counter electrode. This can be simplified.

[0027]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a schematic diagram showing a main part of an embodiment of a method for manufacturing an ink jet head according to the present invention. In the drawing, reference numeral 1 denotes an upper electrode, 2 denotes a lower electrode, 3 denotes a substrate, 4 is an RF power source, 5 is a DC bias power source, and 6 is a magnet.

The vapor phase synthesis method of the diaphragm according to the first aspect of the present invention will be described more specifically by taking a hard carbon film described later as an example. The embodiment shown in FIG. 1 is a plasma CVD apparatus,
To form a hard carbon film, an organic compound gas, in particular,
Use hydrocarbon gas. The phase state in these source gases does not necessarily need to be a gas at normal temperature and normal pressure,
Any liquid or solid can be used as long as it can be vaporized through melting, evaporation, sublimation, etc. by heating or decompression. As the carbon _{source, C 2 H 6, C 3} H 8, C 4 paraffinic hydrocarbons H _10, etc., acetylenic hydrocarbons such as C ₂ H ₄ or diolefinic hydrocarbons, furthermore, aromatic Gases containing all hydrocarbons, such as hydrocarbons, can be used.

Further, other than hydrocarbons, for example, alcohols, ketones, ethers, esters, CO, CO
Any compound containing at least a carbon atom such as ₂ can be used. In addition, a gas containing hydrogen is used to selectively remove the carbon of the SP ² bond generated simultaneously with the carbon of the SP ³ bond in the film. Specifically, H ₂ , H ₂ O
And so on.

In the method for forming a hard carbon film from a raw material gas according to the second aspect of the present invention, a plasma state in which a film forming active species is generated by a plasma method using a direct current, a low frequency, a high frequency, or a microwave or the like. A method using a magnetic field effect for the purpose of enlarging the area, improving the uniformity, lowering the film formation temperature, and the like, such as EC
R plasma CVD or the like is more preferable.

In addition, it may be formed through an ion state generated by ion plating, cluster ion beam, or the like, may be formed from neutral particles generated by ECR sputtering, sputtering, or the like. May be formed by a method combining these.

One example of the film forming conditions of the hard carbon film manufactured in this manner is as follows in the case of the plasma CVD of the embodiment shown in FIG. The mechanical properties of the obtained film are as described above.

RF power: 0.1 to 50 W / cm ² Pressure: 10 ^{-3 to} 10 Pa Deposition temperature: room temperature to 900 ° C.

The hard carbon film thus obtained was a film material containing carbon atoms as a main constituent element and containing at least one of amorphous and microcrystalline (diamond-like carbon film, iC film, Also called an amorphous diamond film). One feature of the hard carbon film is that it can be synthesized at a relatively low temperature by vapor phase growth.

Due to this feature, (1) an inexpensive substrate (such as Si) can be used as compared with the sintering method using green sheets. (2) No deformation or destruction of the diaphragm occurs. (3) The controllability of the diaphragm thickness is significantly improved. Needless to say, there is an effect like this.

Further, the most characteristic features of the hard carbon film are that the Young's modulus is as large as 3 to 7 × 10 ⁴ Kg / mm ² , the chemical stability is excellent, and the grain boundaries of a large order such as zirconia are present. The high toughness is due to the lack of. These characteristics indicate that the hard carbon film is very suitable as a diaphragm for inkjet.

When used as a diaphragm for ink jet, the mechanical properties required of the material include (1) bending strength (corresponding to the maximum tensile stress), (2) Young's modulus, and (3) fracture toughness. .

Of the above, the Young's modulus represents a force that resists an external force that attempts to extend the distance between atoms and ions in a solid.
In this sense, the Young's modulus is considered to reflect the strength of a chemical bond. Therefore, the Young's modulus of a compound having a high covalent bond tends to increase.

In ceramics, it is considered that the order is carbide> nitride = boride> oxide. The Young's modulus is a factor that determines the characteristics of the actuator, such as the fracture toughness (toughness) and the displacement of the diaphragm. A large Young's modulus is an important guideline in selecting the diaphragm material after all. Become.

From the above viewpoint, zirconia cannot be said to be a particularly excellent material in physical properties. Focusing on this point, the above materials were tried as a diaphragm, and as a result, the above-mentioned hard carbon film, and carbides, nitrides, and composites or laminates thereof described later were superior to conventional materials. It has been found that it exhibits the characteristics shown in FIG. Next, each material and configuration will be described more specifically.

FIG. 2 is a graph showing characteristics of typical carbides and nitrides. First, carbide will be described. Specific examples of the carbide include SiC, TiC, ZrC, and Hf.
Examples thereof include C, NbC, TaC, and BC, but are not particularly limited thereto, and include IV, V, and V in the periodic table of elements.
Any Group I carbide can be used.

These materials have a higher Young's modulus than zirconia, are chemically stable, and are more suitable as a diaphragm in consideration of ink resistance. The bending strength was slightly inferior. Furthermore, since the synthesis can be performed at a relatively low temperature by vapor phase growth, the same effect as described above for the hard carbon film is obtained.

Next, the nitride, which is another invention relating to the diaphragm material, will be described. As nitrides, AlN,
Examples include, but are not limited to, SiN, TiN, ZrN, HfN, NbN, TaN and the like, and any nitrides belonging to groups IV, V and VI of the periodic table of the elements can be used.

These materials have a higher Young's modulus than zirconia, are chemically stable, and are more suitable as a diaphragm in consideration of ink resistance. In addition, about bending strength, it was about the same or slightly inferior. Furthermore, since the synthesis can be performed at a relatively low temperature by vapor phase growth, the same effect as described above for the hard carbon film is obtained.

In the synthesis of the above compounds, R
F sputtering, magnetron sputtering, plasma CVD,
A gas phase synthesis method such as ECR plasma CVD, microwave CVD, or ion plating was used. In these film forming methods, the activity of the film forming active species can be increased, so that a compound can be synthesized at a relatively low temperature.

Further, a composite material which is another invention of the diaphragm material will be described. Each of the above-mentioned compounds has an effect even when used alone as a diaphragm, but by forming a composite material, it is possible to provide a more suitable material having the characteristics of two or more materials. In the sintering method, such a composite material cannot be formed at a low temperature of 900 ° C. or less.

As an example of the composite, Hf—Ti—C will be described. In order to use the above-mentioned plasma CVD, first, a metal iodide of Hf and Ti is generated, introduced into a reaction chamber, and then mixed with a hydrocarbon gas such as C ₄ H ₁₀ gas, and then the plasma state is formed. Was reacted. H
The reaction conditions of f-Ti-C are shown below.

RF power: 0.5 to 50 W / cm ² Pressure: 10 ^{-2 to} 10 Pa Deposition temperature: room temperature to 600 ° C. C ₄ H ₁₀ flow rate: 0.05 to 0.4 ml / min

With TiC alone, the Young's modulus is 3 to 4.5 ×
10 ⁴ Kg / mm ^2, bending strength at 30~100Kg / mm ^2,
Although its mechanical properties are good, its corrosion resistance and oxidation resistance are not so strong. Compared to this, the use of the Hf—Ti—C composite (solid solution) can impart chemical stability to HfC.

This is an important point for a diaphragm for ink jet printing, and the ink resistance can be improved by the above-described method. Needless to say, HfI ₄ or TiI ₄ can be independently mixed with C ₄ H ₁₀ gas and reacted to obtain a single HfC or TiC.

FIG. 3 is a view for explaining another embodiment of the ink jet head according to the present invention. In the figure, reference numeral 10 denotes a vibration plate, 11 denotes a first material, 12 denotes a second material, and 13 denotes an ink chamber. is there.

In the embodiment shown in FIG. 3, a material having ink resistance is used as the first material 11 in contact with the ink, and the second material 12 not in contact with the ink has more mechanical properties than chemical stability, for example, In addition, a material which emphasizes Young's modulus, strength, and the like is provided, thereby providing a diaphragm 10 having good characteristics that cannot be obtained by a single material.

More specifically, lamination was performed using HfC as the first material 11 and using TiC as the second material 12. The combination is not limited to the above, and the first
A combination of TiN as the material 11, SiN as the second material 12, or HfC as the first material 11 and SiN as the second material 12 is possible.

FIG. 4 is a diagram for explaining an example of an ink jet head to which the present invention is applied. In FIG.
The i-substrate 15 is a counter electrode, and the other parts having the same function as in FIG. 3 are denoted by the same reference numerals as in FIG.

FIG. 5 is a view for explaining another embodiment of the ink-jet head according to the present invention. In the figure, reference numeral 16 denotes an electrode layer, and other portions having the same functions as those in FIG. 3 or FIG. The same reference numerals as in FIG. 3 or 4 are used.

In the example shown in FIG. 4, when a pulse voltage is applied to the counter electrode 15, an attractive force or a repulsive force by an electrostatic force acts between the counter electrode 15 and the vibrating plate 10 disposed opposite to the pulse voltage. The ink is ejected from the nozzle holes by deforming the nozzle 10. As a substrate, a Si substrate 17 is used, and the diaphragm 10 having a thickness of about 20 microns is formed by anisotropic etching. At this time, a low-resistance Si substrate 17 is used to apply a potential.

The embodiment shown in FIG. 5 uses the above-mentioned hard carbon film as the diaphragm 10 and the later-described carbides, nitrides and composites or laminates thereof, and the diaphragm 10 has a resistance. Since it is high, the electrode layer 16 is provided so as to be in contact with the diaphragm 10.

FIG. 6 is a view for explaining another embodiment of the ink jet head according to the present invention. In the figure, reference numeral 17 denotes a diaphragm film, 18 denotes a resist, 19 denotes an electrode film, and 20 denotes a diaphragm substrate. In addition, the portions having the same functions as those in FIGS. 3 to 5 are denoted by the same reference numerals as those in FIGS. 3 to 5.

In the embodiment shown in FIG. 6A, the diaphragm 1
7 (FIG. 6 (A) I) and then etching the Si substrate 14 as a base to form the diaphragm 10 (FIG. 6 (A)).
II) Then, an electrode film 19 is deposited (FIG. 6 (A) II).
1) Etching to form diaphragm substrate 20
(A) IV).

The embodiment shown in FIG.
The diaphragm film 17 and the electrode film 19 are continuously laminated on the substrate 4 (FIG. 6B), and then the electrode film 19 is etched (FIG. 6B). Is etched to manufacture the diaphragm substrate 20 (III in FIG. 6B).

In the embodiment shown in FIG. 6A, an impurity layer or a foreign substance enters the interface between the diaphragm film 17 and the electrode film 19, and the adhesion between the two is reduced.
Although there were problems such as damage to the thin diaphragm 10 during the process of depositing and etching the electrode film 19, FIG.
In the embodiment shown in (B), the diaphragm film 17 and the electrode film 19
There is no room for an impurity layer or foreign matter to enter the interface with the substrate, and the diaphragm film 17 is not damaged during the process.

FIGS. 7A and 7B are diagrams for explaining another embodiment of the ink jet head according to the present invention. FIG. 7A is a configuration diagram of a main part, and FIG. FIG. 5 is a graph showing the concentration distribution of the nonmetallic element with respect to the direction;
Denotes the thickness of the diaphragm film 17, and the other portions having the same functions as those in FIGS. 3 to 6 are denoted by the same reference numerals as those in FIGS.

In the embodiment shown in FIG. 7, the ratio of the nonmetallic element in the composition of the diaphragm film 17 decreases as the position approaches the counter electrode 15 when the diaphragm film 17 is formed. By doing so, as shown in FIG. 7B, the resistance value of the region can be reduced to the same level as the electrode film 15. Thus, the diaphragm film 17 can substantially also function as an electrode, so that the layer configuration can be simplified. Specifically, in the case of TiC and TiN, the flow rate of the gas that reacts with Ti may be reduced as approaching the counter electrode 15 side.

[0064]

【Example】

(Example 1) A diaphragm made of SiN synthesized by a vapor phase synthesis method will be described. As the source gas, at least two types of gases each containing nitrogen and silicon are used. The phase state of these raw materials does not necessarily need to be a gas at normal temperature and normal pressure, and any liquid or solid that can be vaporized can be used. SiH ₄ ,
Si ₂ H ₆ , Si ₃ H ₈ , SiCl ₃ or the like is used, and N ₂ , NH ₃ , N ₂ O pyridine or the like is used as a nitrogen source.

As a method of forming a SiN film from these source gases, a method in which a film forming active species is formed through a plasma state generated by a plasma method using a direct current, a low frequency, a high frequency, or a microwave or the like. However, a method using a magnetic field effect for the purpose of increasing the area, improving the uniformity, lowering the film forming temperature, etc., for example, ECR plasma CVD
Method is more preferable.

In addition, it may be formed through an ion state generated by ion plating, cluster ion beam, or the like, may be formed from neutral particles generated by ECR sputtering, sputtering, or the like. May be formed by a method combining these. In the present invention, ECR plasma CVD was used and deposited under the following conditions.

Applied magnetic field: 875 G Microwave power: 500 to 2 KW Deposition pressure: 0.005 to 0.1 Pa Deposition temperature: Room temperature to 400 ° C.

[0068] Mechanical properties of the SiN obtained in the above conditions, the Young's modulus ^{2.5~3.5 × 10 4 Kg / mm 2} , was flexural strength 110~140Kg / mm ^2.

Using the SiN film as described above, FIG.
The electrostatic actuator was manufactured according to the example shown in FIG. By using a substrate obtained by attaching 2 μm of SiO ₂ to the surface of Si (100), the above gas phase method was used to form
N was deposited 15 microns thick. Next, 0.5 μm of Ti was formed thereon as an electrode material by sputtering. Further, an opening is opened by etching SiO ₂ at a position corresponding to the diaphragm, and only Si in that portion is etched with a KOH aqueous solution (44%), and anisotropically etched at 80 ° C. to the thickness of the diaphragm. did.

At this time, Ti as an electrode material has corrosion resistance against KOH etching and does not need to be particularly covered with a resist or the like, which is effective for simplifying the process steps.

The diaphragm substrate and the electrode substrate manufactured as described above were joined to form an electrostatic actuator. At this time, the gap between the diaphragm and the lower electrode was set to 0.5 μm. As a result of applying a pulse voltage of about 30 V between the diaphragm electrode and the lower electrode, a sufficient displacement for use as an ink jet was obtained.

(Embodiment 2) An example in which a hard carbon film is used as a diaphragm will be described. CH ₄ : H ₂ = 1 as source gas
A gas mixture of 0: 1 was used. A high frequency plasma CVD method was employed as a synthesis method, and the conditions were as follows at a flow rate of the raw material gas of 10 sccm.

RF power: 5 W / cm ² Pressure: 1 Pa Deposition temperature: 200 ° C.

The mechanical properties of the hard carbon film obtained under the above conditions are as follows: Young's modulus 3.4 × 10 ⁴ Kg / mm ² , bending strength 11
It was 0 kg / mm ² .

Using the hard carbon film as described above, FIG.
An electrostatic actuator was manufactured according to the example shown in FIG. A hard carbon film having a thickness of 10 μm was deposited on the Si (110) surface by using the above-mentioned substrate having SiO ₂ attached to 2 μm as a substrate by the above-described vapor phase method. Next, Pt was formed thereon as an electrode material by magnetron sputtering.
Was formed to 0.3 microns. Further, an opening was opened by etching SiO ₂ at a position corresponding to the diaphragm, and only Si in that portion was anisotropically etched at 80 ° C. to the thickness of the diaphragm at 80 ° C. by etching with a KOH aqueous solution (30%). .

At this time, Pt of the electrode material has corrosion resistance to the KOH etchant and does not need to be covered with a resist or the like in particular, which is effective in simplifying the process steps.

As described above, the manufactured diaphragm substrate and electrode substrate were joined to form an electrostatic actuator. At this time, the gap between the diaphragm and the lower electrode was set to 0.8 μm. As a result of applying a pulse voltage of about 50 V between the diaphragm electrode and the lower electrode, a sufficient displacement for use as an ink jet was obtained.

(Embodiment 3) An example in which a laminate of carbon films is used as a diaphragm will be described. First, in order to generate a metal iodide of Hf and Ti, iodine was reacted with each of the porous bodies of Hf and Ti, and the temperature was set to 800 ° C. to obtain a metal iodide gas. These were alternately introduced into a reaction chamber and reacted with a C ₄ H ₁₀ gas to form a laminate of HfC and TiC on a substrate. The plasma CVD method was used for the synthesis, and deposition was performed under the following reaction conditions.

RF power: 20 W / cm ² Pressure: 2 Pa Deposition temperature: 600 ° C. Flow rate of C ₄ H ₁₀ : 0.05-0.4 ml / mim

First, 3 μm of HfC was deposited as the first material on the side of the vibration plate which is in contact with the ink, and 7 μm of TiC was deposited as the second material on the side not in contact with the ink. As the second material, a material was used in which mechanical properties, such as Young's modulus and strength, were emphasized rather than chemical stability. The HfC Young's modulus is 3.2 × 10 ⁴ Kg / mm ² and Ti
The Young's modulus of C was 4.0 × 10 ⁴ Kg / mm ² . With such a configuration, a diaphragm having both the mechanical properties of TiC and the corrosion resistance and oxidation resistance of HfC could be manufactured.

[0081]

【The invention's effect】

Effect corresponding to the first aspect of the present invention; a step of forming a diaphragm on a substrate by a vapor phase synthesis method is included, so that an inexpensive substrate such as Si can be used, and deformation and destruction of the diaphragm can be prevented. Never happen. Further, since the controllability of the thickness of the diaphragm is remarkably improved, a wide range of materials can be used.

According to a second aspect of the present invention, there is provided an image forming apparatus comprising: a base forming an ink flow path; and a diaphragm integrally formed with the base and constituting a part of the ink flow path. In the ink jet head in which the vibration plate is formed on the base by the vapor phase synthesis method, the vibration plate is made of a hard carbon film containing carbon as a main constituent element, and therefore has a Young's modulus of 3 to 7 × 10 ⁴ Kg /. It has high toughness because it is as large as ² mm2, has excellent chemical stability, and has no large-order grain boundaries unlike zirconia.

According to the third aspect of the present invention, there is provided an image forming apparatus comprising: a base forming an ink flow path; and a diaphragm formed integrally with the base and forming a part of the ink flow path. In the ink jet head in which the vibration plate is formed on the substrate by a gas phase synthesis method, the vibration plate is made of carbide, so that the Young's modulus is larger than that of zirconia, and it is chemically stable, and the ink resistance is high. The performance is also improved.

According to a fourth aspect of the present invention, there is provided an image forming apparatus comprising: a base forming an ink flow path; and a diaphragm formed integrally with the base and constituting a part of the ink flow path. In the inkjet head in which the vibration plate is formed on the substrate by a gas phase synthesis method, the vibration plate is made of nitride, so that the Young's modulus is larger than that of zirconia,
Further, it is chemically stable, and the ink resistance is improved.

According to a fifth aspect of the present invention, there is provided an image forming apparatus comprising: a base forming an ink flow path; and a diaphragm formed integrally with the base and constituting a part of the ink flow path. In the ink jet head in which the vibration plate is formed on the substrate by a gas phase synthesis method, since the vibration plate is made of a composite of at least two kinds of carbides, it has the characteristics of two kinds of materials, for example, a machine. A single layer having good mechanical properties and strong corrosion and oxidation resistance can be obtained.

According to a sixth aspect of the present invention, there is provided an image forming apparatus comprising: a base forming an ink flow path; and a diaphragm integrally formed with the base and constituting a part of the ink flow path. In the ink jet head in which the vibration plate is formed on the base by a gas phase synthesis method, since the vibration plate is made of a laminate of at least two kinds of different materials, it has the characteristics of the two kinds of materials, for example, A single layer having good mechanical properties and strong corrosion and oxidation resistance can be obtained.

According to the seventh aspect of the present invention, a thin film material is formed by laminating a diaphragm constituting a part of the ink flow path and an electrode to which a voltage for driving the diaphragm is applied. In the method for manufacturing an ink jet head including a step, since the thin film material is formed by sequentially and continuously laminating the diaphragm and the electrode by a vapor phase synthesis method,
There is no room for an impurity layer or foreign matter to enter the interface between the diaphragm and the electrode film, the adhesion is improved, and the diaphragm is not damaged during the process.

An effect corresponding to the eighth aspect of the present invention: a vibrating plate which constitutes a part of the ink flow path and has a non-metallic element; In an ink jet head having a counter electrode to which a voltage for driving the plate is applied, the ratio of the non-metallic element of the vibration plate decreases as the distance to the counter electrode decreases. The film can also function as an electrode, and the layer configuration can be simplified.

[Brief description of the drawings]

FIG. 1 is a main part configuration diagram for explaining one embodiment of an inkjet head manufacturing method according to the present invention.

FIG. 2 is a diagram showing characteristics of typical carbides and nitrides.

FIG. 3 is a diagram for explaining another embodiment of the ink jet head according to the present invention.

FIG. 4 is a diagram illustrating an example of an inkjet head to which the present invention is applied.

FIG. 5 is a view for explaining another embodiment of the ink jet head according to the present invention.

FIG. 6 is a view for explaining another embodiment of the ink jet head according to the present invention.

FIG. 7 is a view for explaining another embodiment of the ink jet head according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Upper electrode, 2 ... Lower electrode, 3 ... Base, 4 ... RF power supply, 5 ... DC bias power supply, 6 ... Magnet, 10 ... Vibration plate, 11 ... 1st material, 12 ... 2nd material, 13 ... Ink chamber , 14 ... Si substrate, 15 ... Counter electrode, 16 ... Electrode layer,
17: diaphragm film, 18: resist, 19: electrode film, 20
... diaphragm substrate, d ... thickness of diaphragm film.

Claims (8)

[Claims] 1. A method of manufacturing an ink jet head, comprising a step of forming a vibration plate on a substrate by a vapor phase synthesis method. 2. An ink flow path comprising: a substrate forming an ink flow path; and a vibration plate formed integrally with the substrate and constituting a part of the ink flow path. In an inkjet head formed by a phase synthesis method,
An ink jet head, wherein the diaphragm is made of a hard carbon film containing carbon as a main constituent element. 3. A substrate that forms an ink flow path, and a diaphragm that is formed integrally with the substrate and that constitutes a part of the ink flow path. In an inkjet head formed by a phase synthesis method,
An ink jet head, wherein the vibration plate is made of carbide. 4. A substrate that forms an ink flow path and a diaphragm that is formed integrally with the substrate and that constitutes a part of the ink flow path. In an inkjet head formed by a phase synthesis method,
An ink jet head, wherein the vibration plate is made of nitride. 5. A substrate that forms an ink flow path and a diaphragm that is formed integrally with the substrate and that constitutes a part of the ink flow path. In an inkjet head formed by a phase synthesis method,
An ink jet head, wherein the diaphragm is made of a composite of at least two kinds of carbides. 6. A substrate that forms an ink flow path and a diaphragm that is formed integrally with the substrate and that constitutes a part of the ink flow path. In an inkjet head formed by a phase synthesis method,
An ink jet head, wherein the diaphragm is made of a laminate of at least two kinds of different materials. 7. A diaphragm constituting a part of an ink flow path,
In a method for manufacturing an ink jet head, comprising forming a thin film material by laminating an electrode to which a voltage for driving the vibration plate is applied, the thin film material, the vibration plate and the electrode, A method for manufacturing an ink-jet head, wherein the ink-jet head is formed by continuously laminating by a vapor phase synthesis method. 8. A vibrating plate which forms a part of an ink flow path and has a non-metallic element, and a voltage for driving the vibrating plate which is disposed opposite to the vibrating plate. An inkjet head having a counter electrode to be applied, wherein the ratio of the nonmetallic element of the diaphragm decreases as approaching the counter electrode.