JPH1084060A - Flattening method and equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain a roller-type flattening equipment which is small in size and easily incorporated in a process line and whose working surface is easily cleaned by a method wherein an upper roller is set capable of moving linearly and rotating around an axis vertical to the rotating axis of a lower roller as it is tilted. SOLUTION: A lower drive roller 21 is supported between side plates 11A and 11B in a rotatable manner and rotated around the center axes of shafts 21A and 21B by a drive motor. On the other hand, an upper non-drive roller 25 and its support member 31 are set movable in a vertical direction as rotating and moreover rotatable around the center axis of a shaft 43. By the bias forces of springs 33A and 33B arranged at the edges of a shaft 43, the support member 31 and the non-drive roller 25 are kept always horizontal in attitude or disposed in parallel with a base plate 11D. By this setup, a roller-type flattening device which is small in size and easily incorporated in a process line and whose working surface is easily cleaned and working condition parameters are large in number can be obtained.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a roller type flattening machine, a flattening apparatus and a flattening method suitable for use in a manufacturing process of a chip size package (CSP). The present invention relates to a flattening machine, a flattening device, and a flattening method for flattening a pre-coated solder mounted on a surface.

[0002]

2. Description of the Related Art Referring to FIG. 6, a conventional chip size package (hereinafter referred to as a CSP).
Will be described. This example is based on Japanese Patent Application No. Hei 7 (1999) -197, filed on Dec. 30, 1995 by the same applicant.
-352492 (S95043864), for details, see the same application.

As shown in FIG. 6, the CSP includes an upper semiconductor chip 110 and a lower interposer substrate 120. Interposer substrate 120 has dimensions slightly larger than semiconductor chip 110. Upper semiconductor chip 110
Is an ordinary semiconductor chip or flip chip, which is configured to be mounted on a circuit board by flip chip bonding, and is mounted on an interposer board 120 instead of the circuit board in the CSP. The semiconductor chip 110 may be configured to be mounted by wire bonding, TAB thermocompression bonding, or the like instead of flip chip bonding.

A large number of lands 121 and through-hole lands 125A are arranged on the upper surface 120A of the interposer substrate 120 and are electrically connected to each other by a wiring pattern 122. Through hole land 125A
Are the electrodes 12 on the lower surface 120B of the interposer substrate 120.
5B (not shown) and through-hole connection.

[0005] On the lower surface 120B of the semiconductor chip 110,
Land 121 on upper surface 120A of interposer substrate 120
In response to the above, a large number of aligned aluminum electrodes (not shown) are arranged, and solder bumps 111 are mounted on the aluminum electrodes. Semiconductor chip 110
Are solder-bonded to corresponding lands 121 of the interposer substrate 120.

The semiconductor chip 110 and the interposer substrate 1
The sealing material 115 is inserted between the two, thereby bonding them. The sealing material 115 is an interposer substrate 120
Is filled from the hole 120C provided in the center of the hole or the surrounding gap.

[0007] The CSP comprising the semiconductor chip 110 and the interposer substrate 120 packaged in this way is mounted on a circuit board (motherboard) not shown. The lower surface 120B of the interposer substrate 120 serves as a bonding surface to the motherboard.

Referring to FIGS. 7 and 8, an outline of a CSP manufacturing method will be described. As shown in FIG. 7, the CSP manufacturing process includes a pre-process 100 for preparing a pre-coated substrate for the interposer substrate 120 and a semiconductor chip 1 on this substrate.
Chip bonding process 200 for mounting the semiconductor device 10
And a post-process 300 of dividing (dicing) the substrate to produce a large number of CSPs.

(1) Pre-process First, in step 101, the substrate 120 'is introduced and washed. The substrate is a so-called double-sided copper foil-clad substrate in which copper foil is bonded to both sides of an insulating base material made of glass epoxy or BT resin, etc., and lands 121, wiring patterns 122, through holes, through-hole lands 125A, electrodes and the like are formed. Manufactured by A multilayer board may be used instead of the double-sided copper foil-clad board. Land 121, wiring pattern 122, through hole, through hole land 125
A, electrodes, etc. are made by a known technique.

Next, in step 102, pre-coat solder printing is performed on the substrate. Thereby, the cream solder 141 is mounted on the land 121 as shown in FIG. 8A. After the inspection, in step 103, the substrate 120 'is introduced into a reflow furnace, and solder 1 is attached to the land 121 as shown in FIG. 8B.
42 is mounted. Finally, in step 104, the surface of the solder 142 is flattened as shown in FIG. 8C.

(2) Flip Chip Bonding Step In step 201, the flux 143 is printed as shown in FIG. 8D. At step 202, as shown in FIG. 8E, the flip chip 110 is mounted. A solder bump 111 is mounted on the lower surface of the flip chip 110. In step 203, the substrate is introduced into a reflow furnace, and the solder bump 111 of the flip chip 110 and the solder 142 of the land 121 of the substrate 120 'are joined as shown in FIG. 8F. Finally, in step 204, the flux 143 is washed and dried.

(3) Post-process In step 301, a sealing material is introduced between the flip chip 110 and the substrate 120 ', and then the sealing material is cured. Marking indicating the type is made, and finally the circular substrate 120 'is divided (diced). Thereby, the substrate is divided into small interposer substrates 120, and many CSPs are generated. After baking or drying the CSP, it is placed in a tray or taped.

[0013]

As shown in FIG. 8C, before the CSP manufacturing process, the pre-coated solder 1 is used.
And a step of flattening the surface of 42. However, conventionally, there is no suitable apparatus and machine for flattening the surface of the pre-coated solder 142.

As an apparatus and a method for flattening the surface of the pre-coated solder, there are (1) a roller system in which a substrate is sandwiched between two rollers and pressure, and (2) a flat stamp system in which a flat plate is pressed from above the substrate. Conceivable. The comparison between the two is as follows.

(1) Roller method The contact area with the workpiece is small. Therefore, even if the load applied to the roller is small, the pressure acting on the surface of the workpiece becomes sufficiently large. The device is configured to generate a relatively small load, and can be a small and highly secure leveling machine.

In-line conversion is easy and workability is high. Since the pressure is sandwiched between the two rollers, the pressure and the conveyance can be performed at the same time. Loading and unloading of the substrate onto and from the flattening machine is easy.

The device can be reduced in size. The load applied to the roller may be relatively small, and no particularly complicated mechanism is required for loading and unloading the substrate, so that the flattening machine can be reduced in size.

The work surface can be easily cleaned. The working surface is the surface of the roller. Therefore, for example, the surface can be cleaned while rotating the roller. There are many working condition parameters. The material of the roller surface, the roller load, the number of rotations of the roller and the like are parameters. Therefore, these parameters can be selectively varied to obtain optimal working conditions.

(2) Planar stamping method The contact area with the workpiece is large. Therefore, the load required for pressing is large. The device is configured to generate a relatively large load, resulting in a large and high risk flattening machine.

It is difficult to in-line, and the workability is low. It is necessary to place the substrate in a predetermined working position and discharge it therefrom. That is, the loading and unloading mechanism of the substrate with respect to the flattening machine becomes complicated.

The device becomes large. A relatively large load needs to be generated, and a complicated mechanism is required for loading and unloading the substrate, so that the flattening machine becomes large.

It takes time to clean the work surface. The work of cleaning the work surface involves risks and is difficult to automate. There are few working condition parameters. The material of the stamper surface and the stamper load are parameters. Therefore, there are few parameters to adjust to obtain the optimal working conditions,
Inability to freely adjust delicate working conditions.

From the above, it can be seen that it is preferable to use a roller type rather than a flat stamper type as a flattening machine for flattening the precoat solder.

In view of the above, an object of the present invention is to provide a roller type flattening machine which can be downsized.

In view of the above, an object of the present invention is to provide a roller type flattening machine which can be easily in-lined.

In view of the foregoing, it is an object of the present invention to provide a roller type flattening machine which can easily clean a work surface.

In view of the above, an object of the present invention is to provide a flattening machine having a large number of operation condition parameters.

Further, in view of the above, an object of the present invention is to provide a flattening apparatus or system including a flattening machine.

[0029]

According to the present invention, there is provided a flattening machine for flattening a solder disposed on a surface of a substrate by passing the substrate between a lower roller and an upper roller. The upper roller is linearly movable toward or away from the lower roller, and is rotatable about an axis orthogonal to the axis of rotation of the lower roller. The lower roller is driven by a motor. The circumferential surface of the lower roller is formed of urethane resin. The circumferential surface of the upper roller is DLC (diamond-like carbon) treated.

According to the present invention, a flattening apparatus includes a flattening machine for flattening a solder mounted on a surface of a substrate, a loading conveyor and a flattening machine arranged upstream of the flattening machine. It has an unloading conveyor arranged downstream and a substrate rotating device for changing the rotational position of the substrate arranged on the loading conveyor by 90 °.
It is configured to perform flattening processing in two directions.

According to the present invention, the flattening method comprises a first flattening step of flattening the solder on the surface of the substrate by two rollers of the flattening machine, and a substrate after the first flattening process. Returning the substrate to the upstream side of the flattening machine, rotating the substrate returned to the upstream side of the flattening machine by 90 °, and flattening the solder on the substrate surface by two rollers of the flattening machine. And a second flattening step for performing a planarizing step, wherein the direction of the planarizing step in the second planarizing step is a direction orthogonal to the direction of the planarizing step in the first planarizing step. Further, prior to the first flattening step, the rotational position of the substrate introduced into the loading conveyor is set to 90 degrees.
Includes a rotation step of changing the angle.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a flattening machine according to the present invention will be described with reference to FIGS. FIG. 1 is a partially exploded view of an example of a flattening machine according to the present invention, FIG. 2 is a front view, and FIG. 3 is a side view. As shown in FIG. 1, the flattening machine of the present example has a pair of rollers 21 and 25,
By passing the interposer substrate between 1 and 25, the pre-coated solder mounted on the upper surface of the interposer substrate is flattened.

The lower roller 21 is a drive roller and is driven by a drive motor (not shown). The drive motor is configured to be variable in rotation speed and to be capable of normal rotation and reverse rotation. The drive roller 21 comes into contact with the back surface of the interposer substrate and conveys it by frictional force. Accordingly, the surface of the drive roller 21 has sufficient elasticity to absorb small irregularities such as electrodes and resist on the back side of the interposer substrate, and has sufficient elasticity so as not to slide on the back side of the interposer substrate. It is composed of a material having a coefficient of friction.

According to the present embodiment, the drive roller 21 may be preferably formed by mounting a urethane resin sheet on the surface of a metal roller. The urethane resin sheet may be formed of, for example, urethane resin having a thickness of 5 mm and a hardness of 90 °.

The upper roller is a non-driving roller, and when the interposer substrate sandwiched between the two rollers 21 and 25 moves, it is rotated by the frictional force with the interposer substrate. The non-drive roller 25 contacts and presses the solder on the surface of the interposer substrate. Therefore, it is composed of a material harder than solder. According to this example, the non-driving roller 25 may be formed by performing DLC (diamond-like carbon) processing on the surface of a metal roller.

As shown in FIG. 2, the flattening machine of this embodiment comprises a pair of parallel and vertical side plates 11A and 11B and a horizontal upper plate 11C connecting the upper ends of the side plates 11A and 11B.
And a bottom plate 11D connecting the lower end. The lower roller 21 is rotatably supported by the side plates 11A and 11B, and the upper roller 25 is rotatably supported by a U-shaped support member 31.

The rollers 21 and 25 have shafts 21 at both ends.
A, 21B and 25A, 25B, the lower roller 2
The first shafts 21A and 21B are mounted on inner rings of bearings 23A and 23B mounted on the side plates 11A and 11B, respectively.
The shafts 25A and 25B of the upper roller 25 are mounted on inner rings of bearings 27A and 27B mounted on both ends of the support member 31, respectively.

A further support member 41 is disposed above the support member 31, and the two support members 31, 41 are rotatably connected to each other by a shaft 43 disposed therebetween. . The shaft 43 is the shaft 21 of the lower roller 21.
The support member 31 and the upper roller 25 are inclined about a rotation axis OO (FIG. 1) orthogonal to the center axis of the lower roller 21. It is configured to be able to. Bearings 47 (FIG. 3) are mounted on the upper surface of the lower support member 31, and bearings 45A, 4B are mounted on the lower surface of the upper support member 41.
5B (FIG. 3) is mounted, and the shaft 43
And 45A, 45B.

A pair of springs 33A, 33B is arranged between the two support members 31, 41. A pair of spring retainers 35A and 35B are attached to the upper support member 41,
The spring 33 is controlled by these spring retainers 35A and 35B.
The upper ends of A and 33B are held. In addition, spring retainer 3
By adjusting the position of 5A, 35B, the spring 33
The biasing force of A and 33B can be adjusted.

The cylinder 51 is mounted on the upper plate 11C of the frame, and the lower end of the shaft 53 of the cylinder 51 is mounted on the upper support member 41. The cylinder 51 moves the upper support member 41 and the roller 25 in the vertical direction, and generates a load applied to the upper roller 25. Cylinder 51
The upper roller 25 moves between the upper rising position and the lower flattening position by the expansion and contraction of the shaft 53. In the raised position, the interposer substrate can simply pass (pass operation) without being flattened.

Both ends of the upper support member 41 are
It is slidably mounted on both side plates 11A and 11B via 7A and 57B. Therefore, the upper supporting member 41
With the sliders 57A and 57B constrained, the slider 57A can move in the vertical direction in a horizontal state, that is, in a state parallel to the bottom plate 11D.

The operation of the flattening machine of this embodiment will be described. The lower drive roller 21 is rotatably supported by both side plates 11A and 11B, and is driven by a drive motor (not shown).
It is rotatable around the central axis of A, 21B, but cannot perform any motion other than rotation. On the other hand, the upper non-driving roller 25 and the supporting member 31 that supports the upper non-driving roller 25 are vertically movable and rotatable around the central axis OO of the shaft 43.

However, due to the biasing force of the springs 33A and 33B disposed on both sides of the shaft 43, the support member 31 and the non-drive roller 25 are always kept in the horizontal direction, that is, the bottom plate 11
It is configured to be arranged in parallel with D.

The interval between the two rollers 21 and 25 is set according to the thickness of the interposer substrate 120.
That is, the cylinder 51 (FIGS. 1 to 3) is driven in consideration of the thickness of the interposer substrate 120, and the upper roller 25 is driven.
Is set.

The thickness of the interposer substrate 120 is not constant but fluctuates due to unevenness of the thickness of the base material and unevenness of the surface. When the variation in the thickness of the interposer substrate 120 is small, it is absorbed by the elastic deformation of the driving roller 21. Therefore, the non-drive roller 25 is always kept horizontal, and the two rollers 21 and 25 are kept parallel to each other. The variation of the thickness of the interposer substrate 120 is large,
If it cannot be absorbed by the elastic deformation of the driving roller 21, the non-driving roller 25
Rotate and tilt around O. Thereby, the interposer substrate 120 is pressed by a uniform pressure, and an excessive force is prevented from acting on the two rollers 21 and 25.

Referring to FIG. 4, an example of a flattening apparatus and a flattening method according to the present invention will be described. According to the present invention, the flattening device includes a flattening machine 60, a loading conveyor 61 and an unloading conveyor 62, a substrate rotating device 65, and a substrate positioning device 70. The flattening machine 60 may have the same configuration as the flattening machine described with reference to FIGS. 1 to 3 described above, and includes two rollers 21 and 25.

The loading conveyor 61 and the unloading conveyor 62 are driven by motors (not shown), respectively, and move in the forward direction (the direction from right to left in FIG. 4) and the reverse direction (the direction from left to right in FIG. 4). Direction) and has two parallel guide rails (not shown) for guiding the interposer substrate 120.

The substrate rotation device 65 is configured to change the rotation position of the interposer substrate 120 disposed on the loading conveyor 61 by 90 °, and is typically movable about a vertical rotation axis that is vertically movable. It has a plurality of rotatable, for example, four suction portions 65A. Here, the interposer substrate 120 is square.

When the interposer substrate 120 is placed at a predetermined suction position or a rotation position on the loading conveyor 61, the suction section 65A is lowered, and the interposer substrate 120 is moved downward.
Adsorb and rise. The suction unit 65A is rotated by 90 ° around the vertical rotation axis and descends, and the interposer substrate 120 is placed on the loading conveyor 61. Since the interposer substrate 120 is rotated by 90 ° after being positioned at a predetermined suction position or rotation position, it can be accurately disposed between the two guide rails of the loading conveyor 61.

The substrate positioning device 70 accurately positions the suction position or the rotation position for rotating the interposer substrate 120 by the substrate rotation device 65 on the loading conveyor 61 and the loading position for loading the flattening machine 60. It has a locating pin configured to be positioned and typically capable of ascending and descending.

For example, by engaging the front edge of the interposer substrate 120 with the positioning pins, the interposer substrate 120 is positioned at a predetermined suction position or a rotation position. The interposer substrate 120 is positioned at a predetermined loading position by engaging the rear edge of the interposer substrate 120 with the positioning pins.

Next, the flattening method of the present invention will be described with reference to FIG. 5A. According to this example, the precoat solder on the upper surface of the interposer substrate 120 is flattened by the flattening device in two directions orthogonal to each other. Thus, the pre-coated solder is flattened in two directions, so that the pre-coated solder is flattened reliably and uniformly.

First, flattening is performed along the first direction. The interposer substrate 120 introduced into the loading conveyor 61 is positioned (pos1) by the substrate positioning device 70 at a predetermined suction position or rotation position. Next, the interposer substrate 120 is turned 90 ° by the substrate rotating device 65.
It is rotated (rot1), and is conveyed in the direction of the flattening machine 60 by the loading conveyor 61.

The upper roller 25 of the flattening machine 60 is located at the ascending position, and the positioning pin of the positioning device 70 is located at the descending position. Interposer substrate 120
Is transported to the front of the loading position (for example, to the inside of the flattening machine 60), and stops there. The positioning pin of the positioning device 70 is located at the raised position, and the loading conveyor 61 (and the lower roller 21 of the flattening machine 60) moves in the opposite direction. When the trailing edge of the interposer substrate 120 comes into contact with the positioning pin of the substrate positioning device 70, the interposer substrate 120 is positioned at the loading position (pos.
2) is done.

The upper roller 25 is lowered to a predetermined position, the loading conveyor 61 moves in the forward direction, and the lower drive roller 21 is rotated to flatten the solder on the upper surface of the interposer substrate 120 (pro1). Is done.
The interposer substrate 120 is discharged by the unloading conveyor 62 after the flattening process. Thus, the flattening process is performed along the first direction.

Next, flattening is performed along the second direction. The upper roller 25 of the flattening machine 60 rises, the unloading conveyor 62, the lower roller 21 and the loading conveyor 61 are reversed, and the interposer substrate 12
0 is transported to the substrate rotating device 65. Therefore, the interposer substrate 120 is positioned (pos3) at the suction position or the rotation position by the substrate positioning device 70, and
5 is turned 90 degrees (rot2).

The interposer substrate 120 rotated by 90 °
Is flattened again in the same procedure as the above-described flattening process in the first direction. That is, the upper roller 25 stands by at the raised position, and the positioning pins of the substrate positioning device 70 are arranged at the lowered position. The interposer substrate 120 is conveyed by the loading conveyor 61 toward the flattening machine 60 and stops after passing through the loading position. The positioning pin is located at the raised position, and the loading conveyor 61
(And the lower roller 21) move in the opposite direction, and the rear edge of the interposer substrate 120 contacts the positioning pin.

When the interposer substrate 120 is positioned (pos4) at the loading position by the substrate positioning device 70, the upper roller 25 of the flattening machine 60 is lowered, and the lower roller 21, the loading conveyor 61, and the unloading are performed. The conveyor 62 is rotated forward, and the interposer substrate 120 is flattened (pro2) along the second direction.
The interposer substrate 120 flattened along the second direction is discharged from the flattening machine 60.

In the above steps, the interposer substrate 120
The reason why the interposer substrate 120 is previously rotated by 90 ° before the flattening process is performed in the first direction by the flattening machine 60 is that the flattening process can be minimized. .

The interposer substrate 1 after the flattening process is completed
20 needs to be discharged from the flattening device in the same direction as that introduced into the flattening device.

For example, as shown in FIG. 5B, a case where the interposer substrate 120 is flattened along the first direction by the flattening machine 60 without rotating the interposer substrate 120 by 90 degrees in advance. In this case, after the interposer substrate 120 is flattened along the second direction, the interposer substrate 120 is
5 and rotate the interposer substrate 120 by 90 °, which increases the number of steps.

Although the embodiments of the present invention have been described in detail above, the present invention is not limited to these examples, and various modifications can be made within the scope of the invention described in the claims. It will be understood by those skilled in the art.

The case where the pre-coated solder mounted on the surface of the interposer substrate is flattened has been described above. However, the present invention is not limited to the interposer substrate and is applicable to the case where the solder of another substrate is flattened. Is possible.

[0064]

According to the present invention, downsizing is possible,
There is an advantage that it is possible to provide a roller type flattening machine which is easy to in-line, easily cleans a work surface, and has a large number of work condition parameters.

According to the flattening device of the present invention, since the solder on the surface of the interposer substrate is flattened in two directions orthogonal to each other, there is an advantage that the solder is evenly and uniformly flattened. .

According to the flattening method of the present invention, the substrate is rotated by 90 ° before the solder of the interposer substrate is flattened in two directions, so that the flattening step can be shortened. Have.

[Brief description of the drawings]

FIG. 1 is a partially exploded perspective view of a flattening machine according to the present invention.

FIG. 2 is a diagram showing a front configuration of a flattening machine according to the present invention.

FIG. 3 is a diagram showing a side configuration of a flattening machine according to the present invention.

FIG. 4 is an explanatory diagram for explaining an outline of a flattening device according to the present invention.

FIG. 5 is an explanatory diagram for explaining a flattening process according to the present invention.

FIG. 6 is a diagram illustrating a configuration example of a conventional CSP.

FIG. 7 is a diagram showing a conventional CSP manufacturing process.

FIG. 8 is a diagram showing a conventional CSP manufacturing method.

[Explanation of symbols]

11A, 11B side plate, 11C top plate, 11D bottom plate, 21 rolls, 21A, 21B shaft, 23A,
23B bearing, 25 rolls, 25A, 25B
Shaft, 27A, 27B bearing, 31 support member,
33A, 33B spring, 35A, 35B spring retainer,
41 support member, 43 axis, 45A, 45B, 4
7 bearings, 51 cylinders, 53 shafts, 57
A, 57B slider, 60 flattening machine, 61, 6
2 conveyor, 65 substrate rotating device, 65A suction unit, 70 positioning device, 110 semiconductor chip,
111 solder bump, 115 sealing material, 120
Interposer substrate, 120A upper surface, 120B lower surface, 120C hole, 121 land, 122 wiring pattern, 125A through-hole land, 14
1 cream solder, 142 solder, 143 flux, 145 mask

Claims (16)

[Claims] 1. A flattening machine for flattening a solder disposed on a surface of a substrate by passing the substrate between a lower roller and an upper roller, wherein the upper roller is disposed on the lower roller. A flattening machine, which is movable in a linear direction so as to approach or move away from the roller, and is rotatable and inclined about an axis orthogonal to a rotation axis of the lower roller. 2. The flattening machine according to claim 1, wherein said lower roller is driven by a motor. 3. The flattening machine according to claim 1, wherein a circumferential surface of said lower roller is formed of urethane resin. 4. The flattening machine according to claim 1, wherein a circumferential surface of said upper roller is subjected to a DLC (diamond-like carbon) treatment. 5. The flattening machine according to claim 1, wherein the lower roller is rotatably mounted on a frame, and the upper roller is rotatably mounted on a first support member. The first support member is mounted on the second support member mounted on the frame so as to be rotatable and tiltable about a rotation axis orthogonal to the rotation axis of the lower roller, and the first support member is mounted on the second support member. A flattening machine, wherein the upper roller is also configured to rotate and tilt about the rotation axis when the rotation is tilted about the rotation axis. 6. The flattening machine according to claim 5, wherein the second support member is slidably mounted on the frame via a slider, and the second support member is vertically moved with respect to the frame. A flattening machine, wherein the first support member and the upper roller are configured to move vertically when moved. 7. The flattening machine according to claim 5, wherein a spring is disposed between the first support member and the second support member, and the first support member is biased by the spring. Is flattened so as to be disposed parallel to the second support member. 8. A flattening machine for flattening a solder mounted on a surface of a substrate, a loading conveyor arranged upstream of the flattening machine, and an anchor arranged downstream of the flattening machine. A loading conveyor and a substrate rotating device for changing a rotation position of the substrate disposed on the loading conveyor by 90 °, wherein the flattening machine flattens the solder of the substrate along two directions orthogonal to each other; A flattening device configured to perform a forming process. 9. The flattening device according to claim 8, wherein a substrate positioning device is arranged along the loading conveyor, and the substrate positioning device has a loading position for loading the substrate on the flattening machine and the loading position. A flattening apparatus, wherein the flattening apparatus is configured to be positioned at a rotation position for rotating a substrate by the substrate rotating apparatus. 10. The flattening apparatus according to claim 8, wherein the flattening machine has two rollers, and passes between the two rollers to flatten the solder mounted on the surface of the substrate. A flattening device, characterized in that it is configured to perform a finishing process. 11. The flattening apparatus according to claim 10, wherein the two rollers of the flattening machine include a driving roller and a non-driving roller, wherein the non-driving roller is linearly movable in the direction of the driving roller. A flattening device characterized in that the flattening device is rotatable about a rotation axis orthogonal to the rotation axis of the driving roller. 12. The flattening device according to claim 11, wherein a circumferential surface of the driving roller is formed of urethane resin, and a circumferential surface of the non-driving roller is subjected to a DLC (diamond-like carbon) treatment. Characteristic flattening device. 13. A first flattening step of flattening solder on a substrate surface by two rollers of a flattening machine, and placing the substrate after the first flattening process on an upstream side of the flattening machine. A return step of returning, and a rotation step of changing the rotation position of the substrate returned to the upstream side of the flattening machine by 90 °,
And a second flattening step of flattening the solder on the substrate surface with the two rollers of the flattening machine, wherein the direction of the flattening in the second flattening step is the first flattening process. A flattening method characterized by being in a direction orthogonal to a flattening direction in a processing step. 14. The flattening method according to claim 13, wherein prior to the first flattening step, the rotational position of the substrate introduced into the loading conveyor is set to 90 °.
A flattening method comprising a rotating step of changing. 15. The flattening method according to claim 13, wherein the first and second flattening steps include a positioning step for arranging a substrate at a loading position for loading the flattening machine. A flattening method characterized by including: 16. The flattening method according to claim 14, wherein the two rotation steps include a positioning step for arranging the substrate at a rotation position for loading the substrate on a substrate rotation device. Flattening processing method.