JPH1083942A - Inspecting window for semiconductor cooling chamber - Google Patents
Inspecting window for semiconductor cooling chamberInfo
- Publication number
- JPH1083942A JPH1083942A JP23608296A JP23608296A JPH1083942A JP H1083942 A JPH1083942 A JP H1083942A JP 23608296 A JP23608296 A JP 23608296A JP 23608296 A JP23608296 A JP 23608296A JP H1083942 A JPH1083942 A JP H1083942A
- Authority
- JP
- Japan
- Prior art keywords
- cooling chamber
- wafer
- inspection window
- transparent hard
- inspecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、半導体製造装置に
おけるウエハの真空雰囲気中での処理を実施する半導体
冷却チャンバ(以下、冷却チャンバと略記する)の構造
に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a semiconductor cooling chamber (hereinafter abbreviated as "cooling chamber") for performing processing of a wafer in a vacuum atmosphere in a semiconductor manufacturing apparatus.
【0002】[0002]
【従来の技術】図4は、従来の冷却チャンバの点検窓を
示す斜視図、図5は、図4の点検窓によるウエハの上面
点検要領を示す図、図6は、図4の点検窓によるウエハ
の正面点検要領を示す図である。従来のウエハの冷却チ
ャンバは、図4に示すように、冷却チャンバ1を形成す
る6面体の前面に設けた前面穴1aに、ガラス板2aを
シール材2bと止めねじ4を用いて構成した前部点検窓
2、上面に設けた穴1bに、ガラス板3aをシール材3
aと止めねじ4を用いて構成した上部点検窓3とを備え
ており、冷却チャンバ1内に収容されたウエハ5に対す
る図示しないロボットのティーチングでは、図6に示す
ように、ウエハ5に対する上下(矢印Z方向)、左右
(矢印Y方向)の位置調整は、前部点検窓2によって行
ない、また図5に示すように、ウエハ5に対する前後
(矢印X方向)の位置調整は、上部点検窓3によって行
なっている。2. Description of the Related Art FIG. 4 is a perspective view showing an inspection window of a conventional cooling chamber, FIG. 5 is a diagram showing a procedure for inspecting the upper surface of a wafer by the inspection window of FIG. 4, and FIG. It is a figure showing the front inspection procedure of a wafer. In a conventional wafer cooling chamber, as shown in FIG. 4, a glass plate 2a is formed using a sealing material 2b and a set screw 4 in a front hole 1a provided on the front surface of a hexahedron forming the cooling chamber 1. Window 2, a glass plate 3 a is sealed with a sealing material 3 in a hole 1 b provided on the upper surface.
a and an upper inspection window 3 constituted by using a set screw 4, and when teaching a robot (not shown) to the wafer 5 housed in the cooling chamber 1, as shown in FIG. Position adjustment in the direction of arrow Z) and left and right (direction of arrow Y) is performed by the front inspection window 2, and as shown in FIG. It is done by.
【0003】[0003]
【発明が解決しようとする課題】半導体製造装置におけ
るウエハの成膜処理は、真空雰囲気中の特殊条件下で実
施するために、上記のように、冷却チャンバに対しては
高度の気密構造を必要としている。しかしながら、一層
の原価低減の必要性から、点検窓に対する所要機能を保
持すると共に、構造の簡易化が課題となっていた。本発
明の目的は、冷却チャンバの構造の簡易化を図り、原価
低減と、冷却チャンバ内に収容したウエハに対する点検
と確認作業の迅速化を図ることを目的としてなされたも
のである。As described above, a highly airtight structure is required for the cooling chamber because the film formation processing of the wafer in the semiconductor manufacturing apparatus is performed under special conditions in a vacuum atmosphere. And However, because of the necessity of further cost reduction, it has been a problem to maintain required functions for the inspection window and to simplify the structure. SUMMARY OF THE INVENTION An object of the present invention is to simplify the structure of a cooling chamber, reduce costs, and speed up inspection and confirmation of wafers housed in the cooling chamber.
【0004】[0004]
【課題を解決するための手段】上記の課題を解決するた
めに、本発明は、従来、冷却チャンバの前面と上面の2
箇所にそれぞれ設けられた点検窓により行なっていたウ
エハに対する上下、左右、前後の3方向に対する位置調
整を、角度αを有する冷却チャンバの前方斜面に形成し
た1箇所の点検窓によって行なうように構成した冷却チ
ャンバの点検窓構造である。すなわち上記の目的は、請
求項1記載のように、6面体により構成した筐体と、前
記筐体底面との間に角度αを形成する前記6面体のうち
の一面に穿設した穴と、この穴を被覆する透明硬質部材
と、この透明硬質部材を介する外部空間と前記筐体内部
空間との間を密封するシール部材と、前記透明硬質部材
と前記シール部材を前記筐体に固定する締結手段と、を
有することを特徴とする半導体冷却チャンバの点検窓に
よって達成される。前記角度αは、概ね45°を平均値
とする傾斜角度(鋭角)が好ましいが、冷却チャンバ内
に収容する半導体の処理内容、または、ロボットのティ
ーチングによって、最適な値が選定されるべきであるこ
とは当然である。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention relates to a conventional cooling chamber.
The position adjustment in three directions of up, down, left, right, front and rear with respect to the wafer, which was performed by the inspection windows provided at the respective locations, is performed by one inspection window formed on the front slope of the cooling chamber having the angle α. It is an inspection window structure of a cooling chamber. That is, as described in claim 1, the above-mentioned object is to provide a housing formed of a hexahedron, and a hole formed on one surface of the hexahedron forming an angle α between the housing bottom and the housing. A transparent hard member that covers the hole, a seal member that seals between the external space and the housing internal space via the transparent hard member, and a fastening that fixes the transparent hard member and the seal member to the housing. And means for inspecting the semiconductor cooling chamber. The angle α is preferably an inclination angle (acute angle) having an average value of about 45 °, but an optimum value should be selected according to the processing content of the semiconductor housed in the cooling chamber or the teaching of the robot. That is natural.
【0005】[0005]
【発明の実施の形態】本発明の実施の形態を図面に基づ
いて説明する。図1は、本発明に係る冷却チャンバの点
検窓の一実施の形態を示す斜視図、図2は、図1の点検
窓によるウエハの上面点検要領を示す図、図3は、図1
の点検窓によるウエハの前面点検要領を示す図である。
冷却チャンバ10内に収容されたウエハ5に対する、上
下、左右、前後の3方向の位置調整は、角度αを有する
冷却チャンバ10の前方斜面に形成した1箇所の点検窓
11によって行なう。すなわち、点検窓11は、穴10
aに、ガラス板11aをシール材11bと止めねじ4を
用いて構成され、ウエハ5に対する上下(矢印Z方
向)、左右(矢印Y方向)の2方向の位置調整は図3に
示すように、点検窓11の前側から行なうことができ、
ウエハ5に対する前後(矢印X方向)方向の位置調整
は、図2に示すように、点検窓11の上側から行なうこ
とができ、実質的に1箇所の点検窓11によって3方向
の点検を兼用して実施するすることが可能となる。な
お、請求項1記載の透明硬質部材とは、例えば、硬質ガ
ラス板材であって適宜の厚さを有するものが適当であ
り、また、シール部材とは、例えば、合成ゴム材のよう
な適宜の弾性を有するパッキン材が好ましい。Embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view showing an embodiment of an inspection window of a cooling chamber according to the present invention, FIG. 2 is a diagram showing a procedure for inspecting the upper surface of a wafer by the inspection window of FIG. 1, and FIG.
FIG. 4 is a view showing a procedure for inspecting the front surface of a wafer by an inspection window of FIG.
Position adjustment of the wafer 5 accommodated in the cooling chamber 10 in three directions of up, down, left, right, front and back is performed by one inspection window 11 formed on the front slope of the cooling chamber 10 having the angle α. That is, the inspection window 11 is
As shown in FIG. 3, a glass plate 11a is formed by using a sealing material 11b and a set screw 4 to adjust the position of the glass plate 11a in two directions, up and down (arrow Z direction) and left and right (arrow Y direction). Can be performed from the front side of the inspection window 11,
As shown in FIG. 2, the position of the wafer 5 in the front-rear direction (the direction of the arrow X) can be adjusted from above the inspection window 11, and one inspection window 11 can be used for inspection in three directions. Can be implemented. The transparent hard member according to claim 1 is, for example, a hard glass plate material having an appropriate thickness, and the sealing member is, for example, an appropriate material such as a synthetic rubber material. An elastic packing material is preferred.
【0006】[0006]
【発明の効果】本発明の実施により、従来、2箇所でそ
れぞれ実施していた冷却チャンバ内のウエハの点検を1
箇所の点検窓で兼用することができ、部品点数の減少に
よる構造の簡易化と原価低減を図ることができる。According to the present invention, the inspection of the wafer in the cooling chamber, which has conventionally been performed at two locations, is performed in one step.
The inspection window at the location can also be used, and the structure can be simplified and the cost can be reduced by reducing the number of parts.
【図1】本発明の冷却チャンバの点検窓の一実施の形態
を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of an inspection window of a cooling chamber of the present invention.
【図2】図1の点検窓によるウエハの上面点検要領を示
す図である。FIG. 2 is a diagram showing a procedure for inspecting a top surface of a wafer by an inspection window of FIG. 1;
【図3】図1の点検窓によるウエハの正面点検要領を示
す図である。FIG. 3 is a view showing a procedure for front inspection of a wafer by an inspection window of FIG. 1;
【図4】従来の冷却チャンバの点検窓を示す斜視図であ
る。FIG. 4 is a perspective view showing an inspection window of a conventional cooling chamber.
【図5】図4の点検窓によるウエハの上面点検要領を示
す図である。5 is a view showing a procedure for inspecting the upper surface of the wafer by the inspection window of FIG. 4;
【図6】図4の点検窓によるウエハの正面点検要領を示
す図である。6 is a diagram showing a procedure for inspecting the front of a wafer by the inspection window of FIG. 4;
1…冷却チャンバ 1a…前面穴 1b…上面穴 2…前部点検窓 2a…ガラス板 2b…シール材 3…上部点検窓 3a…ガラス板 3b…シール材 4…止めねじ 5…ウエハ 10…冷却チャンバ 10a…穴 11…点検窓 11a…ガラス板 11b…シール材 DESCRIPTION OF SYMBOLS 1 ... Cooling chamber 1a ... Front hole 1b ... Top hole 2 ... Front inspection window 2a ... Glass plate 2b ... Sealing material 3 ... Upper inspection window 3a ... Glass plate 3b ... Sealing material 4 ... Set screw 5 ... Wafer 10 ... Cooling chamber 10a: hole 11: inspection window 11a: glass plate 11b: sealing material
───────────────────────────────────────────────────── フロントページの続き (72)発明者 遠山 克二 東京都中野区東中野三丁目14番20号 国際 電気株式会社内 (72)発明者 稲田 哲明 東京都中野区東中野三丁目14番20号 国際 電気株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Katsuji Toyama 3-14-20 Higashinakano, Nakano-ku, Tokyo International Electric Company (72) Inventor Tetsuaki Inada 3-14-20 Higashinakano, Nakano-ku, Tokyo International Inside Electric Co., Ltd.
Claims (1)
ちの一面に穿設した穴と、 この穴を被覆する透明硬質部材と、 この透明硬質部材を介する外部空間と前記筐体内部空間
との間を密封するシール部材と、 前記透明硬質部材と前記シール部材を前記筐体に固定す
る締結手段と、を有することを特徴とする半導体冷却チ
ャンバの点検窓。1. A housing formed of a hexahedron, a hole formed on one surface of the hexahedron forming an angle α with the bottom surface of the housing, and a transparent hard member covering the hole. A sealing member for sealing between the external space and the housing internal space via the transparent hard member; and fastening means for fixing the transparent hard member and the sealing member to the housing. Inspection window of the semiconductor cooling chamber.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23608296A JPH1083942A (en) | 1996-09-06 | 1996-09-06 | Inspecting window for semiconductor cooling chamber |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23608296A JPH1083942A (en) | 1996-09-06 | 1996-09-06 | Inspecting window for semiconductor cooling chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1083942A true JPH1083942A (en) | 1998-03-31 |
Family
ID=16995460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23608296A Pending JPH1083942A (en) | 1996-09-06 | 1996-09-06 | Inspecting window for semiconductor cooling chamber |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1083942A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100375988B1 (en) * | 2001-02-05 | 2003-03-15 | 삼성전자주식회사 | semiconductor device manufacturing equipment and method for detecting position of semiconductor wafer |
KR100852620B1 (en) | 2007-03-06 | 2008-08-18 | 주식회사 두오텍 | Apparatus for temperature reliability test of electronic devices |
-
1996
- 1996-09-06 JP JP23608296A patent/JPH1083942A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100375988B1 (en) * | 2001-02-05 | 2003-03-15 | 삼성전자주식회사 | semiconductor device manufacturing equipment and method for detecting position of semiconductor wafer |
KR100852620B1 (en) | 2007-03-06 | 2008-08-18 | 주식회사 두오텍 | Apparatus for temperature reliability test of electronic devices |
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Legal Events
Date | Code | Title | Description |
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A131 | Notification of reasons for refusal |
Effective date: 20061121 Free format text: JAPANESE INTERMEDIATE CODE: A131 |
|
A02 | Decision of refusal |
Effective date: 20070320 Free format text: JAPANESE INTERMEDIATE CODE: A02 |