JPH10780A - Production of ink jet head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To securely connect without applying high pressure and heat by inserting a conductive member up to the position coming into contact with a piezoelectric element through a through-hole into which an adhesive is injected to integrally bond and fix a plate-shaped wiring material, a line head substrate and the conductive member. SOLUTION: A through-hole 5 is formed to a sheet like wiring material 1 at the position corresponding to a piezoelectric element 4. The sheet like wiring material 1 is arranged on the line head substrate 3 having the piezoelectric element 4 arranged thereon so that the through-hole 5 is matched with the position of the piezoelectric element 4 and a conductive adhesive 6 is injected into the through-holes 5. A conductive pin member 7 is inserted into the through-hole 5 into which the adhesive 6 is injected to be pushed in until brought into close contact with the piezoelectric element 4. The adhesive 6 guides the pin member 7 to reach the surface of the piezoelectric element 4 to integrally bond and fix an electrode 2, the conductive pin member 7 and the piezoelectric element 4. By this constitution, certain connection can be achieved without applying high pressure or heat.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a head for an ink jet recording apparatus, and more particularly, to a method for connecting a wiring pattern printed on the surface of a plate-like wiring material to a piezoelectric element on a line head substrate. The present invention relates to a method for manufacturing an ink jet head.

[0002]

2. Description of the Related Art In a conventional method of manufacturing a head for an ink jet recording apparatus, a method of connecting an electrode conducting to a wiring pattern printed on the surface of a plate-like wiring member and a piezoelectric element on a line head substrate includes the following. For example, there is one shown in FIG. In this method, a piezoelectric element 33 provided on a line head substrate 34 and an electrode 3 provided on a
2 and the piezoelectric element 33 and the electrode 32 by continuously applying pressure.
Are electrically connected. The anisotropic conductive sheet 35 has a property that the portion has conductivity while pressure is applied, and this example utilizes this property. FIG. 4 shows one of the methods proposed in Japanese Patent Application Laid-Open No. 4-345858. In this method, an anisotropic conductive film 36 is used instead of the anisotropic conductive sheet 35 used in the above example, and the piezoelectric element 33 and the electrode 32 are electrically connected by applying pressure and heat for a certain time. , Are physically connected. The anisotropic conductive film 3
No. 6 has a property of being cured while having conductivity by applying pressure and heat for a certain period of time, and this example utilizes this property. FIG. 5 shows one of the methods proposed in Japanese Patent Application Laid-Open No. 7-32590. In this method, the elastic projection 37a of the dimple-processed plate-like wiring member 37 is brought into contact with the piezoelectric element 33 disposed on the line head substrate 34, and the elastic projection 37a is pressed from the back side of the elastic projection 37a. The piezoelectric element 33 and the plate-like wiring member 37 are electrically connected by pressing a rubber pad 38 having a projection 38a slightly larger than the diameter of the projection 37a.

[0003]

However, the above-mentioned prior art has the following problems. In the first example (shown in FIG. 3), it is necessary to always apply a relatively high pressure such that the anisotropic conductive sheet 35 exhibits conductivity. Therefore, there have been problems such as destruction of the piezoelectric element due to high pressure, deformation of the ink flow path, and suppression of vibration of the piezoelectric element.
Further, in the example of JP-A-4-345858 (shown in FIG. 4), when a high pressure is applied temporarily, problems such as breakage of the piezoelectric element and deformation of the ink flow path are caused in the same manner as in the above example. At the same time, the above problem could be further expanded by applying heat. In the example of Japanese Patent Application Laid-Open No. Hei 7-32590 (shown in FIG. 5), the elastic projections 3 formed by dimple processing are formed on
7a is required. However, the elastic projections 37a are inevitably large in size for the sake of processing, and are not suitable for a connection portion of an inkjet head in which a large number of contacts are arranged at high density. Accordingly, an object of the present invention is to provide a wiring pattern printed on the surface of a plate-like wiring material connected by the above-mentioned contacts, a piezoelectric element on a line head substrate, Is connected securely without applying high pressure or heat,
It is to provide a method for manufacturing an ink jet head.

[0004]

SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a wiring pattern printed on the surface of a plate-like wiring member, and a wiring pattern provided along the plate-like wiring member. A method for manufacturing an ink jet head by connecting a piezoelectric element on a line head substrate to be used, wherein a through-hole forming step of forming a through-hole on the plate-shaped wiring member at a position corresponding to the piezoelectric element; An adhesive injecting step of injecting a conductive adhesive into the through-hole, and a step in which the plate-shaped wiring member is arranged along the line head substrate.
The conductive member is inserted through the through-hole into which the adhesive has been injected until it comes into contact with the piezoelectric element.
And a bonding step for integrally bonding and fixing the line head substrate and the conductive member. The plate-like wiring material is a so-called wiring board made of a plate-like hard board, a so-called FPC which is a flexible sheet material.
Such existing wiring members can be used. In the through-hole forming step, the plate-shaped wiring member may be directly perforated. However, first, an electrode is formed on the front surface (front and / or back surface) of the plate-shaped wiring member, and thereafter, And forming a through-hole through the plate-like wiring material, and further forming a through-hole by plating the inner surface of the through-hole with a conductive material. The conductivity with the element can be increased. Further, when the conductive member has a pin shape, the connection area between the conductive member and the piezoelectric element can be increased, and
It is easy to apply a pressure force to the piezoelectric element. Further, when the conductive member is formed into a spherical shape, it can be easily inserted into each of the through holes. Further, by applying a non-adhesive treatment to portions of the plate-shaped wiring material other than the through holes, it is possible to easily inject the conductive adhesive into each through hole and surely prevent a short circuit. Can be.

[0005]

Embodiments of the present invention will be described below with reference to the drawings to provide an understanding of the present invention. It should be noted that the present embodiment and the examples that follow are specific examples of the embodiment of the present invention, and do not limit the technical scope of the present invention. Here, FIG. 1 is a cross-sectional view showing a method of connecting an ink jet head according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view of a main part showing a through-hole forming step according to the embodiment of the present invention. A method for connecting an inkjet head according to the present embodiment will be described with reference to FIG. First, a through hole 5 is formed on the sheet-like wiring member 1 at a position corresponding to the piezoelectric element 4 (a through hole forming step, details of which will be described later). Next, as shown in FIG. 1A, the sheet-shaped wiring member 1 is arranged on the line head substrate 3 on which the piezoelectric elements 4 are arranged so that the positions of the through holes 5 and the piezoelectric elements 4 are aligned. Then, the conductive adhesive 6 is injected into the through hole 5 (adhesive injection step). Here, the surface of the sheet-shaped wiring member 1 is coated with a material that repels an adhesive except for the portion of the through-hole 5, so that the adhesive remaining in the portion other than the through-hole 5 is removed. It can be easily removed using a blade of rubber or the like. Subsequently, FIG.
As shown in (b), a conductive pin member 7 is inserted into the through hole 5 into which the adhesive 6 has been injected, and the piezoelectric element 4
Push it in until it touches. As a result, FIG.
As shown in FIG. 5, the adhesive 6 is guided by the pin member 7 and reaches the surface of the piezoelectric element 4 to integrally bond and fix the electrode 2, the conductive pin member 7 and the piezoelectric element 4 (adhesion step). ).

Next, an example of a process of forming the through hole 5 will be described with reference to FIG. First, electrodes 2 and 2 are disposed on both sides of the sheet-like wiring member 1 at positions corresponding to the piezoelectric elements (FIG. 2A). Next, a through-hole 5 is formed at the center of the electrode 2 (FIG. 2B). Finally, plating 8 made of a conductive material is applied to the inner surface of the through hole 5 (FIG. 2).
(C)). The above processing is performed for all the positions corresponding to all the piezoelectric elements. According to this method, the wiring pattern on the surface of the sheet-like wiring member 1 and the piezoelectric element 4 are
It is electrically connected via the conductive plating 8, the conductive adhesive 6, and the conductive pin member 7, and the connection state is further fixed by the conductive adhesive 6, so that the connection state is permanent. Is maintained. Further, as described above, when a portion of the surface of the sheet-shaped wiring member 1 other than the through hole 5 is coated with a material that repels an adhesive, the conductive adhesive 6 is applied to the sheet-shaped wiring member 1. It can be reliably connected even when a large number of contacts are arranged at a high density without being left on the surface and causing a short circuit. As described above, in this embodiment, the permanent connection between the wiring pattern and the piezoelectric element is achieved by the through-hole forming step, the adhesive injecting step, and the bonding step. Since the connection of the head can be performed without using high pressure or heat, problems such as prolonging the life of the piezoelectric element and suppressing vibration do not occur.

[0007]

In the above embodiment, the electrodes 2 are formed on both the front and back surfaces of the sheet-like wiring member 1 in the through-hole forming step. However, in the present invention, the electrodes 2 are required because the connection is performed by the conductive adhesive 6. Not a matter. Even without the electrode 2, the wiring pattern printed on the surface of the sheet-like wiring member 1 and the piezoelectric element 4 can be electrically and physically connected by the conductive adhesive 6. Therefore, the electrode 2 may be formed on either the front surface or the back surface, or may not be formed at all. Further, plating of the inner surface of the through hole 5 can be omitted. In the above-described embodiment, a portion of the surface of the sheet-like wiring member 1 other than the through holes 5 is coated with a material that repels an adhesive, and the adhesive remaining on the surface of the sheet-like wiring member 1 is made of rubber or the like. However, in this case, it is preferable that the electrode 2 is not formed and the surface of the sheet-like wiring member 1 be flattened in order to make the work easier and more reliable. Also,
Instead of the pin member 7, a spherical member can be used as the conductive member. In this case, it is possible to more easily insert the conductive member into each through hole 5 in the bonding step. Further, a wiring board can be used instead of the sheet-like wiring material 1.

[0008]

As described above, according to the method proposed in the present invention, the wiring pattern printed on the surface of the plate-shaped wiring member and the line head can be used even at the connection portion of the ink jet head in which many contacts are arranged at high density. An ink jet head that can be securely connected to a piezoelectric element on a substrate without applying high pressure or heat, and thus without reducing the life of the piezoelectric element and without suppressing vibration of the piezoelectric element. A manufacturing method can be provided.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a method for connecting an inkjet head according to an embodiment of the present invention.

FIG. 2 is an essential part cross sectional view showing a through hole forming step according to the embodiment of the present invention;

FIG. 3 is a diagram showing a conventional method of connecting an inkjet head.

FIG. 4 is a diagram showing a conventional method of connecting an inkjet head.

FIG. 5 is a diagram showing a conventional method for connecting an inkjet head.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Sheet-shaped wiring material 2 ... Electrode 3 ... Line head substrate 4 ... Piezoelectric element 5 ... Through-hole 6 ... Conductive adhesive 7 ... Conductive pin member 8 ... Plated part 31 ... Plate-shaped wiring material 32 ... Electrode 33 ... Piezoelectric Element 34: Line head substrate 35: Anisotropic conductive sheet 36: Anisotropic conductive film 37: Plate wiring material 38: Rubber pad

Claims (8)

[Claims] 1. An ink jet printing method comprising: connecting a wiring pattern printed on the surface of a plate-shaped wiring member to a piezoelectric element disposed along the plate-shaped wiring member and disposed on a line head substrate used in an ink-jet recording apparatus. In a method for manufacturing a head, a through-hole forming step of forming a through-hole at a position corresponding to the piezoelectric element on the plate-like wiring member, and an adhesive injection for injecting a conductive adhesive into the through-hole. A step of inserting a conductive member through the through-hole into which the adhesive is in contact with the piezoelectric element in a state where the plate-shaped wiring member is arranged along the line head substrate; A method for manufacturing an ink jet head, comprising: a bonding step of integrally bonding and fixing a line head substrate and a conductive member. 2. The method according to claim 1, wherein the plate-shaped wiring member is a wiring substrate. 3. The method according to claim 1, wherein the plate-shaped wiring member is a sheet-shaped wiring member. 4. The through hole forming step includes: forming an electrode on the surface of the plate-shaped wiring member; forming a through hole through the electrode and the plate-shaped wiring member; 4. A method for manufacturing an ink-jet head according to claim 1, further comprising a step of plating the conductive material with a conductive material. 5. The method for manufacturing an ink jet head according to claim 4, wherein said electrodes are formed on a front surface and / or a back surface of a plate-shaped wiring member. 6. The method according to claim 1, wherein the conductive member has a pin shape. 7. The conductive member according to claim 1, wherein the conductive member has a spherical shape.
5. The method for manufacturing an ink jet head according to any one of 5. 8. The method for manufacturing an ink jet head according to claim 1, wherein a non-adhesive treatment is applied to a portion other than said through hole of said plate-shaped wiring member.