JPH1076646A - Ink jet recording head and ink jet apparatus having the head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an ink jet recording head causing no irregularity in printing quality by controlling a voltage to be applied to each heater positionally deviated to a constant level and maintaining constant discharge performance. SOLUTION: An ink jet recording head comprises heating resistors 102-1, 102-2 which are utilized for discharging ink, a plurality of electrothermal converters provided with a pair of electrodes 104 electrically connected to the heating resistors 102-1, 102-2, respectively, a plurality of drive elements 105 electrically connected to one of the paired electrodes 104 of each of the electrothermal converters to drive each of the heating resistors 102-1, 102-2, a common wiring 107 electrically connected to the other of the paired electrodes 104 of each of the plural electrothermal converters, a plurality of discharge ports for discharging ink, each of which is provided above the heating resistors, 102-1, 102-2 so as to correspond to each of the heating resistors 102-1, 102-2, ink flow paths communicating to the discharge ports, and a long groove-shaped ink supply port 108 for supplying ink to the ink flow paths.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] 1. Field of the Invention [0002] The present invention relates to an ink jet recording head for ejecting a liquid from an orifice to form droplets, and an ink jet apparatus equipped with the head.
In particular, the ink is ejected perpendicularly to the substrate, the heater performs time-division driving, and the displacement of the landing on the recording material due to the ejection is corrected by shifting the heater position and the corresponding ejection port. The present invention relates to an ink jet recording head and an ink jet device equipped with the head.

[0002]

2. Description of the Related Art With respect to this type of ink jet recording head, for example, an ink jet recording method described in Japanese Patent Application Laid-Open No. 54-51837 is characterized in that thermal energy is applied to a liquid to obtain a driving force for droplet discharge. At
It has features different from other ink jet recording methods. That is, according to the recording method disclosed in the above-mentioned publication, the liquid subjected to the action of thermal energy is heated to generate bubbles, and the liquid is discharged from the orifice discharge port at the tip of the recording head by the action force based on the generation of the bubbles. A droplet is formed, and the droplet adheres to the recording member to record information.

A recording head applied to this recording method is an orifice generally provided for discharging liquid, and a portion where thermal energy for discharging liquid droplets communicating with the orifice acts on the liquid. A liquid discharge portion having a liquid flow path having a heat acting portion as a part thereof, a heating resistor (heater) as an electrothermal converter which is a means for generating thermal energy, and an upper portion for protecting the same from ink It has a protective layer and a lower layer for storing heat.

It is necessary to increase the number of heaters for higher density and higher speed in order to utilize the characteristics of the above-mentioned head. However, as the number of heaters increases, the number of electrical connections to the external wiring board increases. In addition, if the heaters are arranged at a high density, the pitch of the electrodes of each heater becomes small, and connection cannot be made by a normal electric connection method (such as wire bonding). Therefore, as proposed in JP-A-57-72867, the above problem can be solved by forming a driving element on a substrate. By the way, Japanese Patent Application Laid-Open
As described in Japanese Patent Application Laid-Open No. 9-95154, there has been proposed a head of a type in which an orifice plate is attached to a substrate so that the orifice plate is vertically ejected from the surface of the heat acting portion.

When increasing the number of heaters of such a head, the peak current when driving all the heaters is reduced.
In general, driving is performed in a time-division manner. However, when the drive is performed in a time-division manner, the time for applying the voltage differs depending on the heater, so that the ejection timing is different, the landing position of the ink on the paper is different, and the straight line is jagged. Therefore, it has been proposed to shift the position of the heater in the above-described type of head in accordance with the time-division driving timing.

[0006]

FIG. 5 is a view showing the vicinity of a heater in a conventional device. As shown in FIG. 5, drive elements are arranged in a line and a common electrode is provided thereon. In such a case, if the heater position is shifted, the distance between the heater and the wiring of the driving element is different, so that the resistance value of the selection electrode is different depending on the position of the heater. Further, since the distance between the heater and the common electrode is different, the wiring resistance value between the heater and the common electrode is different. The above pattern has two problems. One is that the wires pass between the heaters, so that the wires between the heaters become an obstacle when the density is increased. In addition, the degree of freedom in the horizontal direction of the heater is reduced, and high-frequency operation cannot be performed. The other is that the folded electrode is provided between the heater and the ink supply port, so that the distance between the heater and the ink supply port is increased, and the flow resistance between the heater and the ink supply port is increased. Therefore, the frequency characteristics of the ejection deteriorate, and it may not be possible to cope with ejection at a high frequency.

In view of the above, in order to solve the above problem, there has been proposed a pattern in which no electrode is provided between the heater and the ink supply port as shown in FIG. However, when the position of the heater is shifted in such a pattern, the wiring between the heater and the driving element and the distance between the heater and the common electrode are different, so that the resistance value of the individually selected wiring of the heater and the wiring resistance value between the heater and the common electrode are reduced. Therefore, the voltage applied to the heater is different. As a result, the printing performance may be affected. Further, in the worst case, ejection may not be possible depending on the position of the heater.

Therefore, in the pattern shown in FIG. 6, it is necessary to design the electrodes and the driving elements so that the voltage applied to the heater is constant depending on the position of the heater. In particular, in the case of a substrate on which a drive element is formed, the area between the drive element and the heater is narrow, so that the resistance value correction region of the wiring is narrow.

Accordingly, the present invention solves the above-mentioned problems in the conventional art, and ejects ink perpendicularly to a substrate.
In the ink jet recording head, the heater is driven in a time-division manner, and the displacement of the landing on the recording material due to the driving is corrected by shifting the heater position and the corresponding ejection port. It is an object of the present invention to provide an ink jet recording head in which the voltage applied to the heater is kept constant, the ejection performance is kept constant, and the print quality does not vary.

[0010]

According to the present invention, in order to solve the above-mentioned problems, a heating resistor used for discharging ink and a pair of electrodes electrically connected to the heating resistor are provided. A plurality of electrothermal transducers provided, a plurality of driving elements electrically connected to one of a pair of electrodes of the electrothermal transducer to drive each heating resistor, and the plurality of electrothermal transducers. A common wire electrically connected to the other of the pair of electrodes; a plurality of ejection ports for ejecting ink corresponding to each heating resistor above the heating resistor; and an ink communicating with the ejection ports. A flow path, a long groove-shaped ink supply port for supplying the ink to the ink flow path, and the plurality of heating resistors are arranged along a longitudinal direction of the ink supply port, Tie where the shortest distance to the ink supply port is time-division driven In a different ink jet recording heads by the ring, one of the pair of electrodes, is characterized in that the wiring resistance value of at least one of the electrodes is substantially equal in all electrothermal converter.

According to the present invention, at least the width of the individual selection electrode wiring for each heater and the width of the wiring between the heater and the common electrode are changed so that the voltage applied to each heater is constant. Can be taken.
Further, according to the present invention, the connection positions of at least the individual selection electrode wiring and the wiring of the driving element and the connection position of the wiring between the heater and the common electrode are changed so that the voltage applied to each heater is constant. Can be adopted.
Further, the present invention can adopt a configuration in which the position of a drive element with respect to each heater is changed so that the voltage applied to each heater is constant. Further, the present invention may have a configuration in which the power wiring to the drive element for each heater is corrected so that the voltage applied to each heater is constant.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, according to the present invention, in order to maintain a constant voltage applied to each heater whose position has been shifted, one of the means is to vary the electrode wiring width depending on the position of the heater. However, a configuration in which the wiring resistance value is constant can be adopted. More specifically, the connection between the heater and the wiring of the driving element and the heater having a large distance between the heater and the common electrode have a large wiring thickness, and the heater having a small distance has a small thickness. It is to be noted that the line width of the wiring may be changed on either the electrode between the heater and the wiring of the driving element or the electrode between the heater and the common electrode, or on both. Also, when the distance between the electrode between the heater and the drive element wiring and the distance between the heater and the common electrode are generally short and the resistance value cannot be corrected between them, or when the overetch amount of the wiring is not constant and the wiring is as designed. If the correction cannot be performed, and furthermore, if the distance between the heater and the drive element wiring is to be kept constant so that the ink is not in contact with the connection part, the distance between the heater and the drive element wiring position, The distance to the connection position of the wiring between the heater and the common electrode is made constant. Since the electrodes of the driving element can be widened, the resistance value hardly changes even if the distance between the connection position and the driving element is different. Further, even if the connection position of the wiring between the heater and the common electrode changes, the width of the common electrode can be sufficiently coped with. The connection position may be changed between one of the wires between the heater and the drive element, between the heater and the common electrode, or both.

Further, when a difference in resistance due to a difference in the distance between the wiring and the connection position of the driving element and the driving element becomes a problem, the position of the driving element may be shifted. Further, when it is difficult to shift the position of the driving element, for example, when the chip size becomes large or the wiring of the logic wiring becomes difficult, there is a method of correcting the resistance value of the power wiring input to the driving element. As a method of the correction, it is conceivable that the width of the wiring between the driving element and the power wiring is corrected, and the distance between the connection position and the driving element is fixed. As described above, various solutions have been provided, but these may be used alone or in combination. When the positions of the heaters are designed, it is only necessary that the objects can be achieved by the optimal combination.

[0014]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The embodiments will be described in detail below. [First Embodiment] FIG. 7 is a perspective view showing an ink jet recording head according to the first embodiment. In the ink jet recording head of this embodiment, a high voltage bubble is generated on the heater by applying a pulse voltage to the heater formed on the substrate, and the ink is ejected in a direction perpendicular to the heater by the pressure of the bubble. This is a bubble jet type head. In the figure,
Reference numeral 101 denotes a substrate made of silicon (Si), reference numeral 302 denotes a layer forming an ink flow path wall, and reference numeral 303 denotes an orifice plate in which discharge ports are formed. Reference numeral 304 denotes a base plate made of aluminum (Al).
The substrate 101 is joined to one surface curved in an L shape. Reference numeral 305 denotes a tank for storing ink. Reference numeral 306 denotes a flexible cable, and reference numeral 307 denotes wiring on the substrate 101 and the flexible cable 3.
06, connecting wire, reference numeral 3
Reference numeral 08 denotes an electrical contact for connecting to an electrical connection on the apparatus main body side of the carriage of the printer to which the head is mounted. In the orifice plate 303, the reference n
Numerals 1 to n32 indicate discharge ports, and these discharge ports are arranged in two rows, and each row is arranged to be shifted from each other by a half of the pitch of the discharge ports. That is, the discharge ports n1 to n32 form a staggered arrangement. The head is mounted on a carriage of the printer as described later, and performs ejection while moving in the direction of arrow x in FIG. FIG. 8 is a diagram showing a main part of a cross section taken along line AA ′ in FIG. The ink flows from the ink tank 305 to a chamber including a heater through a hole 310 formed in the base plate 304, a hole formed in the Si substrate 101 (hereinafter, referred to as an ink supply port) 108, and an ink flow path 312. The liquid is discharged from the discharge ports nk (k = 1, 2,..., 32). In the figure, reference numeral hk (k = 1, 2,
, 32) are heaters formed on the Si substrate 101. The heater provided corresponding to the discharge port nk is provided immediately below the discharge port so that the center thereof coincides with the central axis of the discharge port as shown in the figure. FIG. 9 shows each ink channel 3
FIG. 12 is a diagram illustrating the shape of a heater 12 and the arrangement of heaters hk in respective ink flow paths. The arrangement of the heaters hk shown in FIG.
(The relative position between the discharge ports). Heater h1
H10 and heaters h17 to h32 are displaced by １ ／ of each pitch as described above. The head drives 32 heaters at a predetermined timing of 16 times in a time division manner with the same number of heaters. Therefore, at the same timing, up to two heaters are driven according to the ejection data. In the present embodiment, the “distance from the end of the ink supply port” means the distance from the left end of the ink supply port for the heater in the left column, and the distance from the right end of the ink supply port for the heater in the right column. In the ink jet recording head according to the present embodiment, two heaters driven at the same timing land ink on a print medium at a position separated by, for example, a pitch of 10 dots in a main scanning direction, which is a carriage moving direction. It has become.

FIG. 1 is a detailed plan view showing the vicinity of a heater according to a first embodiment of the present invention. 101 is a substrate, 102 is a heater, 10
3 is a selection electrode between the heater and the wiring of the driving element, 104
Is a wiring electrode between the heater and the common electrode, 105 is a driving element,
106 is a wiring of the driving element, 107 is a common electrode, and 108 is an ink supply port.

A description will be given of the process of manufacturing the recording head of this embodiment. First, a driving element and a logic element are formed on a silicon substrate by a bi-CMOS process. The pitch of the driving elements is the same as the pitch of the heater, and is 300 dpi. At the end of the driving element preparation, the wiring electrodes of the driving element
μm, patterned and SiO2 as interlayer insulating layer
Is made 1.5 μm. Next, a 20 μm × 2 is provided on the interlayer protective layer at a position where the wiring of the driving element and the individual electrode of the heater are connected.
A through hole 109 having a size of 0 μm is opened by etching. Then, TaN is 0.1 μm as a heater material.
Form. Al is formed thereon as an electrode layer having a thickness of 0.6 μm, and is formed into a pattern as shown in FIG. 1 by a photolithography technique. The heater size is 30 μm × 30 μm.

As shown in FIG. 1, the heaters 102-1 and 10-1
Reference numeral 2-2 is installed at a distance from the ink supply port 108. Through hole 10 at the connection portion with the wiring of the driving element
9 between the heater-side end and the electrode end of the heater
Is 100 μm for the heater of 102-1;
75 μm for the second heater. Further, the distance B between the electrode end of the heater and the common electrode is 15 for the heater of 102-1.
0 μm, and 125 μm for the heater 102-2. Therefore, if the width of the electrode wiring is the same, the wiring resistance of the heater whose electrode wiring has a resistance of 102-1 is 102-
1.25 times the wiring resistance value of the heater No. 2. Therefore, if the wiring of the heater is the same, the voltage applied to the heater changes, and the discharge performance differs depending on the heater, so that the printing performance deteriorates.

For this reason, in the present embodiment, the resistance value of the wiring was corrected by changing the thickness of the wiring. Both the width of the selection electrode between the heater and the wiring of the driving element and the width of the wiring electrode between the heater and the common electrode are 22-1 with the heater of 102-1.
The thickness was set to 16 μm with a heater of 0 μm and 102-2. 102
By setting the wiring of the heater of −1 to 1.25 times the thickness of the wiring of the heater of 102-2, the heater-side end of the through hole 109 at the connection portion with the wiring of the driving element and the electrode end of the heater are formed. The wire resistance value of the heater in the period 102-2 and the wire resistance value between the electrode end of the heater and the common electrode could be made the same as those of the heater 102-1. Then, since the resistance values of the electrodes were the same, the voltage applied to the heater could be made the same.

Embodiment 2 FIG. 2 is a detailed plan view showing the vicinity of a heater according to Embodiment 2 of the present invention. As in the first embodiment, a driving element and a logic element are formed on a silicon substrate by a bi-CMOS process. The pitch of the driving elements is the same as the pitch of the heater, and is 300 dpi. At the end of the preparation of the driving element, a wiring electrode of the driving element is formed with 1.0 μm of Al—Cu and patterned, and 1.5 μm of SiO 2 is formed as an interlayer insulating layer. Next, a through hole 109 having a size of 10 μm × 10 μm is formed in the interlayer protective layer by etching at a position where the wiring of the driving element and the individual electrode of the heater are connected. As shown in FIG. 2, the position of the through hole 109 is formed so that the distance A between the heater and the through hole 109 is constant (50 μm) in accordance with the displacement of the heater. Then, TaN is formed to a thickness of 0.1 μm as a heater material. Al is formed thereon as an electrode layer having a thickness of 0.6 μm, and is formed into a pattern as shown in FIG. 2 by a photolithography technique.

The position where the heater and the common electrode are connected is shown in FIG.
As shown in (1), the distance B between the heater and the common electrode is set to be the same (100 μm) in accordance with the displacement of the position of the heater. The heater size is 30 μm × 30 μm. The thickness of each electrode is constant at 20 μm. By doing so, the wiring resistance could be made constant for any heater, and the voltage applied to the heater could be made constant. Because the distance between the heater and the wiring of the drive element and the distance between the heater and the common electrode are fixed, even if the overetch amount of the electrode layer changes, the wiring resistance of the heater at any position remains constant. be able to. Further, since the wiring resistance value is not adjusted based on the distance between the heater and the electrode of the driving element, the distance between the through hole 109 at the connection position and the heater can be sufficiently increased.
The through hole 109 can be covered with an organic resin such as a nozzle forming material.

Third Embodiment FIG. 3 is a detailed plan view showing the vicinity of a heater according to a third embodiment of the present invention. In both the first and second embodiments, the length of the wiring 106 between the driving element and the through hole 109 is different due to the displacement of the heater. Since the wiring from the drive element to the through hole 109 can be made thicker and wider, the difference in resistance value in this part was ignored in Examples 1 and 2. However, when the displacement of the heater is large, when the voltage applied to the heater greatly changes the ejection performance, or when the wiring from the driving element to the through hole 109 cannot be made thick or thick, the correction of this portion is required. Have to do. As one of the means, it can be achieved by changing the position of the driving element.

Hereinafter, the present embodiment will be described in detail. Bi-CMOS on a silicon substrate as in the first embodiment
A drive element and a logic element are created by a process. The pitch of the driving elements is 300 dpi, which is the same as the pitch of the heater, and is installed so as to correspond to the displacement of the heater as shown in FIG. At the end of the preparation of the driving element, a wiring electrode of the driving element is formed with 1.0 μm of Al—Cu and patterned, and 1.5 μm of SiO 2 is formed as an interlayer insulating layer. Next, a through hole 10 having a size of 20 μm × 20 μm is provided in the interlayer protective layer at a position where the wiring of the driving element and the individual electrode of the heater are connected.
9 is opened by etching. The position of the through hole 109 is formed so that the distance A between the heater and the through hole 109 is constant (50 μm) in accordance with the displacement of the heater, as in the second embodiment. Then, TaN is formed to a thickness of 0.1 μm as a heater material. On top of this, A
1 is formed to have a thickness of 0.6 μm, and is formed into a pattern as shown in FIG. 3 by a photolithography technique.

The position where the heater and the common electrode are connected is the same as in the second embodiment, and the distance B between the heater and the common electrode is made equal (corresponding to the displacement of the heater) (100 μm).
The heater size is 25 μm × 50 μm. The thickness of each electrode is constant at 30 μm. By doing so, both the wiring resistance value and the wiring of the drive element can be made constant in any heater, and the voltage applied to the heater can be made precisely constant.

Embodiment 4 FIG. 4 is a detailed plan view showing the vicinity of a heater according to Embodiment 4 of the present invention. In the third embodiment, when it is not possible to change the position of the driving element due to the routing of the logic wiring or the like, the voltage of the heater is kept constant by correcting the power wiring 410 input to the driving element as in the present embodiment. You can do it. As shown in FIG. 4, the resistance value of the driving element wiring can be corrected by changing the connection position of the power wiring input to the driving element.
In this way, the voltage applied to the heater can be precisely made constant without changing the position of the drive element. FIG.
0 is a schematic perspective view showing an example of an ink jet printer that can use the ink jet described in each of the above-described embodiments. The ink jet head of each of the above-described embodiments is provided for each of yellow (Y), magenta (M), cyan (C), and black (BK) inks. These four ink jet heads and a tank storing ink to be supplied to these heads are removably mounted on the carriage 12. The carriage 12 is provided so as to be slidable with respect to the guide shaft 11, whereby scanning along the guide shaft 11 is enabled by a belt 52 that is driven by a motor (not shown). The print medium P is intermittently conveyed along with the scanning of the carriage 12 at a portion facing the ejection port of each ink jet head. That is, two pairs of transport rollers 1
The print medium P is intermittently fed by being rotated by a motor (not shown). At the home position of the carriage, a recovery unit 19 for performing an ejection recovery process for each inkjet head is provided.

[0025]

As described above, according to the present invention, ink is ejected perpendicularly to a substrate provided with means for ejecting ink,
Each of the heaters arranged in parallel on the substrate performs time-division driving, and thereby corrects the displacement of the landing on the recording material by shifting the heater position and the corresponding ejection port, and drives each of the heaters. In the ink jet recording head formed on the substrate, it is possible to make the voltage applied to each of the heaters shifted in the position constant, thereby making the ink ejection performance constant. In addition, it is possible to realize an ink jet recording head having no variation in print quality. In the present invention, the connection between the heater and the wiring of the driving element, the heater having a large distance between the heater and the common electrode have a large wiring thickness, and the heater having a small distance has a small wiring resistance, thereby reducing the wiring resistance. By making it constant, the voltage applied to the heater can be made constant. Further, in the present invention, the distance between the electrode between the heater and the wiring of the drive element and the distance between the heater and the common electrode are generally short, and when the resistance value cannot be corrected between them, or when the overetch amount of the wiring is constant. If the wiring cannot be corrected according to the design, and if the connection between the drive element wiring and the heater is fixed and the ink is not in contact with the connection part, the connection between the heater and the drive element wiring is required. The voltage applied to the heater can also be made constant by keeping the distance to the position and the distance to the connection position of the wiring between the heater and the common electrode constant. Further, in the present invention, when a difference in resistance due to a difference in the distance between the wiring and the connection position of the driving element and the driving element becomes a problem, the position of the driving element is also applied to the heater by shifting the position. The applied voltage can be made constant.

When it is difficult to shift the position of the driving element, for example, when the chip size becomes large or the wiring of the logic wiring becomes difficult, the resistance is applied to the heater by a method of correcting the resistance value of the power wiring input to the driving element. The applied voltage can be made constant.

[Brief description of the drawings]

FIG. 1 is a detailed view of the vicinity of a heater according to a first embodiment of the present invention.

FIG. 2 is a detailed view of the vicinity of a heater according to a second embodiment of the present invention.

FIG. 3 is a detailed view around a heater according to a third embodiment of the present invention.

FIG. 4 is a detailed view of the vicinity of a heater according to a fourth embodiment of the present invention.

FIG. 5 is a detailed view of the vicinity of a conventional heater.

FIG. 6 is a detailed view of the vicinity of another conventional heater.

FIG. 7 is a schematic perspective view showing an inkjet recording head according to the present invention.

FIG. 8 is a diagram showing a main part of a cross section taken along line AA ′ in FIG. 7;

9 is a diagram showing the shape of each ink channel and the arrangement of heaters in the ink jet recording head of FIG. 7;

FIG. 10 is a schematic perspective view showing an ink jet recording apparatus on which the ink jet recording head according to the present invention can be mounted.

[Explanation of symbols]

 11: Guide shaft 12: Carriage 15, 16, 17, 18: Conveying roller 19: Recovery unit 101: Substrate 102: Heater 103: Select electrode between heater and drive element wiring 104: Wiring between heater and common electrode Electrode 105: drive element 106: wiring of drive element 107: common electrode 108: ink supply port 109: through hole 302: layer forming ink flow path wall 303: orifice plate 304: base plate made of aluminum (Al) 305: contains ink Tank 306: flexible cable 307: bonding wire 308: electrical contact 310: hole formed in the base plate 312: ink flow path 410: power wiring to be input to the driving element

Claims (8)

[Claims] 1. A plurality of electrothermal converters each including a heating resistor used to discharge ink, and a pair of electrodes electrically connected to the heating resistor. A plurality of driving elements electrically connected to one of the pair of electrodes to drive each heating resistor, and a common wiring electrically connected to the other of the pair of electrodes of the plurality of electrothermal transducers. A plurality of ejection openings for ejecting ink provided above the heating resistors corresponding to the heating resistors, an ink flow passage communicating with the ejection openings, and supplying the ink to the ink flow passage. A plurality of heat generating resistors are arranged along the longitudinal direction of the ink supply port, and the shortest distance to the ink supply port is time-division driven. Different ink jet recording head smell The one of the pair of electrodes, an ink jet recording head is characterized in that wiring resistance values of at least one of the electrodes is substantially equal in all electrothermal converter. 2. The ink jet recording head according to claim 1, wherein the pair of electrodes of the electrothermal transducer is provided so as to avoid between the heating resistor and the ink supply port. 3. The ink jet recording head according to claim 1, wherein a connection position between the electrode and the common wiring is provided at a position equidistant from each heating resistor in all the electrothermal transducers. 4. The ink jet recording head according to claim 1, wherein a connection position between the electrode and the driving element is provided at a position equidistant from each heating resistor in all the electrothermal transducers. 5. The pair of electrodes according to claim 1, wherein the closer the connection position between the electrode and the common wiring or the connection position between the electrode and the driving element is to the heating resistor, the narrower the width of the pair of electrodes. Ink jet recording head. 6. The ink jet recording head according to claim 1, wherein said driving elements are arranged so as to be shifted from each other by a distance from the connected heating resistors. 7. The ink-jet recording head has a power wiring for inputting to the driving element, and the power wiring is arranged so as to be shifted from the heating resistor electrically connected thereto so as to be equal to each other. The ink jet recording head according to claim 1, wherein: 8. An ink jet recording apparatus, comprising: a carriage on which the ink jet head according to claim 1 can be mounted, and a carriage which can scan in a direction perpendicular to an arrangement direction of the heating resistors with the head mounted.