JPH1076553A - Gate cut method of light guide plate molding die - Google Patents

Gate cut method of light guide plate molding die

Info

Publication number
JPH1076553A
JPH1076553A JP8250926A JP25092696A JPH1076553A JP H1076553 A JPH1076553 A JP H1076553A JP 8250926 A JP8250926 A JP 8250926A JP 25092696 A JP25092696 A JP 25092696A JP H1076553 A JPH1076553 A JP H1076553A
Authority
JP
Japan
Prior art keywords
gate
pin
sprue runner
cut
product
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8250926A
Other languages
Japanese (ja)
Inventor
Junichi Asaoka
淳一 浅岡
Mitsuru Koga
充 古賀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Machine Co Ltd
Original Assignee
Toshiba Machine Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Machine Co Ltd filed Critical Toshiba Machine Co Ltd
Priority to JP8250926A priority Critical patent/JPH1076553A/en
Publication of JPH1076553A publication Critical patent/JPH1076553A/en
Pending legal-status Critical Current

Links

Landscapes

  • Liquid Crystal (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PROBLEM TO BE SOLVED: To avoid the deterioration of brightness or light permeability of a cut part due to becoming clouded and the like by a method wherein a gate part between a sprue runner and a molded form is cut immediately after injection by a gate cut pin, provided between an ejector pin for extruding the sprue runner and a product ejection pin and equipped with a spring for buffering shock. SOLUTION: Molten resin is filled into a cavity 14 from an injection device. A gate cut pin 12 is pushed forward to separate a sprue runner 9 from a product 10 while resin is still soft immediately after injection. In this case, a spring 13 for buffering shock is acted so that buckling is not generated in the gate cut pin 12 even when an excessive or repeated load is applied on the same. A mold is opened after the filled resin in the cavity 14 is cooled and cured to eject the sprue runner 9 by an ejector pin 7 for pushing out the sprue runner and eject the product 10 by a project ejector pin 8 respectively. According to this method, the cut part will not become clouded and remaining stress or warpage will hardly be generated.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は射出成形機による導光板
成形用金型のゲートカット方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cutting a gate of a light guide plate using an injection molding machine.

【0002】[0002]

【従来技術】導光板とは、液晶ディスプレイ(LCD)
内で光を液晶に導くバックライトユニットの中に組み込
まれたアクリル板で、同板のエッジ部から或いはその直
下から光を液晶に導く部材であり、 (1)輝度や黒点の因となる異物、或いは光線透過率の
低下となる黄変がないこと。 (2)輝度ムラの原因となるヒケ、ソリのないこと。 (3)残留応力のないこと。 (4)重量、寸法が安定していること。 等が要求されている。
2. Description of the Related Art A light guide plate is a liquid crystal display (LCD).
Acrylic plate incorporated in the backlight unit that guides light to the liquid crystal inside, and is a member that guides light to the liquid crystal from the edge of the plate or directly below it. (1) Foreign matter that causes brightness and black spots Or, there is no yellowing that causes a decrease in light transmittance. (2) There is no sink or warp which causes uneven brightness. (3) No residual stress. (4) The weight and dimensions are stable. Etc. are required.

【0003】[0003]

【発明が解決しょうとする課題】導光板以外の一般の成
形品の多くは、金型から成形品を取出した後にスプルラ
ンナと成形品を切断しているが、前述のように導光板は
光線透過率等が必要であり、冷却、硬化した成形品のゲ
ートカットは切断部が白濁等ができ、輝度や光線透過率
の低下となる。
Many of the general molded products other than the light guide plate cut the sprue runner and the molded product after removing the molded product from the mold, but as described above, the light guide plate transmits light. The gate cut of the cooled and hardened molded product causes clouding at the cut portion, and lowers the brightness and light transmittance.

【0004】本発明の目的は前述のようなゲートカット
により切断部が白濁等ができ、輝度や光線透過率の低下
となるような欠点を取除いた導光板成形用金型のゲート
カット方法を提供することにある。
An object of the present invention is to provide a method for cutting a gate of a mold for molding a light guide plate, which eliminates the drawbacks such that the cut portion becomes cloudy due to the above-described gate cut and lowers the luminance and light transmittance. To provide.

【0005】[0005]

【課題を解決するための手段】前述の目的を達成するた
め本発明は液晶ディスプレイ(LCD)内で光を液晶に
導くバックライトユニットの中に組み込まれたアクリル
板である導光板の成形用金型のゲートカット方法におい
て、スプルランナ押出用のエジェクタピンと成形品を金
型内から突出す製品突出ピンの間に衝撃緩衝用のバネを
設けたゲートカットピンを設け、金型キャビテイ内に樹
脂を注入する射出完了の直後、前記ゲートカットピンに
よりスプルランナと成形品の間のゲート部を切断するこ
とを特徴とする導光板成形用金型のゲートカット方法と
した。
SUMMARY OF THE INVENTION In order to achieve the above object, the present invention provides a light guide plate molding metal which is an acrylic plate incorporated in a backlight unit for guiding light to a liquid crystal in a liquid crystal display (LCD). In the gate cutting method of the mold, a gate cut pin with a shock absorbing spring is provided between the ejector pin for sprue runner extrusion and the product protruding pin that projects the molded product from the mold, and the resin is injected into the mold cavity Immediately after the completion of the injection, a gate portion between the sprue runner and the molded product is cut by the gate cut pin.

【0006】[0006]

【発明の実施の形態】導光板の成形成形用金型のスプル
ランナ押出用のエジェクタピンと成形品を金型内から突
出す製品突出ピンの間に衝撃緩衝用のバネを設けたゲー
トカットピンを設け、金型キャビテイ内に樹脂を注入す
る射出完了の直後、前記ゲートカットピンによりスプル
ランナと成形品の間のゲート部を切断する方法とした。
BEST MODE FOR CARRYING OUT THE INVENTION A gate cut pin provided with a shock absorbing spring is provided between an ejector pin for pushing out a sprue runner of a mold for molding and molding a light guide plate and a product projecting pin for projecting a molded article from the mold. Immediately after the injection of injecting the resin into the mold cavity is completed, the gate cut pin is used to cut the gate between the sprue runner and the molded product.

【0007】[0007]

【実施例】図1ないし図3により本発明の1実施例を説
明すると、1は導光板成形用金型の可動金型で、図示し
てない固定金型に当接するとキャビテイ14が形成され
た後、溶融樹脂が図示してない射出装置からキャビテイ
14内に射出されるようになっている。前記可動金型1
は可動型2と取付板3と同部材2および3を隔てて空間
部4を維持するピン5と前記空間部4内に装着された突
出プレート6で構成されている。
DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described with reference to FIGS. 1 to 3. Reference numeral 1 denotes a movable mold for forming a light guide plate, and a cavity 14 is formed when the movable mold comes into contact with a fixed mold (not shown). After that, the molten resin is injected into the cavity 14 from an injection device (not shown). The movable mold 1
Is composed of a movable mold 2, a mounting plate 3, a pin 5 for maintaining a space 4 with the members 2 and 3 being separated, and a protruding plate 6 mounted in the space 4.

【0008】前記突出プレート6にはスプルランナ押出
用エジェクタピン7,製品突出用ピン8およびスプルラ
ンナ9と製品10をゲート11で切離すゲートカットピ
ン12が設けてある。前記ゲートカットピン12にはゲ
ートカットの際、座屈を防ぐための衝撃緩衝用バネ13
が設けてある。
The projecting plate 6 is provided with a sprue runner ejector pin 7, a product projecting pin 8, and a gate cut pin 12 for separating the sprue runner 9 from the product 10 by a gate 11. The gate cut pin 12 has a shock absorbing spring 13 for preventing buckling during gate cut.
Is provided.

【0009】以上のように構成されており、次にその作
用動作に付いて説明すると、可動金型1が図示してない
固定金型に当接し、キャビテイ14が形成され、型締装
置の型締圧が所定の値に達すると射出装置から前記キャ
ビテイ14内に溶融樹脂が充填される。この時、イ部詳
細に示すようにスプルランナ9と製品(導光板)10は
ゲート11で連絡している。
The operation is described below. To explain the operation, the movable mold 1 comes into contact with a fixed mold (not shown), the cavity 14 is formed, and the mold of the mold clamping device is formed. When the tightening pressure reaches a predetermined value, the injection device fills the cavity 14 with molten resin. At this time, the sprue runner 9 and the product (light guide plate) 10 are in communication with each other through a gate 11 as shown in detail in section A.

【0010】次いで射出完了直後でまだ樹脂が硬化して
ない柔らかい状態の内にゲートカットピン12の後端
(図中左側)から図示してない油圧配管より圧油が作用
し、ゲートカットピン12を前方(図中右側)へ約2m
m程度押して図2に示すようにゲート11でスプルラン
ナ9と製品10を切離すようになっている。この時、ゲ
ートカットピン12には過剰な負荷が掛かったり、或い
は繰返し負荷が掛かったりして、ゲートカットピン12
に座屈が生じないように衝撃緩衝用バネ13が働くよう
にしている。
Then, immediately after the injection is completed, while the resin is not yet cured, the pressure cut oil acts on a hydraulic pipe (not shown) from the rear end (left side in the figure) of the gate cut pin 12 while the resin is not yet cured. To the front (right side in the figure) about 2m
Pressing about m, the sprue runner 9 and the product 10 are separated at the gate 11 as shown in FIG. At this time, an excessive load is applied to the gate cut pin 12 or a repeated load is applied to the gate cut pin 12.
The impact buffer spring 13 works so that buckling does not occur.

【0011】キャビテイ14内の充填樹脂が冷却硬化す
ると、今度は型開きが行われ、図3に示すように、スプ
ルランナ9はスプルランナ押出用エジェクタピン7によ
り、製品10は製品突出用ピン8により夫々突出され
る。
When the filling resin in the cavity 14 is cooled and hardened, the mold is opened this time, and as shown in FIG. 3, the sprue runner 9 is ejected by a sprue runner ejector pin 7 and the product 10 is ejected by a product projection pin 8. Protruded.

【0012】[0012]

【発明の効果】以上説明したように、ゲートカットが射
出完了直後でまだ樹脂が硬化してない柔らかい状態の内
に行うので、切断部に白濁等ができないばかりか、残留
応力やソリ等ができにくくなり、当初に揚げた欠点が取
除かれる。加えて成形中にゲートカットを行うことによ
り成形後のゲートカット工程を省くことができ、成形サ
イクルの短縮、引いては生産コストの削減となる。
As described above, since the gate cut is performed immediately after the completion of the injection and in a soft state in which the resin has not yet been cured, not only the cut portion does not become cloudy, but also residual stress and warpage can be generated. It becomes harder and the flaws originally fried are removed. In addition, by performing the gate cut during the molding, the gate cutting step after the molding can be omitted, and the molding cycle can be shortened and the production cost can be reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の1実施例を示す図。FIG. 1 is a diagram showing one embodiment of the present invention.

【図2】本発明の図のイ部詳細におけるゲートカットの
説明図。
FIG. 2 is an explanatory view of a gate cut in detail A of FIG.

【図3】本発明の1実施例を示す図で、製品およびスプ
ルランナ突出の説明図。
FIG. 3 is a view showing one embodiment of the present invention, and is an explanatory view of a product and a sprue runner protrusion.

【符号の説明】[Explanation of symbols]

1 導光板成形用可動金型 2 可動型 3 取付板 4 空間部 5 ピン 6 突出プレート 7 スプルランナ押出用エジェクタピン 8 製品突出用ピン 9 スプルランナ 10 製品 11 ゲート 12 ゲートカットピン 13 バネ 14 キャビティ REFERENCE SIGNS LIST 1 movable mold for forming light guide plate 2 movable mold 3 mounting plate 4 space 5 pin 6 projecting plate 7 ejector pin for pushing out sprue runner 8 product projecting pin 9 sprue runner 10 product 11 gate 12 gate cut pin 13 spring 14 cavity

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 液晶ディスプレイ(LCD)内で光を液
晶に導くバックライトユニットの中に組み込まれたアク
リル板である導光板の成形用金型のゲートカット方法に
おいて、スプルランナ押出用のエジェクタピンと成形品
を金型内から突出す製品突出ピンの間に衝撃緩衝用のバ
ネを設けたゲートカットピンを設け、金型キャビテイ内
に樹脂を注入する射出完了の直後、前記ゲートカットピ
ンによりスプルランナと成形品の間のゲート部を切断す
ることを特徴とする導光板成形用金型のゲートカット方
法。
1. A gate cutting method for a mold for molding a light guide plate, which is an acrylic plate, incorporated in a backlight unit for guiding light to a liquid crystal in a liquid crystal display (LCD). A gate cut pin provided with a shock-absorbing spring is provided between product protruding pins for projecting the product from inside the mold. Immediately after injection is completed to inject resin into the mold cavity, a sprue runner is formed by the gate cut pin. A gate cutting method for a light guide plate molding die, comprising cutting a gate portion between products.
JP8250926A 1996-09-02 1996-09-02 Gate cut method of light guide plate molding die Pending JPH1076553A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8250926A JPH1076553A (en) 1996-09-02 1996-09-02 Gate cut method of light guide plate molding die

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8250926A JPH1076553A (en) 1996-09-02 1996-09-02 Gate cut method of light guide plate molding die

Publications (1)

Publication Number Publication Date
JPH1076553A true JPH1076553A (en) 1998-03-24

Family

ID=17215083

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8250926A Pending JPH1076553A (en) 1996-09-02 1996-09-02 Gate cut method of light guide plate molding die

Country Status (1)

Country Link
JP (1) JPH1076553A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100979667B1 (en) * 2007-04-18 2010-09-02 가부시키가이샤 메이키 세이사쿠쇼 Apparatus and method for removing light guide plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100979667B1 (en) * 2007-04-18 2010-09-02 가부시키가이샤 메이키 세이사쿠쇼 Apparatus and method for removing light guide plate

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