JPH1076494A - Half cutting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make the cutting depth of a cutting blade into a viscous body to be controlled constant to cut only the released paper layer with high accuracy even when the adhesive body is the one in which the thickness is fluctuated by press-putting a cutting blade on it, or the thickness accuracy is decreased because of the presence of irregularities or unevenness in a base material layer. SOLUTION: The half cutting device is composed of an anvil roller 1 and a die cutting roller 2, the outer peripheral part 21 of which has enlarged diameter parts 22 on both ends, and from the outer peripheral part 21 of which a cutting blade 3 is projected. The die cutting roller 2 is arranged so that the enlarged diameter parts 22 can abut against the outer peripheral surface 11 of the anvil roller 1, and the separating material side of an adhesive body S supplied into a gap 4 formed between the outer peripheral surface 11 of the anvil roller 1 and the outer peripheral part 21 of the die cutting roller 2 is half-cut by a cutting blade 3. In this case, when the projected height of the cutting blade 3 from the outer peripheral part 21 is represented by A, the projected height of the enlarged diameter parts 22 from the outer peripheral part 21 is B, and the thickness of the viscous body S is C, the following relationship is established: A<B<C.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a half-cut apparatus for precisely cutting a release material of an adhesive such as an adhesive tape or an adhesive sheet.

[0002]

2. Description of the Related Art Conventionally, a half-cut device comprising an anvil roll and a die-cut roll has an anvil roll 100 and an enlarged portion 220 having both ends of an outer peripheral portion 210 enlarged as shown in FIG. The enlarged diameter portion 220 is configured by a die cut roll 200 in which the outer peripheral surface 110 of the anvil roll 100 is in contact with the outer peripheral surface 210 and a cutting blade 300 is protruded from the outer peripheral portion 210.

[0003] The cutting of a release material used for an adhesive material such as an adhesive tape or an adhesive sheet using the above-mentioned half-cutting device, that is, a so-called half-cut, is performed by using an outer peripheral surface 110 of the anvil roll 100 and an outer peripheral portion 210 of a die-cut roll 200. The adhesive body 500 is supplied to the gap 400 formed between them, and the cutting blade 300 is rotated.

In this half-cut processing, the height (distance) between the outer peripheral surface 110 of the anvil roll 100 and the cutting edge of the cutting blade 300 is X, the thickness of the adhesive body 500 is N, and the enlarged diameter portion 220 is formed.
Assuming that the protruding height from the outer peripheral portion 210 is Y, the operation is performed in a state where the relationship of X <T <Y is satisfied.

[0005]

However, in the half-cutting of the pressure-sensitive adhesive body satisfying the above-mentioned relationship, it is possible to make the thickness of the uncut portion (pressure-sensitive adhesive layer side) constant. If there is a variation (variation) in the thickness of the pressure-sensitive adhesive body due to unevenness in the embossing of the base material layer or variation in the coarse density of the nonwoven fabric laminate, the thickness of the cut side (release material side) varies Will do. In other words, the depth of the half cut is too deep or too shallow with respect to the originally intended thickness of the half cut, resulting in a quality problem.

Originally, as shown in FIG. 3, a half cut of an adhesive is performed by using a square adhesive release material layer 70 formed by laminating a base material layer 500, an adhesive layer 600, and a release material layer 700.
There are a case where the spine is applied to the spine 0 and a case where the adhesive is punched into a desired square shape and a dry edge 810 is provided around the stamped body as shown in FIG.

[0007] In the latter processing of providing the dry edge 810 on the adhesive, the cutting may be performed while leaving a release material layer having a constant thickness. Therefore, the processing is performed between the outer peripheral surface 110 of the anvil roll 100 and the cutting edge of the cutting blade 300. Distance X to release material layer 8
By setting the thickness based on the thickness of 00, cutting can be easily performed by a conventional method. The reason for this is
The reason for this is that a commonly used release material is a flat sheet based on a film or paper, has no irregularities, has a constant thickness, and has good thickness accuracy.

In the former case, since only the release material layer 700 needs to be cut while leaving the adhesive portion (the base material layer 500 and the adhesive layer 600), the outer peripheral surface 110 of the anvil roll 100 and the cutting blade 300 The distance X to the cutting edge may be set based on the thicknesses of the base material layer 500 and the pressure-sensitive adhesive layer 600. However, when the thickness accuracy of the base layer 500 fluctuates or varies, for example, in a film or the like in which the base layer 500 is embossed, the concave portion of the embossment extends to the innermost end of the intended release material layer 800. There is a problem that the blade edge does not reach, or that the blade edge penetrates deeply in the convex portion, thereby cutting the substrate layer 500.

In particular, when the base layer 500 is made of an elastic material such as a nonwoven fabric, a cloth, or a foam, it is pressed by the cutting blade 300 and deformed.
The thickness of 0 is not stable, and the use of the above-described conventional half-cutting apparatus has a problem that only the release material layer 700 cannot be cut accurately.

The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to solve these problems, and to reduce the thickness of the sheet due to the pressing of the cutting blade. However, even in the case of an adhesive whose thickness accuracy is poor due to unevenness or coarse density present in the base material layer, the penetration depth of the cutting blade into the adhesive is regulated and constant, and only the release material layer is precisely formed. A half-cut device capable of cutting is provided.

[0011]

According to a half-cutting device of the present invention, an anvil roll, a diameter-expanding portion having both ends of an outer peripheral portion enlarged, and a cutting blade protruding from the outer peripheral portion are provided. The die cut roll is disposed so that the enlarged diameter portion can be brought into contact with the outer peripheral surface of the anvil roll, and is formed between the outer peripheral surface of the anvil roll and the outer peripheral portion of the die cut roll. A half-cutting device for half-cutting the release material side of the adhesive supplied to the gap with the cutting blade, wherein the protruding height of the cutting blade from the outer peripheral portion is A, and the protruding height of the enlarged diameter portion from the outer peripheral portion is A Say B,
When the thickness of the adhesive is C, the relationship of A <B <C is established.

That is, the half cut device 10 of the present invention
As shown in FIG. 1, an anvil roll 1 and a die cut roll 2 provided with enlarged diameter portions 22 at both ends of an outer peripheral portion 21, and a cutting blade 3 protruding from the outer peripheral portion 21. It is configured. The die-cut roll 2 is provided such that the enlarged diameter portion 22 can be brought into contact with the outer peripheral surface 11 of the anvil roll 1, and is formed between the outer peripheral surface 11 of the anvil roll 1 and the outer peripheral portion 21 of the die-cut roll 2. The adhesive body S supplied to the gap 4 is half-cut by rotating the cutting blade 3.

In the half-cutting using the half-cutting device 10, the height of the cutting blade 3 projecting from the outer peripheral portion 21 of the die-cut roll 2 in order to regulate the depth of entry of the cutting blade 3 into the adhesive S. A is set equal to or slightly higher than the penetration depth of the cutting edge of the cutting blade 3, and in order to prevent the cutting edge of the cutting blade 3 from being in contact with the anvil roll 1 and being damaged when not in use, The protruding height B of the enlarged diameter portion 22 of the die cut roll 2 from the outer peripheral portion 210 is made higher than the protruding height A of the cutting blade 3.

When the cutting blade 3 is used, the adhesive S is applied to the outer peripheral surface 11 of the anvil roll 1 and the outer peripheral portion of the die cut roll 2 in order to allow the blade edge to sufficiently enter the cutting height 3 of the cutting blade 3. When passing through the gap 4 between the die-cut roll 2 and the anvil roll 1, the enlarged-diameter portion 22 is separated from the anvil roll 1 so that the outer peripheral portion 21 of the die-cut roll 2 and the surface of the adhesive S are in contact with each other. The half-cut is intended to be achieved by making the protruding height B from the outer peripheral portion 21 of the base material smaller than the thickness C of the adhesive body.

[0015]

In the half-cutting device of the present invention, as described above, the protruding height of the cutting blade from the outer peripheral portion is A, the protruding height of the enlarged-diameter portion from the outer peripheral portion is B, and the thickness of the adhesive is defined as In the case of C, since the relationship of A <B <C is established, the thickness may fluctuate due to the pressing of the cutting blade, or the base material layer may have unevenness or coarse density, resulting in poor thickness accuracy. Even in the case of a body, the penetration depth of the cutting blade into the adhesive body is regulated to be constant, and only the release material layer can be cut with high accuracy.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below based on examples. In this example, an adhesive having the following structure was used. That is, the base material layer is made of a spunlaced nonwoven fabric (weighing 50 g / m ² ) (thickness: 200 μm) and a thickness of 20 μm.
To form a two-layer structure. On the polyethylene film side of the base layer, a thickness of 50
μm pressure-sensitive adhesive layer, and 50 μm thick as a release material layer
m, a polyethylene terephthalate film subjected to a mold release treatment was provided.

When a conventional half-cutting device is used to perform the spine-cutting process on the release material layer of the pressure-sensitive adhesive body, in order to completely cut the release material layer, from the outer peripheral surface of the anvil roll to the cutting edge of the cutting blade. It was necessary to set the height (distance) of the anvil roll to 90 μm, but in this case, the polyethylene film of the base material layer was partially cut, and the outer periphery of the anvil roll was cut so that the polyethylene film was not cut. If the height from the surface to the cutting edge of the cutting blade is gradually increased, the release material layer will not be partially cut,
It has been found that there is no suitable height from the outer peripheral surface of the anvil roll to the cutting edge of the cutting blade. The reason for this is that the unevenness and coarse density of the spunlace nonwoven fabric of the base material layer are large, and the penetration depth of the cutting edge of the cutting blade is not constant.

Therefore, in the half-cutting device of the present invention, the distance (height) from the outer peripheral surface of the anvil roll to the cutting edge of the cutting blade is set to 90 μm, and the height of the enlarged diameter portion protruding from the outer peripheral portion is 140 μm. The half-cut was performed using the die-cut roll set to. As a result, when the adhesive passes through the gap between the half-cut roll and the die-cut roll, the die-cut roll is lifted upward, and the cutting blade forms only the release material layer in a manner that follows the unevenness and coarse density of the adhesive. It was confirmed that good half-cut could be realized without cutting the polyethylene film of the base material layer.

[0019]

According to the half cut device of the present invention,
An anvil roll and a die-cut roll having an enlarged-diameter portion at both ends of the outer peripheral portion, and a die-cut roll having a cutting blade protruding from the outer peripheral portion, wherein the die-cut roll has the enlarged-diameter portion as described above. The adhesive is disposed so as to be able to abut on the outer peripheral surface of the anvil roll, and the release material side of the adhesive supplied to the gap formed between the outer peripheral surface of the anvil roll and the outer peripheral portion of the die cut roll is half cut by the cutting blade. A half-cutting device for cutting, where A is the protruding height of the cutting blade from the outer peripheral portion, B is the protruding height of the enlarged diameter portion from the outer peripheral portion, and C is the thickness of the adhesive body. Since the relationship of <C 1 is established, the thickness of the cutting blade can be changed even when the thickness of the pressure-sensitive adhesive body changes due to the pressing of the cutting blade or the thickness accuracy is poor due to unevenness or coarse density in the base material layer. The depth of penetration into the adhesive is regulated and It allowed the cutting of the accuracy separation material layer only. Therefore, it is suitable as a half-cut device.

[Brief description of the drawings]

FIG. 1 is a front view showing an example of a half-cut device according to the present invention.

FIG. 2 is a front view showing a conventional half cut device.

FIG. 3 is a cross-sectional view illustrating a configuration of an adhesive body.

FIG. 4 is a cross-sectional view illustrating a configuration of an adhesive body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Anvil roll 11 Outer peripheral surface 2 Die cut roll 21 Outer peripheral part 22 Large diameter part 3 Cutting blade 4 Gap A, B Height (distance) C (adhesive) thickness S Adhesive

Claims (1)

[Claims] 1. An anvil roll, and a die cut roll having an enlarged diameter portion at both ends of an outer peripheral portion and having a cutting blade protruding from the outer peripheral portion. The enlarged diameter portion is disposed so as to be in contact with the outer peripheral surface of the anvil roll, and the release material side of the adhesive supplied to the gap formed between the outer peripheral surface of the anvil roll and the outer peripheral portion of the die cut roll. A half-cut device for half-cutting by the cutting blade, wherein the projecting height of the cutting blade from the outer peripheral portion is A, the projecting height of the enlarged-diameter portion from the outer peripheral portion is B,
When the thickness of the adhesive is C, a relationship of A <B <C is established.