JPH1065223A - Thermomodule - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance heat dissipation and absorption performance of a heat plate by arranging P-type and N-type thermoelectric elements alternately and sandwiching the elements by dielectric heat plates, provided with a plurality of protrusions and recesses on the surface. SOLUTION: Each heat plate 1, 2 made of alumina ceramics, for example, has inner surface (rear surface) on which specified electrodes 3, 4 are formed by Cu plating, for example, and outer surface (surface) on which a plurality of protrusions and recesses 5, 6 are formed. The protrusions and recesses 5, 6 are formed in a pyramid shape, for example, and a metal plating layer, e.g. Cu-plating layers 7, 8, are formed on the surface thereof and solder coating layers 9, 10 are formed thereon for the purpose of coupling with other components. The protrusions and recesses 5, 6 can be formed by making V- grooves from the X and Y axial directions, using a dicing saw, and the Cu- plating layer can be formed by applying a Cu-plating layer of several tens of μm thickness to an electroless Ni-plating layer of several μm thickness.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to an improvement of a thermo module.

[0002]

2. Description of the Related Art A thermo-module has P-type and N-type thermoelectric elements alternately arranged, and is constituted by a sandwich of heat transfer plates. One heat transfer plate dissipates heat and the other heat transfer plate absorbs heat. It is widely used as a small heat exchanger.

[0003]

In the above-mentioned conventional thermo module, since the heat transfer plate is formed of an insulating material such as alumina ceramics, the heat transfer property is relatively poor, and there is a problem that the heat radiation and heat absorption performance is reduced. Was. The present invention has been made to solve such a conventional problem, and an object of the present invention is to provide a thermo module in which heat dissipation and heat absorption performance of a heat transfer plate is improved.

[0004]

Means for Solving the Problems As means for technically solving the above-mentioned problems, the present invention provides a structure in which P-type and N-type thermoelectric elements are alternately arranged and sandwiched by a heat transfer plate. In the thermo module, a plurality of irregularities are provided on a surface of the heat transfer plate to improve heat transfer efficiency. Further, the heat transfer plate is made of an insulator, and the gist is that the uneven portion is plated with metal.

[0005]

Embodiments of the present invention will be described below in detail with reference to the accompanying drawings. In FIG. 1, reference numerals 1 and 2 denote heat transfer plates made of a heat transfer plate of alumina ceramic or the like. Predetermined electrodes 3 and 4 are formed on an inner surface (back surface) by Cu plating or the like, and a plurality of electrodes are provided on an outer surface (front surface). Are provided, respectively.

The irregularities 5, 6 are formed, for example, in a pyramid shape as shown in FIG. 2, and a metal plating layer, for example, a Cu plating layer 7, 8 is provided on the surface thereof. Solder coating layers 9 and 10 are formed as shown in FIG.

The concave and convex portions 5 and 6 can be formed, for example, by V-groove processing from both X and Y axis directions by a dicing apparatus. It can be formed by applying a plating layer.

Reference numeral 11 denotes a P-type thermoelectric element, and 12 denotes an N-type thermoelectric element, each of which is formed in the shape of a prism or a column, and whose upper and lower end faces are provided with, for example, Ni plating layers 13 and 14. These P-type thermoelectric elements 11 and N-type thermoelectric elements 12 are:
As shown in FIG. 3, a plurality of the heat transfer plates 1 and 2 are provided in a sandwich manner between the heat transfer plates 1 and 2, and are electrically connected to predetermined positions of the electrodes 3 and 4.

Reference numeral 15 denotes a lead wire, which is connected to the + and-terminal portions 4a of the electrode 4 on the heat transfer plate 2 side, thereby forming a thermo module 16 as shown in FIG.

The thermo module 1 thus formed
Numeral 6 is used as a minute heat exchanger incorporated in an electronic device or the like. For example, the heat transfer plate 1 side absorbs heat and the heat transfer plate 2 side dissipates heat.

In this case, pyramid-shaped irregularities 5, 6 are formed on the surfaces of the heat transfer plates 1, 2 as described above.
Since the surface area is larger than that of the flat plate, the heat transfer efficiency is remarkably improved, and both the heat absorption performance and the heat radiation performance are improved.
Although illustration is omitted, the parts to be mounted on the thermo module 16 are also formed with an uneven portion corresponding to the unevenness of the heat transfer plate.
The degree of adhesion to the heat transfer plate is improved, so that the heat transfer efficiency can be further improved, the positioning of components is easy, and the mounting state is stable.

[0012]

As described above, according to the present invention,
Since a plurality of irregularities are provided on the surface of the heat transfer plate of the thermo module, the heat transfer efficiency can be improved, and thereby the heat radiation and heat absorption performance of the thermo module can be significantly improved.

[Brief description of the drawings]

FIG. 1 is an exploded view showing a structure of a thermo module according to the present invention.

FIG. 2 is an explanatory diagram showing an example of forming irregularities on a heat transfer plate.

FIG. 3 is a front view of the formed thermo module.

FIG. 4 is a plan view of the thermo module.

[Explanation of symbols]

 1, 2, heat transfer plate 3, 4, electrode 5, 6, unevenness 7, 8, Cu plating layer 9, 10, solder coating layer 11, P-type thermoelectric element 12, N-type thermoelectric element 13, 14, Ni plating layer 15 Lead wire 16 Thermo module

Claims (2)

[Claims] 1. A thermo module in which P-type and N-type thermoelectric elements are alternately arranged, and a plurality of irregularities are provided on a surface of the heat transfer plate to improve heat transfer efficiency. A thermo module characterized by improvement. 2. The thermo module according to claim 1, wherein the heat transfer plate is made of an insulator, and the uneven portions are plated with metal.