JPH1065099A - Cooling structure in uninterruptible power supply - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the size, weight, and cost of the cooling structure of an uninterruptible power supply. SOLUTION: With a first basic configuration in (a), a semiconductor switch 1 is provided at one vertical part of a base plate 11 with a high thermal conductivity being formed in inverted U shape, a semiconductor element 2 belonging to a multifunctional inverter is provided at the other vertical part, and a fin unit 5 is provided at a horizontal part. Also, the capacity of the fin unit 5 is determined by the calorific value of the semiconductor element 2 that is larger than the calorific value of the semiconductor switch 1. Therefore, heat generated selectively by the semiconductor switch 1 and the semiconductor element 2, namely heat generated from the semiconductor switch 1 in a normal case and heat generated from the semiconductor element 2 when power fails or the semiconductor switch 1 fails are discharged via the fin unit 5. Each second and third basic configurations in (b) and (c) differ from the first one, where base plates 12 and 13 are in inverted L shape and the semiconductor switch 1 and the semiconductor switch 2 are horizontal to a vertical part or are provided side by side in upper and lower directions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for cooling a semiconductor switch and a multifunctional inverter provided in an uninterruptible power supply, and more particularly to a cooling structure for an uninterruptible power supply which can be reduced in size and weight and reduced in cost. .

[0002]

2. Description of the Related Art Generally, a basic circuit of an uninterruptible power supply 10 includes a semiconductor switch 1 and a multifunctional inverter 9 as shown in FIG. In normal times, a start switch 7, a semiconductor switch 1, a multifunctional inverter 9 functioning as a rectifier, and a changeover switch 8
, AC and DC power are supplied to the load and the battery, respectively, which are not denoted by reference numerals. This is a charging operation for the battery. At the time of power failure or when a failure occurs in the semiconductor switch 1, AC power that has been orthogonally transformed is supplied from the battery side to the load via the multifunctional inverter 9 functioning as an inverter. The origin of the name of the multifunctional inverter 9 is that it functions not only as an original inverter but also sometimes as a rectifier. The semiconductor switch 1 and the semiconductor element 2 of the multifunctional inverter 9 are
Both are heat generating parts, and it is necessary to provide cooling fins to dissipate the generated heat and cool the heat generating part.

This cooling structure is specifically shown in a perspective view of FIG. In FIG. 4, almost reverse L
Vertical portion (front side) of base plate 21 formed in a character shape
Next, the semiconductor switches 1 are arranged side by side in the horizontal direction. Here, the base plate 21 is made of a material having high thermal conductivity. Further, a cooling fin unit 5 is provided above the inverted L-shaped horizontal portion of the base plate 21. On the other hand, as in the case of the semiconductor switch 1, the semiconductor elements 2 belonging to the multi-function inverter 9 are arranged side by side on the vertical portion (front side) of the base plate 22 formed substantially in an inverted L-shape. A fin unit 5 (hidden and invisible) is provided above the inverted L-shaped horizontal portion of the base plate 22. A unit according to the semiconductor switch 1;
The units related to the semiconductor element 2 are vertically arranged at a slight interval. Therefore, the heat generated by the semiconductor switch 1 and the semiconductor element 2 is reduced by the base plates 21, 21 as a good heat conductor.
2 to the respective fin units 5 and dissipated therefrom. In addition, the radiation is forcibly and promoted by the fan 6 disposed above. The units related to the semiconductor switch 1 and the semiconductor element 2 are vertically arranged side by side to save space. For good cooling, it is naturally preferable to arrange the units horizontally rather than vertically. .

[0004]

As described above, as described above,
In the conventional cooling structure, although only one of the semiconductor switch 1 and the multifunctional inverter 9 always operates,
Semiconductor switch 1 and semiconductor element 2 of multifunctional inverter 9
Are provided with fin units 5 for cooling.
Not only is this itself useless, but also there is a problem that the uninterruptible power supply 10 becomes large and costs increase.

An object of the present invention is to provide a cooling structure for an uninterruptible power supply which can solve the above-mentioned problems of the prior art and can achieve a reduction in size, weight and cost. .

[0006]

SUMMARY OF THE INVENTION The present invention relates to a structure for cooling a semiconductor switch and a multifunctional inverter provided in an uninterruptible power supply, comprising a base plate of a high thermal conductivity material formed in an inverted U shape; A cooling fin provided above the horizontal portion of the inverted U-shape of the plate; and a semiconductor switch and a multi-function inverter respectively provided on each vertical portion of the inverted U-shape of the base plate.

Further, the present invention provides a base plate of a high thermal conductivity material formed in an inverted L-shape; cooling fins provided above an inverted L-shaped horizontal portion of the base plate;
And a multi-function inverter and a semiconductor switch provided in the vertical portion of the character. here,
In particular, the semiconductor switch and the multi-function inverter are arranged in a horizontal direction on the inverted L-shaped vertical portion of the base plate, or are arranged vertically on the inverted L-shaped vertical portion of the base plate. Is preferred.

Still further, according to the present invention, the capacity of the cooling fin is determined in accordance with the amount of heat generated by the multifunctional inverter.
It is preferable to adopt such a configuration. Therefore, according to the present invention, the heat selectively generated by (the semiconductor element of) the semiconductor switch and the multifunctional inverter provided in each of the inverted U-shaped vertical portions of the base plate, that is, the heat generated from the semiconductor switch in the normal state. In the event of a power failure or a semiconductor switch failure, the heat generated by the multi-function inverter is dissipated through common cooling fins provided above the inverted U-shaped horizontal portion.

Further, according to the present invention, heat generated alternatively by a semiconductor switch and a multi-function inverter arranged, for example, horizontally or vertically in the inverted L-shaped vertical portion of the base plate, that is, normally, In some cases, heat generated from the semiconductor switch is dissipated through a common cooling fin provided above the inverted L-shaped horizontal portion in the event of a power failure or failure of the semiconductor switch, and from a multi-function inverter. .

In particular, since the capacity of the cooling fin is determined according to the amount of heat generated by the multifunction inverter, it is possible to cope with a semiconductor switch.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A basic configuration according to the present invention and an embodiment configured based on the basic configuration will be described below with reference to the drawings. FIGS. 1A and 1B relate to a basic configuration according to the present invention. FIG. 1A is a side view of a first basic configuration, FIG. 1B is a side view of a second basic configuration, and FIG. 1C is a side view of a third basic configuration.

In FIG. 1 (a), a first basic configuration is an inverted U
Base plate 11 made of a high thermal conductivity material formed in a letter shape
The semiconductor switch 1 is mounted on one of the vertical portions (here, the right side).
However, the semiconductor element 2 belonging to the multi-function inverter 9 is provided in the other (here, the left side) vertical portion, and the fin unit 5 is provided above the horizontal portion. In addition, the capacity of the fin unit 5 is determined in accordance with the amount of heat generated when the semiconductor element 2 of the multi-function inverter 9 is out of power, for example, when the capacity of the semiconductor switch 1 is larger than the normal amount of heat generated. Therefore, heat generated alternatively in the semiconductor switch 1 and the semiconductor element 2 of the multi-function inverter 9, that is, heat generated from the semiconductor switch 1 at normal times, and from the semiconductor element 2 at the time of power failure or failure of the semiconductor switch 1 The generated heat is dissipated through the fin unit 5, the semiconductor switch 1 is moderately cooled, and the semiconductor element 2 is slightly excessively cooled.

In FIG. 1B, the second basic structure is different from the first basic structure in that the base plate 12 is made of a high thermal conductivity material formed in an inverted L-shape instead of an inverted U-shape. ,
The point is that the semiconductor switch 1 and the semiconductor element 2 are horizontally arranged side by side in the vertical portion of the inverted L-shape. Others are the same as the first basic configuration. In FIG. 1C, the third basic configuration is the same as the second basic configuration.
The difference from the basic configuration is that the inverted L-shaped vertical portion of the base plate 13 is longer than the base plate 12 and that the semiconductor switch 1 and the semiconductor element 2 are arranged vertically. Others are second
It is the same as the basic configuration.

When each of the first, second and third basic configurations is actually applied to form an embodiment, an optimum configuration is selected according to the situation of the peripheral structure. The more basic configuration options, the more flexibility in specification and design. FIG. 2 is a perspective view of the embodiment. This embodiment is configured according to the first basic configuration. The semiconductor element 2 is provided in a vertical portion on the near side of the base plate 11 (for convenience, the same reference numeral is assigned as in the basic configuration) and the semiconductor switch 1 is provided in the vertical portion on the other side. (Dashed lines) are arranged side by side, and a common fin unit 5 is provided in the upper horizontal portion. Moreover, the capacity of the fin unit 5 is designed in accordance with the amount of heat generated when the semiconductor element 2 is out of power, for example, when the semiconductor switch 1 has a larger amount of heat than the normal state.

Therefore, the heat generated by the semiconductor switch 1 and the semiconductor element 2 is alternatively conducted to the common fin unit 5 via the base plate 11 as a good heat conductor, and is radiated from the fin unit 5 to be cooled. . More specifically, the semiconductor switch 1 is cooled as moderately as designed, and the semiconductor element 2 is cooled slightly excessively. In addition, this heat dissipation (cooling) is forcibly and promoted by the fan 6 disposed above.

[0016]

According to the present invention, heat generation in the semiconductor switch and the multi-function inverter is alternatively performed, that is, from the semiconductor switch in a normal state, and from the multi-function inverter (semiconductor element thereof) in the event of a power failure or failure of the semiconductor switch. Since each generates heat, heat can be dissipated through a common cooling fin. Therefore, there is an excellent effect that the size, weight, and cost can be reduced by almost half compared to the conventional cooling structure while maintaining the cooling performance of the semiconductor switch and the multi-function inverter.

[Brief description of the drawings]

1 (a) is a side view of a first basic configuration, FIG. 1 (b) is a side view of a second basic configuration, and FIG. 1 (c) is a side view of a third basic configuration.

FIG. 2 is a perspective view of an embodiment according to the present invention.

FIG. 3 is a basic circuit diagram of an uninterruptible power supply.

FIG. 4 is a perspective view of a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor switch 2 Semiconductor element 3, 4 Base plate 5 Fin unit 6 Fan 7 Start switch 8 Changeover switch 9 Multifunctional inverter 10 Uninterruptible power supply 11, 12, 13 Base plate

Claims (5)

[Claims] 1. A structure for cooling a semiconductor switch and a multifunctional inverter provided in an uninterruptible power supply, comprising a base plate of a high thermal conductivity material formed in an inverted U shape; and an inverted U-shaped horizontal portion of the base plate. A cooling fin provided on an upper side of the base plate; and a semiconductor switch and a multi-function inverter provided on each of the vertical portions of the inverted U-shaped base plate, respectively. 2. A structure for cooling a semiconductor switch and a multi-function inverter included in an uninterruptible power supply, comprising: a base plate of a high thermal conductivity material formed in an inverted L-shape; A cooling structure for an uninterruptible power supply, comprising: cooling fins provided on an upper side of the portion; and a semiconductor switch and a multifunctional inverter provided on an inverted L-shaped vertical portion of the base plate. 3. The cooling structure according to claim 2, wherein the semiconductor switch and the multi-function inverter are provided with a reverse L of the base plate.
A cooling structure in an uninterruptible power supply, wherein the cooling structure is arranged in a horizontal direction in a vertical portion of a character. 4. The cooling structure according to claim 2, wherein the semiconductor switch and the multi-function inverter are connected to the base plate by a reverse L.
A cooling structure for an uninterruptible power supply, characterized in that the cooling structure is arranged vertically in a vertical part of a character. 5. The uninterruptible power supply according to claim 1, wherein the capacity of the cooling fin is determined in accordance with the amount of heat generated by the multi-function inverter. Cooling structure.