JPH1064973A - Semiconductor manufacturing device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To use the external surfaces of a polygonal transportation chamber for the other purpose than cooling by installing a wafer transporting mechanism which transports wafers between cassette chambers and reaction chambers in the transportation chamber and providing a cooling table within the turning radius of the waver transporting mechanism. SOLUTION: Two cassette chambers 1A and 1B are respectively provided on the two continuous external surfaces of a polygonal transportation chamber 5 and two reaction chambers 2A and 2B are provided on another two continuous external surfaces. A wafer transporting mechanism 4 which transports wafers 3 between the chambers 1A and 1B and 2A and 2B is provided in the chamber 5. Then, for example, two cooling tables 6 are provided at positions higher than the turning plane of the mechanism 4 at cooling time within the turning radius R of the mechanism 4 and, at the same time, the elevating/lowering shaft 8 of the mechanism 4 is vertically erected on the mechanism 4 or tables 6. Therefore, the external surfaces of the chamber 5 which have been used for cooling the chamber 5 can be used for other purposes and the function of an individual wafer type semiconductor manufacturing device can be improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing single-wafer apparatus for cooling a wafer.

[0002]

2. Description of the Related Art FIG. 2 is an explanatory plan view showing an example of a conventional apparatus. In this conventional example, for example, two cassette chambers 1A and 1B are continuously provided on two outer surfaces of a polygonal transfer chamber 5, and two reaction chambers 2A and 2B are continuously provided on the other two outer surfaces. And two cooling chambers 7A and 7B are attached to the two outer surfaces. 4 is a wafer transfer mechanism for transferring a wafer, 9 is a pivot, and 10 is a wafer holder.

[0003]

In the above-mentioned prior art, since a cooling chamber is continuously provided on at least one outer surface of the polygonal transfer chamber 5, at least one outer surface of the transfer chamber 5 is used for cooling. And cannot be used for other purposes such as formation of another film.

[0004]

SUMMARY OF THE INVENTION In order to solve the above-mentioned problems of the prior art, the apparatus of the present invention comprises cassette chambers 1A, 1B,.
., A wafer transfer mechanism 4 for transferring the wafer 3 between the reaction chambers 2A, 2B,... Is installed in the transfer chamber 5, and a cooling table 6 is provided inside the turning range of the wafer transfer mechanism 4. It is characterized by.

[0005]

DESCRIPTION OF THE PREFERRED EMBODIMENTS FIGS. 1A and 1B are a plan view for explanation showing an embodiment of the apparatus of the present invention and a view showing the relationship between the height of a turning surface and the height of a cooling stand in the present invention. .
In the present embodiment, for example, two cassette chambers 1A and 1B are continuously provided on two outer surfaces of the polygon transfer chamber 5, and two reaction chambers 2A and 2B are continuously provided on the other two outer surfaces, for example. 1A, 1B and the reaction chamber 2A, 2B between the wafer 3
Is installed in the transfer chamber 5, and inside the turning range R of the wafer transfer mechanism 4,
At the time of cooling, for example, two cooling stands 6 are provided at a position higher than the turning surface, and an elevating shaft 8 is vertically attached to the wafer transfer mechanism 4 or the cooling stand 6, for example.

The operation of the above configuration will be described.
The wafer holder 10 of the wafer transfer mechanism 4 is turned around the turning shaft 9 to be directed to one of the cassette chambers 1A and 1B, for example, 1A, and the wafer holder 10 is extended into the cassette chamber 1A. Then, the wafer 3 is moved slightly upward by the elevating shaft 8 to transfer the wafer 3 onto the wafer holder 10, and then the wafer holder 10 is reduced and turned to rotate one of the reaction chambers 2A and 2B. The wafer 3 is loaded into the reaction chamber 2A by extending the wafer holder 10 toward the reaction chamber, for example, 2A, and then moved down slightly by the elevating shaft 8 to move the wafer 3 onto the susceptor in the reaction chamber 2A. A film is formed on the wafer 3 by flowing the reaction gas while heating the wafer on the susceptor.

The reaction chamber 2 is extended by extending the wafer holder 10.
A, after that, the wafer 3 is moved slightly upward to move the high-temperature wafer 3 onto the wafer holder 10, and then the wafer holder 10 is reduced and turned to rotate one of the cooling tables 7A and 7B. For example, the wafer is stopped at a position above the cooling stand 7A, and the wafer holder 10 is moved down by the elevating shaft 8 to transfer the high-temperature wafer 3 onto the cooling stand 7A for cooling. The cooled wafer 3 is transferred to the wafer holder 10 and stored in an empty storage groove in the cassette chamber 1A. The other reaction chamber 2B is used for forming a reaction product film different from the one reaction chamber 2A.
A film can be formed on the wafer 3 in the reaction chamber 2A, and another film can be formed on the film of the wafer 3 in the reaction chamber 2B, or different films can be formed on different wafers. The wafers formed in the two reaction chambers 2A and 2B are cooled by cooling tables 7A and 7B.
Can be cooled. The elevating shaft is connected to the cooling stand 6.
To transfer the wafer.

[0008]

According to the present invention, as described above, the outer surface conventionally used for cooling the polygonal transfer chamber can be used for purposes other than cooling. Semiconductor manufacturing function can be improved.

[Brief description of the drawings]

FIGS. 1A and 1B are a plan view for explanation showing an embodiment of the device of the present invention, and a diagram showing the relationship between the height of a turning surface and the height of a cooling stand in the present invention.

FIG. 2 is an explanatory plan view showing one example of a conventional device.

[Explanation of symbols]

 1A, 1B Cassette chamber 2A, 2B Reaction chamber 3 Wafer 4 Wafer transfer mechanism 5 Transfer chamber 6 Cooling stand 7A, 7B Cooling chamber 8 Elevating shaft 9 Rotating shaft 10 Wafer holder

 ────────────────────────────────────────────────── ─── Continuing on the front page (72) Katsuji Toyama, Inventor 3--14-20 Higashinakano, Nakano-ku, Tokyo Inside Kokusai Electric Corporation

Claims (1)

[Claims] 1. A semiconductor manufacturing method comprising: installing a wafer transfer mechanism for transferring a wafer between a cassette chamber and a reaction chamber in a transfer chamber; and providing a cooling table inside a turning range of the wafer transfer mechanism. apparatus.