JPH106134A - Wire saw - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide such a wire saw as being capable of supplying sufficient cooling water to a cutting point under any circumstances and efficiently discharge chip accompanied by cutting. SOLUTION: A groove 1 to supply cooling water to a cutting point is formed in at least one place in the circumferential direction of an abrasive grain part 3 on a continuous or uncontinuous basis. In this way, chip accompanied by is cutting is also efficiently discharged through the groove 1, resulting in improved cutting performance.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wire saw used for cutting stone, concrete, building material and the like.

[0002]

2. Description of the Related Art A wire saw used for such cutting is simpler in operation, cheaper in equipment and equipment, and has a lower noise and vibration when cutting than a circular saw or a chain saw. It is widely used for demolition of buildings, bridges, etc. because of its small number.

[0003] This wire saw is basically, as seen in European Patent Publication No. 160625,
Ring-shaped diamond beads having an abrasive layer formed by electrodeposition or metal sintering on a bead base were fixed at regular intervals to a wire core, and the wire core was covered with a coating material such as a resin. It is wound around a work material, applied to a pulley of a driving device, then tensioned, and rotated at a high speed to perform cutting.

At this time, cooling water is used for cooling in order to prevent the performance of the abrasive grains from being deteriorated due to heat generated by friction between the diamond beads and the work material. However, the size and shape of the work material are various, and in particular, when used for civil engineering, it is difficult to supply sufficient cooling water depending on the use environment, and therefore, there is a problem that the performance is reduced. .

[0005]

SUMMARY OF THE INVENTION An object of the present invention is to provide a wire saw capable of supplying sufficient cooling water to a cutting point under any environment and efficiently discharging chips generated by cutting. is there.

[0006]

According to the present invention, a groove is formed in at least one position in the circumferential direction of the abrasive grain portion in a direction intersecting the circumferential direction. As a result, the cooling water can be efficiently supplied to the cutting point, and chips generated during the cutting can be efficiently discharged through the groove, so that the cutting performance is improved.

[0007]

BEST MODE FOR CARRYING OUT THE INVENTION A groove is formed on a circumferential surface of an abrasive grain portion.
It is not necessarily required to be in a right angle direction, and it may be formed to be inclined with respect to the traveling direction, or may be formed into a non-uniform intermittent shape. Further, the depth of the groove can be set arbitrarily, but in order to maintain the effect of the groove until all the abrasive grains wear out and reach the end of its life, it is preferable to set the depth to reach the metal base. The cross-sectional shape can be set arbitrarily, such as a V-shape, inverted trapezoidal shape, U-shape, and the like.

[0008]

FIG. 1 shows an embodiment of a diamond bead for a wire saw according to the present invention. As shown in FIG. 1, reference numeral 1 denotes a groove formed over the entire circumference in the circumferential direction of the abrasive part 3 formed on the outer peripheral surface of the base metal 2. The groove 1 has a width of 1.5 mm, the side surface of the cross section is vertical, and the depth is
To a depth to reach. This wire saw was prepared according to the specifications shown in Table 1, and a cutting test was performed under the conditions shown in Table 2.
Further, as a comparative example, as shown in Table 1, the same test was performed on the same specification having no groove formed in this example.
FIG. 2 shows the test results. As shown in the figure, in the comparative example, the load power increased with the increase in the cutting area, and the sharpness decreased. On the other hand, in the example, even if the cutting area increased, the stable and good sharpness was improved. Lasted. Thus, it can be seen that the cutting performance of the example is improved as compared with the comparative example.

[0009]

[Table 1]

[Table 2] In the above embodiment, the groove 1 formed in the abrasive grain portion 3 was used.
Are provided continuously at right angles in the circumferential direction. However, the present invention is not limited to this example, and as shown in FIGS. 3 and 4, a continuous groove 11 or an intermittent groove 12 inclined with respect to the traveling direction. And even
It was also found that the cutting performance was improved as compared with the comparative example in the case of combining them.

[0010]

According to the wire saw of the present invention, since sufficient cooling water is supplied to the cutting point and the chips generated during cutting are efficiently discharged, the cutting performance is improved and the stable performance is maintained. can do.

[Brief description of the drawings]

FIG. 1 shows an embodiment of a diamond bead for a wire saw of the present invention.

FIG. 2 shows a cutting test result of the wire saw of the present invention and a comparative example.

FIG. 3 shows another example of a form of a groove formed in an abrasive layer of diamond beads.

FIG. 4 shows still another example of a form of a groove formed in an abrasive layer of diamond beads.

[Explanation of symbols]

1, 11, 12 Grooves formed in the abrasive part 2 Base metal
3 Abrasive part

Claims (1)

[Claims] 1. A wire saw in which annular diamond beads having abrasive grains formed on a base metal are arranged at arbitrary intervals on a wire core, and a coating material made of resin, rubber or the like is formed between the diamond beads. A groove is formed in at least one location in the circumferential direction of the abrasive grain portion in a direction crossing the circumferential direction.