JPH1060698A - Method for cleaning and roughening surface of printed circuit board - Google Patents
Method for cleaning and roughening surface of printed circuit boardInfo
- Publication number
- JPH1060698A JPH1060698A JP8222298A JP22229896A JPH1060698A JP H1060698 A JPH1060698 A JP H1060698A JP 8222298 A JP8222298 A JP 8222298A JP 22229896 A JP22229896 A JP 22229896A JP H1060698 A JPH1060698 A JP H1060698A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- electrolytic
- cleaning
- roughening
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は印刷回路板金属表面
の清浄粗面化法に関し、特に、例えばフィルム状にコー
ティングされた印刷回路板の銅表面を清浄及び粗面化
し、且つ環境保護や資源リサイクルの効果がある印刷回
路板表面の清浄粗面化法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for cleaning and roughening a metal surface of a printed circuit board. The present invention relates to a method for cleaning and roughening the surface of a printed circuit board having an effect of recycling.
【0002】[0002]
【従来の技術】従来の印刷回路板(PC板)における銅
など金属表面の清浄及び粗面化は、印刷回路板を直接酸
溶液などのような腐蝕性化学薬液の中に浸漬して、その
薬液の腐蝕研磨作用により該印刷回路板の銅表面にある
不純物を溶かして清浄し且つ粗面化させるのであるが、
その強酸性薬液が洗浄に使用されてゆくうちに溶かした
金属で飽和状態になれば、廃液として一先ず無害になる
まで処理してから廃棄すべきであるのが、しばしば処理
が不完全であったり或いは手抜きされたりして、重金属
による環境汚染を来すのみならず資源の浪費ともなる。2. Description of the Related Art A conventional printed circuit board (PC board) is used to clean and roughen a metal surface such as copper by directly immersing the printed circuit board in a corrosive chemical solution such as an acid solution. The corrosion and polishing action of the chemical solution dissolves impurities on the copper surface of the printed circuit board to clean and roughen the surface.
If the strongly acidic chemical becomes saturated with the dissolved metal as it is used for cleaning, it should be treated as a waste liquid until it is harmless, and then discarded. Or, if it is omitted, it not only causes environmental pollution due to heavy metals but also wastes resources.
【0003】[0003]
【発明が解決しようとする課題】上記従来の印刷回路板
表面の清浄粗面化法における問題点に鑑み、本発明は、
逆電解手段により印刷回路板表面を清浄粗面化して、清
浄剤の酸溶液を再生循環使用し、且つ陰極に還元沈積し
た金属を回収して、環境汚染防止や資源リサイクルに役
立つ印刷回路板表面の清浄粗面化法を提供することを目
的とする。SUMMARY OF THE INVENTION In view of the above problems in the conventional method for cleaning and roughening the surface of a printed circuit board, the present invention provides
The surface of the printed circuit board is cleaned and roughened by reverse electrolysis, the acid solution of the cleaning agent is recycled and recycled, and the metal deposited and reduced on the cathode is recovered to help prevent environmental pollution and recycle resources. It is an object of the present invention to provide a clean surface roughening method.
【0004】[0004]
【課題を解決するための手段】上記目的を達成するた
め、本発明は、清浄剤としての電解液が注入された一個
以上の電解槽内に、それぞれ電源の負極と接続した陰極
板を浸漬して、印刷回路板を電源の正極に接続して陽極
として各電解槽内を連続通過させるように移送し、該印
刷回路板表面の金属を電解して該陰極板表面に還元沈積
させ、電解研磨作用により印刷回路板表面を逆電解して
清浄すると同時に粗面化させるように構成される。In order to achieve the above object, the present invention provides a method of immersing a cathode plate connected to a negative electrode of a power source in one or more electrolytic cells into which an electrolytic solution as a detergent is injected. Then, the printed circuit board is connected to the positive electrode of the power supply and transferred so as to continuously pass through each electrolytic cell as an anode. By the action, the surface of the printed circuit board is reversely electrolyzed to be cleaned and roughened at the same time.
【0005】そして、上記印刷回路板の連続移送を、適
当な間隔置きに配設された多数個の回転ローラーからな
る移送機構で行ない、且つ上記電解槽の入口及び出口付
近の適当な位置にあるローラーを、電源正極と接続した
陽極ローラーに形成して印刷回路板と電気的に接続さ
せ、上記各電解槽内における陰極板を、該各電解槽内の
印刷回路板移送経路の上、下方にそれぞれ一個づつ取付
けるようにすれば一層好ましくなる。[0005] Then, the printed circuit board is continuously transferred by a transfer mechanism including a plurality of rotating rollers arranged at appropriate intervals, and is at an appropriate position near the entrance and exit of the electrolytic cell. A roller is formed on an anode roller connected to a power supply positive electrode and electrically connected to a printed circuit board, and a cathode plate in each of the above-described electrolytic cells is placed above and below a printed circuit board transfer path in each of the electrolytic cells. It is more preferable to attach each one one by one.
【0006】上記のように構成された本発明は、その印
刷回路板の移送経路に一個或いは一個以上の電解槽を設
けて、各電解槽内に電解液11を注入し、且つ各電解槽
内における印刷回路板の移送経路に電源の負極と接続し
た陰極板を浸漬装着しているので、電解槽内を通過する
印刷回路板の金属表面を電解研磨作用により清浄粗面化
処理することができる。According to the present invention having the above structure, one or more electrolytic cells are provided in the transfer path of the printed circuit board, the electrolytic solution 11 is injected into each electrolytic cell, and Since the cathode plate connected to the negative electrode of the power supply is immersed and mounted in the transfer path of the printed circuit board, the metal surface of the printed circuit board passing through the electrolytic cell can be cleaned and roughened by the electrolytic polishing action. .
【0007】そして、この電解研磨作用によって金属イ
オンを含む電解液は、陰極板と接して析出作用により金
属を陰極板表面に析出させることができ、電解液が再生
されるので循環使用することができると共に、電解液中
の金属を回収して環境汚染を回避することができる。[0007] The electrolytic solution containing metal ions by the electropolishing action comes into contact with the cathode plate, and the metal can be deposited on the surface of the cathode plate by the deposition action. Since the electrolytic solution is regenerated, it can be recycled. In addition, the metal in the electrolyte can be recovered to avoid environmental pollution.
【0008】[0008]
【発明の実施の形態】以下、本発明を実施の形態例に基
づいて具体的に説明するが、本発明はこの例だけに限定
されない。図1に示す如く、本発明は、主として一個以
上の電解液11を注入された電解槽1を備えて、各電解
槽1にそれぞれ電源の負極と接続した陰極板2を浸漬装
着し、且つ印刷回路板(PC板)3を電源の正極と接続
させて陽極として各電解槽1内を連続通過するよう移送
し、印刷回路板3表面の金属(例えば銅)を電解して、
陰極板2表面に還元沈積させ、これにより印刷回路板の
表面を電解研磨作用で清浄粗面化する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be specifically described based on embodiments, but the present invention is not limited to these embodiments. As shown in FIG. 1, the present invention mainly includes an electrolytic cell 1 into which one or more electrolytic solutions 11 are injected, and immerses and mounts a cathode plate 2 connected to a negative electrode of a power source in each of the electrolytic cells 1 and performs printing. The circuit board (PC board) 3 is connected to the positive electrode of the power source, transferred as an anode so as to continuously pass through each electrolytic cell 1, and electrolyzes the metal (eg, copper) on the surface of the printed circuit board 3;
The surface of the printed circuit board is cleaned and roughened by an electrolytic polishing action by reducing and depositing on the surface of the cathode plate 2.
【0009】したがって本発明は、印刷回路板3の移送
経路に一個或いは一個以上の電解槽1を設けて、各電解
槽1内に導電性の電解液11を注入し、電解液11は、
例えば電解金属の硫酸塩溶液であって導電媒体として使
われ、且つ各電解槽1内における印刷回路板3の移送経
路に電源の負極と接続した陰極板2を浸漬装設して、陰
極板2を印刷回路板3の移送経路の上、下方に二つ相対
して取付け、印刷回路板3の両面に対して同時に逆電解
処理を行なえるようにする。Therefore, according to the present invention, one or more electrolytic baths 1 are provided in the transfer path of the printed circuit board 3, and a conductive electrolytic solution 11 is injected into each electrolytic bath 1;
For example, a cathode plate 2, which is a sulfate solution of an electrolytic metal and is used as a conductive medium and is connected to a negative electrode of a power supply, is immersed in a transfer path of a printed circuit board 3 in each electrolytic cell 1. Are mounted above and below the transfer path of the printed circuit board 3 so that reverse electrolysis can be performed on both sides of the printed circuit board 3 at the same time.
【0010】そして、各印刷回路板3の連続移送は、多
数個の適当な間隔置きに排列設置された回転ローラー4
1からなる移送機構4によって各電解槽1内に通過させ
られ、且つ各電解槽1の入口12及び出口13付近の適
当な位置にあるローラーを電源正極と連接させて陽極ロ
ーラー42に形成し、電解槽1に入る印刷回路板3に陽
極の電気性を保たせて、これにより陽極電気性を保った
印刷回路板3が電解槽1の電解液11中でその表面の銅
金属を電解し、並びに同一電解槽1内の陰極板2表面に
銅金属が還元沈積するのであり、即ち印刷回路板3の金
属表面を電解して陰極板2表面に還元沈積させ、印刷回
路板表面を清浄粗面化する目的を達成できるのである。
一方、陰極板2表面に還元沈積した銅は一層の薄片銅箔
を形成するので、直接剥がして再利用することができ、
また電解媒質の硫酸塩電解液11は反復に循環使用でき
るので、従来のように重金属や強酸薬液の環境汚染を形
成しない。The continuous transfer of each printed circuit board 3 is performed by rotating rollers 4 arranged at a plurality of appropriate intervals.
A roller at an appropriate position near the inlet 12 and outlet 13 of each of the electrolytic cells 1 is connected to the positive electrode of the power source and formed on the anode roller 42 by the transfer mechanism 4 comprising The printed circuit board 3 entering the electrolytic cell 1 is made to maintain the electrical property of the anode, whereby the printed circuit board 3 maintaining the anode electrical property electrolyzes the copper metal on the surface thereof in the electrolytic solution 11 of the electrolytic cell 1, In addition, copper metal is reduced and deposited on the surface of the cathode plate 2 in the same electrolytic cell 1, that is, the metal surface of the printed circuit board 3 is electrolyzed to be reduced and deposited on the surface of the cathode plate 2, and the surface of the printed circuit board is cleaned and roughened. It can achieve the purpose of becoming.
On the other hand, since the copper deposited by reduction on the surface of the cathode plate 2 forms a single-layer copper foil, it can be directly peeled off and reused.
Further, since the sulfate electrolyte solution 11 as the electrolytic medium can be repeatedly used repeatedly, environmental pollution of heavy metals or strong acid chemicals is not formed as in the related art.
【0011】上記陰極板2を浸漬装設した電解槽1の設
置は、印刷回路板3表面の清浄粗面化する程度に応じて
一個または多数個連続的に印刷回路板3の移送経路に設
けてよく、或いは電解槽1を適当な長さに設けて、必要
な逆電解の清浄粗面化効果を達成できるようにしてもよ
い。The electrolytic cell 1 in which the above-mentioned cathode plate 2 is immersed is installed by providing one or many continuously in the transfer path of the printed circuit board 3 depending on the degree to which the surface of the printed circuit board 3 is cleaned and roughened. Alternatively, the electrolytic cell 1 may be provided at an appropriate length so that the required reverse electrolysis clean and roughening effect can be achieved.
【0012】[0012]
【発明の効果】上記のように構成された本発明は、下記
のような効果がある。 逆電解により印刷回路板表面の清浄粗面化するの
で、環境保護の訴求に応えることができて、汚染を生じ
ない。 電解液となる硫酸塩を反復循環使用することができ
る。 陰極板に還元沈積した銅は、直接取下して再利用す
ることができ、資源リサイクルの目的を達成できる。 電解による粗面化法を採用しているので、印刷回路
板に機械による表面研磨法のような応力集中の変形現象
が生じない。The present invention configured as described above has the following effects. Since the surface of the printed circuit board is cleaned and roughened by the reverse electrolysis, it can meet the demand for environmental protection and does not cause contamination. The sulfate serving as the electrolyte can be repeatedly used. Copper reduced and deposited on the cathode plate can be directly removed and reused, thereby achieving the purpose of resource recycling. Since the surface roughening method by electrolysis is adopted, a stress concentration deformation phenomenon such as a mechanical surface polishing method on a printed circuit board does not occur.
【図1】本発明における比較的好ましい実施例の表示図
である。FIG. 1 is a schematic representation of a preferred embodiment of the present invention.
1 電解槽 11 電解液 12 電解槽への入口 13 電解槽からの出口 2 陰極板 3 印刷回路板(PC板) 4 移送機構 41 回転ローラー 42 陽極ローラー DESCRIPTION OF SYMBOLS 1 Electrolyzer 11 Electrolyte 12 Entrance to an electrolyzer 13 Outlet from an electrolyzer 2 Cathode plate 3 Printed circuit board (PC board) 4 Transfer mechanism 41 Rotary roller 42 Anode roller
Claims (3)
以上の電解槽内に、それぞれ電源の負極と接続した陰極
板を浸漬して、印刷回路板を電源の正極に接続して陽極
として各電解槽内を連続通過させるように移送し、該印
刷回路板表面の金属を電解して該陰極板表面に還元沈積
させ、電解研磨作用により印刷回路板表面を逆電解して
清浄すると同時に粗面化させるようにしてなる印刷回路
板表面の清浄粗面化法。1. A cathode plate connected to a negative electrode of a power source is immersed in one or more electrolytic cells into which an electrolytic solution as a detergent is injected, and a printed circuit board is connected to a positive electrode of the power source to serve as an anode. It is transferred so as to continuously pass through each electrolytic cell, and the metal on the surface of the printed circuit board is electrolyzed to be reduced and deposited on the surface of the cathode plate. A method for cleaning and roughening the surface of a printed circuit board, which is to be surface-roughened.
隔置きに配設された多数個の回転ローラーからなる移送
機構で行ない、且つ上記電解槽の入口及び出口付近の適
当な位置にあるローラーを、電源正極と接続した陽極ロ
ーラーに形成して印刷回路板と電気的に接続させてなる
請求項1に記載の印刷回路板表面の清浄粗面化法。2. The continuous transfer of the printed circuit board is performed by a transfer mechanism including a plurality of rotating rollers arranged at appropriate intervals, and is at an appropriate position near the entrance and exit of the electrolytic cell. The method for cleaning and roughening the surface of a printed circuit board according to claim 1, wherein the roller is formed as an anode roller connected to a positive electrode of a power supply and electrically connected to the printed circuit board.
電解槽内の印刷回路板移送経路の上、下方にそれぞれ一
個づつ取付けるようにしてなる請求項1に記載の印刷回
路板表面の清浄粗面化法。3. The printed circuit board surface according to claim 1, wherein one of the cathode plates in each of the electrolytic cells is attached above and below a printed circuit board transfer path in each of the electrolytic cells. Clean surface roughening method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8222298A JPH1060698A (en) | 1996-08-23 | 1996-08-23 | Method for cleaning and roughening surface of printed circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8222298A JPH1060698A (en) | 1996-08-23 | 1996-08-23 | Method for cleaning and roughening surface of printed circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1060698A true JPH1060698A (en) | 1998-03-03 |
Family
ID=16780176
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8222298A Pending JPH1060698A (en) | 1996-08-23 | 1996-08-23 | Method for cleaning and roughening surface of printed circuit board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1060698A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011084801A (en) * | 2009-10-19 | 2011-04-28 | Furukawa Electric Co Ltd:The | Method and apparatus for manufacturing surface roughened copper plate |
-
1996
- 1996-08-23 JP JP8222298A patent/JPH1060698A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011084801A (en) * | 2009-10-19 | 2011-04-28 | Furukawa Electric Co Ltd:The | Method and apparatus for manufacturing surface roughened copper plate |
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