JPH1056288A - Composite electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the increase in the number of independent parts and to eliminate processes of low efficiency, relating to a composite electric part with a counter measure for heat radiation. SOLUTION: A connector 4 is connected/fixed to a conductive pattern on a substrate 2, combined thermally to a heat generating electronic part 5. A contact piece 1b is formed at a tip of a tongue-like plate 1a of a shield case 1 formed by bending. The substrate 2 is so housed in the shield case 1 that the contact piece 1b inside the shield case 1 is inserted into the connector 4 on the substrate 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a composite electronic component which requires measures for heat radiation, and to a structure capable of reducing the number of assembling steps and eliminating steps with poor workability.

[0002]

2. Description of the Related Art As an example of a miniaturized electronic device, there are many composite electronic components in which desired functional circuits are compactly assembled and the functional circuits are housed in a package. In such a composite electronic component, when a heat-generating electronic element such as a transistor is provided in a circuit, a measure for radiating heat generated in the electronic element becomes a problem. For this heat dissipation measure, heat dissipation means for emitting heat to the outside of the package and heat conduction means for guiding the heat generated in the electronic element to the heat dissipation means are required. Incidentally, in a conventional composite electronic component, heat generated in an electronic element is guided to a shield case for a package, and the shield case is often used as a heat radiation means.

[0003] As an example of a conventional composite electronic component using a shield case as a heat radiating means, there is one having a cross section as shown in FIG. In FIG. 6, the substrate 2
Various electronic elements 6 and a heat-generating electronic element 5 are mounted on the upper and lower surfaces of the substrate 2 to form a certain functional circuit, and the lower surface of the substrate 2 is electrically connected to a circuit pattern of a mother substrate. Terminal pins 2a are provided. The shield case 8 for accommodating the substrate 2 first cuts out one of the side walls of the metal plate into a long plate shape, then turns the metal plate of the extension part inward, and furthermore, the tip side of the extension part is the shield case 8. It is characterized by having a tongue-shaped plate 8a bent and formed so as to be parallel to the ceiling plate. When such a shield case 8 is used, the assembly of the composite electronic component is performed as follows.

A flat plate 9 having a tapped hole is inserted into a space formed between a ceiling plate and a tongue plate 8a of a shield case 8, and the flat plate 9 is fixed by a projection 8b. The substrate 2 is housed inside the shield case 8 so that the positions of the through holes provided in the substrate 2, the electronic element 5, and the tongue plate 8a and the tapped holes of the flat plate 9 are aligned. A screw 10 is passed through the holes of the substrate 2, the electronic element 5, and the tongue plate 8a, and the screw 10 is screwed into a tap hole of the flat plate 9, thereby fastening the substrate 2, the electronic element 5, and the tongue plate 8a together. By this joint fastening, the electronic element 5 and the tongue-shaped plate 8a are simultaneously brought into close contact with each other while fixing the substrate 2. Then, the case lid 3 is fitted into the opening of the shield case 8 to complete the composite electronic component.

In the composite electronic component having such a structure, when heat is generated in the electronic element 5 and the temperature rises,
First, the heat is transmitted to the tongue-shaped plate 8a in a close contact state. Since the tongue plate 8a has an integral structure with the side wall of the shield case 8, heat is transmitted from the tongue plate 8a to the side wall of the shield case 8. Further, the heat conducted to the tongue plate 8a is also transmitted to the ceiling plate of the shield case 8 through the flat plate 9, whereby the heat is released and diffused from the outer surface of the shield case 8 into the atmosphere.

[0006]

The composite electronic component shown in FIG. 6 has an electronic element 5 and a tongue-shaped plate 8 formed by screws 10 and a flat plate 9.
a, and the heat generated in the electronic element 5 is conducted to the shield case 8 via the tongue-shaped plate 8a to radiate heat. In such a configuration, during the assembling process, the operation of inserting the flat plate 9 between the ceiling plate of the shield case 8 and the tongue plate 8a, and the operation of inserting the screw 10 into the board 2, the electronic element 5, and the tongue plate 8a Screwing into the tap hole of the flat plate 9 through the hole. Since these two operations are difficult to mechanize, there is a problem that a large amount of labor is required and the operation efficiency is low.

[0007] For this reason, since the screws 10 and the flat plate 9 are required as independent parts, the material cost is increased due to the increase in the number of independent parts. Its presence also resulted in increased manufacturing costs. Therefore, the present invention can firstly suppress the increase in the number of independent components, secondly eliminate the steps with low work efficiency, and thirdly sufficiently release the heat generated in the electronic element to the shield case. It is an object of the present invention to provide a composite electronic component that can conduct electricity.

[0008]

SUMMARY OF THE INVENTION The present invention relates to a composite electronic component in which various electronic elements are mounted on a substrate and the substrate is housed in a shield case, and is joined to a connector and a shield case fixed on the substrate. By providing the fixed contact piece, the contact piece is inserted into the connector, so that the board is fixed at a predetermined position in the shield case, and at the same time, heat is applied to the shield case via the connector and the contact piece. It is characterized by conducting.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A connector is connected and fixed to a conductor pattern on a substrate which is in thermal connection with a heat-generating electronic component. On the other hand, a contact piece is joined and fixed to a predetermined position inside the shield case. Here, as a specific structure of the shield case, at least one of the metal plates forming the side wall of the shield case is cut out long, the metal plate of the extension portion is folded inward, and the tip of the extension portion is the ceiling of the shield case. It is assumed that a tongue-shaped plate is formed by folding back to be parallel to the plate. As an example, the contact piece is formed integrally with the shield case by processing the tip of the tongue plate of the shield case.

The board is stored in the shield case such that the contact pieces inside the shield case are inserted into the connector on the board, and at this time, the connector uses the force to hold the contact pieces. The position of the substrate in the inside is fixed. With this configuration, the heat generated in the electronic element is conducted to the shield case via the thermally connected conductor pattern, connector, and contact piece, and heat is radiated from the outer surface of the shield case.

[0011]

1 to 3 show a first embodiment of a composite electronic component according to the present invention. 1 is a sectional view of a composite electronic component according to the present invention, FIG. 2 is a partially enlarged view of an area [A] shown in FIG. 1, and FIG. 3 is a top view of the part shown in FIG. It is as follows. Various electronic elements 6 and a heat-generating electronic element 5 for forming a functional circuit are mounted on both upper and lower surfaces of the substrate 2, and a connector 4 is fixed to the substrate 2 together with these elements. On the other hand, in the shield case 1, a tongue-shaped plate 1a is formed in the same manner as the conventional shield case (8) shown in FIG. 6, and the tip of the tongue-shaped plate 1a is processed to form a contact piece 1b.

Such a connector 4, a contact piece 1b
When the composite electronic component having the above structure is assembled, the board 2 is housed inside the shield case 1 such that the contact piece 1b formed integrally with the shield case 1 is inserted into the connector 4 on the board 2. Then, as shown in FIG. 2, the connector 4 sandwiches the inserted contact piece 1b between the two contact conductors 4b, and holds the contact piece 1b by the stress. As a result, the substrate 2 is fixed at a predetermined position inside the shield case 1 by the force holding the contact piece 1b of the connector 4.

Here, the means for fixing the connector 4 to the substrate 2 is required to have good heat conductivity as well as mechanical strength. As the simplest means satisfying these two conditions, soldering can be used. However, if the shield case 1 needs to be insulated from the circuit, the conductor pattern to which the connector 4 is soldered must in principle be insulated from the circuit. Therefore, FIGS. 2 and 3
As shown in the figure, the conductor pattern 2c to which the connector 4 is soldered is formed by applying a thin slit-shaped insulating band 2d to the conductor pattern 2b to which the heat-generating electronic component 5 is soldered. . With such a structure, the conductor patterns 2b and 2c are electrically insulated from each other, but are thermally coupled via the substrate 2. It goes without saying that the longer the sides of the conductor patterns 2b and 2c facing each other across the insulating band 2, the higher the thermal coupling between the conductor patterns 2b and 2c.

Therefore, heat generated in the electronic element 5 is transferred to the conductor pattern 2b, the insulating band 2d (substrate 2), and the conductor pattern 2b.
c, the connector 4, the contact piece 1b, and the tongue-shaped plate 1a conduct electricity, and finally heat is radiated from the outer surface of the shield case 1. Comparing the configuration according to the present invention shown in FIG. 1 with the conventional configuration shown in FIG. 6, since the contact piece 1b is formed integrally with the shield case 1 in the configuration of FIG.
Only the connector 4 is required as an independent component, and an increase in the number of independent components for forming a composite electronic component can be suppressed. The contact piece 1b shown in FIG. 1 can be formed at the same time when the shield case 1 is manufactured from a metal plate, and the connector 4 can be fixed to the board 2 by soldering together with other electronic components 5 and 6. Requires less man-hours. Further, in the configuration shown in FIG. 1, the operation of housing the substrate 2 in the shield case 1 is as simple as pushing it in, and a step with low work efficiency as in the related art can be eliminated.

FIGS. 4 and 5 show second and third embodiments of the composite electronic component according to the present invention, respectively. Note that FIG.
FIG. 5 schematically shows only a shield case, a board, a contact piece, and a connector, respectively, and other parts are not shown. In the second embodiment shown in FIG. 4, the shield case 1 has the tongue plate 1a shown in FIG. 1 attached to the ceiling plate of the shield case 1 so that the space between the tongue plate 1a and the ceiling plate can be reduced. Specifically, the structure is such that the contact pieces 1b extend from the ceiling plate of the shield case 1 in the direction of the substrate 2. The third embodiment shown in FIG. 5 has a structure in which the shield case 1 and the contact piece 7 are separately manufactured, and then the shield case 1 and the contact piece 7 are joined.

In each of the embodiments shown in FIGS. 1, 4 and 5, it is assumed that the contact pieces 1b and 7 are plate-shaped and the connector 4 is a direct-type wiring board connector component. However, the contact pieces 1b and 7 may be pin-shaped, and various connector components having pin specifications may be used as the connector 4. Further, in the embodiment shown in FIG.
Plugs and jacks can be used for the connector 4. If there is no need to insulate the shield case 1 from the circuit, for example, if it is possible to connect the shield case 1 to ground, the connector 4 may be soldered to a ground conductor pattern to which the terminals of the electronic element 5 are connected. Is also good.
As described above, the present invention can be variously modified depending on the conditions of the contact piece provided on the shield case and the connector fixed to the board.

[0017]

As described above, the present invention is characterized in that the connector is fixed on the board, the contact piece is provided in the shield case, and the board is stored in the shield case by inserting the contact piece into the connector. It is assumed that. According to this configuration, the contact piece can be formed integrally with the shield case, and an increase in the number of independent components constituting the composite electronic component can be suppressed. In addition, the contact piece can be formed at the time of manufacturing the shield case, and the connector can be fixed to the substrate by soldering together with other electronic components, so that the number of assembly steps is reduced. Then, the work of housing the substrate in the shield case is as simple as pushing it in, and a step with low work efficiency can be eliminated. Further, heat can be dissipated from the internal electronic element via the connector and the contact piece. Therefore, according to the present invention, it is possible to obtain an inexpensive composite electronic component in which the production cost and the material cost are reduced while taking measures against heat radiation.

[Brief description of the drawings]

FIG. 1 is a sectional view of a first embodiment of a composite electronic component according to the present invention.

FIG. 2 is a partially enlarged view of an area [A] shown in FIG.

FIG. 3 is a top view of the part shown in FIG. 2;

FIG. 4 is a model diagram of a second embodiment of the composite electronic component according to the present invention.

FIG. 5 is a schematic diagram of a third embodiment of the composite electronic component according to the present invention.

FIG. 6 is a sectional view of an example of a conventional composite electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Shield case 1a Tongue plate 1b Contact piece 2 Substrate 2a Terminal pin 2b Heat-generating electronic component side conductor pattern 2c Connector-side conductor pattern 2d Slit-shaped insulating band 3 Case cover 4 Connector 4a Connector housing 4b Contact conductor 5 Heat generation Electronic components 6 Various electronic components

Claims (5)

[Claims] 1. A composite electronic component in which various electronic elements are mounted on a substrate and the substrate is housed in a shield case, wherein the connector is fixed on the substrate and the connector is fixed to the shield case. A certain contact piece, and the contact piece is inserted into the connector, so that the substrate is fixed at a predetermined position in the shield case, and at the same time, the connector and the shield case are connected to the shield case via the contact piece. A composite electronic component characterized by conducting heat. 2. A composite electronic component in which various electronic elements are mounted on a substrate and the substrate is housed in a shield case, wherein the conductor on the substrate is in thermal connection with the electronic element requiring heat dissipation measures. A connector connected to the pattern, and a contact piece joined and fixed to the shield case, and the substrate is fixed at a predetermined position in the shield case by inserting the contact piece into the connector. Simultaneously, the heat generated in the electronic element is transmitted to the shield case via the connector and the contact piece. 3. The conductor pattern to which the connector is connected is arranged with a narrow insulating band in a slit shape with respect to the conductor pattern to which the electronic element requiring heat dissipation is electrically connected. The composite electronic component according to claim 2, wherein: 4. The shield case, wherein at least one of a metal plate constituting a side wall of the shield case is cut out long, the metal plate is folded back into the shield case, and bent parallel to a ceiling plate of the shield case. The composite electronic component according to claim 1, further comprising a tongue-shaped tongue-shaped plate, wherein the tongue-shaped plate is provided with the contact piece. 5. The composite electronic component according to claim 1, wherein said shield case and said contact piece are formed integrally.