JPH1048655A - Liquid crystal driving device and its display device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce a distance between input/output terminals of a liquid crystal driving device by overlapping a peripheral part of a semiconductor chip with an edge of an opening part of a film and making it larger than a distance from one end of a semiconductor chip to plural output terminals of the semiconductor chip. SOLUTION: An IC chip 301 is made so as to be overlapped with the edge of the opening part 307 of a base film 305 in its peripheral part. Then, a length that the peripheral part of the IC chip 301 of a liquid crystal display panel side overlapped with the edge of the opening part 307 of the base film 305 is made longer than the length that the peripheral part of a drive circuit substrate side overlapped with the edge of the opening part 307, and the distance from the end part of the IC chip 301 of the liquid crystal display panel side to an output side bonding pad 304b is made longer than the distance from the end part of the drive circuit substrate side to an input side bonding pad 304a. Then, a deterrent means deterring a protective film leaked out of between the semiconductor chip and the film when the protective film formed on a surface that plural input/output terminals of the semiconductor chip are formed is provided.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid crystal driving device and a liquid crystal display device, and more particularly to a technique which is effective when applied to a narrow frame of a liquid crystal display panel.

[0002]

2. Description of the Related Art As a conventional liquid crystal display device, a simple matrix type liquid crystal display device for driving a pixel at an intersection of stripe-shaped XY electrodes and an active element (for example, a thin film transistor) for each pixel are provided. It is roughly classified into an active matrix type liquid crystal display device that performs switching driving.

FIG. 18 shows a conventional color STN (Super Twin) which is one of simple matrix type liquid crystal display devices.
FIG. 2 is a block diagram illustrating a schematic configuration of a simple matrix type liquid crystal display module (LCM) of a stable nematic type.

In FIG. 18, reference numeral 501 denotes a display control device;
502 is a power supply circuit, 503 is a liquid crystal display panel, IC-U
1, IC-U2, IC-U3, and IC-Un are upper drain drivers (data signal line driving circuits), IC-L1,
IC-L2, IC-L3 and IC-Ln are lower drain drivers (data signal line driving circuits), IC-C1 and IC
-C2, IC-C3, IC-C4, and IC-C5 are common drivers (scanning signal line driving circuits).

The liquid crystal display panel 503 includes a pair of glass substrates arranged to face each other with a liquid crystal interposed therebetween, and one of the glass substrates has a surface extending on the liquid crystal side extending in the X direction and having a Y direction.
M common electrodes (scanning signal lines) are formed side by side in the direction, and each of the m common electrodes is connected to a corresponding common driver (IC-C1 to Cn).

On the liquid crystal side of the other glass substrate, there are formed n segment electrodes (data signal lines) extending in the Y direction and juxtaposed in the X direction.
The n segment electrodes are divided into upper and lower two, and each of the n divided segment electrodes is connected to a corresponding upper segment driver (IC-U1 to IC-U1).
n) or the corresponding lower segment drivers (IC-L1 to Ln).

The intersections of the plurality of segment electrodes and the plurality of common electrodes constitute a pixel area, and each of the upper segment drivers (IC-U1 to Un) and each of the lower segment drivers (IC-L1 to Ln). And applying a data signal line drive voltage to the plurality of segment electrodes and a scanning signal line drive voltage to the plurality of common electrodes from each of the common drivers (IC-C1 to Cn) to drive the pixels.

In this case, a so-called AC drive method is adopted in which each drive voltage applied to the plurality of segment electrodes and the plurality of common electrodes is inverted at a predetermined cycle so that no DC voltage is applied to the liquid crystal. Is done.

The display control device 501 supplies display data (Din) to each of the segment drivers (IC-U1 to Un, IC-L1 to Ln) based on display data transferred from the host computer or the like.

The display control device 501 is adapted to display control signals (clocks (CL1, CL2), frame signals (FLM), alternating signals (M), etc.) based on display control signals transferred from the host computer or the like. And each segment driver (IC-U1 to Un, IC-L1 to Ln)
And a display control signal is sent to each common driver (IC-C1 to Cn), and each segment driver (IC-U1 to IC-U1 to Cn) is sent.
Un, IC-L1 to Ln) and each common driver (I
C-C1 to Cn).

A power supply circuit 502 generates a data signal line driving voltage and a scanning signal line driving voltage, and applies the data signal line driving voltage to each segment driver (IC-U1 to Un, IC-L1 to Ln). (IC-C1-C
The scanning signal line driving voltage is supplied to n).

FIG. 19 shows a display control device 50 shown in FIG.
1 to each segment driver (IC-U1 to Un, I
C-L1 to Ln) and each common driver (IC-
It is a figure which shows the display data (Din) sent to C1-Cn), and the timing chart of a display control signal (clock (CL1, CL2), a frame signal (FLM), and an alternating signal (M)).

Each segment driver (IC-U1)
To Un, IC-L1 to Ln) and each common driver (IC-C1 to Cn) as the display control signal input from the display control device 501, the clock (CL)
1, CL2), an alternating signal (M) and a display control signal other than the frame signal (FLM).
Are omitted.

FIG. 20 is a block diagram showing a schematic circuit configuration of each segment driver (IC-U1 to Un, IC-L1 to Ln) shown in FIG.

The segment driver shown in FIG. 20 includes a shift register circuit 511, a bit latch circuit 512, a line latch circuit 513, a selector circuit 514, an output buffer circuit 515, and a random logic circuit 510.

Next, the operation of the segment driver shown in FIG. 20 will be described.

The shift register circuit 511 generates a data latch signal for the bit latch circuit 512 based on the display data latch clock (CL2) input from the display controller 501, and outputs the signal to the bit latch circuit 512. .

The bit latch circuit 512 latches 8-bit display data (Din) input from the display control device 501 based on a data capture signal input from the shift register circuit 511.

The line latch circuit 513 latches the display data captured by all the bit latch circuits 512 based on the output timing control clock (CL1) and outputs the latched display data to the selector circuit 514.

The selector circuit 514 converts the voltage level of the display data input from the line latch circuit 513 to a high voltage level for driving the liquid crystal, and converts the output buffer circuit 51 to a high voltage level.
5 is output.

The output buffer circuit 515 includes a power supply circuit 5
02 to 4 levels of data signal line driving voltages are supplied, and the output buffer circuit 515 receives one of the 4 levels of data signal line driving voltages supplied from the power supply circuit 502 from the selector circuit 514. And output to each segment electrode (data signal line) based on the high voltage level display data and the AC signal (M).

In this case, each segment driver (IC
-U1 to Un, IC-L1 to Ln) output carry signals (EI / O1 or EI / O2),
The carry signal of the previous stage is directly input to the carry inputs of the segment drivers (IC-U1 to Un, IC-L1 to Ln) of the next stage, and each of the segment drivers (IC-U1 to Un, IC-) is input by the carry signal. The operation of taking in the display data of L1 to Ln is controlled, and incorrect display data is transferred to each of the segment drivers (IC-U1 to Un, IC-
L1 to Ln).

When the segment driver shown in FIG. 20 is arranged above liquid crystal display panel 503 and when arranged below liquid crystal display panel 503, the output terminals of output buffer circuit 515 are inverted left and right. It is necessary to invert the data signal line drive voltage from the output buffer circuit 515 output to each segment electrode left and right.

A random logic circuit 510 shown in FIG.
Is an output buffer circuit 5 output to each segment electrode.
Left and right inversion (SHL) of data signal line drive voltage from 15
Is performed, the 8-bit display data (Din) input from the display control device 501 is rearranged.

Each common driver (IC-C) shown in FIG.
1 to Cn) are supplied with four levels of scanning signal line driving voltages, and each common driver (IC-C1 to Cn)
Selects a common electrode driven every horizontal scanning time by an internal logic circuit in accordance with a frame signal (FLM) supplied from the display control device 501 and a clock (CL1), and selects the selected common electrode, Further, one of the four levels of the scanning signal line driving voltage supplied from the power supply circuit 502 is selected and output to the other common electrodes based on the alternating signal (M).

In this case, each common driver (IC-C
1 to Cn) output a carry signal, and
The signals are sent to the next stage common driver (IC-C1
Cn) is input to the carry input, and the carry signal controls the common electrode selection operation of each of the common drivers (IC-C1 to Cn).

FIG. 21 shows the liquid crystal display panel 5 shown in FIG.
FIG. 11 is a diagram for explaining an example of a data signal line driving voltage applied to a segment electrode 03 and a scanning signal line driving voltage applied to a common electrode.

In the example shown in FIG. 21, the power supply circuit 502
Different voltages of V1 to V6 are generated, and V1,
V2, V3, and V4 are applied to each segment driver (IC
-U1 to Un, IC-L1 to Ln), and
1, V2, V5, and V6 are applied to each common driver (IC
-C1 to Cn).

As shown in FIG. 21, for example, when the AC signal (M) is at the High level, the V2 drive voltage supplied from the power supply circuit 502 is applied to each segment electrode of the display data "1". A drive voltage of V4 supplied from the power supply circuit 502 is applied to each segment electrode of the display data “0”, and when the AC signal (M) is at the Low level, each segment of the display data “1” is The drive voltage of V1 supplied from the power supply circuit 502 is applied to the electrodes, and the drive voltage of V3 supplied from the power supply circuit 502 is applied to each segment electrode of the display data “0”.

Similarly, when the alternating signal (M) is at the high level, the power supply circuit 50 is connected to the selected common electrode.
The drive voltage V1 supplied from the power supply circuit 502 is applied to the non-selected common electrode, and the drive voltage V5 supplied from the power supply circuit 502 is applied to the non-selected common electrode. The drive voltage of V2 supplied from the power supply circuit 502 is applied to the common electrode, and the drive voltage of V6 supplied from the power supply circuit 502 is applied to the unselected common electrodes.

FIG. 22 is an exploded perspective view showing components of the simple matrix type liquid crystal display module (LCM) shown in FIG.

The liquid crystal display module (LC) shown in FIG.
In M), the cold cathode tube 528, the cold cathode tube 528
A light guide plate assembly 527 for irradiating the liquid crystal display panel 503 with light from the light source, a prism sheet 526 for condensing light from the light guide plate assembly 527, and a lower frame 532 in which a white paint is applied to a metal plate include: In the order shown in FIG. 22, it is fitted into the window of the frame-shaped mold 525.

Here, the light guide plate assembly 527 includes a light guide plate made of an acrylic plate, and reflection sheets and diffusion sheets formed on both sides of the light guide plate.

Around the cold cathode tube 528, a silver reflection sheet 529 for condensing light emitted in a direction different from that of the light guide plate assembly 527 to the light guide plate assembly 527 without waste is arranged.

A drive circuit board 524 is mounted around the liquid crystal display panel 503, and a tape carrier package 535 is mounted on the drive circuit board 524.

The liquid crystal display module (LC) shown in FIG.
In M), the liquid crystal display panel 503 around which the drive circuit board 524 is mounted is placed on the window of the mold 525, and further thereon, the silicon spacer 522, the bar spacer 532, and the upper frame having the display window are provided. 521 are assembled, and the lower frame is sandwiched between claws provided on the upper frame 521 to assemble.

Here, the mold 525, the prism sheet 526, the cold cathode tube 528, the silver reflection sheet 529, the light guide plate assembly 527, and the lower frame 532 constitute a backlight for irradiating the liquid crystal display panel 503 with light. I do.

In FIG. 22, reference numeral 530 denotes a rubber bush.

As described above, the simple matrix type liquid crystal display module (LCM) shown in FIG.
A liquid crystal display panel 503 having a display 24 mounted around and a backlight are housed between an upper frame 521 having a display window and a lower frame 532.

The area of the display window of the upper frame 521 is a simple matrix type liquid crystal display module (LC
M), a region other than the display region of the simple matrix type liquid crystal display module (LCM), that is, a region around the display window of the upper frame 521 is called a normal frame, and this frame region includes: As is clear from FIG.
Tape carrier package 535 and drive circuit board 5
24 are stored.

FIG. 23 shows the driving circuit board 52 shown in FIG.
FIG. 4 is a plan view of a liquid crystal display panel 503 mounted on the periphery.

As shown in FIG. 23, the drive circuit board 524
Is divided into three, and each drive circuit board (524a, 524b,
524c) are provided along the sides of the liquid crystal display panel 503, respectively, and each drive circuit board (524a, 524b,
524c) are electrically connected by a flat cable 536.

Each drive circuit board (524a, 524b, 5
24c) includes a tape carrier package (535a,
535b, 535c), electronic components such as resistors or capacitors are mounted, and each tape carrier package (53
5a, 535b, and 535c) include the liquid crystal display panel 50.
Chip (semiconductor chip) (537) for driving
a, 537b, 537c) are mounted by a tape automated bonding method (TAB).

The tape carrier package (535)
a, 535b) constitute each of the segment drivers (IC-U1 to Un, IC-L1 to Ln) shown in FIG. 18, and the tape carrier package 535c constitutes each of the common drivers (IC-C1 to Cn) shown in FIG. ).

In this case, the IC chip (5) mounted on the tape carrier package (535a, 535b)
37a and 537b), the circuits shown in FIG. 20 are arranged along the flow of signals (data), that is, the input-side bonding pads of the IC chip and the random logic circuit 5.
10, shift register circuit 511, bit latch circuit 5
12, a line latch circuit 513, a selector circuit 514,
An output buffer circuit 515 and an output-side bonding pad are provided in this order.

FIG. 24 is a sectional view of the tape carrier package 535a shown in FIG.

In FIG. 24, reference numeral 541 denotes an IC chip 53.
Reference numeral 542 denotes an input side wiring portion, and reference numeral 542 denotes an IC chip 537.
a, the input side bonding pad 543a of the IC chip 537a is provided at the tip (inner lead) inside the input side wiring portion 541, and the tip (inside) of the output side wiring portion 542. The output side bonding pad 543b is connected to the inner lead) by a so-called gang bonding method.

Here, the input wiring portion 541 and the output wiring portion 542 are made of, for example, copper (Cu).

Input side wiring section 541 and output side wiring section 5
42, the outer ends (outer leads)
Corresponding to the input and output of the C chip 537a, the terminal portion of the drive circuit board 524a is connected to the outer end of the input side wiring portion 541 by soldering or the like, and the outer end of the output side wiring portion 542. The terminal portion of the liquid crystal display panel 503 is connected to the portion by an anisotropic conductive film.

Reference numeral 544 denotes a base film made of, for example, polyimide or the like. The base film 544 is bonded to the input-side wiring portion 541 and the output-side wiring portion 542 with an adhesive 545.

Reference numeral 546 denotes a solder resist film for masking so that the solder does not stick to unnecessary portions during soldering, and reference numeral 547 denotes a thermosetting resin for protecting the IC chip 537a.

FIG. 25 is a schematic enlarged view showing the tape carrier package 535a shown in FIG. 23 in an enlarged manner.

In FIG. 25, for easy understanding, a thermosetting resin 5 for protecting the IC chip 537a is used.
47 shows a state where 47 has been removed.

As shown in FIG. 25, the output-side wiring portion 542 of the tape carrier package 535a has a pitch between terminal portions (segment electrode terminal portions) of the liquid crystal display panel 503 and the output-side bonding pad 5 of the IC chip 537a.
Since the pitch is different from the pitch of 43b, the wiring is oblique so that the pitch becomes narrower from the outer end portion having a wide pitch to the inner end portion having a narrow pitch.

This is a tape carrier package 535.
The same applies to the input-side wiring portion 541 a.

As described above, the tape carrier package 5
35a, the input wiring section 541 and the output wiring section 542
In order to adjust the pitch at each end of the input-side wiring portion 541 and the output-side wiring portion 542, the diagonal wiring portion (54
8a, 548b) were required.

[0057]

In recent years, in a liquid crystal display device such as a liquid crystal display module (LCM), the display screen has become larger and larger, and the display screen size tends to be larger. There is a demand for reducing the area other than the display area of the liquid crystal display device, that is, the frame portion, as much as possible, in order to eliminate the problem and aesthetic appearance as the display device.

In order to reduce the frame portion of the liquid crystal display module (LCM) shown in FIGS. 18 to 25, it is necessary to reduce the area around the display window of the upper frame 521 as shown in FIG. There is
In the liquid crystal display module (LCM) shown in FIGS. 8 to 25, the tape carrier package 535 and the drive circuit board 52 are provided in the area around the display window of the upper frame 521.
4 are stored.

Therefore, in order to reduce the upper and lower frame portions of the liquid crystal display module (LCM) shown in FIGS. 18 to 25, the tape carrier packages (535a, 53) accommodated in the upper and lower regions of the upper frame 521.
It is necessary to reduce the length (TCP width) in the direction of the wiring portion (input side wiring portion 541 and output side wiring portion 542) of 5b).

However, in the conventional tape carrier packages (535a, 535b), it is difficult to reduce the length in the wiring portion direction for the following reasons.

(1) Tape carrier package (535)
The terminal portions of the drive circuit board 524 and the liquid crystal display panel 503 are connected to the outer ends of the input-side wiring portion 541 and the output-side wiring portion 542 of the tape carrier package (535a). , 535
A predetermined length is required at the outer ends of the input-side wiring portion 541 and the output-side wiring portion 542 in b).

(2) Tape carrier package (535)
a, 535b), the input-side wiring portion 541 and the output-side wiring portion 542 have a diagonal wiring portion (548a, 548a, 548a) having a predetermined length in order to adjust the pitch at each end of the input-side wiring portion 541 and the output-side wiring portion 542. 548b) is required.

(3) The display screen size of the liquid crystal display device increases, and the tape carrier package (535a, 53
The pitch size of the outer end portion of the output side wiring portion 542 of FIG. 5b) is large (or the IC chip (537a, 537a)).
When the chip size of the tape carrier package (535a, 535b) becomes smaller (the pitch size of the tip inside the output-side wiring portion 542 of the tape carrier package (535a, 535b) becomes smaller), the output-side wiring portion 542 of the tape carrier package (535a, 535b) becomes smaller. Wiring length of the oblique wiring portion 548a (L
0) becomes large.

The present invention has been made to solve the above-mentioned problems of the prior art, and an object of the present invention is to provide a liquid crystal driving device that reduces the distance between input / output terminals and reduces the distance between the semiconductor chip and the periphery. It is an object of the present invention to provide a technique capable of preventing a protection film formed on a substrate from leaking to an input / output terminal region.

Another object of the present invention is to provide a technique that makes it possible to reduce a frame area other than a display area in a liquid crystal display device.

The above objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0067]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

(1) Provided around the liquid crystal display panel,
A liquid crystal driving device for outputting a signal line driving voltage to a signal line of the liquid crystal display panel, comprising: a semiconductor chip having a plurality of input terminals and a plurality of output terminals; an opening in a central portion; Parts are connected to a plurality of input terminals of the semiconductor chip, an outer end is connected to a plurality of terminals of the drive circuit board, a plurality of input side wirings, and an inner end is a plurality of output terminals of the semiconductor chip. And a film formed with a plurality of output-side wirings whose outer end portions are connected to a plurality of terminals of the liquid crystal display panel. A protective film formed on a surface of the semiconductor chip on which a plurality of input / output terminals are formed, wherein the protective film is disposed on the film so that a portion overlaps an edge of an opening of the film. Wherein said by providing the semiconductor chip and the inhibition means for inhibiting the protective film leaking from between the film when formed.

(2) In the means (1), the length of the overlap between the output side wiring formed on the film and the semiconductor chip is the same as the length of the input side wiring formed on the film and the semiconductor chip. It is characterized by being larger than the length.

(3) In the means of (2), the plurality of output terminals of the semiconductor chip are connected to a tip of the semiconductor chip on the liquid crystal display panel side and a tip of the semiconductor chip on the drive circuit board side. Are provided in a central region between the two.

(4) In the means of (2), the plurality of output terminals of the semiconductor chip are connected to a tip of the semiconductor chip on the liquid crystal display panel side and a tip of the semiconductor chip on the drive circuit board side. The semiconductor chip is provided on the drive circuit board side of the semiconductor chip from a central portion between the two.

(5) In the means (5), a plurality of input terminals and a plurality of output terminals of the semiconductor chip are provided on a straight line.

(6) In the means of (1) to (5), the suppressing means may be a liquid crystal of the semiconductor chip on a surface of the film opposite to a surface on which an input wiring or an output wiring is formed. The insulating tape is provided on at least one peripheral portion of the display panel side or the drive circuit board side.

(7) In the means of (1) to (5), the suppressing means may be a liquid crystal of the semiconductor chip on a surface of the film opposite to a surface on which an input wiring or an output wiring is formed. It is a solder resist film provided on at least one peripheral portion on the display panel side or the drive circuit board side.

(8) In the means of the above (1) to (5), the suppressing means may be provided on the liquid crystal display panel side or the drive circuit board side of the semiconductor chip on the side of the semiconductor chip overlapping the film. It is an aluminum wiring provided on at least one peripheral portion.

(9) In the above-mentioned means (1) to (5), the suppressing means may be provided on the side of the semiconductor chip overlapping with the film on the side of the liquid crystal display panel or the drive circuit board of the semiconductor chip. It is a LOCOS region provided on at least one peripheral portion.

(10) In the above-mentioned means (1) to (5), the suppressing means may be provided on a surface of the semiconductor chip overlapping with the film on a liquid crystal display panel side or a drive circuit board side of the semiconductor chip. It is a bump region provided on at least one peripheral portion.

(11) A liquid crystal display device is provided with the liquid crystal driving device of the means (1) to (9) and a liquid crystal display panel.

According to the means (1) to (10), the peripheral portion of the semiconductor chip is overlapped with the edge of the opening of the film, and the length of the overlap between the output side wiring formed on the film and the semiconductor chip is set. Is larger than the overlapping length of the input side wiring formed on the film and the semiconductor chip, that is, the distance from one end of the semiconductor chip to the plurality of output terminals of the semiconductor chip, the plurality of semiconductor chips from the other end of the semiconductor chip Since the distance to the input terminal is made larger, the distance between the input and output terminals of the liquid crystal driving device can be reduced.

When a protective film is formed on a surface of a semiconductor chip on which a plurality of input terminals and output terminals are provided, a means for suppressing the protective film leaking from between the semiconductor chip and the film is provided. So, the outer tip of the input side wiring and the output side wiring formed on the film,
It is possible to prevent poor connection between the drive circuit board and the terminal portion of the liquid crystal display panel.

According to the means (11), the frame area of the liquid crystal display device can be reduced.

[0082]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention applied to a simple matrix type liquid crystal display module of a color STN system will be described below with reference to the drawings.

In all the drawings for describing the embodiments of the present invention, components having the same functions are denoted by the same reference numerals, and their repeated description will be omitted.

[Embodiment 1] The schematic structure of a color STN type simple matrix liquid crystal display module (LCM) according to Embodiment 1 of the present invention is shown in FIG.
Since the configuration is the same as that of the conventional simple matrix type liquid crystal display module (LCM) of the color STN system shown in FIG.

The color ST according to the first embodiment of the present invention
N-type simple matrix liquid crystal display module (LC
The driving method of M) is not limited to the voltage averaging method.

FIG. 1 is an exploded perspective view showing components of a liquid crystal display panel used in a color STN type simple matrix type liquid crystal display module according to an embodiment of the present invention (Embodiment 1). FIG.
FIG. 2 is a sectional view of a main part of the liquid crystal display panel shown in FIG.

As shown in FIG. 1 or FIG. 2, in the liquid crystal display panel 100 according to the first embodiment of the present invention, a band-shaped transparent conductive film (ITO) is provided on the glass substrate 1 side with respect to the liquid crystal layer 10. ) Are formed, and a plurality of common electrodes (scanning signal lines) 14 made of a strip-shaped transparent conductive film (ITO) are formed on the glass substrate 2 side.

A plurality of segment electrodes 13 and an alignment film 7 are sequentially laminated inside the glass substrate 1 (the liquid crystal layer 10 side), and a color filter (4a) is disposed inside the glass substrate 2 (the liquid crystal layer 10 side). , 4b, 4c), a light-shielding film 3, a protective film 5, a plurality of common electrodes 14, and an alignment film 6 are sequentially stacked.

Further, outside the glass substrate 1, a polarizing plate 1
1 and a retardation plate 15 are formed, and a polarizing plate 12 is formed outside the glass substrate 2.

Reference numeral 25 in FIG. 2 denotes a region outside the glass substrate 1 where the polarizing plate 11 and the retardation plate 15 are formed.

The common electrode 14 and the segment electrode 13 are orthogonal to each other, and the intersection of the common electrode 14 and the segment electrode 13 forms one pixel.

The segment electrode 13 and the common electrode 14 extend to one end of the glass substrate 1 and the glass substrate 2, respectively, and are provided with terminal portions (23, 2) for electrically connecting to the segment driver and the common driver.
4) is formed.

Here, the segment electrode 13 is composed of segment electrodes (13a, 13b, 13c) for R (red), G (green), and B (blue), respectively.

The color filters (4a, 4b, 4)
c), the lattice-shaped light-shielding film 3 is formed so as to surround the common electrode 1.
4 and between the segment electrodes 13.

Further, as shown in FIG. 2, the liquid crystal layer 10 is filled with a spacer 8 for keeping the thickness of the liquid crystal layer 10 uniform.

The glass substrate 2, the light shielding film (3),
The color filters (4a, 4b, 4c), the protective film 5, the plurality of common electrodes 14, the alignment film 6, and the polarizing plate 12 constitute the common electrode substrate 110, and the glass substrate 1, the plurality of segment electrodes 13, the alignment Film 7, polarizing plate 11, retardation plate 1
5 constitutes the segment electrode substrate 120.

Liquid crystal display panel 1 according to Embodiment 1 of the present invention
00 is manufactured by the following steps.

(A) After the common electrode substrate 110 and the segment electrode 120 are separately manufactured, the sealing material 9 is formed around the common electrode substrate 100, and the spacer 8 is arranged inside the sealing material 9.

(B) The pattern surfaces of the common electrode substrate 110 and the segment electrode substrate 120 are aligned, and the outer surfaces of the common electrode substrate 110 and the segment electrode substrate 120 are heated while being pressurized to cure the sealing material 9 and The electrode substrate 110 and the segment electrode substrate 120 are bonded and sealed.

(C) The liquid crystal layer 10 is injected from the opening of the sealing material, and the opening is sealed with an epoxy resin or the like. Finally, the phase difference plate 15 and the polarizing plate are placed on the glass substrates (1, 2). The boards (14, 15) are attached.

FIG. 3 is a schematic sectional view of the periphery of the liquid crystal display module (LCM) according to the first embodiment of the present invention, and shows the side where the cold cathode tubes are arranged (the cold cathode tubes 528 in FIG. 22 are arranged). 2) shows a cross section of FIG.

Also in the simple matrix type liquid crystal display module according to the first embodiment of the present invention, like the conventional simple matrix type liquid crystal display module (LCM) shown in FIG. 18, the liquid crystal display panel 100 shown in FIG. 1 or FIG. A drive circuit board is mounted around the device.

This drive circuit board is divided into three parts, each of which is provided along the side of the liquid crystal display panel 100, and each drive circuit board is electrically connected by a flat cable (not shown).

Electronic components such as a tape carrier package, a resistor or a capacitor are mounted on each drive circuit board, and the liquid crystal display panel 1 is mounted on the tape carrier package.
00 is mounted by a tape automated bonding (TAB) method.

FIG. 3 shows only the drive circuit board 204 and the tape carrier package 300 provided above (or below) the liquid crystal display panel. The tape carrier package 300 has an IC chip 301 mounted thereon. You.

The simple matrix type liquid crystal display module according to the first embodiment of the present invention has a drive circuit board 204 and a remaining portion on a backlight similarly to the conventional simple matrix type liquid crystal display module (LCM) shown in FIG. The liquid crystal display panel 100 shown in FIG. 1 or FIG. 2 on which two drive circuit boards are mounted is mounted.
A silicon spacer (not shown), a bar spacer (not shown), and an upper frame 201 having a display window are superimposed, and a lower frame 212 is provided with claws provided on the upper frame 201.
Assembled by sandwiching

Further, like the conventional simple matrix type liquid crystal display module (LCM) shown in FIG.
08, the light from the cold cathode tube 208 is
Light guide plate assembly 207, light guide plate assembly 20
A prism sheet 206 for condensing light from 7, and
The lower frame 212 in which the white paint is applied to the metal plate,
A mold 205 formed in a frame shape in the order shown in FIG.
Into the window.

Further, around the cold cathode tube 208, a silver reflection sheet 20 for condensing light emitted in a direction different from that of the light guide plate assembly 207 to the light guide plate assembly 207 without waste is provided.
9 are arranged.

Here, the light guide plate assembly 207 includes a light guide plate 251 made of an acrylic plate, a reflection sheet 252 and a diffusion sheet 253 formed on both sides of the light guide plate, and includes a mold 205, a prism sheet 206, and a cold cathode. The tube 208, the silver reflection sheet 209, the light guide plate assembly 207, and the lower frame 212 constitute a backlight.

Reference numeral 210 shown in FIG. 3 is a double-sided tape for bonding the silver reflection sheet 209 and the light guide plate assembly 207.

FIG. 4 is a schematic plan view of the tape carrier package 300 according to the first embodiment of the present invention, and FIG. 5 is a schematic sectional view of the tape carrier package 300 according to the first embodiment of the present invention. .

The tape carrier package 300 according to the first embodiment of the present invention includes the segment drivers (IC-U1 to Un, IC-L) shown in FIG. 20 (or FIG. 18).
1 to Ln).

4 and 5, reference numeral 302 denotes an input side wiring portion of the IC chip 301, and reference numeral 303 denotes an IC chip 30.
1 is an output side wiring section.

An input side bonding pad 304a of the IC chip 301 is provided at an inner end (inner lead) of the input side wiring section 302, and an output side bonding pad is provided at an inner side end of the output side wiring section 303. 304b is connected by a so-called gang bonding method.

Here, the input wiring 302 and the output wiring 303 are made of, for example, copper (Cu).

At the outer end of the input side wiring portion 302,
The terminal portion of the drive circuit board is connected by soldering or the like, and the terminal portion 23 of the liquid crystal display panel 100 is connected to the outer end of the output side wiring portion 303 by an anisotropic conductive film.

Here, as shown in FIG. 4, the input-side wiring section 302 and the output-side wiring section 303 are connected to the input-side wiring section 3.
Diagonal wiring portions (309a, 309b) are provided in order to match the pitch at each end of the output wiring portion 303 and the output wiring portion 303.

Reference numeral 305 denotes, for example, a base film made of polyimide or the like provided with an opening 307, and the base film 305 is bonded to the input-side wiring portion 302 and the output-side wiring portion 303 with an adhesive. .

Reference numeral 308 denotes a thermosetting resin (resin) for protecting the IC chip 301.

Note that this thermosetting resin (resin) 308
Are omitted in FIG.

As shown in FIG. 4, Embodiment 1 of the present invention
In the tape carrier package 300 of FIG.
01 is made to overlap with the edge of the opening 307 of the base film 305 at the periphery thereof, and the output side bonding pad 304b of the IC chip 301 is connected to the wiring portion (input side wiring portion 302) of the carrier package 300.
And the output side wiring section 303) in the center in the wiring direction.

That is, in the tape carrier package 300 according to the first embodiment of the present invention, the length (L3) at which the peripheral portion of the IC chip 301 on the liquid crystal display panel 100 side overlaps the edge of the opening 307 of the base film 305 is set as follows. IC chip 3
01 is larger than the length of the periphery of the opening 307 of the base film 305 overlapping the edge of the opening 307 of the base film 305 so that the IC chip 301 side of the liquid crystal display panel 100 (the output side wiring section 303 of the tape carrier package 300). The distance (L1) from the end on the outer tip side) to the output-side bonding pad 304b of the IC chip 301 is
The distance (L2) from the end of the chip 301 on the side of the drive circuit board 204 (the end on the outer side of the input side wiring portion 302 of the tape carrier package 300) to the input side bonding pad 304a of the IC chip 301 is made larger.

FIG. 6 shows an IC chip 301 mounted on the tape carrier package 300 according to the first embodiment of the present invention.
FIG. 2 is a diagram showing the schematic internal circuit configuration of FIG. 1 together with the wiring pattern of the tape carrier package 300 according to the first embodiment of the present invention.

As shown in FIG. 6, Embodiment 1 of the present invention
The internal circuit of the IC chip 301 mounted on the tape carrier package 300 is not provided along the flow of signals (data). As shown in FIG. 6, a random logic circuit 310, an input side bonding pad 304a,
Shift register circuit / bit latch circuit 311, output side bonding pad 304b, output buffer circuit 31
2. Line latch circuits / selector circuits 313 are provided in this order.

Here, the wiring routing of the oblique wiring portion 309b of the output side wiring portion 303 of the tape carrier package 300 is considered in consideration of the disconnection of the wiring pattern of the output side wiring portion 303 during etching and the short circuit of the adjacent wiring pattern. Long (L
0) is represented by the following equations (1) and (2).

[0126]

L0 = (OL / 2−１ ／) × (OLP−OPP) tan (θ) ‥ (1)

[0127]

Θ = sin ~ ¹ (RP / OLP) ‥‥‥‥‥ (2) where, OL: number of output side wiring parts 303 OLP: outside end part (outer lead) of output side wiring part 303 Pitch OPP; Pitch of output-side bonding pad 304b of IC chip 301; RP; Wiring pitch of diagonal wiring portion 309b As can be understood from the above equations (1) and (2), a liquid crystal display device such as a simple matrix type liquid crystal display module is used. When the display screen size increases, the tape carrier package 3
The pitch size of the outer end portion of the output-side wiring portion 303 of the tape carrier package 300 becomes large, and the wiring routing length (L0) of the oblique wiring portion 309b of the output-side wiring portion 303 of the tape carrier package 300 increases.

This is the same even when the chip size of the IC chip 301 is reduced and the pitch size of the tip inside the output side wiring section 303 of the tape carrier package 300 is reduced.

However, in the tape carrier package 300 according to the first embodiment of the present invention, the IC chip 301
Is provided at the center of the wiring portion of the tape carrier package 300 in the wiring direction, so that the output-side bonding pad 304b of the IC chip 301 extends from the end of the IC chip 301 on the liquid crystal display panel 100 side. Distance (L1) can be increased.

Thus, the tape carrier package 3
00, the oblique wiring portion 309b of the output side wiring portion 303 is an IC.
Since it can be provided at a position overlapping with the chip 301,
The width of the tape carrier package 300 in the wiring portion direction can be reduced (TCP width; L10).

Therefore, by using the tape carrier package 300 according to the first embodiment of the present invention, it is possible to reduce the width of the upper and lower frame regions of the liquid crystal display module (LCM).

When forming the inner end of the input-side wiring portion 302 and the inner end of the output-side wiring portion 303 of the tape carrier package 300 by etching, a predetermined etching space is provided between the respective end portions. Necessary, the input side bonding pad 3 of the IC chip 301
A predetermined interval is required between the first bonding pad 04a and the output-side bonding pad 304b.

However, in the tape carrier package 300 according to the first embodiment of the present invention, the IC chip 301
The shift register circuit / bit latch circuit 311 is arranged between the input side bonding pad 304a and the output side bonding pad 304b of the IC.
By effectively utilizing the chip 301, the width of the IC chip 301 in the wiring portion direction of the tape carrier package 300 can be reduced.

[Second Embodiment of the Invention] The simple matrix type liquid crystal display module of the color STN system according to the second embodiment of the present invention has a structure of an IC chip mounted on a tape carrier package. This is different from the simple matrix type liquid crystal display module of Embodiment 1.

FIG. 7 shows an IC chip 321 mounted on a tape carrier package 320 according to the second embodiment of the present invention.
FIG. 9 is a diagram showing the schematic internal circuit configuration of FIG. 7 together with the wiring pattern of the tape carrier package 320 according to the second embodiment of the present invention.

A tape carrier package 320 shown in FIG. 7 is a tape carrier package provided above (or below) a liquid crystal display panel.

Also in the tape carrier package 320 according to the second embodiment of the present invention, the IC chip 321 is made to overlap the edge of the opening of the base film 305 at the peripheral portion, and as shown in FIG. Chip 321
Of the wiring portion of the tape carrier package 320 from the center in the wiring direction.
It is provided on the drive circuit board 204 side of the C chip 321 (on the front end side outside the input side wiring section 302 of the tape carrier package 320) and close to the input side bonding pad 304a of the IC chip 321.

In addition, an IC mounted on the tape carrier package 320 according to the second embodiment of the present invention accordingly.
The internal circuit of the chip 321 is not provided along the flow of the signal (data), and as shown in FIG.
a, output-side bonding pad 304b, output buffer circuit 312, line latch circuit / selector circuit 313,
The shift register circuit and the bit latch circuit 311 are provided in this order.

Also in the tape carrier package 320 according to the second embodiment of the present invention, the distance (L1) from the end of the IC chip 321 on the liquid crystal display panel 100 side to the output side bonding pad 304b of the IC chip 321 is I.
From the end of the C chip 321 on the drive circuit board 204 side, IC
The distance (L2) to the input side bonding pad 304a of the chip 321 is set to be larger than the distance (L2).

As a result, the tape carrier package 3
The diagonal wiring part 309b of the output side wiring part 303 of the IC 20
Since it can be provided at a position overlapping with the chip 321,
The width (TCP width; L10) of the tape carrier package 320 in the wiring portion direction can be reduced.

Therefore, by using the tape carrier package 320 according to the second embodiment of the present invention, it is possible to reduce the width of the upper and lower outer frame regions of the liquid crystal display module (LCM).

[Third Embodiment of the Invention] The simple matrix type liquid crystal display module of the color STN mode according to the third embodiment of the present invention has a structure of an IC chip mounted on a tape carrier package. This is different from the simple matrix type liquid crystal display module of Embodiment 1.

FIG. 8 shows an IC chip 331 mounted on a tape carrier package 330 according to the third embodiment of the present invention.
FIG. 11 is a diagram showing the schematic internal circuit configuration of FIG. 10 together with the wiring pattern of the tape carrier package 330 according to the third embodiment of the present invention.

A tape carrier package 330 shown in FIG. 8 is a tape carrier package provided above (or below) the liquid crystal display panel.

Also in the tape carrier package 330 according to the third embodiment of the present invention, the IC chip 331 is made to overlap the edge of the opening of the base film 305 at the peripheral portion, and as shown in FIG. Chip 331
Of the tape carrier package 330 from the center in the wiring direction.
On the drive circuit board 204 side of the C chip 331 (on the front end side outside the input side wiring portion 302 of the tape carrier package 330), the C chip 331 is provided at the same position as the input side bonding pad 304a of the IC chip 331.

In addition, an IC mounted on the tape carrier package 330 according to the third embodiment of the present invention accordingly.
The internal circuits of the chip 331 are not arranged in accordance with the flow of signals (data), but as shown in FIG. 8, a random logic circuit 310, an input side bonding pad 304a and an output side bonding pad 304b, an output buffer circuit 312, a line The latch circuit / selector circuit 313 and the shift register circuit / bit latch circuit 311 are provided in this order.

Also in the tape carrier package 330 according to the third embodiment of the present invention, the distance (L1) from the end of the IC chip 331 on the liquid crystal display panel 100 side to the output side bonding pad 304b of the IC chip 331 is I.
From the end on the drive circuit board 204 side of the C chip 331, the IC
The distance (L2) to the input side bonding pad 304a of the chip 331 is set to be larger.

As a result, the tape carrier package 3
The oblique wiring portion 309b of the output side wiring portion 303 of the IC 30
Since it can be provided at a position overlapping with the chip 331,
The width of the tape carrier package 330 in the wiring direction (T
CP width; L10) can be reduced.

Therefore, by using the tape carrier package 330 according to the third embodiment of the present invention, the width of the frame area other than the display area of the liquid crystal display module (LCM) can be reduced.

In the tape carrier package 330 according to the third embodiment of the present invention, no space is required for installing the output-side bonding pad 304b.
The width of the C chip 331 can be reduced, and by using the tape carrier package 330 according to the third embodiment of the present invention, the width of the frame region other than the display region of the liquid crystal display module (LCM) can be further reduced. .

[Fourth Embodiment of the Invention] A simple matrix type liquid crystal display module of a color STN system according to a fourth embodiment of the present invention has a structure of an IC chip mounted on a tape carrier package. This is different from the simple matrix type liquid crystal display module of Embodiment 1.

In the tape carrier package according to each of the embodiments of the present invention, the number of output terminals (the output side wiring portion 30 connected to the terminal portion 23 of the liquid crystal display panel 100) is originally required.
3, the number of input terminals (the drive circuit board 204).
(The number of input-side wiring portions 302 connected to the terminal portions of the above) can be reduced.

FIG. 9 is a diagram for explaining NC pins and dummy input-side bonding pads in a conventional tape carrier package. FIG. 10 is a diagram showing input signals in an IC chip mounted on a conventional tape carrier package. It is principal part sectional drawing of a side bonding pad area | region.

As shown in FIG. 9, in the conventional tape carrier package, the input side of the tape carrier package is required to ensure uniformity at the time of bonding at the tip inside the output side wiring section and the input side wiring section. N in the wiring section
C pin (empty pin or dummy pin) 412 is provided,
Further, a dummy input-side bonding pad 414a is provided on the IC chip 401.

9 and 10, reference numeral 413 denotes an input-side wiring portion (hereinafter, referred to as an active pin) connected to the terminal portion 204 of the drive circuit board in the input-side wiring portion.

In this case, as shown in FIG. 10, in the conventional IC chip 401, the protection diode 420 is provided on the input side bonding pad 404a to which the active pin 413 is connected. No protection diode is provided on the dummy input side bonding pad 414a to which the dummy input side bonding pad 414a is connected.
On top of

Therefore, as shown in FIG. 10, the NC pin 412 or the dummy input side bonding pad 41
When static electricity is applied to 4a and the LOCOS region 421 causes dielectric breakdown due to the static electricity, the static electricity is
It flows into the IC chip 401 through the S region 421,
The chip 401 was sometimes broken.

In FIG. 10, the protection diode 420
Are formed in the P-well and in the N-well.

FIG. 11 is a diagram for explaining NC pins and dummy input-side bonding pads in the tape carrier package according to the fourth embodiment of the present invention.

Also in the tape carrier package according to the fourth embodiment of the present invention, the input of the tape carrier package is ensured in order to ensure the uniformity at the time of bonding of the inner ends of the output side wiring section 303 and the input side wiring section 302. An NC pin 352 is provided on the side wiring portion 302, and a dummy input side bonding pad 354a is provided on the IC chip 351.
Is provided.

However, as shown in FIG. 11, in the tape carrier package according to the fourth embodiment of the present invention, the active pin (the input side wiring connected to the terminal section 204 of the drive circuit board in the input side wiring section 302) is used. Part) 353,
The NC pin 352 is connected.

In this case, since a protection diode is provided on the input side bonding pad 304a to which the active pin 353 is connected, even when static electricity is applied to the NC pin 352 or the dummy input side bonding pad 354a, The static electricity is discharged to the reference potential (power supply potential (VCC) or ground potential (GND)) via the protection diode provided on the input side bonding pad 304a to which the active pin 353 is connected. Will not cause dielectric breakdown.

In FIG. 11, the NC pins 352 are connected to the active pins 353 in the input side wiring section 302 of the tape carrier package.
Within the 51, the NC pin 352 may be connected to the active pin 353.

FIG. 12 is a cross-sectional view of a main part of an input-side bonding pad region of an example of an IC chip 351 mounted on a tape carrier package according to the fourth embodiment of the present invention. FIG. 9 is a diagram showing an example of an IC chip 351 connected to an active pin 353.

As shown in FIG. 12, a protection diode 360 is provided on the input side bonding pad 304a to which the active pin 353 of the IC chip 351 is connected.

A dummy input-side bonding pad 354a to which the NC pin 352 is connected is provided on the LOCOS region 361. The dummy input-side bonding pad 354a is connected to the aluminum (Al) wiring layer 3
62, the active pin 353 of the IC chip 351
Are connected to the input-side bonding pad 304a to be connected.

In the IC chip 351 shown in FIG. 12, even if static electricity is applied to the NC pin 352 or the dummy input-side bonding pad 354a, the static electricity is provided to the input-side bonding pad 304a to which the active pin 353 is connected. Protection diode 3
Through 60, the discharge is made to a reference potential (power supply potential (VCC) or ground potential (GND)).

It should be noted that in FIG.
Two cases are shown, i.e., the case where 60 is formed in a P well and the case where 60 is formed in an N well.

The configuration of the output-side bonding pad 304b of the IC chip 351 mounted on the tape carrier package according to the fourth embodiment of the present invention is the same as that of the output-side bonding pad of the IC chip of each of the above-described embodiments. Configurations can be employed.

[Embodiment 5] The simple matrix type liquid crystal display module of the color STN mode according to the fifth embodiment of the present invention has a tape carrier package having the simple matrix according to the first embodiment of the present invention. This is different from the liquid crystal display module.

FIG. 13 is a diagram showing the surface of the tape carrier package according to the first embodiment on the side where the wiring portion is formed.

As shown in FIG. 13 or FIG. 5, in the tape carrier package according to the first embodiment of the present invention, a thermosetting resin (resin) 308 for protecting the IC chip is provided around the IC chip 301. .

The thermosetting resin 308 is used to connect the tip inside the input wiring 302 and the tip inside the output wiring 303 to the input bonding pads 304a and the output bonding pads 304b of the IC chip 301.
Then, a thermosetting resin 308 is applied on the surface of the IC chip 301 on the side where the bonding pads (304a, 304b) are provided, and is heated and cured.

The thermosetting resin 30 shown in FIG. 13 or FIG.
8 is formed, the thermosetting resin 308 that leaks out from between the base film 305 and the IC chip 301 is formed on the surface of the base film 305 opposite to the surface on which the wiring portion is formed. In some cases, the resin leaked to a region facing the outer tip and was hardened.

If the outer end of the output side wiring section 303 and the terminal section 23 of the liquid crystal display panel 100 are connected by an anisotropic conductive film, the base film 3
The pressing and heating are performed by applying a jig to a region on the surface opposite to the surface on which the wiring portion of No. 05 is formed and facing the outer end of the output side wiring portion 303.

Therefore, the output-side wiring portion 3 is formed on the surface of the base film 305 opposite to the surface on which the wiring portion is formed.
03, a thermosetting resin 3
When 08 is formed, the jig cannot be normally applied to the base film 305 when connecting the outer end portion of the output side wiring portion 303 and the terminal portion 23 of the liquid crystal display panel 100, In addition to the poor connection between the outer end of the output side wiring portion 303 and the terminal portion 23 of the liquid crystal display panel 100, in some cases, the IC chip 30
One could be destroyed.

Therefore, in the tape carrier package 370 according to the fifth embodiment of the present invention, a means for suppressing the amount of the thermosetting resin leaking from between the base film 305 and the IC chip 371 is provided. However, on the surface of the base film 305 opposite to the surface on which the wiring portion is formed, the leakage is prevented from reaching the region facing the front end portion outside the output-side wiring portion 303.

FIGS. 14 to 17 are schematic sectional views showing an example of the restraining means in the tape carrier package 370 according to the fifth embodiment of the present invention. FIG. Sectional view taken along line ', (b) in each figure
FIG. 14 is a sectional view showing a part of a section taken along line BB ′ shown in FIG. 13.

A tape carrier package 3 shown in FIG.
At 70, an insulating tape 381 is attached to the surface of the base film 305 opposite to the surface on which the wiring portion is formed, and to a region corresponding to the peripheral portion of the IC chip 371 on the liquid crystal display panel 100 side. The amount of the thermosetting resin leaking from between the film 305 and the IC chip 371 is reduced so that the thermosetting resin 308 is provided on the output film on the surface opposite to the surface on which the wiring portion of the base film 305 is formed. 30
3 so as not to leak to the region facing the outer end.

Thus, in the tape carrier package 370 shown in FIG. 14, it is possible to prevent poor connection between the outer end of the output side wiring section 303 and the connection terminal section 23 of the liquid crystal display panel 100.

Also, on the surface of the base film 305 opposite to the surface on which the wiring portion is formed, and on the IC chip 371
An insulating tape 381 is attached to a region corresponding to the peripheral portion on the side of the drive circuit board 204, and the thermosetting resin 308 is applied to the input-side wiring on the surface of the base film 305 opposite to the surface on which the wiring portion is formed. It may be configured not to leak to a region facing the outer end of the portion 302.

In this case, it is possible to prevent poor connection between the outer end of the input side wiring portion 302 and the drive circuit board 204.

The tape carrier package 3 shown in FIG.
In 70, a solder resist film 382 is formed on the surface of the base film 305 opposite to the surface on which the wiring portion is formed, and in a region where the IC chip 371 does not overlap the IC chip 371 on the liquid crystal display panel 100 side. By reducing the amount of the thermosetting resin leaking from between the base film 305 and the IC chip 371, the thermosetting resin 308 is placed on the output side on the surface opposite to the surface of the base film 305 on which the wiring portion is formed. This is to prevent leakage to the region facing the front end outside the wiring portion 303.

Thus, even in the tape carrier package 370 shown in FIG. 15, it is possible to prevent a poor connection between the outer end of the output side wiring portion 303 and the connection terminal portion 23 of the liquid crystal display panel 100.

The IC chip 371 is provided on the surface of the base film 305 opposite to the surface on which the wiring portion is formed.
A solder resist film 382 is formed in a region not overlapping with the IC chip 371 on the side of the drive circuit board 204, and the thermosetting resin 308 is applied on the surface of the base film 305 opposite to the surface on which the wiring portion is formed. It may be configured not to leak to a region facing the outer end portion of the side wiring portion 302.

In this case, it is possible to prevent poor connection between the outer end of the input side wiring portion 302 and the drive circuit board 204.

A tape carrier package 3 shown in FIG.
In 70, a LOCOS region or aluminum (Al) wiring 383 is formed on the surface of the IC chip 371 on the side overlapping with the base film 305 and in the peripheral region of the IC chip 371 on the liquid crystal display panel 100 side. The amount of the thermosetting resin leaking from between the film 305 and the IC chip 371 is reduced so that the thermosetting resin 308 is provided on the output film on the surface opposite to the surface on which the wiring portion of the base film 305 is formed. The structure prevents leakage to the region facing the front end outside 303.

Thus, in the tape carrier package 370 shown in FIG. 16 as well, it is possible to prevent poor connection between the outer end of the output side wiring section 303 and the connection terminal section 23 of the liquid crystal display panel 100.

Further, a LOCOS region or aluminum (Al) wiring 383 is formed on the surface of the IC chip 371 on the side overlapping with the base film 305 and on the peripheral portion of the IC chip 371 on the side of the drive circuit board 204. The curable resin 308 may be prevented from leaking to a region on the surface of the base film 305 opposite to the surface on which the wiring portion is formed and facing the outer end of the input-side wiring portion 302.

In this case, it is possible to prevent poor connection between the outer end portion of the input side wiring portion 302 and the drive circuit board 204.

Tape carrier package 3 shown in FIG.
In 70, for example, a gold (Au) bump region 384 is formed on the surface of the IC chip 371 on the side overlapping the base film 305 and on the periphery of the IC chip 371 on the liquid crystal display panel 100 side. The amount of the thermosetting resin that leaks out from between the IC chip 371 and the thermosetting resin 308 is reduced, and the thermosetting resin 308 is placed on the surface of the base film 305 opposite to the surface on which the wiring portion is formed.
3 so as not to leak to the region facing the outer end.

As a result, in the tape carrier package 370 shown in FIG. 17, it is also possible to prevent poor connection between the outer end of the output side wiring section 303 and the connection terminal section 23 of the liquid crystal display panel 100.

Further, on the surface of the IC chip 371 on the side overlapping with the base film 305 and on the peripheral portion of the IC chip 371 on the drive circuit board 204 side, for example, gold (Au)
The bump region 384 is formed, and the thermosetting resin 308 does not leak out to a region on the surface of the base film 305 opposite to the surface on which the wiring portion is formed and facing the outer end of the input-side wiring portion 302. You may do so.

In this case, it is possible to prevent poor connection between the outer end of the input side wiring portion 302 and the drive circuit board 204.

Note that, in the tape carrier package 370 shown in FIGS.
2 and the length of the inner end of the output side wiring section 303 (the inner lead length; L4) is reduced, the inner side end of the input side wiring section 302 and the inner side end of the output side wiring section 303 and I
When connecting the input side bonding pad 304a and the output side bonding pad 304b of the C chip 371 by the gang bonding method, the input side wiring portion 302
Since the inner end of the output side wiring section 303 is disconnected, the input side wiring section 302 and the output side wiring section 30 are disconnected.
The length of the tip portion inside 3 needs to be at least 260 μm or more.

Further, in FIGS. 14 to 17, 37
Reference numeral 7 denotes a solder resist film for masking the solder so that the solder does not stick to unnecessary portions.

Further, the suppressing means for suppressing the amount of the thermosetting resin leaking from between the base film 305 and the IC chip 371 according to the fifth embodiment of the present invention is applied to the tape carrier package according to each of the above embodiments. It goes without saying that it is possible.

Further, in the embodiment of the present invention, the case where the present invention is applied to an STN type simple matrix type liquid crystal display panel has been described. However, the present invention is not limited to this. It is needless to say that the present invention can be applied to the active type liquid crystal display panel.

As described above, the invention made by the present inventors is described below.
Although specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the present invention, and it is needless to say that various modifications can be made without departing from the gist of the present invention. .

[0200]

The effects obtained by the representative ones of the inventions disclosed in the present application will be briefly described as follows.

(1) According to the present invention, the peripheral portion of the semiconductor chip is overlapped with the edge of the opening of the film, and the distance from one end of the semiconductor chip to the plurality of output terminals of the semiconductor chip is set to the other value. Since the distance is larger than the distance from the end to the plurality of input terminals of the semiconductor chip, the distance between the input / output terminals of the liquid crystal driving device can be reduced.

(2) According to the present invention, when the protection film is formed, the suppression means for suppressing the protection film leaking from between the semiconductor chip and the film is provided, so that the input side formed on the film is provided. It is possible to prevent poor connection between the outer ends of the wiring and the output-side wiring, and the terminals of the drive circuit board and the liquid crystal display panel.

(3) According to the present invention, the frame area of the liquid crystal display device can be made smaller than before.

[Brief description of the drawings]

FIG. 1 is a color STN (Super Twisted) according to an embodiment of the present invention (Embodiment 1).
FIG. 3 is an exploded perspective view showing components of a liquid crystal display panel used in a (d Nematic) type simple matrix type liquid crystal display module.

FIG. 2 is a sectional view of a main part of the liquid crystal display panel shown in FIG.

FIG. 3 is a schematic sectional view of a peripheral portion of the liquid crystal display module (LCM) according to the first embodiment of the present invention.

FIG. 4 is a schematic plan view of the tape carrier package 300 according to the first embodiment of the present invention.

FIG. 5 is a schematic sectional view of the tape carrier package 300 according to the first embodiment of the present invention.

FIG. 6 shows a schematic internal circuit configuration of an IC chip 301 mounted on the tape carrier package 300 according to the first embodiment of the present invention and a wiring pattern of the tape carrier package 300 according to the first embodiment of the present invention. FIG.

FIG. 7 shows a schematic internal circuit configuration of an IC chip 321 mounted on the tape carrier package 320 according to the second embodiment of the present invention and a wiring pattern of the tape carrier package 320 according to the second embodiment of the present invention. FIG.

FIG. 8 shows a schematic internal circuit configuration of an IC chip 331 mounted on a tape carrier package 330 according to the third embodiment of the present invention and a wiring pattern of the tape carrier package 330 according to the third embodiment of the present invention. FIG.

FIG. 9 shows an NC in a conventional tape carrier package.
FIG. 3 is a diagram for explaining pins and dummy input-side bonding pads.

FIG. 10 is a cross-sectional view of a main part of an input-side bonding pad region in an IC chip mounted on a conventional tape carrier package.

FIG. 11 is a diagram for explaining NC pins and dummy input-side bonding pads in a tape carrier package according to a fourth embodiment of the present invention.

FIG. 12 is a cross-sectional view of a main part of an input-side bonding pad region of an example of an IC chip 351 mounted on a tape carrier package according to a fourth embodiment of the present invention.

FIG. 13 is a diagram illustrating a surface of the tape carrier package according to the first embodiment of the present invention on which a wiring portion is formed;

FIG. 14 is a schematic cross-sectional view illustrating an example of a suppressing unit in a tape carrier package 370 according to a fifth embodiment of the present invention.

FIG. 15 is a schematic cross-sectional view illustrating an example of a suppressing unit in a tape carrier package 370 according to a fifth embodiment of the present invention.

FIG. 16 is a schematic cross-sectional view illustrating an example of a suppressing unit in a tape carrier package 370 according to a fifth embodiment of the present invention.

FIG. 17 is a schematic cross-sectional view illustrating an example of a suppressing unit in a tape carrier package 370 according to the fifth embodiment of the present invention.

FIG. 18 is a block diagram illustrating a schematic configuration of a conventional color STN type simple matrix liquid crystal display module (LCM), which is one of the simple matrix liquid crystal display devices.

19 is a diagram showing a display control device 501 shown in FIG. 18 in which each segment driver (IC-U1 to Un, IC-L1 to L
n) and each common driver (IC-C1 to Cn)
FIG. 2 is a diagram showing a display data (Din) transmitted to the CPU and timing charts of display control signals (clocks (CL1, CL2), a frame signal (FLM), and an alternating signal (M)).

FIG. 20 is a diagram illustrating each segment driver (IC-
FIG. 2 is a block diagram showing a schematic circuit configuration of U1 to Un, IC-L1 to Ln).

21 illustrates a data signal line driving voltage applied to a segment electrode of the liquid crystal display panel 503 illustrated in FIG. 12, and
FIG. 4 is a diagram for explaining an example of a scanning signal line driving voltage applied to a common electrode.

FIG. 22 is an exploded perspective view showing components of the simple matrix type liquid crystal display module (LCM) shown in FIG.

23 is a plan view of the liquid crystal display panel 503 around which the drive circuit board 524 shown in FIG. 22 is mounted.

24 is a tape carrier package 53 shown in FIG.
It is sectional drawing of 5a.

FIG. 25 is a tape carrier package 53 shown in FIG.
It is a schematic enlarged view which expands and shows 5a.

[Explanation of symbols]

1, 2, glass substrate, 3 light-shielding film, 4a, 4b, 4c
R (red), G (green), B (blue) color filters, 5: protective film, 6, 7: alignment film, 8: spacer, 9:
Sealing material, 10: liquid crystal layer, 11, 12: polarizing plate, 13,
13a, 13b, 13c: segment electrode, 14: common electrode, 15: retardation plate, 23, 24: terminal section, 10
0, 503: liquid crystal display panel, 110: common electrode substrate, 120: segment electrode substrate, 201, 521: upper frame, 204, 524, 524a, 524b, 5
24c: drive circuit board, 205, 525: mold, 2
06,526: prism sheet, 207, 527: light guide plate assembly, 208, 528: cold cathode tube, 209, 252
... Silver reflection sheet, 210 ... Double-sided tape, 212,532
... lower frame, 251 ... light guide plate, 252 ... reflection sheet, 253 ... diffusion sheet, 300, 320, 330, 3
70, 535, 535a, 535b, 535c: Tape carrier package, 301, 321, 331, 35
1,371,401,537a, 537b, 537c ...
IC chip (semiconductor chip), 302, 541... Input side wiring section, 303, 542... Output side wiring section, 304a, 5
43a: Input side bonding pad, 304b, 543
b: output side bonding pad, 305, 544: base film, 307: opening, 308, 547: thermosetting resin (resin), 309a, 309b, 548a, 5
48b: diagonal wiring section, 310, 510: random logic circuit, 311: shift register circuit / bit latch circuit, 312, 515: output buffer circuit, 313: line latch circuit / selector circuit, 352, 412: NC pin (empty pin) Or dummy pins), 353, 413 ...
Active pins, 354a, 414a: Dummy input side bonding pads, 360, 420: Protective diodes, 361, 421: LOCOS region, 362: Aluminum (Al) wiring layer, 377, 546, 382: Solder resist film, 381: Insulation Tape, 383 ... LOCO
S region or aluminum (Al) wiring, 384: bump region, 501: display control device, 502: power supply circuit,
511: shift register circuit, 512: bit latch circuit, 513: line latch circuit, 514: selector circuit, 522: silicon spacer, 532: rod spacer,
530: rubber bush, 536: flat cable, 5
45 ... Adhesive.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Shinji Yasukawa 3681 Hayano, Mobara-shi, Chiba Hitachi Device Engineering Co., Ltd. (72) Inventor Akira Ogura 3681 Hayano, Mobara-shi, Chiba Prefecture Hitachi Device Engineering Co., Ltd. (72) Inventor Hiroyuki Takahashi 3300 Hayano, Mobara City, Chiba Prefecture, Hitachi, Ltd.Electronic Device Division

Claims (11)

[Claims] 1. A liquid crystal driving device provided around a liquid crystal display panel and outputting a signal line driving voltage to a signal line of the liquid crystal display panel, the semiconductor chip having a plurality of input terminals and a plurality of output terminals. A plurality of input-side wires having an opening in the center, an inner tip connected to a plurality of input terminals of the semiconductor chip, and an outer tip connected to a plurality of terminals of the drive circuit board; A film formed with a plurality of output-side wirings having an inner tip connected to a plurality of output terminals of the semiconductor chip and an outer tip connected to a plurality of terminals of the liquid crystal display panel. In the driving device, the semiconductor chip is disposed on the film such that a peripheral portion of the semiconductor chip overlaps an edge of an opening of the film, and a plurality of input / output terminals of the semiconductor chip are formed. A protective film formed on the surface to be formed;
A liquid crystal driving device, further comprising: suppression means for suppressing a protection film leaking from between the semiconductor chip and the film when forming the protection film. 2. The semiconductor device according to claim 1, wherein an overlapping length of the output side wiring formed on the film and the semiconductor chip is larger than a overlapping length of the input side wiring formed on the film and the semiconductor chip. Item 2. A liquid crystal driving device according to item 1. 3. A plurality of output terminals of the semiconductor chip,
3. The liquid crystal driving device according to claim 2, wherein the liquid crystal driving device is provided in a central region between a front end portion of the semiconductor chip on the liquid crystal display panel side and a front end portion of the semiconductor chip on the drive circuit board side. . 4. A plurality of output terminals of the semiconductor chip,
The semiconductor chip is provided on the drive circuit board side of the semiconductor chip from a central portion between the tip of the semiconductor chip on the liquid crystal display panel side and the tip of the semiconductor chip on the drive circuit board side. The liquid crystal driving device according to claim 2. 5. The liquid crystal driving device according to claim 4, wherein a plurality of input terminals and a plurality of output terminals of the semiconductor chip are provided on a straight line. 6. The device according to claim 5, wherein the suppressing means is provided on a surface of the film opposite to a surface on which an input-side wiring or an output-side wiring is formed, and is provided around at least one of a liquid crystal display panel side and a drive circuit board side of the semiconductor chip. 6. An insulating tape provided on a portion.
The liquid crystal driving device described in 1. 7. The semiconductor device according to claim 6, wherein the suppressing means is provided on a surface of the film opposite to a surface on which input-side wiring or output-side wiring is formed, around at least one of a liquid crystal display panel side and a drive circuit board side of the semiconductor chip. The liquid crystal driving device according to claim 1, wherein the liquid crystal driving device is a solder resist film provided in a portion. 8. The suppression means is an aluminum wiring provided on at least one peripheral portion of the semiconductor chip on a liquid crystal display panel side or a drive circuit board side on a surface of the semiconductor chip overlapping with the film. 6. The liquid crystal driving device according to claim 1, wherein: 9. The LOCOS region provided on at least one peripheral portion of the semiconductor chip on the liquid crystal display panel side or the drive circuit board side on the surface of the semiconductor chip on the side overlapping with the film. 6. The liquid crystal driving device according to claim 1, wherein: 10. The suppression means is a bump area provided on at least one peripheral portion of the semiconductor chip on a liquid crystal display panel side or a drive circuit board side on a surface overlapping with the film of the semiconductor chip. 6. The liquid crystal driving device according to claim 1, wherein: 11. A liquid crystal display device comprising: the liquid crystal driving device according to claim 1; and a liquid crystal display panel.