JPH1045918A - Polyimide powder and preparation of powder molding - Google Patents

Polyimide powder and preparation of powder molding

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Publication number
JPH1045918A
JPH1045918A JP8635397A JP8635397A JPH1045918A JP H1045918 A JPH1045918 A JP H1045918A JP 8635397 A JP8635397 A JP 8635397A JP 8635397 A JP8635397 A JP 8635397A JP H1045918 A JPH1045918 A JP H1045918A
Authority
JP
Japan
Prior art keywords
powder
polyimide
polyimide powder
aromatic
aromatic polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8635397A
Other languages
Japanese (ja)
Other versions
JP4010594B2 (en
Inventor
Hiroaki Yamaguchi
裕章 山口
Fumio Aoki
文雄 青木
Akinori Shiotani
陽則 塩谷
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ube Corp
Original Assignee
Ube Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ube Industries Ltd filed Critical Ube Industries Ltd
Priority to JP8635397A priority Critical patent/JP4010594B2/en
Publication of JPH1045918A publication Critical patent/JPH1045918A/en
Application granted granted Critical
Publication of JP4010594B2 publication Critical patent/JP4010594B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Processes Of Treating Macromolecular Substances (AREA)
  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain a polyimide powder molding excellent in heat resistance, dimensional stability, mechanical strengths and elongation by packing a specified aromatic polyimide powder into a mold and molding the powder. SOLUTION: An aromatic polyimide powder which is prepared by coating a solid mainly consisting of a crystalline aromatic polyimide having such high heat resistance that no glass transition temperature is observed in the range of room temperature to 400 deg.C with a coating film of an amorphous polyimide and is judged to have a high molecular weight from the measurement of a logarithmic viscosity (at 30 deg.C in a concentration of 0.5g/100ml concentrated sulfuric acid) and whose crystallinity can be confirmed by wide-angle X-ray diffractometry is packed into a mold and molded under applied pressure and heat. This polyimide powder is prepared from an acid component comprising 3,3',4,4'-biphenyltetracarboxylic acid dianhydride and 0.5 to below 30mol% 2,3,3',4'-biphenyltetracarboxylic acid dianhydride and an aromatic diamine component comprising at least 80mol% p-phenylenediamine and has a mean particle diameter of 0.5-100μm.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】この発明は、例えば主要単位
として3,3’,4,4’−ビフェニルテトラカルボン
酸成分、少量単位として2,3,3’,4’−ビフェニ
ルテトラカルボン酸成分を、芳香族ジアミン成分として
パラフェニレンジアミンを有する極めて高いレベルの耐
熱性を保持しているとともに、特に曲げ強度や引張強度
が大きく、伸びの大きい芳香族ポリイミド粉末成形体の
製法およびその製造に使用される芳香族ポリイミド粉末
に関するものである。
[0001] The present invention relates to, for example, a 3,3 ', 4,4'-biphenyltetracarboxylic acid component as a main unit and a 2,3,3', 4'-biphenyltetracarboxylic acid component as a small unit. Having an extremely high level of heat resistance having paraphenylenediamine as an aromatic diamine component, and having particularly high flexural strength and tensile strength, is used for the production of aromatic polyimide powder molded articles having large elongation and its production. The present invention relates to an aromatic polyimide powder.

【0002】[0002]

【従来の技術】従来、3,3’,4,4’−ビフェニル
テトラカルボン酸成分とパラフェニレンジアミン成分と
からなるポリイミド粉末成形体の製法としては、例えば
特開昭61−241326号公報、特開平1−2661
34号公報などに記載されている。これらの文献による
と、上記成形体は耐熱性、寸法安定性、圧縮強度等の機
械的強度に優れていることが示されている。
2. Description of the Related Art Conventionally, as a method for producing a polyimide powder molded product comprising a 3,3 ', 4,4'-biphenyltetracarboxylic acid component and a paraphenylenediamine component, for example, JP-A-61-241326, Kaihei 1-2661
No. 34, for example. According to these documents, it is shown that the above-mentioned molded article is excellent in mechanical strength such as heat resistance, dimensional stability and compressive strength.

【0003】しかし、上記の公知文献に記載されている
ポリイミド粉末は、融点(またはガラス転移温度)が実
質的に測定されず、加熱圧縮成形時の粉体どうしの融着
が充分でないためか、機械的強度のうち特に曲げ強度や
引張強度が必ずしも充分に満足できるものではなかっ
た。また、成形体を切削加工等によって種々の形状に二
次加工するさいに、伸びと曲げ強度や引張強度が充分大
きくないためか、成形時に欠けたりして生産性が高くな
いという問題点が指摘されている。
However, the melting points (or glass transition temperatures) of the polyimide powders described in the above-mentioned known documents are not substantially measured, and the fusion of the powders during heat compression molding is not sufficient. In particular, bending strength and tensile strength among mechanical strengths were not always satisfactory. In addition, when secondary processing of the molded body into various shapes by cutting etc., it is pointed out that the productivity is not high because the elongation, bending strength and tensile strength are not sufficiently large, or it is chipped at the time of molding. Have been.

【0004】このため、成形体の伸びおよび機械強度を
大きくするために加熱圧縮成形時の粉体どうしの融着性
を改良するための試みがなされた。例えば、3,3’,
4,4’−ビフェニルテトラカルボン酸成分とパラフェ
ニレンジアミン成分とから得られるポリイミドに熱可塑
性ポリイミドを混合して得られるポリイミド粉末を圧縮
成形する方法が試みられたが、性質の全く異なる両成分
の均一混合が困難であり、得られる成形体の機械的強度
および伸びは未だ満足できるレベルに達するものではな
く、また耐熱性が却って低下するという問題点が指摘さ
れている。従って、従来の技術では、耐熱性、機械的強
度および伸びを併せて満足する芳香族ポリイミド粉末成
形体を得ることができなかったのである。
[0004] For this reason, attempts have been made to improve the fusing property between powders during heat compression molding in order to increase the elongation and mechanical strength of the compact. For example, 3,3 ',
A method of compression molding a polyimide powder obtained by mixing a thermoplastic polyimide with a polyimide obtained from a 4,4′-biphenyltetracarboxylic acid component and a paraphenylenediamine component has been attempted. It has been pointed out that uniform mixing is difficult, the mechanical strength and elongation of the obtained molded product have not yet reached a satisfactory level, and that the heat resistance is rather lowered. Therefore, according to the conventional technique, it was not possible to obtain an aromatic polyimide powder molded product satisfying both heat resistance, mechanical strength and elongation.

【0005】[0005]

【発明が解決しようとする課題】この発明の目的は、従
来公知の3,3’,4,4’−ビフェニルテトラカルボ
ン酸成分とパラフェニレンジアミンとを主成分とするポ
リイミド粉末成形体のような、耐熱性と寸法安定性、圧
縮強度等を低下させることなく、機械的強度および伸び
を高いレベルで有している芳香族ポリイミド粉末成形体
の製法を提供することである。
SUMMARY OF THE INVENTION An object of the present invention is to provide a polyimide powder molded product containing a conventionally known 3,3 ', 4,4'-biphenyltetracarboxylic acid component and paraphenylenediamine as main components. Another object of the present invention is to provide a method for producing an aromatic polyimide powder molded body having a high level of mechanical strength and elongation without lowering heat resistance, dimensional stability, compressive strength and the like.

【0006】[0006]

【課題を解決するための手段】この発明者らは、前記の
課題を達成するために鋭意検討した結果、ポリイミド粉
末として、高耐熱性の結晶性芳香族ポリイミドと非結晶
性ポリイミドとの特定の組合せおよび構造にすることに
よって、前記の矛盾する物性を両立することができるこ
とを見出し、この発明を完成したものである。
Means for Solving the Problems The present inventors have conducted intensive studies to achieve the above object, and as a result, as a polyimide powder, a high heat-resistant crystalline aromatic polyimide and a non-crystalline polyimide have been specified. It has been found that the contradictory physical properties can be achieved by combining and configuring, and the present invention has been completed.

【0007】すなわち、この発明は、ガラス転移温度
(Tg)が室温〜400℃の温度範囲では観測されない
高耐熱性の結晶性芳香族ポリイミドから主としてなる固
形分を非結晶性ポリイミドからなる被覆層で覆ってな
り、対数粘度(30℃、0.5g/100ml濃硫酸)
による測定によって高分子量とみなすことができ、広角
X線回折法により結晶化度が確認される芳香族ポリイミ
ド粉末を金型内に充填し、圧力および熱を同時あるいは
別々に加えて成形することを特徴とするポリイミド粉末
成形体の製法に関する。
That is, the present invention provides a coating layer comprising a non-crystalline polyimide containing a solid component mainly composed of a highly heat-resistant crystalline aromatic polyimide, whose glass transition temperature (Tg) is not observed in a temperature range of room temperature to 400 ° C. Covered, logarithmic viscosity (30 ° C, 0.5g / 100ml concentrated sulfuric acid)
Filling into a mold an aromatic polyimide powder that can be regarded as a high molecular weight by the measurement according to, and whose crystallinity is confirmed by wide-angle X-ray diffraction, and molding by applying pressure and heat simultaneously or separately. The present invention relates to a method for producing a characteristic polyimide powder compact.

【0008】また、この発明は、ガラス転移温度(T
g)が室温〜400℃の温度範囲では観測されない高耐
熱性の結晶性芳香族ポリイミドから主としてなる固形分
を非結晶性ポリイミドからなる被覆層で覆ってなり、対
数粘度(30℃、0.5g/100ml濃硫酸)による
測定によって高分子量とみなすことができ、広角X線回
折法により結晶化度が確認されることを特徴とする芳香
族ポリイミド粉末に関する。
[0008] The present invention also relates to a glass transition temperature (T
g), which is not observed in the temperature range of room temperature to 400 ° C., is formed by covering a solid content mainly composed of a highly heat-resistant crystalline aromatic polyimide with a coating layer composed of an amorphous polyimide, and having a logarithmic viscosity (30 ° C., 0.5 g). / 100 ml concentrated sulfuric acid), which can be regarded as a high molecular weight and whose degree of crystallinity is confirmed by wide-angle X-ray diffraction.

【0009】この発明における芳香族ポリイミド粉末
は、ガラス転移温度(Tg)が室温〜400℃の温度範
囲では観測れない高耐熱性の結晶性芳香族ポリイミドか
ら主としてなる固形分、好適には3,3’,4,4’−
ビフェニルテトラカルボン酸成分とパラフェニレンジア
ミンより誘導されるポリイミド固形分(粒子)を非結晶
性ポリイミドからなる被覆層で覆ってなり、対数粘度
(30℃、0.5g/100ml濃硫酸)による測定に
よって高分子量とみなすことができる、広角X線回折法
により結晶化度が確認され、好適には高耐熱性の結晶性
芳香族ポリイミド粒子の表面を非結晶性のポリイミドポ
リマ−からなる被覆層で覆ってなる2層構造を有する前
記の対数粘度が0.4以上、特に0.5〜3の粒子であ
る。すなわち、粒子の内層部分は結晶性芳香族ポリイミ
ドであるのに対し、その外層は非結晶性ポリイミドの薄
い層の2層構造となっている粉末である。
The aromatic polyimide powder according to the present invention has a solid content mainly composed of a highly heat-resistant crystalline aromatic polyimide whose glass transition temperature (Tg) is not observed in a temperature range of room temperature to 400 ° C., preferably 3, 3 ', 4,4'-
A polyimide solid content (particles) derived from a biphenyltetracarboxylic acid component and paraphenylenediamine is covered with a coating layer made of non-crystalline polyimide, and measured by logarithmic viscosity (30 ° C., 0.5 g / 100 ml concentrated sulfuric acid). The crystallinity is confirmed by wide-angle X-ray diffraction, which can be regarded as a high molecular weight, and the surface of the high heat-resistant crystalline aromatic polyimide particles is preferably covered with a coating layer made of a non-crystalline polyimide polymer. The particles having a logarithmic viscosity of 0.4 or more, particularly 0.5 to 3, having a two-layer structure of That is, the inner layer portion of the particles is a crystalline aromatic polyimide, while the outer layer is a powder having a two-layer structure of a thin layer of an amorphous polyimide.

【0010】前記の非結晶性のポリイミドによる被覆
は、結晶性芳香族ポリイミド粒子のほぼ全面であること
が好ましいが、これは必ずしも必須ではなく、ポリイミ
ド粉末の粒子表面のある部分(例えば40%以下)であ
れば結晶性芳香族ポリイミド粒子面が表面層を形成して
いてもよい。この発明のポリイミド粉末によれば、成形
の際に粉末粒子表面のポリマ−溶融が充分で、かつ相互
に融合し合って結合するため、耐熱性と機械的強度、伸
びが高度にバランスした成形品が得られると考えられ
る。
The above-mentioned coating with the amorphous polyimide is preferably carried out on almost the entire surface of the crystalline aromatic polyimide particles, but this is not essential, and a certain portion of the polyimide powder particle surface (for example, 40% or less) In the case of (1), the surface of the crystalline aromatic polyimide particles may form a surface layer. ADVANTAGE OF THE INVENTION According to the polyimide powder of this invention, since the polymer on the surface of the powder particles is sufficiently melted during the molding, and they fuse and bond with each other, a molded product having a high balance of heat resistance, mechanical strength and elongation. Is considered to be obtained.

【0011】この発明における芳香族ポリイミド粉末
を、この発明の一実施例の粉末の透過型電子顕微鏡によ
る断面写真図である図1、従来のポリイミド粉末の断面
写真図である図2、およびこの発明の一実施例の粉末と
従来のポリイミド粉末の両方の広角X線回折法(WAX
S)によるX線回折スペクトル図である図3を用いて説
明する。
FIG. 1 is a cross-sectional photograph of the aromatic polyimide powder of the present invention, taken by a transmission electron microscope, according to one embodiment of the present invention. FIG. 2 is a cross-sectional photograph of a conventional polyimide powder. Wide Angle X-ray Diffraction (WAX) for Both Example Powder and Conventional Polyimide Powder
This will be described with reference to FIG. 3 which is an X-ray diffraction spectrum diagram according to S).

【0012】図1において、この発明のポリイミド粉末
の内層部分は、図2と同様に結晶構造の明瞭な構造とな
っており、その外層に内層とは異なる無定形の非結晶性
芳香族ポリイミドである被覆層でほぼ全面を薄く覆って
なる構造である。
In FIG. 1, the inner layer portion of the polyimide powder of the present invention has a clear crystal structure as in FIG. 2, and its outer layer is made of an amorphous non-crystalline aromatic polyimide different from the inner layer. This is a structure in which the entire surface is thinly covered with a certain coating layer.

【0013】また、図3において、非結晶性芳香族ポリ
イミドを導入したこの発明の粉末の方が従来のもの(後
述の比較例1のもの)よりも低い結晶化度を有すことが
明らかである。これらの強度〔cps〕とピ−ク位置
(2θ)とを観察すると、2θが11.2929、1
8.4398、21.0729、23.1386、2
4.2767、25.7922、27.6764、2
9.0357に結晶性ポリイミドに基づくピ−クが認め
られる。
FIG. 3 clearly shows that the powder of the present invention into which the non-crystalline aromatic polyimide has been introduced has a lower crystallinity than the conventional powder (comparative example 1 described later). is there. Observing the intensity [cps] and the peak position (2θ), 2θ is 11.2929,
8.4398, 21.0729, 23.1386, 2
4.2767, 25.7922, 27.6664, 2
At 9.0357, a peak based on crystalline polyimide is observed.

【0014】この発明における芳香族ポリイミドの粉末
は、好適には次の方法、すなわち、結晶性芳香族ポリイ
ミドを与える芳香族テトラカルボン酸成分、例えば好適
には3,3’,4,4’−ビフェニルテトラカルボン酸
あるいはその酸二無水物またはその酸と低級アルコ−ル
とのエステル化物、および非結晶性ポリイミドを与える
テトラカルボン酸成分、例えば好適には2,3,3’,
4’−ビフェニルテトラカルボン酸あるいはその酸二無
水物またはその酸と低級アルコ−ルとのエステル化物
(いずれも好適には酸二無水物)を主成分とし、非結晶
性ポリイミドを与えるテトラカルボン酸成分(好適には
2,3,3’,4’−ビフェニルテトラカルボン酸類)
を全テトラカルボン酸成分に対して約0.5モル%以上
30モル%未満、特に1モル%以上25モル%未満、そ
の中でも特に1.5モル%以上20モル%未満の割合で
含む芳香族テトラカルボン酸成分と、パラフェニレンジ
アミンを全ジアミン成分に対して少なくとも約80モル
%以上の割合で含む芳香族ジアミン成分とを、略等モル
量を公知の方法で有機極性溶媒中で、重合およびイミド
化、ついで反応系からの粉末回収によって製造される、
高分子量の芳香ポリイミドからなる平均粒子径(一次粒
子)が0.5〜100μm、特に1〜50μmの粉末で
ある。
The aromatic polyimide powder in the present invention is preferably produced by the following method, that is, an aromatic tetracarboxylic acid component for giving a crystalline aromatic polyimide, for example, preferably 3,3 ′, 4,4′-. Biphenyltetracarboxylic acid or an acid dianhydride thereof or an esterified product of the acid and a lower alcohol, and a tetracarboxylic acid component to give an amorphous polyimide, for example, preferably 2,3,3 ′,
Tetracarboxylic acid containing 4'-biphenyltetracarboxylic acid or an acid dianhydride or an esterified product of the acid and a lower alcohol (preferably an acid dianhydride) to give a non-crystalline polyimide Component (preferably 2,3,3 ', 4'-biphenyltetracarboxylic acid)
Containing at least about 0.5 mol% to less than 30 mol%, preferably 1 mol% to less than 25 mol%, and more preferably 1.5 mol% to less than 20 mol%, based on the total tetracarboxylic acid component Polymerization of a tetracarboxylic acid component and an aromatic diamine component containing at least about 80 mol% or more of paraphenylenediamine to all diamine components in an organic polar solvent by a known method in a known manner is carried out. Manufactured by imidation followed by powder recovery from the reaction system,
It is a powder having an average particle size (primary particle) of a high molecular weight aromatic polyimide of 0.5 to 100 μm, particularly 1 to 50 μm.

【0015】前記の方法によれば、結晶性芳香族ポリイ
ミドの微小粒子を生成させながら高分子化、イミド化
後、非結晶性ポリイミドを不溶性にしてポリイミド粉末
を析出させた後、粉末回収してポリイミド粉末を得るこ
とができる。この方法によれば重合およびイミド化に特
別の操作を加えなくても、2層構造を有するポリイミド
粉末であって、残存反応溶媒が少なく、均一な粒子形成
を容易に行うことができる。この場合、非結晶性ポリイ
ミドの割合が多くなると、粒子が多くの溶媒を含みペ−
スト状となり、粉末を回収するための操作が複雑にな
る。
According to the above-mentioned method, the polymer is polymerized and imidized while generating fine particles of the crystalline aromatic polyimide, and then the amorphous polyimide is made insoluble to precipitate the polyimide powder. A polyimide powder can be obtained. According to this method, even if no special operation is added to polymerization and imidization, it is a polyimide powder having a two-layer structure, the amount of residual reaction solvent is small, and uniform particle formation can be easily performed. In this case, when the proportion of the non-crystalline polyimide increases, the particles contain many solvents and the
As a result, the operation for recovering the powder becomes complicated.

【0016】この発明のポリイミド粉末は、2種のポリ
イミドが実質的に共重合していないが、このことは結晶
化度が組成比とほぼ一致していることから確認される。
一方、結晶性芳香族ポリイミド粉末をあらかじめ添加し
た系で非結晶性ポリイミドを生成させる方法では、2種
(結晶性ポリイミド、非結晶性ポリイミド)の混合物に
なって、非結晶性ポリイミドで被覆した粒子は得られ
ず、このような混合物から得られる成形体は物性が不十
分である。
In the polyimide powder of the present invention, two kinds of polyimides are not substantially copolymerized, which is confirmed by the fact that the crystallinity is almost equal to the composition ratio.
On the other hand, in a method in which a non-crystalline polyimide is produced in a system in which a crystalline aromatic polyimide powder has been added in advance, a mixture of two types (crystalline polyimide and non-crystalline polyimide) is coated with the non-crystalline polyimide. Is not obtained, and a molded article obtained from such a mixture has insufficient physical properties.

【0017】前記の芳香族テトラカルボン酸成分として
は、3,3’,4,4’−ビフェニルテトラカルボン酸
類と2,3,3’,4’−ビフェニルテトラカルボン酸
類のみを前記の割合で使用することが粉末成形体の高い
レベルの物性(特に機械的強度と使用時の耐熱性)から
望ましいが、ビフェニルテトラカルボン酸類の一部、好
適には50モル%以下、特に20モル%以下を他の芳香
族テトラカルボン酸類で置き換えてもよい。
As the aromatic tetracarboxylic acid component, only 3,3 ', 4,4'-biphenyltetracarboxylic acid and 2,3,3', 4'-biphenyltetracarboxylic acid are used in the above ratio. Although it is desirable to perform high-level physical properties (particularly mechanical strength and heat resistance during use) of the powder molded body, it is preferable to reduce the amount of some biphenyltetracarboxylic acids, preferably 50 mol% or less, particularly 20 mol% or less. May be replaced by an aromatic tetracarboxylic acid.

【0018】これらの芳香族テトラカルボン酸類として
は、ピロメリット酸またはその酸二無水物、3,3’,
4,4’−ベンゾフェノンテトラカルボン酸またはその
酸二無水物、2,2’−ビス(3,4−ジカルボキシフ
ェニル)プロパンまたはその酸二無水物、ビス(3,4
−ジカルボキシフェニル)メタンまたはその酸二無水
物、ビス(3,4−ジカルボキシフェニル)エ−テルま
たはその酸二無水物などを挙げることができる。
As these aromatic tetracarboxylic acids, pyromellitic acid or its acid dianhydride, 3,3 ',
4,4'-benzophenonetetracarboxylic acid or its acid dianhydride, 2,2'-bis (3,4-dicarboxyphenyl) propane or its acid dianhydride, bis (3,4
-Dicarboxyphenyl) methane or an acid dianhydride thereof, bis (3,4-dicarboxyphenyl) ether or an acid dianhydride thereof, and the like.

【0019】また、前記のパラフェニレンジアミンは粉
末成形品の物性と重合・イミド化の操作の簡単さから単
独で使用することが望ましいが、物性を実質的に損なわ
ない範囲でその少量部、好適には約20モル%以下を他
の芳香族ジアミン、ジアミノポリシロキサンなどのジア
ミンで置き換えてもよい。例えば、このようなジアミン
としては、メタフェニレンジアミン、4,4’−ジアミ
ノジフェニルエ−テル、4,4’−ジアミノジフェニル
メタン、4,4’−ジアミノジフェニルプロパン、ビス
(4−アミノフェニル)ジメチルシラン、1,4−ビス
(4−アミノ−フェノキシ)ベンゼン、1,3−ビス
(4−アミノ−フェノキシ)ベンゼンなどを挙げること
ができる。
The above-mentioned paraphenylenediamine is desirably used alone in view of the physical properties of the powder molded product and the simplicity of the polymerization / imidization operation. However, a small amount of the paraphenylenediamine is preferably used as long as the physical properties are not substantially impaired. About 20 mol% or less may be replaced with diamines such as other aromatic diamines and diaminopolysiloxanes. For example, examples of such a diamine include metaphenylenediamine, 4,4'-diaminodiphenyl ether, 4,4'-diaminodiphenylmethane, 4,4'-diaminodiphenylpropane, and bis (4-aminophenyl) dimethylsilane , 1,4-bis (4-amino-phenoxy) benzene, 1,3-bis (4-amino-phenoxy) benzene, and the like.

【0020】この発明において、前記の芳香族ポリイミ
ドの粉末を金型内に充填し、圧力および熱を同時あるい
は別々に加えて成形してポリイミド粉末成形体を製造す
る。前記の芳香族ポリイミドの粉末はそのまま使用する
か、あるいは前記粉末から予備成形体を形成するかし
て、成形温度200〜600℃、好ましくは250〜5
50℃、特に好ましくは300〜500℃、および成形
圧力300〜10000Kg/cm2 、好ましくは50
0〜8000Kg/cm2 、特に好ましくは600〜6
000Kg/cm2 で圧縮成形することによって好適に
製造することができる。これらの温度や圧力は前記の範
囲内であれば任意に選択すればよい。
In the present invention, the above-mentioned aromatic polyimide powder is filled in a mold and molded by simultaneously or separately applying pressure and heat to produce a molded polyimide powder. The aromatic polyimide powder is used as it is, or a preform is formed from the powder, and the molding temperature is 200 to 600 ° C, preferably 250 to 5 ° C.
50 ° C., particularly preferably 300 to 500 ° C., and a molding pressure of 300 to 10000 Kg / cm 2 , preferably 50
0 to 8000 kg / cm 2 , particularly preferably 600 to 6 kg / cm 2
It can be suitably manufactured by compression molding at 000 kg / cm 2 . These temperatures and pressures may be arbitrarily selected as long as they are within the above ranges.

【0021】あるいは、前記の芳香族ポリイミド粉末
を、好適には充分乾燥(前焼成)した後あるいはその予
備成形体を、成形温度:室温〜350℃、成形圧力30
0〜10000Kg/cm2 、好ましくは500〜80
00Kg/cm2 、より好ましくは600〜6000K
g/cm2 で圧縮成形した成形体を、非圧縮下、200
〜600℃、好ましくは250〜500℃にて後焼結す
ることにより製造するものである。この方法によって得
られる成形体は、前述の加熱圧縮成形により得られた成
形体と比較して、総合的な特性は低下するが、並列処理
ができるなど生産性に優れているという特徴がある。
Alternatively, the aromatic polyimide powder is preferably sufficiently dried (pre-baked) or its preform is molded at a molding temperature of room temperature to 350 ° C. and a molding pressure of 30 ° C.
0 to 10000 Kg / cm 2 , preferably 500 to 80
00Kg / cm 2 , more preferably 600-6000K
g / cm 2 of the molded article under non-compression
It is manufactured by post-sintering at -600 ° C, preferably 250-500 ° C. The molded product obtained by this method has a characteristic that the overall characteristics are lower than that of the molded product obtained by the above-mentioned heat compression molding, but the product is excellent in productivity such as parallel processing.

【0022】さらに、この発明の粉末成形体の製法にお
いては、シリカ、マイカ、カオリン、アスベスト、窒化
ほう素、酸化アルミニウム、酸化鉄、グラファイト、硫
化モリブデン、硫化鉄などの無機充填剤、あるいは、ふ
っ素樹脂などの有機充填剤などの各種の充填剤を前記の
ポリイミド粉末と混合(内部添加、外部添加のいずれの
方法で配合したものでもよい。)して使用することがで
きる。
Further, in the method for producing the powder compact of the present invention, an inorganic filler such as silica, mica, kaolin, asbestos, boron nitride, aluminum oxide, iron oxide, graphite, molybdenum sulfide, iron sulfide, or fluorine Various fillers such as an organic filler such as a resin can be mixed with the above-mentioned polyimide powder (may be blended by any of internal addition and external addition) and used.

【0023】この発明の製法において、ポリイミド粉末
成形体を製造する装置としては、例えば、4柱式油圧式
プレス、高圧ホットプレスなどを挙げることができる。
また、前記の予備成形体は、例えば、ロ−タリ−プレ
ス、タブレットマシ−ンを使用する方法によって形成す
ることが好ましい。
In the production method of the present invention, examples of an apparatus for producing a polyimide powder molded body include a four-column hydraulic press, a high-pressure hot press, and the like.
The preform is preferably formed by a method using a rotary press or a tablet machine, for example.

【0024】この発明の方法によって得られるポリイミ
ド粉末成形体は、前述の特定の芳香族ポリイミド粉末か
ら得られるものであり、従来公知の3,3’,4,4’
−ビフェニルテトラカルボン酸類とパラフェニレンジア
ミンとから得られるポリイミド粉末成形体の優れた耐熱
性、寸法安定性等を低下させることなく、機械的強度や
伸びを向上させることができる。
The polyimide powder compact obtained by the method of the present invention is obtained from the above-mentioned specific aromatic polyimide powder, and is a conventionally known 3,3 ′, 4,4 ′.
-Mechanical strength and elongation can be improved without deteriorating excellent heat resistance, dimensional stability and the like of a polyimide powder molded product obtained from biphenyltetracarboxylic acids and paraphenylenediamine.

【0025】[0025]

【実施例】以下、この発明の実施例を示す。以下の各例
において、ポリイミド粉末成形体の種々の物性は、次の
試験方法によって測定したものである。 (i) 曲げ試験:ASTM D−790 測定温度23℃
において、曲げ強度(Kg/cm2 )を求めた。 (ii)引張試験:ASTM D−638に準じて、測定温
度23℃において、引張強度(Kg/cm2 )を求め
た。
Embodiments of the present invention will be described below. In each of the following examples, various physical properties of the polyimide powder molded body were measured by the following test methods. (i) Bending test: ASTM D-790 Measurement temperature 23 ° C
, The bending strength (Kg / cm 2 ) was determined. (ii) Tensile test: Tensile strength (Kg / cm 2 ) was determined at a measurement temperature of 23 ° C. according to ASTM D-638.

【0026】実施例1 N−メチル−2−ピロリドン(NMP)1275gと、
パラフェニレンジアミン(PPD)60.47g(0.
559モル)とを、攪拌機、還流冷却器(水分離器付
き)、温度計、窒素導入管を備えた容量2Lの四ツ口セ
パラブルフラスコに、60℃において添加し、その混合
液に窒素ガス流通と攪拌をしながら、3,3’,4,
4’−ビフェニルテトラカルボン酸(s−BPDA)1
48.08g(0.503モル)と2,3,3’,4’
−ビフェニルテトラカルボン酸(a−BPDA)16.
45g(0.0559モル)とをほぼ同時に添加し、約
20分間で100℃まで昇温し、各モノマ−成分をNM
P溶媒に均一に溶解した溶液を調製した。次いで、その
溶液を窒素ガス流通と攪拌を継続しながら、溶媒と生成
水とを還流させ、生成水を除去しながら、約30分間で
190℃まで昇温した。芳香族ポリイミドの析出は内温
165℃付近から始まった。内温が190℃に達した
後、反応を3時間継続し、反応を完結させた。
Example 1 1275 g of N-methyl-2-pyrrolidone (NMP)
60.47 g of paraphenylenediamine (PPD) (0.
559 mol) was added at 60 ° C. to a 2 L four-neck separable flask equipped with a stirrer, a reflux condenser (with a water separator), a thermometer and a nitrogen inlet tube at 60 ° C. 3,3 ', 4, while circulating and stirring
4'-biphenyltetracarboxylic acid (s-BPDA) 1
48.08 g (0.503 mol) and 2,3,3 ', 4'
-Biphenyltetracarboxylic acid (a-BPDA) 16.
45 g (0.0559 mol) were added almost simultaneously, and the temperature was raised to 100 ° C. in about 20 minutes.
A solution uniformly dissolved in the P solvent was prepared. Next, the solution was heated to 190 ° C. in about 30 minutes while refluxing the solvent and the generated water while continuing the nitrogen gas flow and stirring, and removing the generated water. The precipitation of the aromatic polyimide started at an internal temperature of around 165 ° C. After the internal temperature reached 190 ° C., the reaction was continued for 3 hours to complete the reaction.

【0027】その後、反応液を冷却し、芳香族ポリイミ
ド粉末を濾別し、その粉末をアセトンで洗浄し、さらに
減圧乾燥器中で150℃で10時間乾燥し、次いで30
0℃にて常圧乾燥を30分間行い、芳香族ポリイミド粉
末202.1g(理論収率98.6%)を得た。この芳
香族ポリイミド粉末は、透過型電子顕微鏡による観察
(断面図を示す)から結晶性ポリイミド粒子の表面の全
部を非結晶性のポリイミドからなる被覆層で覆ってなる
2層構造を有しており、そのポリマ−の対数粘度(30
℃、0.5g/100ml濃硫酸)が0.62であり、
平均粒径(一次粒子)は6μmであり、広角X線回折法
(ル−ランド法)による解析で結晶化度は38%であっ
た。またガラス転移温度は400℃まで観測されなかっ
た。このポリイミド粉末をポリイミド粉末−Aと称す
る。
Thereafter, the reaction solution was cooled, the aromatic polyimide powder was filtered off, the powder was washed with acetone, and further dried at 150 ° C. for 10 hours in a vacuum drier.
Drying under normal pressure at 0 ° C. was performed for 30 minutes to obtain 202.1 g (theoretical yield: 98.6%) of an aromatic polyimide powder. This aromatic polyimide powder has a two-layer structure in which the entire surface of the crystalline polyimide particles is covered with a coating layer made of amorphous polyimide from observation by a transmission electron microscope (showing a cross-sectional view). , The logarithmic viscosity of the polymer (30
° C, 0.5 g / 100 ml concentrated sulfuric acid) is 0.62,
The average particle size (primary particles) was 6 μm, and the crystallinity was 38% as analyzed by wide-angle X-ray diffraction (Leland's method). No glass transition temperature was observed up to 400 ° C. This polyimide powder is referred to as polyimide powder-A.

【0028】比較例1 実施例1において、a−BPDAを用いずテトラカルボ
ン酸成分としてs−BPDAのみを164.53g
(0.559モル)を用いた以外は、同様な操作を繰り
返した。得られた粉末は202.5g(理論収率98.
8%)、このポリイミド粉末は対数粘度が0.65、平
均粒子が8μm、透過型電子顕微鏡による観察(断面図
を示す)から結晶化度が43%であり、ガラス転移温度
が400℃まで測定されなかった。このポリイミド粉末
をポリイミド粉末−Bと称する。
Comparative Example 1 In Example 1, 164.53 g of s-BPDA alone was used as a tetracarboxylic acid component without using a-BPDA.
(0.559 mol), except that (0.559 mol) was used. The obtained powder weighed 202.5 g (theoretical yield: 98.
8%), the polyimide powder has a logarithmic viscosity of 0.65, an average particle size of 8 μm, a crystallinity of 43% from observation with a transmission electron microscope (showing a cross-sectional view), and a glass transition temperature of up to 400 ° C. Was not done. This polyimide powder is referred to as polyimide powder-B.

【0029】比較例2 実施例1において、s−BPDAを用いずテトラカルボ
ン酸成分としてa−BPDAのみを164.53g
(0.559モル)を用いた以外は、同様な操作を繰り
返した。粉末は得られず、糊状の固形分が得られた。
Comparative Example 2 In Example 1, 164.53 g of only a-BPDA was used as a tetracarboxylic acid component without using s-BPDA.
(0.559 mol), except that (0.559 mol) was used. No powder was obtained and a pasty solid was obtained.

【0030】実施例2 ポリイミド粉末−Aを、円筒形(直径60mm、高さ6
0mm)の金型内に充填し、350℃に加熱されたオ−
ブン内に入れて、減圧下約3時間の前焼成を行い、その
前焼成されたポリイミド粉末に、圧力2000Kg/c
2 を加えて350℃で10分間加圧し、前記の圧力下
に約120分間で昇温して480℃の温度とし、この圧
力と温度で30分間維持し、この間に揮発分などのガス
抜きをする本焼成を行い、そして、加圧状態を停止し
て、圧縮成形機から取り出し成形品をさらにオ−ブン内
で450℃、2時間の後焼成を行った後放冷して、ポリ
イミド粉末成形体(直径60mm、高さ10mmの円
柱)を得た。このポリイミド粉末成形体を切削加工し
て、ポリイミド粉末成形体からなる板(試験片)を作成
し、曲げ試験を行った。曲げ強度は1700Kg/cm
2 であった。粉末成形体は良好な切削加工性(二次加工
性)を示した。
Example 2 A polyimide powder-A was prepared in a cylindrical form (diameter 60 mm, height 6
0 mm) and heated to 350 ° C.
And then pre-fired for about 3 hours under reduced pressure, and the pre-fired polyimide powder was subjected to a pressure of 2000 kg / c.
m 2 , and pressurized at 350 ° C. for 10 minutes, and heated under the above pressure for about 120 minutes to a temperature of 480 ° C., and maintained at this pressure and temperature for 30 minutes, during which gas such as volatile matter was released. After the main baking, the pressurized state is stopped, the molded product is taken out of the compression molding machine, further subjected to post-baking at 450 ° C. for 2 hours in an oven, and then allowed to cool to obtain a polyimide powder. A molded product (a cylinder having a diameter of 60 mm and a height of 10 mm) was obtained. This polyimide powder compact was cut to prepare a plate (test piece) made of the polyimide powder compact, and a bending test was performed. Flexural strength is 1700Kg / cm
Was 2 . The powder compact exhibited good cutting workability (secondary workability).

【0031】比較例3 ポリイミド粉末として、ポリイミド粉末−Bを使用した
ほかは実施例2と同様に加熱圧縮成形を行って、ポリイ
ミド粉末成形体を得た。その成形体の曲げ強度は107
0Kg/cm2 であった。
Comparative Example 3 A heat-compression molding was carried out in the same manner as in Example 2 except that polyimide powder-B was used as the polyimide powder, to obtain a molded polyimide powder. The bending strength of the molded body is 107
It was 0 kg / cm 2 .

【0032】実施例3 ポリイミド粉末−Aを300℃に加熱されたオ−ブンに
入れて常圧下、約1時間前焼成し、次に円筒形(直径3
0mm、高さ30mm)の金型内に充填し、圧力200
0Kg/cm2 を加えて常温で10分間加圧し、放圧し
た後金型から取り出した成形品を300℃に加熱された
オ−ブン内に入れて、約120分かけて480℃の温度
とし、この温度で30分間維持し、次いで放冷してポリ
イミド粉末成形体(直径30mm、高さ3mmの円柱)
を得た。このポリイミド粉末成形体を切削加工して試験
片を作成した。この試験片の引張強度は850Kg/c
2 であった。
Example 3 A polyimide powder-A was placed in an oven heated to 300 ° C. and calcined under normal pressure for about 1 hour.
0 mm, height 30 mm) and pressure 200
After adding 0 Kg / cm 2 and pressurizing at room temperature for 10 minutes, the pressure was released, and the molded product taken out of the mold was placed in an oven heated to 300 ° C., and the temperature was raised to 480 ° C. over about 120 minutes. Maintained at this temperature for 30 minutes and then allowed to cool to form a polyimide powder compact (a cylinder 30 mm in diameter and 3 mm in height)
I got A test piece was prepared by cutting this polyimide powder compact. The tensile strength of this test piece is 850 Kg / c
m 2 .

【0033】比較例4 ポリイミド粉末−Bを使用したほかは、実施例3と同様
にしてポリイミド粉末成形体を得た。その成形体につい
ての引張強度は450Kg/cm2 であった。
Comparative Example 4 A polyimide powder molded body was obtained in the same manner as in Example 3 except that polyimide powder-B was used. The tensile strength of the compact was 450 kg / cm 2 .

【0034】実施例4 粉末成形体の伸びについて、比較例3と実施例3でそれ
ぞれ得られた成形体について相対値(比較例3のものを
1とする)で評価した結果、2.5倍の値であった。ま
た、実施例2、3および比較例3、4で得られた粉末成
形体について、耐熱性を熱重量減少測定により、寸法安
定性を加熱収縮率により、圧縮強度を圧縮試験(AST
M D−695に準ずる方法)により評価したところ、
いずれも実質的に差異は認められず、良好な耐熱性を示
した。
Example 4 With respect to the elongation of the powder compact, the compacts obtained in Comparative Example 3 and Example 3 were evaluated as relative values (the value in Comparative Example 3 was 1). Was the value of For the powder compacts obtained in Examples 2 and 3 and Comparative Examples 3 and 4, the heat resistance was measured by thermogravimetric reduction, the dimensional stability was determined by the heat shrinkage, and the compression strength was determined by a compression test (AST).
(Method according to MD-695).
In each case, no substantial difference was observed, indicating good heat resistance.

【0035】実施例5 s−BPDAとa−BPDAとの割合を98:2(モル
比)に変えた他は実施例1と同様に実施してポリイミド
粉末を得た。このポリイミド粉末は、実施例1で得られ
たポリイミド粉末(ポリイミド粉末−A)と同様に結晶
性ポリイミド粒子の表面のほぼ全面を非結晶性のポリイ
ミドからなる被覆層で覆ってなる2層構造を有してお
り、そのポリマ−の対数粘度が0.62であり、平均粒
径が6μmであり、結晶化度(全体として)が36%で
あった。またガラス転移温度は400℃まで観測されな
かった。このポリイミド粉末を用いて実施例2と同様に
圧縮成形し、得られた試験片について曲げ強度を測定し
た結果、曲げ強度は1200Kg/cm2 であった。
Example 5 A polyimide powder was obtained in the same manner as in Example 1 except that the ratio of s-BPDA to a-BPDA was changed to 98: 2 (molar ratio). This polyimide powder has a two-layer structure in which almost the entire surface of the crystalline polyimide particles is covered with a coating layer made of amorphous polyimide similarly to the polyimide powder (polyimide powder-A) obtained in Example 1. The polymer had a logarithmic viscosity of 0.62, an average particle size of 6 μm, and a crystallinity (overall) of 36%. No glass transition temperature was observed up to 400 ° C. This polyimide powder was compression-molded in the same manner as in Example 2, and the bending strength of the obtained test piece was measured. As a result, the bending strength was 1200 kg / cm 2 .

【0036】実施例6 s−BPDAとa−BPDAとの割合を85:15(モ
ル比)に変えた他は実施例1と同様に実施してポリイミ
ド粉末を得た。このポリイミド粉末は、実施例1で得ら
れたポリイミド粉末(ポリイミド粉末−A)と同様に結
晶性ポリイミド粒子の表面の全面を非結晶性のポリイミ
ドからなる被覆層で覆ってなる2層構造を有しており、
そのポリマ−の対数粘度が0.63であり、平均粒径が
6μmであり、結晶化度(全体として)が28%であっ
た。またガラス転移温度は400℃まで観測されなかっ
た。このポリイミド粉末を用いて実施例2と同様に圧縮
成形し、得られた試験片について曲げ強度を測定した結
果、曲げ強度は1570Kg/cm2 であった。
Example 6 A polyimide powder was obtained in the same manner as in Example 1 except that the ratio of s-BPDA to a-BPDA was changed to 85:15 (molar ratio). This polyimide powder has a two-layer structure in which the entire surface of the crystalline polyimide particles is covered with a coating layer made of amorphous polyimide similarly to the polyimide powder (polyimide powder-A) obtained in Example 1. And
The logarithmic viscosity of the polymer was 0.63, the average particle size was 6 μm, and the crystallinity (overall) was 28%. No glass transition temperature was observed up to 400 ° C. This polyimide powder was compression molded in the same manner as in Example 2, and the bending strength of the obtained test piece was measured. As a result, the bending strength was 1570 Kg / cm 2 .

【0037】[0037]

【発明の効果】この発明は以上詳述したような構成を有
しているため、下記のような効果を奏する。
Since the present invention has the structure described in detail above, it has the following effects.

【0038】すなわち、この発明の方法によれば、耐熱
性と寸法安定性、圧縮強度等を低下させることなく、機
械的強度および伸びが高いレベルで調和している芳香族
ポリイミド粉末成形体を得ることができる。
That is, according to the method of the present invention, it is possible to obtain an aromatic polyimide powder molded body having a high level of mechanical strength and elongation without lowering heat resistance, dimensional stability, compressive strength and the like. be able to.

【0039】また、この発明の芳香族ポリイミド粉末
は、成形の際に粉末粒子表面のポリマ−溶融が充分で、
かつ相互に融合し合って結合することが可能であり、耐
熱性と機械的強度、伸びが高度にバランスした成形品を
得られる。
The aromatic polyimide powder of the present invention has sufficient polymer melting on the surface of the powder particles during molding.
In addition, it is possible to fuse and bond with each other, and to obtain a molded product in which heat resistance, mechanical strength and elongation are highly balanced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】この発明の粉末の一例の透過型電子顕微鏡観察
による断面写真図である。
FIG. 1 is a photograph of a cross section of an example of the powder of the present invention observed by a transmission electron microscope.

【図2】従来の粉末の一例の透過型電子顕微鏡観察によ
る断面写真図である。
FIG. 2 is a cross-sectional photographic view of an example of a conventional powder observed by a transmission electron microscope.

【図3】この発明の粉末の一例と従来の粉末の一例の各
々の広角X線回折法(WAXS)によるX線回折スペク
トル図である。強度の大きいスペクトル図が従来の粉末
のもので、強度の小さいスペクトル図がこの発明の粉末
のスペクトル図を示す。
FIG. 3 is an X-ray diffraction spectrum of one example of the powder of the present invention and one example of a conventional powder by wide-angle X-ray diffraction (WAXS). A spectrum diagram with a large intensity is that of the conventional powder, and a spectrum diagram with a small intensity is the spectrum diagram of the powder of the present invention.

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 ガラス転移温度(Tg)が室温〜400
℃の温度範囲では観測されない高耐熱性の結晶性芳香族
ポリイミドから主としてなる固形分を非結晶性ポリイミ
ドからなる被覆層で覆ってなり、対数粘度(30℃、
0.5g/100ml濃硫酸)による測定によって高分
子量とみなすことができ、広角X線回折法により結晶化
度が確認される芳香族ポリイミド粉末を金型内に充填
し、圧力および熱を同時あるいは別々に加えて成形する
ことを特徴とするポリイミド粉末成形体の製法。
1. A glass transition temperature (Tg) of room temperature to 400
The solid content mainly composed of the highly heat-resistant crystalline aromatic polyimide which is not observed in the temperature range of ° C. is covered with a coating layer composed of the non-crystalline polyimide, and the logarithmic viscosity (30 ° C.,
0.5 g / 100 ml concentrated sulfuric acid) can be regarded as a high molecular weight, and an aromatic polyimide powder whose crystallinity is confirmed by a wide-angle X-ray diffraction method is filled in a mold, and pressure and heat are simultaneously or simultaneously applied. A method for producing a polyimide powder molded body, which is separately added and molded.
【請求項2】 芳香族ポリイミド粉末は広角X線回折法
により測定される結晶化度が高耐熱性の結晶性芳香族ポ
リイミド単独の場合よりも低く、また粉末についてのガ
ラス転移温度が室温から400℃の温度範囲では観測さ
れないものである請求項1記載のポリイミド粉末成形体
の製法。
2. The aromatic polyimide powder has a lower crystallinity as measured by a wide-angle X-ray diffraction method than that of a highly heat-resistant crystalline aromatic polyimide alone, and the glass transition temperature of the powder is from room temperature to 400 ° C. The method for producing a polyimide powder molded body according to claim 1, which is not observed in a temperature range of ° C.
【請求項3】 芳香族ポリイミド粉末は3,3’,4,
4’−ビフェニルテトラカルボン酸二無水物と2,3,
3’,4’−ビフェニルテトラカルボン酸二無水物から
なる芳香族テトラカルボン酸成分およびパラフェニレン
ジアミンを80モル%以上含む芳香族ジアミン成分とか
らなり、2,3,3’,4’−ビフェニルテトラカルボ
ン酸成分が全芳香族テトラカルボン酸成分中0.5モル
%以上30モル%未満の範囲にあり、平均粒子径が0.
5〜100μmである請求項1記載のポリイミド粉末成
形体の製法。
3. The aromatic polyimide powder is 3, 3 ′, 4,
4'-biphenyltetracarboxylic dianhydride and 2,3
2,3,3 ', 4'-biphenyl comprising an aromatic tetracarboxylic acid component comprising 3', 4'-biphenyltetracarboxylic dianhydride and an aromatic diamine component containing at least 80 mol% of paraphenylenediamine The content of the tetracarboxylic acid component is in the range of 0.5 mol% to less than 30 mol% of the total aromatic tetracarboxylic acid component, and the average particle diameter is 0.1 mol%.
The method for producing a polyimide powder molded body according to claim 1, which has a thickness of 5 to 100 µm.
【請求項4】 芳香族ポリイミド粉末の成形を成形温度
200〜600℃および成形圧力300〜10000K
g/cm2 で加熱圧縮成形、または室温〜350℃およ
び成形圧力300〜10000Kg/cm2 にて得た予
備成形体を非圧縮下200〜600℃にて後焼結して行
う請求項1記載の粉末成形体の製法。
4. The molding of the aromatic polyimide powder at a molding temperature of 200 to 600 ° C. and a molding pressure of 300 to 10,000 K
2. A pre-molded product obtained by heat compression molding at g / cm 2 or at room temperature to 350 ° C. and a molding pressure of 300 to 10,000 kg / cm 2 is post-sintered at 200 to 600 ° C. under non-compression. Of powder compacts.
【請求項5】 ガラス転移温度(Tg)が室温〜400
℃の温度範囲では観測されない高耐熱性の結晶性芳香族
ポリイミドから主としてなる固形分を非結晶性ポリイミ
ドからなる被覆層で覆ってなり、対数粘度(30℃、
0.5g/100ml濃硫酸)による測定によって高分
子量とみなすことができ、広角X線回折法により結晶化
度が確認されることを特徴とする芳香族ポリイミド粉
末。
5. A glass transition temperature (Tg) of room temperature to 400.
The solid content mainly composed of the highly heat-resistant crystalline aromatic polyimide which is not observed in the temperature range of ° C. is covered with a coating layer composed of the non-crystalline polyimide, and the logarithmic viscosity (30 ° C.,
Aromatic polyimide powder characterized in that it can be regarded as a high molecular weight by measurement with 0.5 g / 100 ml concentrated sulfuric acid) and the degree of crystallinity is confirmed by wide-angle X-ray diffraction.
JP8635397A 1996-04-05 1997-04-04 Production method of polyimide powder and powder compact Expired - Lifetime JP4010594B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8635397A JP4010594B2 (en) 1996-04-05 1997-04-04 Production method of polyimide powder and powder compact

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP8386296 1996-04-05
JP8-138550 1996-05-31
JP8-83862 1996-05-31
JP13855096 1996-05-31
JP8635397A JP4010594B2 (en) 1996-04-05 1997-04-04 Production method of polyimide powder and powder compact

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006237413A Division JP4218716B2 (en) 1996-04-05 2006-09-01 Aromatic polyimide powder and molded article comprising the aromatic polyimide powder

Publications (2)

Publication Number Publication Date
JPH1045918A true JPH1045918A (en) 1998-02-17
JP4010594B2 JP4010594B2 (en) 2007-11-21

Family

ID=27304353

Family Applications (1)

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Country Link
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534622B2 (en) 2000-10-31 2003-03-18 Ube Industries, Ltd. Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production
US6750320B2 (en) 2001-02-20 2004-06-15 Central Glass Company, Limited Process for producing polyimide platy object
US6958192B2 (en) 2002-04-05 2005-10-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and aromatic diamines
WO2021182589A1 (en) * 2020-03-13 2021-09-16 宇部興産株式会社 Aromatic polyimide powder for molded body, molded body using same, method for improving mechanical strength of molded body
CN114230790A (en) * 2021-12-24 2022-03-25 长沙新材料产业研究院有限公司 Polyimide powder and preparation method thereof

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6534622B2 (en) 2000-10-31 2003-03-18 Ube Industries, Ltd. Process for production of polyimide powder, polyimide powder, polyimide powder molded bodies and process for their production
US6750320B2 (en) 2001-02-20 2004-06-15 Central Glass Company, Limited Process for producing polyimide platy object
US6958192B2 (en) 2002-04-05 2005-10-25 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Polyimides from 2,3,3′,4′-biphenyltetracarboxylic dianhydride and aromatic diamines
WO2021182589A1 (en) * 2020-03-13 2021-09-16 宇部興産株式会社 Aromatic polyimide powder for molded body, molded body using same, method for improving mechanical strength of molded body
CN114230790A (en) * 2021-12-24 2022-03-25 长沙新材料产业研究院有限公司 Polyimide powder and preparation method thereof

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