JPH1044203A - Injection molding method for molding with uneven thickness - Google Patents

Injection molding method for molding with uneven thickness

Info

Publication number
JPH1044203A
JPH1044203A JP20689996A JP20689996A JPH1044203A JP H1044203 A JPH1044203 A JP H1044203A JP 20689996 A JP20689996 A JP 20689996A JP 20689996 A JP20689996 A JP 20689996A JP H1044203 A JPH1044203 A JP H1044203A
Authority
JP
Japan
Prior art keywords
molding
mold
molded product
injection molding
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP20689996A
Other languages
Japanese (ja)
Inventor
Nobuyuki Hosonuma
信行 細沼
Shuji Hoshina
修司 保科
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Asahi Chemical Industry Co Ltd
Original Assignee
Asahi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asahi Chemical Industry Co Ltd filed Critical Asahi Chemical Industry Co Ltd
Priority to JP20689996A priority Critical patent/JPH1044203A/en
Publication of JPH1044203A publication Critical patent/JPH1044203A/en
Withdrawn legal-status Critical Current

Links

Abstract

PROBLEM TO BE SOLVED: To prevent occurrence of appearance defects such as warping caused by molding strains, weld lines, silver streaks by heating the metal mold surface forming the surface of a molding at a higher temperature than the softening temperature in advance by high frequency induction heating and then molding it by the injection molding. SOLUTION: Copper tubes composed of mutually isolated fine wires are densely shaped along a single layer spiral form, and solidified to be fixed to form a flat plate by using partially heat-resistant resin, in an inductor. The inductor is disposed close to the surface of a metal mold cavity before a thermoplastic resin is injected for molding, to heat the metal mold by a high frequency electric source. Thereafter, the inductor is drawn from the metal mold and then the metal mold is closed to start injection-molding. By this method, a molding product having a thickness ratio b/a of 1/30-1/2, and the thickness of 0.1-5mm at the thin part of the molding product, in particular a flat plate molding product with uneven thickness having 10 inches or longer diagonal length, for instance, can be formed.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は各種熱可塑性樹脂偏
肉成形品を射出成形する方法、及びその成形品に係わ
る。特に、偏肉薄肉タイプのサイドライト式面照明装置
(バックライト)用導光板の射出成形に適する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for injection-molding various kinds of thermoplastic resin uneven molded articles, and to the molded articles. In particular, it is suitable for injection molding of a light guide plate for a side-light type surface illumination device (backlight) of an uneven thickness type.

【0002】[0002]

【従来技術】各種熱可塑性樹脂の射出成形方法は、金型
キャビティ内へ溶融樹脂を射出充填し、ゲート部が冷却
固化するまで保圧によりスプールの溶融樹脂を介してキ
ャビティ内に圧力を加えゲートが固化した後金型内の成
形品を得る方法が通常行われている。一般にこの様な射
出成形における充填、保圧工程では、溶融樹脂の流動抵
抗及び冷却等によりキャビティ内に圧力分布が生じ不均
一な冷却が起こりやすく、偏肉成形品の薄肉部の成形厚
みが特に1mm以下の薄肉成形品で顕著に見られ、更に
ゲートから流動末端までの流動距離が長い場合には充填
不良に成る。成形品の薄肉部の厚みが1mm以下の偏肉
薄肉成形品を射出成形する方法において、通常、射出成
形速度を速くしたり、射出成形圧力や保圧を高くした
り、金型温度を高くしたり、或いは、流動性の良い樹脂
を用いたりする方法が用いられているがその対応は十分
ではない。
2. Description of the Related Art Injection molding of various thermoplastic resins is performed by injecting a molten resin into a mold cavity, applying pressure to the cavity through the molten resin of the spool by holding pressure until the gate is cooled and solidified, and applying a gate. Usually, a method of obtaining a molded product in a mold after solidification is performed. In general, in the filling and holding pressure steps in such injection molding, pressure distribution occurs in the cavity due to the flow resistance and cooling of the molten resin, and uneven cooling is likely to occur. It is remarkable in a thin-walled molded product of 1 mm or less, and when the flow distance from the gate to the flow end is long, poor filling occurs. In the method of injection molding a thin-walled thin-walled molded product having a thin-walled portion having a thickness of 1 mm or less, usually, the injection molding speed is increased, the injection molding pressure or holding pressure is increased, or the mold temperature is increased. Or a method using a resin having good fluidity has been used, but the method is not sufficient.

【0003】射出成形速度を速くすると、溶融樹脂のせ
ん断発熱によって極部的に溶融樹脂温度が高くなるため
にシルバーストリークが発生したり、或いは、特に成形
品の薄肉部においては金型表面と溶融樹脂との摩擦抵抗
が大きくなるために成形品に反りやフローマークなどが
発生する。また、射出成形圧力や保圧を大きくしたりす
る場合も、特に成形品の薄肉部に於いては溶融樹脂が急
速に冷却されるため(冷却速度が大きい)、残留応力が
大きくなり、成形品に変形或いは反り等が発生し易くな
り好ましくない。また、流動性の良い樹脂を用いること
によってある程度薄肉部での流動性は改善されるが、十
分な効果を出すためには樹脂の分子量を小さくする必要
があり、機械的強度が低下しクラックやクレージングな
どが発生し易くなり好ましくない。
When the injection molding speed is increased, the temperature of the molten resin becomes extremely high due to the heat generated by the shearing of the molten resin, and silver streaks may occur. Since the frictional resistance with the resin is increased, the molded product is warped or a flow mark is generated. In addition, when the injection molding pressure or the holding pressure is increased, the molten resin is rapidly cooled (the cooling rate is high) particularly in the thin portion of the molded product, so that the residual stress increases, and the molded product is reduced. Undesirably, deformation or warpage easily occurs. Also, by using a resin having good fluidity, the fluidity in a thin portion is improved to some extent, but in order to obtain a sufficient effect, it is necessary to reduce the molecular weight of the resin, and the mechanical strength is reduced and cracks and Crazing and the like easily occur, which is not preferable.

【0004】上記の方法の中で金型温度を高くすること
は非常に有効な手段である。しかし従来一般的に、金型
にそれぞれ加熱用及び冷却用の孔を設け、この孔に熱媒
及び冷媒を交互に流すことによって金型温度をコントロ
ール(加熱と冷却)する方法が行われるが、通常金型は
鋼鉄性であり、成形品に比べて重量的にも容量的にも何
倍も大きく加熱冷却に多くの熱量と時間とを必要とす
る。すなわち、工業生産上の問題点を有する。
[0004] In the above method, increasing the mold temperature is a very effective means. However, conventionally, generally, a method for controlling the mold temperature (heating and cooling) by providing a heating and cooling hole in the mold respectively and alternately flowing a heat medium and a coolant through the hole is performed. Usually, a mold is made of steel, and is many times larger in weight and capacity than a molded product, and requires a large amount of heat and time for heating and cooling. That is, there is a problem in industrial production.

【0005】更に高周波誘導加熱方法を採用することに
より、金型表面を熱可塑性樹脂の加熱変形温度以上に加
熱する方法が、特公昭58ー40504号公報、特公昭
62ー58287号公報、特公平3ー45687号公報
等に開示されているが、本発明でいう偏肉薄肉成形品の
成形方法に関するものではない。
Further, a method of heating the mold surface to a temperature higher than the heating deformation temperature of the thermoplastic resin by adopting a high frequency induction heating method is disclosed in Japanese Patent Publication No. 58-40504, Japanese Patent Publication No. 62-58287, and Japanese Patent Publication No. Although disclosed in Japanese Patent Application Laid-Open No. 3-45687 and the like, it does not relate to the method for molding an uneven thickness thin molded article according to the present invention.

【0006】[0006]

【発明が解決しょうとする課題】本発明は、熱可塑性樹
脂を用いて、厚肉部aと薄肉部bの比b/aが1/30
〜1/2で、成形品の薄肉部の厚みが0.1mmから5
mmである偏肉成形品を射出成形する方法に於いて、従
来の方法では、金型内での溶融樹脂の流動性が不十分で
あると所定の形状の成形品が得られなかったり、所定の
形状の成形品を得る為には、通常より射出成形速度を早
くしたり或いは射出成形圧力を大きくしたりする必要か
ら、得られる成形品に反り、或いはウエルドラインやシ
ルバーストリークス等といった外観不良が発生してしま
うという問題があった。また、流動性を高める目的に金
型に加熱用及び冷却用の孔を設け、成形時に熱媒を冷却
時に冷媒を流すことによって成形品を得る方法も有る
が、通常金型は鋼鉄性であり、成形品に比べて重量的に
も容量的にも何倍も大きく加熱冷却に多くの熱量と時間
とを必要とする。すなわち、工業生産上の問題点を有す
る。
According to the present invention, the ratio b / a of the thick portion a to the thin portion b is 1/30 using a thermoplastic resin.
The thickness of the thin part of the molded product is from 0.1 mm to 5
In the method of injection-molding an uneven thickness molded product having a thickness of 0.1 mm, if the flowability of the molten resin in the mold is insufficient, a molded product having a predetermined shape cannot be obtained, It is necessary to increase the injection molding speed or increase the injection molding pressure than usual in order to obtain a molded product with a shape of, and the resulting molded product is warped or has poor appearance such as weld lines or silver streaks There is a problem that occurs. There is also a method in which holes for heating and cooling are provided in a mold for the purpose of increasing fluidity, and a molded product is obtained by flowing a cooling medium during cooling of a heat medium during molding.However, the mold is usually made of steel. Heating and cooling require a large amount of heat and a lot of time as compared with the molded product. That is, there is a problem in industrial production.

【0007】すなわち、熱可塑性樹脂を用いて、厚肉部
aと薄肉部bの比b/aが1/30〜1/2で、成形品
の薄肉部の厚みが0.1mmから5mmである偏肉成形
品を射出成形する方法に於いて、上記問題点を解決する
必要がある。
That is, using a thermoplastic resin, the ratio b / a of the thick portion a to the thin portion b is 1/30 to 1/2, and the thickness of the thin portion of the molded product is 0.1 mm to 5 mm. It is necessary to solve the above problems in a method of injection-molding an uneven thickness molded product.

【0008】[0008]

【課題を解決するための手段】本発明者らはこれらの問
題を解決するために鋭意検討した結果、偏肉成形品を射
出成形する方法において、金属からなる型キァビティを
加熱するにあたり高周波誘導加熱の原理を利用すれば、
金型の表層部を選択的に加熱することができ、しかも金
型表面を急加熱急冷却することも可能となり、成形歪み
による反り或いはウエルドラインやシルバーストリーク
ス等といった外観不良を起こすことなく、偏肉成形品を
得ることができることを見出し完成した。
Means for Solving the Problems The inventors of the present invention have made intensive studies to solve these problems, and as a result, in a method of injection-molding an uneven thickness molded product, a high-frequency induction heating method is used to heat a metal mold cavity. Using the principle of
It is possible to selectively heat the surface layer of the mold, and it is also possible to rapidly heat and cool the surface of the mold, without causing appearance defects such as warpage due to molding distortion or weld lines and silver streaks. We have found that we can obtain uneven thickness molded products and completed it.

【0009】すなわち本発明は、熱可塑性樹脂を用い
て、厚肉部aと薄肉部bの比b/aが1/30〜1/2
であり、成形品の薄肉部の厚みが、0.1〜5mmであ
る偏肉成形品を射出成形する方法に於いて、成形品表面
を形成させるべき金型表面を予め該熱可塑性樹脂の軟化
温度以上に高周波誘導加熱しておき射出成形することを
特徴とする。更に、成形品の薄肉部の厚みが特に0.1
mmから1mmであり、該熱可塑性樹脂がメタクリル樹
脂またはポリカーボネイト樹脂であることを特徴とする
射出成形方法である。
That is, in the present invention, the ratio b / a of the thick part a to the thin part b is 1/30 to 1/2 using a thermoplastic resin.
In the method of injection-molding an uneven thickness molded product having a thin portion with a thickness of 0.1 to 5 mm, the surface of a mold on which a molded product surface is to be formed is softened in advance by the thermoplastic resin. It is characterized by high-frequency induction heating above the temperature and injection molding. Furthermore, the thickness of the thin portion of the molded product is particularly 0.1
mm to 1 mm, wherein the thermoplastic resin is a methacrylic resin or a polycarbonate resin.

【0010】更に、熱可塑性樹脂からなり、上記方法に
よって得られたb/aの比が1/30〜1/2であり、
かつ成形品の薄肉部の厚みが、0.1mmから5mmで
あることを特徴とする偏肉成形品、更には前記成形品か
らなる大型の液晶表示装置等に用いられるサイドライト
式面照明装置(バックライト)用導光板を提供するもの
である。
Further, the b / a ratio obtained by the above method is made of a thermoplastic resin, and is 1/30 to 1/2,
In addition, the thickness of the thin-walled portion of the molded product is 0.1 mm to 5 mm, and a sidelight type surface lighting device used for a large-sized liquid crystal display device or the like comprising the molded product ( (Backlight) light guide plate.

【0011】以下に本発明を詳細に説明する。本発明
は、金型表面温度を熱可塑性樹脂の軟化温度以上にする
ことにより、可塑性を保持したまま成形が可能となり、
前述したように成形歪みによる反り、或いはウエルドラ
インやシルバーストリークス等といった外観不良を起こ
すことなく、偏肉成形品を得るこちができることを可能
にしたものである。
Hereinafter, the present invention will be described in detail. The present invention makes it possible to mold while maintaining the plasticity by setting the mold surface temperature to the softening temperature of the thermoplastic resin or higher,
As described above, it is possible to obtain an uneven thickness molded product without causing warpage due to molding distortion, or appearance defects such as weld lines and silver streaks.

【0012】更に金型表面を加熱する手段として、高周
波誘導加熱方法を採用することにより、その生産性を向
上させることに成功した。以下にその説明をする。金型
の表面を熱可塑性樹脂の軟化温度以上にしたまま金型よ
り成形品を離型することは不可能であり、変形のない所
望の成形品を得るためには金型を冷却し成形品温度が熱
可塑性樹脂の軟化温度より低温に冷却固化させた状態に
て金型より離型する必要がある。ところが射出成形用金
型は通常の場合、成形品形状より重量的にはもちろん容
量的にも何倍も大きい鋼鉄性のもであり、加熱冷却に多
くの熱量と時間を必要とする。すなわち上述の成形品を
得る上で工業生産上の問題がある。このような方法によ
り成形すると成形サイクルは40〜60分必要である。
そこで、加熱するにあたり高周波誘導加熱の原理を利
用すれば、金型の表層部を選択的に加熱することがで
き、しかも金型表面を急加熱急冷却することも可能とな
る。換言すると、高周波誘導加熱により金型表面付近を
選択的に加熱すれば、金型表面付近を急加熱急冷できる
ので成形サイクルをさほど延長することなく射出成形を
可能とし、かつ射出成形時金型表面が熱可塑性樹脂の軟
化温度以上に保たれているため該熱可塑性樹脂が金型内
流動中に冷却され難い。従って、成形品の肉厚の比b/
aが1/30〜1/2であり、かつ成形品の薄肉部の厚
みが、0.1mmから5mmであるような成形品、特に
その対角の長さが10インチ以上である様な平板状の偏
肉成形品を成形する場合に、必要以上に射出成形速度や
射出成形圧力を大きくすることなく成形できるので、射
出成形時の流動抵抗が少なく配向歪みが発生しずらくな
るため、特に薄肉の厚みが0.1mmから1mmである
ような偏肉成形品の薄肉部に反りが発生しずらくなる。
かつまた、極部的に急激に溶融樹脂の流動抵抗が低下す
ることによるシェアー発熱が起こらないのでシルバース
トリークなど外観不良のない成形品を得ることができ
る。更には、フローマークや光沢ムラのない、表面の平
滑性、光沢に優れた成形品を得ることが出来る。
Further, by adopting a high-frequency induction heating method as a means for heating the mold surface, the productivity was successfully improved. This is described below. It is impossible to release the molded product from the mold while keeping the surface of the mold at or above the softening temperature of the thermoplastic resin.To obtain the desired molded product without deformation, cool the mold and cool the molded product. It is necessary to release the mold from the mold while cooling and solidifying the thermoplastic resin at a temperature lower than the softening temperature of the thermoplastic resin. However, the mold for injection molding is usually made of steel which is several times larger in volume and capacity than the shape of the molded product, and requires a large amount of heat and time for heating and cooling. That is, there is a problem in industrial production in obtaining the above-mentioned molded product. Molding by such a method requires a molding cycle of 40 to 60 minutes.
Therefore, if the principle of high-frequency induction heating is used for heating, the surface layer of the mold can be selectively heated, and the mold surface can be rapidly heated and cooled. In other words, if the vicinity of the mold surface is selectively heated by high-frequency induction heating, the vicinity of the mold surface can be rapidly heated and cooled, so that injection molding can be performed without prolonging the molding cycle. Is maintained at a temperature equal to or higher than the softening temperature of the thermoplastic resin, so that the thermoplastic resin is hardly cooled during the flow in the mold. Therefore, the ratio b /
A flat plate whose a is 1/30 to 1/2 and the thickness of the thin portion of the molded product is 0.1 mm to 5 mm, especially a diagonal length of which is 10 inches or more When molding an uneven thickness molded article, it can be molded without increasing the injection molding speed and injection molding pressure more than necessary, so that the flow resistance at the time of injection molding is small and the orientation distortion hardly occurs. Warpage does not easily occur in the thin portion of the uneven thickness molded product having a thin thickness of 0.1 mm to 1 mm.
In addition, since no shear heat is generated due to an extremely rapid decrease in the flow resistance of the molten resin, a molded article free from appearance defects such as silver streaks can be obtained. Further, it is possible to obtain a molded article free from flow marks and gloss unevenness and having excellent surface smoothness and gloss.

【0013】またこの方法によれば、金型全体の熱膨
張、収縮等の影響がなくなり、成形品の寸法精度も上が
り外観上の斑もなくなる。本発明に用いられる金型の材
質は、高周波により誘導加熱現象を生じさせる事ができ
る点で、磁性材料が好ましい。本発明に用いられる高周
波誘導加熱方法に於ける周波数は、金型表面の加熱され
る部分の厚みを制御する事ができる点で、1KHz〜1
MHzの範囲が特に好ましい。
Further, according to this method, the influence of thermal expansion, shrinkage, etc. of the whole mold is eliminated, the dimensional accuracy of the molded product is increased, and the appearance is not uneven. The material of the mold used in the present invention is preferably a magnetic material because an induction heating phenomenon can be caused by high frequency. The frequency in the high-frequency induction heating method used in the present invention ranges from 1 KHz to 1 KHz in that the thickness of the heated portion of the mold surface can be controlled.
The range of MHz is particularly preferred.

【0014】本発明に於ける軟化温度とは、JIS K
7207のB法(試験片に加える曲げ応力4.6kgf
/cm2)に規定された方法で測定した熱可塑性樹脂の
荷重たわみ温度より10度低い温度として定義する。本
発明では、金型表面の温度をこのように定義した軟化温
度以上にする必要がある。また、軟化温度は使用する熱
可塑性樹脂により変化させる必要がある。
The softening temperature in the present invention is defined by JIS K
Method B of 7207 (Bending stress applied to test piece 4.6 kgf
/ Cm 2 ) is defined as a temperature 10 degrees lower than the deflection temperature under load of the thermoplastic resin measured by the method specified in ( 2 ). In the present invention, the temperature of the mold surface needs to be equal to or higher than the softening temperature defined in this way. Further, the softening temperature needs to be changed depending on the thermoplastic resin used.

【0015】更に本発明になる成形法を図によって説明
する。図1に示す様に固定側金型と移動側金型の中間に
高周波誘導加熱のインダクタを設置する。移動側金型と
固定側金型との間にインダクタを挟みこみ、挟みこんだ
状態で高周波を発信させたときの金型の温度分布の経時
変化を第2図に示す。このとき金型は冷却水による冷却
は行っていない。金型表面(A点やB点)のみ急激に温
度が上昇し、金型内部(C点やD点)の温度は高周波誘
導加熱によって温度上昇が殆どないことが確認できる。
高周波誘導加熱により金型表面付近を選択的に加熱すれ
ば金型表面付近を急加熱急冷却出来るので成形サイクル
をさほど延長することなく射出成形を可能とし、かつ射
出成形時金型表面が熱可塑性樹脂の加熱変形温度以上に
保たれているため該熱可塑性樹脂が金型冷却中に冷却さ
れ難くなり、必要以上に射出速度や射出圧力を大きくす
ることなく射出成形出来るため、配向歪みによる反りの
発生や、シェアー発熱によるシルバーストリークスの発
生や黄変などの外観不良のない、すなわちフローマーク
や光沢ムラのない、平滑性、光沢の優れた成形品を得る
ことが出来る。
Further, the molding method according to the present invention will be described with reference to the drawings. As shown in FIG. 1, an inductor for high-frequency induction heating is installed between the fixed mold and the movable mold. FIG. 2 shows a time-dependent change in the temperature distribution of the mold when the inductor is sandwiched between the movable mold and the fixed mold and a high frequency is transmitted in the sandwiched state. At this time, the mold was not cooled by the cooling water. It can be confirmed that the temperature rises only at the mold surface (points A and B), and the temperature inside the mold (points C and D) hardly rises due to high-frequency induction heating.
If the vicinity of the mold surface is selectively heated by high-frequency induction heating, the vicinity of the mold surface can be rapidly heated and cooled, enabling injection molding without prolonging the molding cycle, and the mold surface is thermoplastic during injection molding. Since the resin is kept at a temperature higher than the heating deformation temperature, the thermoplastic resin is hardly cooled during cooling of the mold, and can be injection molded without increasing the injection speed and injection pressure more than necessary. A molded product having no appearance defects such as generation of silver streaks due to shear heat generation and yellowing, that is, no flow mark or uneven gloss, and excellent smoothness and gloss can be obtained.

【0016】本発明に於ける偏肉成形品とは、平板状で
断面績が楔形形状を有するものをいい、微細な凹凸形状
を付した面を有していても良い。代表的な断面形状を図
4に示す。本発明でいう熱可塑性樹脂とは、メタクリル
樹脂、ポリカーボネイト樹脂、ポリスチレン、ゴム補強
ポリスチレン、AS樹脂、アクリロニトリルーブタジエ
ンースチレン共重合体、ポリエチレン、ポリプロピレ
ン、ナイロン、変性ポリフェニレンエーテル等が上げら
れるが、特に、メタクリル樹脂またはポリカーボネイト
樹脂が適する。
The uneven thickness molded article in the present invention means a flat-plate shaped article having a wedge-shaped cross section, and may have a surface with fine irregularities. FIG. 4 shows a typical cross-sectional shape. The thermoplastic resin in the present invention, methacrylic resin, polycarbonate resin, polystyrene, rubber-reinforced polystyrene, AS resin, acrylonitrile butadiene-styrene copolymer, polyethylene, polypropylene, nylon, modified polyphenylene ether, etc. , Methacrylic resin or polycarbonate resin is suitable.

【0017】更に上記成形方法によって得られた成形品
の肉厚の比b/aが1/30〜1/2であり、かつ成形
品の薄肉部の厚みが、0.1mmから5mmであり、好
ましくは0.1〜1mmであるような偏肉成形品は外観
不良もなく、液晶表示装置等の光源として利用される偏
肉薄肉タイプ(楔形)のサイドライト式面照明装置(バ
ックライト)用導光板に適する。
Further, the thickness ratio b / a of the molded product obtained by the above molding method is 1/30 to 1/2, and the thickness of the thin portion of the molded product is from 0.1 mm to 5 mm, An uneven thickness molded product having a thickness of preferably 0.1 to 1 mm has no appearance defect, and is used for an uneven thickness thin type (wedge-shaped) sidelight type surface illumination device (backlight) used as a light source for a liquid crystal display device or the like. Suitable for light guide plate.

【0018】最近の液晶表示装置等の大型薄肉化の要求
にもとづき、バックライトに対しても同様の要求が強ま
っており、導光板には大型薄肉で品質の安定した求めら
れている。特に対角の大きさが10インチ以上で、肉厚
の比b/aが1/30〜1/2であり、かつ薄肉部の成
形品の厚みが、0.1mmから5mmであるような楔形
導光板では、過度の成形歪みやウエルドラインの発生を
抑えて成形するのは非常の困難となっている。成形品に
過度の成形歪みが残留していると、反りの原因となり、
導光板をバックライトに組み込んだ時にクラックや輝度
バランスのズレを発生させるので好ましくないが、本発
明になるバックライト用導光板によれば、これらの要求
に応えることができる。
Based on recent demands for large-sized and thin-walled liquid crystal display devices and the like, similar demands have been made for backlights, and light guide plates are required to be large-sized, thin and have stable quality. In particular, a wedge shape in which the diagonal size is 10 inches or more, the thickness ratio b / a is 1/30 to 1/2, and the thickness of the thin-walled molded product is 0.1 mm to 5 mm. It is very difficult to form a light guide plate while suppressing the occurrence of excessive molding distortion and weld lines. If excessive molding distortion remains in the molded product, it may cause warpage,
When the light guide plate is incorporated in the backlight, it is not preferable because cracks and deviation in luminance balance occur. However, the backlight light guide plate according to the present invention can meet these requirements.

【0019】[0019]

【発明の実施の形態】以下に実施例によって本発明をさ
らに詳しく説明するが、本発明はこれら実施例によって
制限されるものではない。本件の各種評価方法は以下の
方法によった。 (1)デルペットR80NH:旭化成工業(株)社製の
メタアクリル樹脂。加熱変形温度100℃、メルトフロ
ーレイト5.9g/10分。 (2)重量の測定 研精工業(株)社製電磁式はかりFAー6000にて測
定する。0.05gの精度にて測定する。 (3)反り量の測定 図3に示す成形品を成形後、70℃のギアオーブン中に
48時間エージングし、23℃×50%RHの恒温室に
て24時間放置後、該恒温室にて以下の手順にて測定す
る。
DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described in more detail with reference to the following examples, but the present invention is not limited to these examples. Various evaluation methods in this case were based on the following methods. (1) Delpet R 80NH: a methacrylic resin manufactured by Asahi Kasei Corporation. Heat deformation temperature: 100 ° C., melt flow rate: 5.9 g / 10 minutes. (2) Measurement of Weight The weight is measured with an electromagnetic balance FA-6000 manufactured by Kensei Industry Co., Ltd. Measure with an accuracy of 0.05 g. (3) Measurement of amount of warpage After molding the molded article shown in FIG. 3, it was aged in a gear oven at 70 ° C. for 48 hours, left in a constant temperature room at 23 ° C. × 50% RH for 24 hours, and then left in the constant temperature room. Measure according to the following procedure.

【0020】まず成形品を金属定盤上にのせ、次いでゲ
ートのある角に5cm角の立法体で重さ約200gの重
りをのせる。この時成形品のイ、ロの箇所で成形品と定
盤との間にできる隙間をダイヤルゲージにて測定する。
First, the molded product is placed on a metal platen, and then a 200 cm weight is placed on a corner having a gate with a 5 cm square cube. At this time, the gap formed between the molded product and the surface plate at the points a and b of the molded product is measured with a dial gauge.

【0021】[0021]

【実施例1】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、図3に示す厚肉部aが2.5mmで薄肉部b
が1.0mmである偏肉タイプの平板を成形した。
Example 1 As a thermoplastic resin, Delpet R 80N was used.
H, a normal S-45C steel material is used as a mold, and a thick part a shown in FIG. 3 is 2.5 mm and a thin part b is shown in FIG. 3 by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd.
Was 1.0 mm.

【0022】インダクタは互いを絶縁した細線からなる
断面積10mm3の銅管を密に、一層の渦巻状にそわせ
型づくり、部分的に耐熱シリコン樹脂を用い、平板状に
固定固化作成する。射出成形条件は、表1に示すが、シ
リンダー温度は溶融した樹脂の温度が250℃になるよ
うに設定した。
The inductor is formed by densely forming a copper tube having a sectional area of 10 mm 3 consisting of fine wires insulated from one another in a spiral shape, and partially fixing and solidifying it in a flat plate shape using heat-resistant silicon resin. The injection molding conditions are shown in Table 1. The cylinder temperature was set such that the temperature of the molten resin was 250 ° C.

【0023】デルペットR80NHを射出成形する前に
上述のインダクタを金型キャビティ表面から5mmの位
置に近づけ、25KHz、30KWの高周波電源によ
り、6秒間金型を加熱し、しかる後インダクタを金型間
より抜き出し、金型を閉じ射出成形を開始する。樹脂充
填時の金型表面温度は118℃であった。表1に示す充
填速度にて3秒間射出し、30Kgf/cm2の保圧を
1秒間加えた後30秒間冷却後、成形品を取り出した。
全成形サイクルは50秒であった。
Before the injection molding of Delpet R 80NH, the above-mentioned inductor is brought close to the position 5 mm from the surface of the mold cavity, the mold is heated by a high frequency power supply of 25 KHz and 30 KW for 6 seconds, and then the inductor is removed from the mold. Then, the mold is closed and injection molding is started. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed at a filling speed shown in Table 1 for 3 seconds, a holding pressure of 30 kgf / cm 2 was applied for 1 second, and after cooling for 30 seconds, the molded product was taken out.
The entire molding cycle was 50 seconds.

【0024】[0024]

【比較例1】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例1と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例1、比較例1とも、成形品の重量を(2)のはかりを
用いて0.05gの精度にて測定し、予めフル充填して
おいた成形品の重さで除して、充填率とし結果を表1に
示した。
Comparative Example 1 Injection molding was performed under the same conditions as in Example 1 except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In both Example 1 and Comparative Example 1, the weight of the molded article was measured with the accuracy of 0.05 g using the scale of (2), and divided by the weight of the molded article which had been fully filled in advance, and then filled. The results are shown in Table 1 below.

【0025】[0025]

【実施例2】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、実施例1と同じ偏肉タイプの平板を成形し
た。インダクタは互いを絶縁した細線からなる断面積1
0mm3の銅管を密に、一層の渦巻状にそわせ型づく
り、部分的に耐熱シリコン樹脂を用い、平板状に固定固
化作成する。
EXAMPLE 2 Dell thermoplastic resin Pet R 80 N
Using H, a normal S-45C steel material was used as a mold, and the same uneven thickness type flat plate as in Example 1 was formed by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. The inductor has a cross-sectional area 1 consisting of fine wires insulated from each other.
A copper tube of 0 mm 3 is densely formed in a spiral shape to form a mold, and a heat-resistant silicon resin is partially used to fix and solidify it in a flat plate shape.

【0026】射出成形条件は、表1に示すが、シリンダ
ー温度は溶融した樹脂の温度が250℃になるように設
定した。デルペットR80NHを射出成形する前に上述
のインダクタを金型キャビティ表面から5mmの位置に
近づけ、25KHz、30KWの高周波電源により、6
秒間金型を加熱し、しかる後インダクタを金型間より抜
き出し、金型を閉じ射出成形を開始する。樹脂充填時の
金型表面温度は118℃であった。表1に示す充填速度
にて3秒間射出し、50Kgf/cm2の保圧を1秒間
加えた後30秒間冷却後、成形品を取り出した。全成形
サイクルは50秒であった。
The injection molding conditions are shown in Table 1. The cylinder temperature was set such that the temperature of the molten resin was 250 ° C. Before the injection molding of Delpet R 80NH, the above-mentioned inductor was brought close to a position 5 mm from the surface of the mold cavity, and a high frequency power supply of 25 KHz and 30 KW was used.
The mold is heated for a second, and then the inductor is pulled out from between the molds, and the mold is closed to start injection molding. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed for 3 seconds at a filling speed shown in Table 1, a holding pressure of 50 kgf / cm 2 was applied for 1 second, and after cooling for 30 seconds, a molded product was taken out. The entire molding cycle was 50 seconds.

【0027】[0027]

【比較例2】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例2と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例2、比較例2とも、成形品の重量を(2)のはかりを
用いて0.05gの精度にて測定し、予めフル充填して
おいた成形品の重さで除して、充填率とし結果を表1に
示した。
Comparative Example 2 Injection molding was performed under the same conditions as in Example 2 except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In both Example 2 and Comparative Example 2, the weight of the molded article was measured with the scale of (2) with an accuracy of 0.05 g, and divided by the weight of the molded article which had been fully filled in advance. The results are shown in Table 1 below.

【0028】[0028]

【実施例3】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、実施例1と同じ偏肉タイプの平板を成形し
た。インダクタは互いを絶縁した細線からなる断面積1
0mm3の銅管を密に、一層の渦巻状にそわせ型づく
り、部分的に耐熱シリコン樹脂を用い、平板状に固定固
化作成する。
Example 3 As a thermoplastic resin, Delpet R 80N
Using H, a normal S-45C steel material was used as a mold, and the same uneven thickness type flat plate as in Example 1 was formed by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. The inductor has a cross-sectional area 1 consisting of fine wires insulated from each other.
A copper tube of 0 mm 3 is densely formed in a spiral shape to form a mold, and a heat-resistant silicon resin is partially used to fix and solidify it in a flat plate shape.

【0029】射出成形条件は、表1に示すが、シリンダ
ー温度は溶融した樹脂の温度が250℃になるように設
定した。デルペットR80NHを射出成形する前に上述
のインダクタを金型キャビティ表面から5mmの位置に
近づけ、25KHz、30KWの高周波電源により、6
秒間金型を加熱し、しかる後インダクタを金型間より抜
き出し、金型を閉じ射出成形を開始する。樹脂充填時の
金型表面温度は118℃であった。表1に示す充填速度
にて3秒間射出し、70Kgf/cm2の保圧を1秒間
加えた後30秒間冷却後、成形品を取り出した。全成形
サイクルは50秒であった。
The injection molding conditions are shown in Table 1. The cylinder temperature was set so that the temperature of the molten resin became 250 ° C. Before the injection molding of Delpet R 80NH, the above-mentioned inductor was brought close to a position 5 mm from the surface of the mold cavity, and a high frequency power supply of 25 KHz and 30 KW was used.
The mold is heated for a second, and then the inductor is pulled out from between the molds, and the mold is closed to start injection molding. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed for 3 seconds at a filling speed shown in Table 1, a holding pressure of 70 kgf / cm 2 was applied for 1 second, and after cooling for 30 seconds, a molded product was taken out. The entire molding cycle was 50 seconds.

【0030】[0030]

【比較例3】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例3と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例3、比較例3とも、成形品の重量を(2)のはかりを
用いて0.05gの精度にて測定し、予めフル充填して
おいた成形品の重さで除して、充填率とし結果を表1に
示した。
Comparative Example 3 Injection molding was performed under the same conditions as in Example 3 except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In each of Example 3 and Comparative Example 3, the weight of the molded article was measured with the accuracy of 0.05 g using the scale of (2), and divided by the weight of the molded article which had been fully filled in advance, and then filled. The results are shown in Table 1 below.

【0031】[0031]

【実施例4】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、実施例1と同じ偏肉タイプの平板を成形し
た。インダクタは互いを絶縁した細線からなる断面積1
0mm3の銅管を密に、一層の渦巻状にそわせ型づく
り、部分的に耐熱シリコン樹脂を用い、平板状に固定固
化作成する。
Example 4 As a thermoplastic resin, Delpet R 80N
Using H, a normal S-45C steel material was used as a mold, and the same uneven thickness type flat plate as in Example 1 was formed by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. The inductor has a cross-sectional area 1 consisting of fine wires insulated from each other.
A copper tube of 0 mm 3 is densely formed in a spiral shape to form a mold, and a heat-resistant silicon resin is partially used to fix and solidify it in a flat plate shape.

【0032】射出成形条件は、表2に示すが、シリンダ
ー温度は溶融した樹脂の温度が250℃になるように設
定した。デルペットR80NHを射出成形する前に上述
のインダクタを金型キャビティ表面から5mmの位置に
近づけ、25KHz、30KWの高周波電源により、6
秒間金型を加熱し、しかる後インダクタを金型間より抜
き出し、金型を閉じ射出成形を開始する。樹脂充填時の
金型表面温度は118℃であった。100mm/sの充
填速度にて3秒間射出し、70Kgf/cm2の保圧を
1秒間加えた後30秒間冷却後、成形品を取り出した。
全成形サイクルは50秒であった。
The injection molding conditions are shown in Table 2. The cylinder temperature was set such that the temperature of the molten resin was 250 ° C. Before the injection molding of Delpet R 80NH, the above-mentioned inductor was brought close to a position 5 mm from the surface of the mold cavity, and a high frequency power supply of 25 KHz and 30 KW was used.
The mold is heated for a second, and then the inductor is pulled out from between the molds, and the mold is closed to start injection molding. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed at a filling speed of 100 mm / s for 3 seconds, a holding pressure of 70 kgf / cm 2 was applied for 1 second, and after cooling for 30 seconds, the molded product was taken out.
The entire molding cycle was 50 seconds.

【0033】得られた成形品はソリ、ウエルドラインが
なく導光板として用いるのに最適であった。
The obtained molded product had no warp or weld line and was most suitable for use as a light guide plate.

【0034】[0034]

【比較例4】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例4と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例4、比較例4とも、成形品を70℃のギアオーブン中
に48時間エージングし、23℃×50%RHの恒温室
にて24時間放置後、(3)の方法にて反り量を測定
し、目視観察によってウエルドラインの有無を観察し結
果を表2に示した。
Comparative Example 4 Injection molding was performed under the same conditions as in Example 4 except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In both Example 4 and Comparative Example 4, the molded product was aged in a gear oven at 70 ° C. for 48 hours, left in a constant temperature room at 23 ° C. × 50% RH for 24 hours, and then the amount of warpage was determined by the method (3). The measurement was performed, and the presence or absence of a weld line was observed by visual observation. The results are shown in Table 2.

【0035】[0035]

【実施例5】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、実施例1と同じ偏肉タイプの平板を成形し
た。インダクタは互いを絶縁した細線からなる断面積1
0mm3の銅管を密に、一層の渦巻状にそわせ型づく
り、部分的に耐熱シリコン樹脂を用い、平板状に固定固
化作成する。
EXAMPLE 5 Del thermoplastic resin Pet R 80 N
Using H, a normal S-45C steel material was used as a mold, and the same uneven thickness type flat plate as in Example 1 was formed by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. The inductor has a cross-sectional area 1 consisting of fine wires insulated from each other.
A copper tube of 0 mm 3 is densely formed in a spiral shape to form a mold, and a heat-resistant silicon resin is partially used to fix and solidify it in a flat plate shape.

【0036】射出成形条件は、表2に示すが、シリンダ
ー温度は溶融した樹脂の温度が250℃になるように設
定した。デルペットR80NHを射出成形する前に上述
のインダクタを金型キャビティ表面から5mmの位置に
近づけ、25KHz、30KWの高周波電源により、6
秒間金型を加熱し、しかる後インダクタを金型間より抜
き出し、金型を閉じ射出成形を開始する。樹脂充填時の
金型表面温度は118℃であった。100mm/sの充
填速度にて3秒間射出し、70Kgf/cm2の保圧を
1秒間加えた後25秒間冷却後、成形品を取り出した。
全成形サイクルは45秒であった。
The injection molding conditions are shown in Table 2, and the cylinder temperature was set such that the temperature of the molten resin became 250 ° C. Before the injection molding of Delpet R 80NH, the above-mentioned inductor was brought close to a position 5 mm from the surface of the mold cavity, and a high frequency power supply of 25 KHz and 30 KW was used.
The mold is heated for a second, and then the inductor is pulled out from between the molds, and the mold is closed to start injection molding. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed at a filling speed of 100 mm / s for 3 seconds, a holding pressure of 70 kgf / cm 2 was applied for 1 second, and after cooling for 25 seconds, the molded product was taken out.
The entire molding cycle was 45 seconds.

【0037】得られた成形品はソリ、ウエルドラインが
なく導光板として用いるのに最適であった。
The obtained molded product had no warp or weld line and was most suitable for use as a light guide plate.

【0038】[0038]

【比較例5】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例5と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例5、比較例5とも、成形品を70℃のギアオーブン中
に48時間エージングし、23℃×50%RHの恒温室
にて24時間放置後、(3)の方法にて反り量を測定
し、目視観察によってウエルドラインの有無を観察し結
果を表2に示した。
Comparative Example 5 Injection molding was performed under the same conditions as in Example 5 except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In each of Example 5 and Comparative Example 5, the molded product was aged in a gear oven at 70 ° C. for 48 hours, left in a constant temperature room at 23 ° C. × 50% RH for 24 hours, and then the amount of warpage was determined by the method (3). The measurement was performed, and the presence or absence of a weld line was observed by visual observation. The results are shown in Table 2.

【0039】[0039]

【実施例6】熱可塑性樹脂としてはデルペットR80N
Hを使用し、金型としては通常のS−45C鋼材を用
い、住友重機械工業(株)社製SG100型射出成形機
によって、実施例1と同じ偏肉タイプの平板を成形し
た。インダクタは互いを絶縁した細線からなる断面積1
0mm3の銅管を密に、一層の渦巻状にそわせ型づく
り、部分的に耐熱シリコン樹脂を用い、平板状に固定固
化作成する。
Embodiment 6 As a thermoplastic resin, Delpet R 80N is used.
Using H, a normal S-45C steel material was used as a mold, and the same uneven thickness type flat plate as in Example 1 was formed by an SG100 type injection molding machine manufactured by Sumitomo Heavy Industries, Ltd. The inductor has a cross-sectional area 1 consisting of fine wires insulated from each other.
A copper tube of 0 mm 3 is densely formed in a spiral shape to form a mold, and a heat-resistant silicon resin is partially used to fix and solidify it in a flat plate shape.

【0040】射出成形条件は、表2に示すが、シリンダ
ー温度は溶融した樹脂の温度が250℃になるように設
定した。デルペットR80NHを射出成形する前に上述
のインダクタを金型キャビティ表面から5mmの位置に
近づけ、25KHz、30KWの高周波電源により、6
秒間金型を加熱し、しかる後インダクタを金型間より抜
き出し、金型を閉じ射出成形を開始する。樹脂充填時の
金型表面温度は118℃であった。100mm/sの充
填速度にて3秒間射出し、100Kgf/cm2の保圧
を1秒間加えた後30秒間冷却後、成形品を取り出し
た。全成形サイクルは50秒であった。
The injection molding conditions are shown in Table 2. The cylinder temperature was set so that the temperature of the molten resin was 250 ° C. Before the injection molding of Delpet R 80NH, the above-mentioned inductor was brought close to a position 5 mm from the surface of the mold cavity, and a high frequency power supply of 25 KHz and 30 KW was used.
The mold is heated for a second, and then the inductor is pulled out from between the molds, and the mold is closed to start injection molding. The mold surface temperature at the time of filling the resin was 118 ° C. Injection was performed at a filling speed of 100 mm / s for 3 seconds, a holding pressure of 100 kgf / cm 2 was applied for 1 second, and after cooling for 30 seconds, the molded product was taken out. The entire molding cycle was 50 seconds.

【0041】得られた成形品はソリ、ウエルドラインが
なく導光板として用いるのに最適であった。
The obtained molded product had no warp or weld line and was most suitable for use as a light guide plate.

【0042】[0042]

【比較例6】インダクタを金型の間に挟みこむ工程を行
なわない以外は実施例6と同様の条件にて射出成形し
た。樹脂充填時の金型表面温度は58℃であった。実施
例6、比較例6とも、成形品を70℃のギアオーブン中
に48時間エージングし、23℃×50%RHの恒温室
にて24時間放置後、(3)の方法にて反り量を測定
し、目視観察によってウエルドラインの有無を観察し結
果を表2に示した。
Comparative Example 6 Injection molding was performed under the same conditions as in Example 6, except that the step of sandwiching the inductor between the molds was not performed. The mold surface temperature at the time of filling the resin was 58 ° C. In both Example 6 and Comparative Example 6, the molded product was aged in a gear oven at 70 ° C. for 48 hours, left in a constant temperature room at 23 ° C. × 50% RH for 24 hours, and then the amount of warpage was determined by the method (3). The measurement was performed, and the presence or absence of a weld line was observed by visual observation. The results are shown in Table 2.

【0043】[0043]

【表1】 [Table 1]

【0044】[0044]

【表2】 [Table 2]

【0045】[0045]

【発明の効果】本発明により、経済的に偏肉薄肉成形品
を射出成形することができ、得られた偏肉薄肉成形品は
外観良好で導光板として適している。
According to the present invention, an uneven thickness thin molded product can be economically injection molded, and the obtained uneven thickness thin molded product has a good appearance and is suitable as a light guide plate.

【0046】[0046]

【図面の簡単な説明】[Brief description of the drawings]

【0047】[0047]

【図1】本発明の実施態様の概念図FIG. 1 is a conceptual diagram of an embodiment of the present invention.

【0048】[0048]

【図2】図1に示す装置での金型の温度分布の一例FIG. 2 shows an example of a temperature distribution of a mold in the apparatus shown in FIG.

【0049】[0049]

【図3】本実施例に用いた成形品の概念図FIG. 3 is a conceptual diagram of a molded product used in the present embodiment.

【0050】[0050]

【図4】偏肉成形品の断面図FIG. 4 is a sectional view of an uneven thickness molded product.

【0051】[0051]

【符号の説明】[Explanation of symbols]

A、B、C、D 金型温度の測定位置 a 成形品の厚肉部 b 成形品の薄肉部 イ ソリの測定位置 ロ ソリの測定位置 A, B, C, D Measuring position of mold temperature a Thick part of molded product b Thin part of molded product

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 庁内整理番号 FI 技術表示箇所 B29K 101:12 B29L 11:00 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 6 Identification code Agency reference number FI Technical display location B29K 101: 12 B29L 11:00

Claims (5)

【特許請求の範囲】[Claims] 【請求項1】 熱可塑性樹脂を用いて、厚肉部aと薄肉
部bの比b/aが1/30〜1/2であり、成形品の薄
肉部の厚みが0.1〜5mmである偏肉成形品を射出成
形する方法に於いて、成形品表面を形成させるべき金型
表面を予め該熱可塑性樹脂の軟化温度以上に高周波誘導
加熱しておき射出成形することを特徴とする偏肉成形品
の射出成形方法。
1. Using a thermoplastic resin, the ratio b / a of the thick part a to the thin part b is 1/30 to 1/2, and the thickness of the thin part of the molded product is 0.1 to 5 mm. In a method of injection-molding a certain uneven molded product, a mold surface on which a molded product surface is to be formed is subjected to high-frequency induction heating in advance to a temperature higher than a softening temperature of the thermoplastic resin and injection-molded. Injection molding method for meat molded products.
【請求項2】 成形品の薄肉部の厚みが、O.1mmか
ら1mmであることを特徴とする請求項1の射出成形方
法。
2. The molded article according to claim 1, wherein said thin portion has a thickness of O.D. 2. The injection molding method according to claim 1, wherein the distance is 1 mm to 1 mm.
【請求項3】 熱可塑性樹脂が、メタクリル樹脂または
ポリカーボネイト樹脂であることを特徴とする請求項1
の射出成形方法。
3. The method according to claim 1, wherein the thermoplastic resin is a methacrylic resin or a polycarbonate resin.
Injection molding method.
【請求項4】 熱可塑性樹脂からなり、請求項1記載の
射出成形方法で成形された偏肉成形品であって、b/a
の比が1/30〜1/2であり、かつ薄肉部の成形品の
厚みが、0.1mmから5mmであることを特徴とする
偏肉成形品。
4. An uneven thickness molded article made of a thermoplastic resin and molded by the injection molding method according to claim 1, wherein b / a
Characterized by a ratio of 1/30 to 1/2, and a thickness of the thin-walled molded product is from 0.1 mm to 5 mm.
【請求項5】 請求項4の偏肉成形品からなるサイドラ
イト式面照明装置(バックライト)用導光板。
5. A light guide plate for a sidelight-type surface illumination device (backlight), comprising the unevenly molded product according to claim 4.
JP20689996A 1996-08-06 1996-08-06 Injection molding method for molding with uneven thickness Withdrawn JPH1044203A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20689996A JPH1044203A (en) 1996-08-06 1996-08-06 Injection molding method for molding with uneven thickness

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20689996A JPH1044203A (en) 1996-08-06 1996-08-06 Injection molding method for molding with uneven thickness

Publications (1)

Publication Number Publication Date
JPH1044203A true JPH1044203A (en) 1998-02-17

Family

ID=16530913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20689996A Withdrawn JPH1044203A (en) 1996-08-06 1996-08-06 Injection molding method for molding with uneven thickness

Country Status (1)

Country Link
JP (1) JPH1044203A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326356A (en) * 1999-03-15 2000-11-28 Sumitomo Chem Co Ltd Manufacture of light guiding plate made of acrylic resin
JP2007223143A (en) * 2006-02-23 2007-09-06 Sumitomo Chemical Co Ltd Method for molding thermoplastic resin molding
JP2008246776A (en) * 2007-03-29 2008-10-16 Sumitomo Chemical Co Ltd Mold for molding thermoplastic resin and manufacturing method of thermoplastic resin molded object
JP2011025458A (en) * 2009-07-22 2011-02-10 Sumitomo Chemical Co Ltd Method for manufacturing thin-wall molding
KR20170138021A (en) * 2016-06-06 2017-12-14 최현범 Eumpan the mold with a lid

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000326356A (en) * 1999-03-15 2000-11-28 Sumitomo Chem Co Ltd Manufacture of light guiding plate made of acrylic resin
JP2007223143A (en) * 2006-02-23 2007-09-06 Sumitomo Chemical Co Ltd Method for molding thermoplastic resin molding
JP2008246776A (en) * 2007-03-29 2008-10-16 Sumitomo Chemical Co Ltd Mold for molding thermoplastic resin and manufacturing method of thermoplastic resin molded object
JP2011025458A (en) * 2009-07-22 2011-02-10 Sumitomo Chemical Co Ltd Method for manufacturing thin-wall molding
KR20170138021A (en) * 2016-06-06 2017-12-14 최현범 Eumpan the mold with a lid

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