JPH1041200A - Method for forming terminal electrode in chip type electronic device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a terminal electrode of desired thickness on the side face of an electronic device element accurately with high productivity. SOLUTION: A plurality of mask plates 13 having an opening 13A are arranged on the side face 11A of juxtaposed electronic device elements 11 such that the opening 13A is located at a position for forming an electrode. A paste 15 for forming electrode is then developed by means of a squeegee 14 and applied through the opening 13A to the side face 11A of the electronic device element 11. Consequently, a predetermined quantity of paste can be applied surely to the side face 11A of the electronic device element depending on the depth of the opening (thickness of the mask plate). Quantity of the paste can be regulated easily by altering the thickness of the mask plate and a terminal electrode of desired thickness can be formed uniformly and accurately. Several hundreds to several thousands of electronic device elements can be processed when they are juxtaposed previously according to the number of openings in the mask plate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for forming a terminal electrode of a chip-type electronic component, and more particularly, to form a terminal electrode having a desired thickness with high productivity on a side surface of a rectangular parallelepiped electronic component body. About the method.

[0002]

2. Description of the Related Art Three-terminal capacitors, two-element capacitors,
Chip-type electronic components such as LC composite EMI filters are shown in FIG.
As shown in FIG. 1, terminal electrodes (signal electrodes) 2 and 2 are formed on a pair of parallel end faces of a rectangular parallelepiped electronic component body 1, and terminal electrodes (ground electrodes) are also provided on side faces between the end faces.
The formation of 3, 3 has three terminals or more.

Conventionally, the terminal electrodes on the side surfaces of such a chip-type electronic component are formed as follows. That is,
First, FIG. 7 (a) (side view), (b) (B in FIG. 7 (a))
As shown in a cross-sectional view taken along the line B), the electronic component bodies 1 are arranged in parallel with the terminal electrode forming side surface 1A facing upward. And
As shown in FIGS. 7 (a) and 7 (b) and FIG. 6 (a) (enlarged view of FIG. 7 (b)), the blade 4 having an appropriate thickness and having a groove 4A at the tip portion is inserted into the groove 4A. By applying an appropriate amount of the electrode forming paste 5 and pressing it against the side surface 1A of the electronic component body 1, the paste 5 is transferred to the body 1 as shown in FIG. Thereafter, by firing, the side surface 1A of the electronic component body 1 is formed as shown in FIG.
The terminal electrode 3 is formed.

[0004]

However, in the above-mentioned conventional method for forming a terminal electrode, when the blade is applied to the element body and the paste is transferred, the paste remains in the groove at the tip of the blade, and the paste is removed. Variation in coating amount,
There has been a problem that the thickness of the formed electrode tends to fluctuate. Further, the number of electronic component bodies to be processed at one time is limited, and there is a problem that mass productivity is not good.

The present invention solves the above-mentioned conventional problems, and enables a terminal electrode having a desired thickness to be accurately formed on a side surface of an electronic component element body, and has a good mass productivity. It is an object to provide a forming method.

[0006]

According to a method for forming a terminal electrode of a chip-type electronic component of the present invention, an electrode-forming paste is applied to a side face between a pair of parallel end faces of a rectangular parallelepiped electronic component body. In the method for forming a terminal electrode of a chip-type electronic component in which a terminal electrode is formed by firing and baking, a plurality of electronic component bases are scheduled to be applied to each of the electronic component bases when applying the electrode forming paste. A plurality of mask plates each having a plurality of openings are superposed on the side of the electronic component body where the paste is to be applied, and the openings are pasted on the side surfaces of the respective electronic component bodies. A paste is spread on the mask plate using a squeegee, and the paste is applied to the side surface of the electronic component body through the opening.

[0007] In a method in which an electrode forming paste is spread on a mask plate by a squeegee and the paste is applied to the side surface of the electronic component body through an opening of the mask plate,
A predetermined amount of paste corresponding to the depth of the opening, that is, the thickness of the mask plate can be reliably applied to the side surface of the electronic component body.

Further, by changing the thickness of the mask plate, the amount of the paste to be easily applied can be increased or decreased.

For this reason, a terminal electrode having a desired thickness can be formed with high precision without variation in thickness. Moreover, by arranging a large number of electronic component bodies in parallel according to the numerical aperture of the mask plate, it is possible to process several hundred to several thousand pieces, and the mass productivity is remarkably improved.

It is preferable that the electronic component bodies are held in parallel by holding them with a holder in terms of stable holding of the electronic component bodies. In this case, a recess for accommodating the electronic component body and a bottom surface of the recess are provided. It is preferable that the electronic component body is sucked into the concave portion by inserting the electronic component body into the concave portion and sucking the electronic component body into the concave portion by using a holder having a suction hole that opens.

[0011]

Embodiments of the present invention will be described below with reference to the drawings.

FIGS. 1A to 1C are sectional views showing an example of a procedure for forming terminal electrodes of a chip-type electronic component according to the present invention.
2 is a plan view illustrating an example of a mask plate used in the present invention, FIG. 3 is a perspective view illustrating a method of arranging the mask plate, and FIG. 4 is a side view illustrating a method of developing a paste using a squeegee.

In this embodiment, a plurality of recesses 12A for accommodating the electronic component body 11 and the recesses 12A are provided.
A having a suction hole 12B opening on the bottom surface of A
And a mask plate 13 having a plurality of openings 13A. First, the plurality of electronic component bodies 11 are inserted into the recesses 12A of the holder 12, and the paste-applied side surfaces of the electronic component bodies 11 (terminal electrodes). The electronic component body 11 is sucked from the suction hole 12B so as to be stably held in the recess 12A (FIG. 1 (a)). This suction is continued until the application of the electrode forming paste is completed.

Next, side surfaces 1 of a plurality of electronic component bodies 11 in which mask plates 13 with openings shown in FIG.
1A, the opening 1 of the mask plate 13 (FIG. 3).
3A is arranged so as to be located at the paste application scheduled portion on the side surface 11A of each electronic component body 11.

Thereafter, the squeegee 14 is moved on the mask plate 13 to spread the electrode forming paste 15 on the mask plate 13, and the electrode forming paste 15 is formed on the side surface 11 A of the electronic component body 11 through the opening 13 A of the mask plate 13. The paste 15 is applied by a printing method (FIG. 1)
(B), FIG. 4). As a result, the paste 15 is
It can be applied to a predetermined thickness corresponding to the depth of A, that is, the thickness of the mask plate 13. Further, by changing the thickness of the mask plate, the paste application thickness, that is, the thickness of the terminal electrode to be formed can be easily adjusted.

After the paste is applied, the mask plate 13 is removed (FIG. 1C), and dried and fired according to a conventional method to form terminal electrodes.

In the present invention, the mask plate is usually 0.8 to 1.4 mm × 1.0 to 1.4.
Hundreds to thousands of openings with a thickness of about 0.0
A metal plate of about 5 to 0.5 mm made of stainless steel, aluminum, or the like is used, and thereby, the electrode forming paste is applied to hundreds to thousands of electronic component bodies in one process. It becomes possible.

[0018]

The present invention will be described more specifically with reference to the following examples.

Example 1 According to the method of the present invention shown in FIGS. 1 to 4, a paste for forming an electrode was applied to the side surface of the electronic component body.

The electronic component body is 4.5 mm × 1.6 mm ×
1.2 mm (thickness), and the mask plate is
This is a 0.05 mm thick aluminum plate provided with 300 openings of 1.4 mm × 1.2 mm.

After application of the electrode forming paste, the electronic component element body is placed in a drier while being held by the holder, and placed at 150 ° C. for 1 hour.
Dry for 5 minutes.

Thereafter, an electrode-forming paste was applied to the opposite side surface in the same manner, dried and fired at 750 ° C. for 5 minutes to form a terminal electrode.

The formed terminal electrode is 1.4 mm × 1.
The thickness was 2 mm and 0.04 mm, there was no variation in thickness, and terminal electrodes having almost the same thickness could be formed for all the electronic component bodies.

Example 2 In Example 1, 3.2 mm × 3.2 mm ×
1.6 mm × 1.2 mm (thickness) is used, and a mask plate is 1.1 mm × 1.2 mm × 0.25 mm
In the second embodiment, a thicker mask plate was used than in the first embodiment, so that the electrode forming paste was also thickly applied, and the thick terminal was formed. An electrode was formed.

The formed terminal electrode is 1.1 mm × 1.
The thickness was 2 mm and 0.2 mm, there was no variation in thickness, and terminal electrodes having almost the same thickness could be formed for all the electronic component bodies.

[0026]

As described in detail above, according to the method for forming a terminal electrode of a chip-type electronic component of the present invention, the terminal electrodes on the side surfaces of the chip-type electronic component can be formed with a high precision and a desired thickness. It can be formed with good mass productivity.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view illustrating an embodiment of a method for forming a terminal electrode of a chip-type electronic component according to the present invention.

FIG. 2 is a plan view showing one embodiment of a mask plate used in the present invention.

FIG. 3 is a perspective view showing an embodiment of a method for forming a terminal electrode of a chip-type electronic component according to the present invention.

FIG. 4 is a side view showing an embodiment of the method for forming terminal electrodes of a chip-type electronic component according to the present invention.

FIG. 5 is a perspective view of a three-terminal chip type electronic component.

FIGS. 6A and 6B are cross-sectional views showing a conventional method of forming a terminal electrode, and FIG. 6C is a perspective view of the same.

7A is a side view showing a conventional method of forming a terminal electrode, and FIG. 7B is a cross-sectional view taken along the line BB of FIG. 7A.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component body 2, 3 Terminal electrode 4 Blade 5 paste 11 Electronic component body 12 Holder 12A Depression 12B Suction hole 13 Mask plate 13A Opening 14 Squeegee 15 Electrode forming paste

Claims (3)

[Claims] 1. A terminal electrode for a chip-type electronic component in which a terminal electrode is formed by applying and firing an electrode forming paste on a side surface between a pair of parallel end surfaces of a rectangular parallelepiped electronic component body. In the method, in applying the paste for forming an electrode, a plurality of electronic component bodies are arranged in parallel such that the side to be applied with the paste of each electronic component body faces upward. A mask plate with a plurality of openings is superimposed on the side to which the paste is to be applied, and the openings are arranged at the places where the paste is to be applied on the side of each electronic component body, and the paste is spread on the mask plate using a squeegee. And applying the paste to the side surface of the electronic component body through the opening. 2. The method according to claim 1, wherein the plurality of electronic component element bodies are held by a holder and are arranged upwardly in parallel. 3. The holder according to claim 2, wherein the holder has a concave portion for accommodating the electronic component element, and a suction hole opened on a bottom surface of the concave part. A method of forming a terminal electrode of a chip-type electronic component, wherein the electronic component body is sucked and held in a recess by inserting the electronic component into the recess and sucking the electronic component from the suction hole.