JPH10338855A - Adhesive for conductive tile and conductive floor prepared by using the same - Google Patents
Adhesive for conductive tile and conductive floor prepared by using the sameInfo
- Publication number
- JPH10338855A JPH10338855A JP15235997A JP15235997A JPH10338855A JP H10338855 A JPH10338855 A JP H10338855A JP 15235997 A JP15235997 A JP 15235997A JP 15235997 A JP15235997 A JP 15235997A JP H10338855 A JPH10338855 A JP H10338855A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive
- conductive
- resin
- tile
- floor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Floor Finish (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Elimination Of Static Electricity (AREA)
- Conductive Materials (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、導電性タイル用接
着剤、より詳しくは、美観を維持しつつ導電性タイルを
施工できる接着剤と、それを用いた導電性床とに関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive for a conductive tile, and more particularly, to an adhesive capable of constructing a conductive tile while maintaining an aesthetic appearance, and a conductive floor using the adhesive.
【０００２】[0002]
【従来の技術】手術室のように、可燃性の麻酔ガスを使
用する場所においては、患者や手術用器具等に蓄積した
静電気によって引火爆発が生じるおそれがある。また、
コンピュータ室、集積回路（ＩＣ）組立工場等において
は、静電気によって素子が破損したり、静電気によるゴ
ミやホコリの付着によって不良品が生じるといったおそ
れがある。従って、これらの部屋の床には、静電気が生
じないように導電性を付与することが求められている。2. Description of the Related Art In a place where a combustible anesthetic gas is used, such as an operating room, there is a fear that static electricity accumulated in a patient or a surgical instrument may cause a flash explosion. Also,
In a computer room, an integrated circuit (IC) assembly factory, or the like, elements may be damaged by static electricity, or defective products may be caused by adhesion of dust or dust due to static electricity. Therefore, it is required that the floors of these rooms have conductivity so that static electricity is not generated.
【０００３】従来より、導電性を有する床（以下、「導
電性床」という）としては、カーボンブラック、グラフ
ァイト、銅粉末、酸化亜鉛等の導電性物質を配合した樹
脂組成物を床面上に塗布した導電性塗床が知られている
（特開昭５６−１５９２７３号公報、特開昭５８−９４
７９号公報、特開昭５８−４２６７０号公報、特公平２
−６１７９９号公報）。[0003] Conventionally, as a floor having conductivity (hereinafter referred to as "conductive floor"), a resin composition containing a conductive material such as carbon black, graphite, copper powder, zinc oxide or the like is placed on the floor. A coated conductive coating is known (JP-A-56-159273, JP-A-58-94).
No. 79, JP-A-58-42670, Japanese Patent Publication No.
-61799).
【０００４】一方近年、上記導電性塗床に代えて、導電
性を有する陶磁器タイル（以下、「導電性タイル」とい
う）を床に敷設した導電性床が使用されつつある（実開
平２−６４６３８号公報、特開昭６３−２６５０６８号
公報）。この導電性タイルを用いた導電性床は、タイル
単位を取り替えることで局部的な補修を容易に行えるこ
と、床材がタイルであることから運搬や施工が容易であ
ること、種々のタイルを組み合わせることで床の模様等
を容易に設定できること等の利点を有する。On the other hand, in recent years, a conductive floor in which a ceramic tile having conductivity (hereinafter referred to as “conductive tile”) is laid on the floor is being used instead of the conductive coated floor (Japanese Utility Model Laid-Open No. 2-64638). JP-A-63-265068. The conductive floor using this conductive tile can be easily repaired locally by replacing the tile unit, it can be easily transported and constructed because the floor material is a tile, and it combines various tiles This has the advantage that the floor pattern and the like can be easily set.
【０００５】[0005]
【発明が解決しようとする課題】導電性タイルを施工す
る方法には種々の方法が知られているが、施工が容易で
あるという観点から、特公平４−４４２５号公報、特公
平１−５８２９３号公報、特開昭６３−２７７３６３号
公報に記載の、導電性を有する接着剤を用いて、前記タ
イルを床に接着する方法が好適に用いられている。Various methods are known for constructing conductive tiles. From the viewpoint of ease of construction, Japanese Patent Publication No. 4-4425 and Japanese Patent Publication No. 1-58293 are known. The method of bonding the tile to the floor using a conductive adhesive described in JP-A-63-277363 and JP-A-63-277363 is suitably used.
【０００６】しかしながら、上記公報に記載の接着剤
は、エポキシ樹脂、ポリウレタン樹脂、不飽和ポリエス
テル樹脂、これらの変性物（例えばエポキシ変性ポリエ
ステル）等に、導電性充填剤としてのカーボンブラッ
ク、グラファイト、または金、銀、銅等の金属粉を配合
して得られるものであって、かかる導電性充填剤に起因
して黒色や金属光沢を呈している。[0006] However, the adhesive described in the above-mentioned publications can be used in combination with an epoxy resin, a polyurethane resin, an unsaturated polyester resin, a modified product thereof (for example, an epoxy-modified polyester), and the like, as a conductive filler such as carbon black, graphite, or the like. It is obtained by blending a metal powder such as gold, silver, and copper, and exhibits black or metallic luster due to the conductive filler.
【０００７】このため、導電性タイル単位の接合部であ
る目地部から接着剤がはみ出ると導電性タイルの美観が
損なわれるという問題があった。そこで本発明の目的
は、美観を損なうことなく施工できる導電性タイル用接
着剤と、導電性床とを提供することである。また、本発
明の他の目的は、導電性タイルの色に応じて着色できる
導電性タイル用接着剤を提供することである。[0007] For this reason, there has been a problem that the appearance of the conductive tile is impaired if the adhesive protrudes from the joint portion, which is the joint portion of the conductive tile unit. Therefore, an object of the present invention is to provide a conductive tile adhesive and a conductive floor which can be applied without impairing the appearance. It is another object of the present invention to provide a conductive tile adhesive that can be colored according to the color of the conductive tile.
【０００８】[0008]
【課題を解決するための手段】本発明者らは、上記課題
を解決するために鋭意研究を重ねた結果、樹脂１００重
量部に対して、針状酸化チタン５〜５５重量部および／
またはステンレス系充填剤１〜５重量部を含有するとき
は、無色または白色で、充分な導電性を有する導電性タ
イル用接着剤が得られるという新たな事実を見出し、本
発明を完成するに至った。Means for Solving the Problems The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems, and as a result, based on 100 parts by weight of resin, 5 to 55 parts by weight of acicular titanium oxide and / or
Alternatively, when 1 to 5 parts by weight of a stainless steel filler is contained, the present inventors have found a new fact that an adhesive for conductive tiles which is colorless or white and has sufficient conductivity can be obtained, and has completed the present invention. Was.
【０００９】一方、本発明の導電性床は、上記導電性タ
イル用接着剤を用いて導電性タイルを床に接着したこと
を特徴とする。すなわち、本発明の導電性タイル用接着
剤を用いて導電性床を施工したときは、該接着剤が無色
または白色であって、充分な導電性を有することから、
該接着剤が目地部からはみ出た場合であっても導電性床
の美観が損なわれることがなく、しかも導電性床全体と
して充分な導電性を付与することができる。On the other hand, the conductive floor of the present invention is characterized in that the conductive tile is bonded to the floor using the above-mentioned adhesive for conductive tile. That is, when a conductive floor is constructed using the conductive tile adhesive of the present invention, the adhesive is colorless or white, and has sufficient conductivity,
Even if the adhesive protrudes from the joint, the aesthetic appearance of the conductive floor is not impaired, and sufficient conductivity can be imparted to the entire conductive floor.
【００１０】上記本発明の導電性タイル用接着剤におい
て、前記樹脂には、エポキシ樹脂を用いるのが、接着性
や施工時の作業性の観点から好ましい。また、上記本発
明の導電性タイル用接着剤において、前記樹脂１００重
量部に対して着色剤５〜１０重量部を含有するときは、
該接着剤に種々の着色を施すことができる。In the adhesive for a conductive tile according to the present invention, it is preferable to use an epoxy resin as the resin from the viewpoint of adhesiveness and workability during construction. Further, in the conductive tile adhesive of the present invention, when the coloring agent contains 5 to 10 parts by weight based on 100 parts by weight of the resin,
Various colors can be applied to the adhesive.
【００１１】[0011]
【発明の実施の形態】以下、本発明の導電性タイル用接
着剤について詳細に説明する。本発明の導電性タイル用
接着剤は、樹脂中に所定量の針状酸化チタンおよび／ま
たはステンレス系充填剤と、必要に応じて着色剤とを配
合したものである。上記接着剤における樹脂としては、
例えばエポキシ樹脂、ポリウレタン樹脂、不飽和ポリエ
ステル樹脂、これらの変性物（例えばエポキシ変性ポリ
エステル）等の従来公知の種々の樹脂が用いられる。な
かでも、エポキシ樹脂や室温硬化型のポリウレタン樹脂
は、接着性および施工時の作業性の観点から好適に用い
られる。BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the adhesive for a conductive tile of the present invention will be described in detail. The adhesive for a conductive tile of the present invention is obtained by blending a predetermined amount of acicular titanium oxide and / or a stainless-based filler in a resin and, if necessary, a coloring agent. As the resin in the adhesive,
For example, various conventionally known resins such as an epoxy resin, a polyurethane resin, an unsaturated polyester resin, and a modified product thereof (for example, an epoxy-modified polyester) are used. Among them, epoxy resins and room-temperature-curable polyurethane resins are preferably used from the viewpoint of adhesiveness and workability during construction.
【００１２】上記接着剤を硬化させるための硬化剤とし
ては、従来公知の種々のものを使用できる。例えば、エ
ポキシ樹脂、ポリウレタン樹脂を用いる場合には、硬化
剤として変性ポリアミド樹脂、ポリオール等が用いられ
る。本発明の導電性タイル用接着剤において、針状酸化
チタンおよびステンレス系充填剤は、該接着剤に導電性
を付与するために用いられる。As the curing agent for curing the adhesive, various conventionally known curing agents can be used. For example, when an epoxy resin or a polyurethane resin is used, a modified polyamide resin, a polyol, or the like is used as a curing agent. In the adhesive for conductive tiles of the present invention, acicular titanium oxide and a stainless steel filler are used to impart conductivity to the adhesive.
【００１３】上記針状酸化チタンの粒子の形状は、針状
であるほかは特に限定されないが、粒子の短径Ｄと長径
Ｌとの比（Ｌ／Ｄ）が２．５〜１２０、好ましくは５〜
５５であるのが適当である。なお、粒子の短径Ｄは０．
０５〜０．４μｍ、好ましくは０．１〜０．３μｍの範
囲であるのが適当である。一方、粒子の長径Ｌは１〜６
μｍ、好ましくは１．５〜５．５μｍの範囲であるのが
適当である。The shape of the above-mentioned acicular titanium oxide particles is not particularly limited except that they are acicular, but the ratio (L / D) of the minor axis D to the major axis L of the particles is 2.5 to 120, preferably. 5-
A value of 55 is appropriate. In addition, the minor axis D of the particles is 0.1.
The range is suitably from 0.5 to 0.4 μm, preferably from 0.1 to 0.3 μm. On the other hand, the major axis L of the particles is 1 to 6
Suitably, it is in the range of μm, preferably 1.5-5.5 μm.
【００１４】上記粒子の比（Ｌ／Ｄ）が上記範囲を下回
ると、すなわち粒子の形状が球形に近づくと、接着剤に
充分な導電性を付与するために多量の酸化チタンを配合
する必要が生じる。その結果、接着剤の粘度が高くなり
すぎて、導電性タイルの施工時における作業性が低下
し、実用に適さなくなるという問題が生じる。逆に、比
（Ｌ／Ｄ）が上記範囲を超えるものは入手が困難であ
る。When the ratio (L / D) of the particles falls below the above range, that is, when the shape of the particles approaches a sphere, it is necessary to incorporate a large amount of titanium oxide in order to impart sufficient conductivity to the adhesive. Occurs. As a result, there arises a problem that the viscosity of the adhesive becomes too high, the workability at the time of applying the conductive tile is reduced, and the adhesive becomes unsuitable for practical use. Conversely, those having a ratio (L / D) exceeding the above range are difficult to obtain.
【００１５】また、上記粒子の短径Ｄまたは長径Ｌが上
記範囲を超えると、樹脂中での分散性が低下するため好
ましくない。逆に短径Ｄまたは長径Ｌが上記範囲を下回
るものは入手が困難である。針状酸化チタンの配合量
は、樹脂１００重量部に対して５〜５５重量部、好まし
くは２０〜３０重量部である。針状酸化チタンの配合量
が上記範囲を超えると、上記と同様に、施工時の作業性
が低下して、接着剤が実用に適さなくなるために好まし
くない。逆に、配合量が上記範囲を下回ると、接着剤に
充分な導電性を付与できなくなるために好ましくない。If the minor axis D or the major axis L of the particles exceeds the above range, the dispersibility in the resin is undesirably reduced. Conversely, those having a minor axis D or major axis L below the above range are difficult to obtain. The compounding amount of the acicular titanium oxide is 5 to 55 parts by weight, preferably 20 to 30 parts by weight based on 100 parts by weight of the resin. If the compounding amount of the acicular titanium oxide exceeds the above-mentioned range, the workability at the time of construction decreases similarly to the above, and the adhesive is not suitable for practical use. Conversely, if the amount is less than the above range, it is not preferable because sufficient conductivity cannot be imparted to the adhesive.
【００１６】本発明に使用可能な針状酸化チタンの具体
例としては、石原産業（株）製の商品名「ＦＴ−１００
０」（一次粒子の短径Ｄ＝０．１３μｍ、長径Ｌ＝１．
６８μｍ）、同社製の「ＦＴ−２０００」（Ｄ＝０．２
１μｍ、Ｌ＝２．８６μｍ）、同社製の「ＦＴ−３００
０」（Ｄ＝０．２７μｍ、Ｌ＝５．１５μｍ）等があげ
られる。A specific example of the acicular titanium oxide that can be used in the present invention is "FT-100" manufactured by Ishihara Sangyo Co., Ltd.
0 "(minor axis D of the primary particles = 0.13 μm, major axis L = 1.
68 μm), “FT-2000” (D = 0.2
1 μm, L = 2.86 μm), “FT-300”
0 "(D = 0.27 μm, L = 5.15 μm) and the like.
【００１７】上記ステンレス系充填剤の粒子の形状は特
に限定されないが、針状または繊維状であること、具体
的には粒子の短径Ｄと長径Ｌとの比（Ｌ／Ｄ）が１００
〜２０００、好ましくは２５０〜１０００であるのが適
当である。また、粒子の短径Ｄは５μｍ以下、好ましく
は２〜４μｍの範囲であるのが適当であって、粒子の長
径Ｌは５ｍｍ、好ましくは１〜２ｍｍの範囲であるのが
適当である。The shape of the particles of the stainless filler is not particularly limited, but may be needle-like or fibrous, and more specifically, the ratio (L / D) of the minor axis D to the major axis L of the particles is 100%.
It is suitably from 2000 to 2000, preferably from 250 to 1000. Further, the minor axis D of the particles is suitably 5 μm or less, preferably 2 to 4 μm, and the major axis L of the particles is suitably 5 mm, preferably 1 to 2 mm.
【００１８】上記粒子における短径と長径との比（Ｌ／
Ｄ）、短径Ｄまたは長径Ｌが上記範囲を外れたときの問
題点は、前述の酸化チタンの場合と同様である。すなわ
ち、短径Ｄまたは長径Ｌが上記範囲を超えると、樹脂中
での分散性が低下するため好ましくない。また、着色剤
が金属光沢を呈するおそれもある。逆に短径Ｄまたは長
径Ｌが上記範囲を下回るものは入手が困難である。In the above particles, the ratio of the minor axis to the major axis (L /
The problems when D), minor axis D or major axis L are out of the above range are the same as in the case of the above-described titanium oxide. That is, if the minor axis D or the major axis L exceeds the above range, the dispersibility in the resin decreases, which is not preferable. Further, the colorant may have a metallic luster. Conversely, those having a minor axis D or major axis L below the above range are difficult to obtain.
【００１９】ステンレス系充填剤の配合量は、樹脂１０
０重量部に対して１〜５重量部、好ましくは１〜３重量
部である。ステンレス系充填剤の配合量が上記範囲を超
えると、施工時の作業性が低下したり、接着剤が金属光
沢を呈するおそれがあるために好ましくない。逆に、配
合量が上記範囲を下回ると、接着剤に充分な導電性を付
与できなくなるために好ましくない。The compounding amount of the stainless filler is as follows.
It is 1 to 5 parts by weight, preferably 1 to 3 parts by weight based on 0 parts by weight. If the amount of the stainless filler is more than the above range, it is not preferable because workability at the time of construction is reduced and the adhesive may have metallic luster. Conversely, if the amount is less than the above range, it is not preferable because sufficient conductivity cannot be imparted to the adhesive.
【００２０】本発明に使用可能なステンレス系充填剤の
具体例としては、東京製鋼（株）製の商品名「サスミッ
クファイバー」（短径Ｄ＝４μｍ、長径Ｌ＝２ｍｍ）等
があげられる。本発明の導電性タイル用接着剤に配合さ
れる導電性充填剤としては、上記針状酸化チタンおよび
／またはステンレス系充填剤とともに、該接着剤が導電
性タイルの美観を損なわない範囲において、カーボンブ
ラックやグラファイトを配合してもよい。すなわち、カ
ーボンブラック、グラファイト、および金、銀、銅等の
金属粉の配合量が樹脂に対して１ｐｐｍ以下であれば、
接着剤が黒色や金属光沢を呈することがなく、従って、
本発明の目的に応じた接着剤が得られる。Specific examples of the stainless steel filler usable in the present invention include “Sussic Fiber” (trade name: short diameter D = 4 μm, long diameter L = 2 mm) manufactured by Tokyo Steel Corporation. As the conductive filler to be added to the conductive tile adhesive of the present invention, the needle-like titanium oxide and / or stainless steel-based filler may be used together with carbon as long as the adhesive does not impair the beauty of the conductive tile. Black or graphite may be blended. That is, if the compounding amount of carbon black, graphite, and metal powder such as gold, silver, and copper is 1 ppm or less with respect to the resin,
The adhesive does not exhibit a black or metallic luster,
An adhesive according to the object of the present invention is obtained.
【００２１】本発明の導電性タイル用接着剤に配合でき
る着色剤としては、例えば、従来公知の種々の顔料、染
料、あるいは樹脂中に顔料や染料を含有してなるトナー
等があげられる。着色剤を配合する場合において、その
配合量は、上記接着剤における樹脂１００重量部に対し
て５〜１０重量部、好ましくは８〜１０重量部であるの
が適当である。着色剤の配合量が上記範囲を超えると、
接着剤の接着強度が低下するなどの問題が生じるおそれ
がある。逆に配合量が上記範囲を下回ると、充分な着色
が得られなくなるおそれがある。Examples of the colorant that can be added to the adhesive for a conductive tile of the present invention include various conventionally known pigments and dyes, and toners containing a pigment and a dye in a resin. In the case of blending a coloring agent, the blending amount is appropriately 5 to 10 parts by weight, preferably 8 to 10 parts by weight based on 100 parts by weight of the resin in the adhesive. When the amount of the coloring agent exceeds the above range,
There is a possibility that problems such as a decrease in the adhesive strength of the adhesive may occur. Conversely, if the amount is less than the above range, sufficient coloring may not be obtained.
【００２２】本発明の導電性タイル用接着剤において
は、接着剤のオープンタイムを調整することを目的とし
て、溶剤を用いることができる。かかる溶剤としては、
例えばメタノール、トルエン、酢酸エチル等があげられ
る。溶剤の配合量は、使用する樹脂、オープンタイム調
整の程度等により異なるが、一般には、樹脂１００重量
部に対して５〜２０重量部程度配合すればよい。In the adhesive for a conductive tile of the present invention, a solvent can be used for the purpose of adjusting the open time of the adhesive. Such solvents include:
For example, methanol, toluene, ethyl acetate and the like can be mentioned. The amount of the solvent varies depending on the resin to be used, the degree of adjustment of the open time, and the like, but generally, about 5 to 20 parts by weight per 100 parts by weight of the resin.
【００２３】本発明の導電性タイル用接着剤の接着強度
は、建研式接着試験に準拠した測定方法において、２０
ｋｇｆ／ｃｍ2 以上、好ましくは３０〜４０ｋｇｆ／ｃ
ｍ2であるのが適当である。上記接着剤の接着強度は、
使用する樹脂、硬化剤の種類や、導電性充填剤等の配合
量などで調整できる。該接着強度が上記範囲を下回る
と、導電性タイルの接着が不十分になり、経時的に床面
から剥離しやすくなるといった問題が生じるおそれがあ
る。The adhesive strength of the adhesive for a conductive tile of the present invention was determined by a measuring method based on the Kenken-type adhesive test by 20
kgf / cm 2 or more, preferably 30 to 40 kgf / c
Suitably, it is m 2 . The adhesive strength of the above adhesive is
It can be adjusted by the type of the resin and the curing agent to be used, the amount of the conductive filler, and the like. If the adhesive strength is lower than the above range, there is a possibility that the adhesion of the conductive tile becomes insufficient and a problem such that the conductive tile is easily peeled off from the floor surface with time may occur.
【００２４】なお、建研式接着試験による接着強度の測
定方法は次のとおりである。まず、底面が４ｃｍ×４ｃ
ｍの鉄片の該底面および床材表面の油汚れ、ホコリ等を
トルエン等の溶剤で除去し、さらにサンドペーパーで充
分に研磨する。次いで、上記床材表面と鉄片の底面と
を、試験に供する接着剤を用いて接着する。接着剤が充
分に硬化した後、鉄片の４辺に沿って、床材表面に切込
みを入れる。その後、前記鉄片をポータブル引張試験機
で床材表面に対して垂直に引っ張り、接着面に破断が生
じたときの引張り強さを測定する。この測定値を鉄辺の
底面積で割った値を、接着強度（ｋｇｆ／ｃｍ2 ）とし
た。The method of measuring the adhesive strength by the Kenken-type adhesive test is as follows. First, the bottom is 4cm x 4c
Oil dirt, dust, and the like on the bottom surface and floor material surface of the iron piece of m are removed with a solvent such as toluene, and further polished sufficiently with sandpaper. Next, the floor material surface and the bottom surface of the iron piece are bonded using an adhesive to be tested. After the adhesive has fully cured, cuts are made in the flooring surface along the four sides of the iron piece. Thereafter, the iron piece is pulled perpendicularly to the surface of the floor material by a portable tensile tester, and the tensile strength when a fracture occurs in the bonding surface is measured. The value obtained by dividing the measured value by the bottom area of the iron side was defined as the adhesive strength (kgf / cm 2 ).
【００２５】本発明の導電性タイル用接着剤には、該接
着剤を塗布して完全に硬化させた時点での表面電気抵抗
が、米国ＮＦＰＡ(National Fine Protection Associat
ion)規格５６−Ａによる測定値で１×１０5 Ω以下、好
ましくは１×１０3 〜１×１０5 Ωであることが要求さ
れる。上記表面抵抗が上記範囲を超えると、接着剤の導
電性が不十分になり、その結果、導電性床に充分な導電
性を付与することができず、本発明の目的を達成できな
くなるおそれがあるため好ましくない。The adhesive for a conductive tile of the present invention has a surface electrical resistance at the time when the adhesive is applied and completely cured, which is determined by the US NFPA (National Fine Protection Associat).
ion) It is required that the measured value according to the standard 56-A is 1 × 10 5 Ω or less, preferably 1 × 10 3 to 1 × 10 5 Ω. When the surface resistance exceeds the above range, the conductivity of the adhesive becomes insufficient, and as a result, sufficient conductivity cannot be imparted to the conductive floor, and the object of the present invention may not be achieved. It is not preferable because there is.
【００２６】すなわち、接着剤の表面抵抗が上記範囲を
超えると、導電性床の導電性（表面抵抗）が１×１０8
Ωを超えるおそれがあり、充分な導電性が得られない。
尚、接着剤の表面抵抗が上記した下限値を超えて極端に
小さくなって、導電性床の表面抵抗が低くなりすぎ（１
×１０4 Ω以下）たときには、漏電時に人体に危険を及
ぼすおそれがある。That is, when the surface resistance of the adhesive exceeds the above range, the conductivity (surface resistance) of the conductive floor becomes 1 × 10 8.
Ω may be exceeded, and sufficient conductivity cannot be obtained.
Incidentally, the surface resistance of the adhesive becomes extremely small exceeding the lower limit described above, and the surface resistance of the conductive floor becomes too low (1).
(× 10 4 Ω or less), there is a risk of causing a danger to the human body at the time of leakage.
【００２７】なお、前記ＮＦＰＡ規格５６−Ａによる表
面電気抵抗の測定方法を、図１を参照して説明する。接
着剤を床１６に塗布し、完全に硬化させて得られた接着
剤の層１０の表面に、絶縁抵抗器１２（出力電圧：直流
５００Ｖ、短絡電流：２．５〜１０ｍＡ）における１対
のＮＦＰＡ電極１４を約９１．４ｃｍ（３フィート）の
間隔で接触させ、両電極１４間の抵抗値を測定する。こ
の測定を５ヶ所以上で行い、その平均値を接着剤の表面
電気抵抗（Ω）とした。A method of measuring the surface electric resistance according to the NFPA standard 56-A will be described with reference to FIG. The adhesive was applied to the floor 16 and completely cured, and the surface of the adhesive layer 10 was placed on a pair of insulating resistors 12 (output voltage: 500 V DC, short-circuit current: 2.5 to 10 mA). The NFPA electrodes 14 are brought into contact with each other at an interval of about 91.4 cm (3 feet), and the resistance value between the electrodes 14 is measured. This measurement was performed at five or more locations, and the average value was defined as the surface electrical resistance (Ω) of the adhesive.
【００２８】上記ＮＦＰＡ電極１４には、図２に示すよ
うに、円筒状の本体２０の下面にゴム片２２を介してア
ルミ箔２４を被覆したものが用いられる。この場合、電
極１４の重量は約２．２７ｋｇ（５ポンド）、電極１４
の下面におけるアルミ箔２４の円形接触面２６の直径は
約６．３５ｃｍ（２．５インチ）、ゴム片２２の硬度は
ショアーＡ(shore A) で４０〜６０、ゴム片２２の厚み
は約６．１ｍｍ（１／４インチ）、アルミ箔２４の厚み
は０．０１２７〜０．２５４ｍｍ（０．０００５〜０．
０００１インチ）である。As the NFPA electrode 14, as shown in FIG. 2, a cylindrical main body 20 having a lower surface covered with an aluminum foil 24 via a rubber piece 22 is used. In this case, the weight of the electrode 14 is approximately 2.27 kg (5 pounds), and the electrode 14
The diameter of the circular contact surface 26 of the aluminum foil 24 on the lower surface is about 6.35 cm (2.5 inches), the hardness of the rubber piece 22 is 40-60 for Shore A, and the thickness of the rubber piece 22 is about 6 0.1 mm (1/4 inch), and the thickness of the aluminum foil 24 is 0.0127 to 0.254 mm (0.0005 to 0.25 mm).
0001 inches).
【００２９】次に、本発明の導電性床について説明す
る。本発明の導電性床は、上記本発明の導電性タイル用
接着剤を用いて施工したものである。本発明に用いられ
る導電性タイルとしては、従来公知のものを用いること
ができる。具体的には、ホモジニアスビニル床タイル
（ＪＩＳ Ｋ ６９１１に規定の表面抵抗値が１×１０
8 Ω以下、体積抵抗値が１×１０8 Ω以下）等があげら
れる。Next, the conductive floor of the present invention will be described. The conductive floor of the present invention is constructed using the above-mentioned adhesive for a conductive tile of the present invention. A conventionally known conductive tile can be used as the conductive tile used in the present invention. Specifically, a homogeneous vinyl floor tile (having a surface resistance value of 1 × 10 specified in JIS K 6911)
8 Ω or less, and the volume resistance value is 1 × 10 8 Ω or less).
【００３０】かかる導電性タイル表面の導電性は、前述
のように、ＮＦＰＡ規格５６−Ａによる測定値で１×１
０8 Ω以下、好ましくは１×１０4 〜１×１０8 Ωであ
ることが要求される。本発明の導電性床は、床材表面に
本発明の導電性タイル用接着剤を塗布し、該接着剤によ
り形成された層の表面にタックが生じた後、上記導電性
タイルを敷設し、接着剤を完全に硬化させることによっ
て施工される。As described above, the conductivity of the conductive tile surface is 1 × 1 as measured by the NFPA standard 56-A.
0 8 Omega less, preferably required to be 1 × 10 4 ~1 × 10 8 Ω. The conductive floor of the present invention, the adhesive for the conductive tile of the present invention is applied to the floor material surface, and after the tack is generated on the surface of the layer formed by the adhesive, the conductive tile is laid, It is applied by completely curing the adhesive.
【００３１】上記施工時において、接着剤を塗布して形
成される層の厚さは、通常０．５〜１．５ｍｍの範囲で
設定される。接着剤の層の厚さが上記範囲から外れる
と、施工時の作業性や、接着剤および導電性タイル表面
の導電性に悪影響を及ぼすおそれがあるため、好ましく
ない。At the time of the above construction, the thickness of the layer formed by applying the adhesive is usually set in the range of 0.5 to 1.5 mm. If the thickness of the adhesive layer is out of the above range, the workability during construction and the conductivity of the adhesive and the conductive tile surface may be adversely affected, which is not preferable.
【００３２】[0032]
【実施例】以下、実施例および比較例をあげて本発明を
説明する。実施例および比較例に使用した成分は次のと
おりである。 〔導電性タイル用接着剤〕導電性タイル用接着剤は、以
下に示す樹脂、導電性充填剤、溶剤および必要に応じて
着色剤を配合してなる主剤と、硬化剤とからなる。The present invention will be described below with reference to examples and comparative examples. The components used in the examples and comparative examples are as follows. [Adhesive for Conductive Tile] The adhesive for conductive tile comprises a resin, a conductive filler, a solvent, and a main agent prepared by mixing a coloring agent as required, and a curing agent.
【００３３】樹脂：エポキシ樹脂（油化シェル（株）製
の商品名「エピコート８２８」） 針状酸化チタン：石原産業（株）製の商品名「ＦＴ−２
０００」（一次粒子の短径Ｄ０．２１μｍ、長径Ｌ２．
８６μｍ） ステンレス系充填剤：東京製鋼（株）製の商品名「サス
ミックファイバー」（一次粒子の短径Ｄ＝４μｍ、長径
Ｌ＝２ｍｍ） カーボンブラック：電気化学工業社製のアセチレンブラ
ック（商品名「デンカブラック」） 溶剤：メタノール 着色剤：トナー（エポキシトナー） 硬化剤：変性ポリアミド樹脂（富士化成（株）製の商品
名「トーマイドＴＸＡ−５２５」） 〔導電性タイル〕導電性タイルとしては、ホモジニアス
ビニル床タイル（７０４．８ｍｍ×３０４．８ｍｍ、厚
さ２ｍｍ、ＪＩＳ Ｋ ６９１１に規定の表面抵抗値
３．９×１０7 Ω、体積抵抗値が１．８×１０7 Ω）を
使用した。Resin: Epoxy resin (trade name “Epicoat 828” manufactured by Yuka Shell Co., Ltd.) Acicular titanium oxide: trade name “FT-2” manufactured by Ishihara Sangyo Co., Ltd.
000 "(minor diameter D0.21 μm of primary particles, major diameter L2.
86 μm) Stainless steel filler: trade name “Sasmic Fiber” (trade name of primary particle: short diameter D = 4 μm, long diameter L = 2 mm) manufactured by Tokyo Steel Co., Ltd. Carbon black: acetylene black manufactured by Denki Kagaku Kogyo KK "Denka Black") Solvent: methanol Colorant: toner (epoxy toner) Curing agent: modified polyamide resin (trade name "TOMIDE TXA-525" manufactured by Fuji Kasei Co., Ltd.) [Conductive tile] As the conductive tile, A homogeneous vinyl floor tile (704.8 mm × 304.8 mm, thickness 2 mm, surface resistance 3.9 × 10 7 Ω and volume resistance 1.8 × 10 7 Ω specified in JIS K 6911) was used.
【００３４】実施例１〜８、比較例１〜３ 各実施例および比較例で使用した接着剤の配合成分を表
１〜２に示す。Examples 1 to 8 and Comparative Examples 1 to 3 Tables 1 and 2 show the components of the adhesive used in each of the Examples and Comparative Examples.
【００３５】[0035]
【表１】 [Table 1]
【００３６】[0036]
【表２】 [Table 2]
【００３７】（導電性タイルの施工）床材表面（下地）
であるコンクリートの表面におけるレイタンス、汚れ、
油脂等を研磨により除去した後、床全体を４等分するよ
うに墨出しを行った。次いで、前記実施例および比較例
の接着剤について、それぞれ主剤と硬化剤とを混合し、
電動攪拌機で２分以上攪拌した後、櫛目コテで接着剤を
速やかに塗り広げた。約２０分経過後、接着剤の層（厚
さ約１．０ｍｍ）にタックが生じてから導電性タイルを
敷設し、導電性床を形成した。(Construction of conductive tile) Floor material surface (base)
Latencies, dirt,
After removing fats and oils by polishing, blacking was performed so as to divide the entire floor into four equal parts. Next, for the adhesives of the above Examples and Comparative Examples, the main agent and the curing agent were mixed, respectively,
After stirring with an electric stirrer for 2 minutes or more, the adhesive was quickly spread with a comb iron. After a lapse of about 20 minutes, a tack was formed on the adhesive layer (about 1.0 mm in thickness), and then a conductive tile was laid to form a conductive floor.
【００３８】（施工時における作業性の評価）施工時に
おける作業性の評価とは、櫛目コテによる塗り広げやす
さについての評価であって、以下の基準に基づいて行っ
た。 〇：櫛目コテにからまずに塗り広げることができ、作業
性は実用上充分であった。(Evaluation of Workability During Construction) The evaluation of workability during construction refers to the evaluation of ease of spreading with a comb iron, and was performed based on the following criteria. 〇: It could be spread out first from the comb iron, and the workability was practically sufficient.
【００３９】×：作業性が低く、実用上不適当であっ
た。 （接着剤の導電性の測定）接着剤の導電性の測定は、接
着剤を床に塗り広げ、導電性タイルを敷設せずに接着剤
を完全に硬化させた後（２日以上経過後）、前述のＮＦ
ＰＡ規格５６−Ａに準じて行った。X: The workability was low, and it was unsuitable for practical use. (Measurement of the conductivity of the adhesive) The conductivity of the adhesive is measured after spreading the adhesive on the floor and completely curing the adhesive without laying a conductive tile (after 2 days or more). , The aforementioned NF
Performed according to PA standard 56-A.
【００４０】なお、絶縁抵抗器（ＳＡＮＷＡ製の型番
「ＰＤＭ−５０５」）を使用した。測定時の電極間距離
は約９１．４ｃｍ、測定時の気温は２３℃、湿度は５５
％であった。 （導電性タイル表面の導電性の測定）導電性タイル表面
の導電性の測定は、上記実施例および比較例において、
導電性タイルを敷設し、接着剤を完全に硬化させた後、
前述のＮＦＰＡ規格５６−Ａに準じて行った。絶縁抵抗
器は前出の「ＰＤＭ−５０５」を使用した。An insulation resistor (model number "PDM-505" manufactured by SANWA) was used. The distance between the electrodes at the time of measurement was about 91.4 cm, the temperature at the time of measurement was 23 ° C., and the humidity was 55
%Met. (Measurement of Conductivity of Conductive Tile Surface) The measurement of conductivity of the conductive tile surface was performed in the above Examples and Comparative Examples.
After laying the conductive tile and completely curing the adhesive,
The measurement was performed according to the above-mentioned NFPA standard 56-A. As the insulation resistor, “PDM-505” described above was used.
【００４１】以上の評価および測定の結果は、上記表１
〜２に示すとおりである。表１〜２に示すように、実施
例１〜８の接着剤は、いずれも施工時の作業性が良好
で、接着剤自体の導電性および導電性タイル表面の導電
性が充分であった。また、接着剤の色はいずれも白色で
あったので、導電性タイルの目地部からはみ出して美観
を損ねるという問題も生じなかった。The results of the above evaluation and measurement are shown in Table 1 above.
As shown in FIGS. As shown in Tables 1 and 2, all of the adhesives of Examples 1 to 8 had good workability during construction, and the conductivity of the adhesive itself and the conductivity of the surface of the conductive tile were sufficient. In addition, since the color of each adhesive was white, there was no problem that the adhesive protruded from the joints of the conductive tile and spoiled the aesthetic appearance.
【００４２】一方、比較例１の接着剤は黒色を帯びてい
るため、導電性タイルの美観が損なわれるという問題が
生じた。比較例２の接着剤は針状酸化チタンの配合量が
所定範囲を超えており、比較例３の接着剤はステンレス
系充填剤の配合量が所定範囲を超えていることから、接
着剤自体および導電性タイル表面の導電性は良好であっ
たものの、施工時の作業性が低く、実用に適さないとい
う問題があった。On the other hand, since the adhesive of Comparative Example 1 was black, there was a problem that the aesthetic appearance of the conductive tile was impaired. In the adhesive of Comparative Example 2, the amount of the acicular titanium oxide exceeds the predetermined range, and in the adhesive of Comparative Example 3, the amount of the stainless filler exceeds the predetermined range. Although the conductivity of the conductive tile surface was good, there was a problem that workability during construction was low and the tile was not suitable for practical use.
【００４３】[0043]
【発明の効果】以上詳述したように、本発明の導電性タ
イル用接着剤およびそれを用いた導電性床によれば、充
分な導電性を有する導電性床を施工できるとともに、接
着剤が無色または白色であるため、導電性タイルの美観
を損なうことがない。As described above in detail, according to the adhesive for a conductive tile of the present invention and the conductive floor using the same, a conductive floor having a sufficient conductivity can be constructed, and the adhesive can be used. The colorless or white color does not impair the aesthetic appearance of the conductive tile.
【図面の簡単な説明】[Brief description of the drawings]
【図１】ＮＦＰＡ規格５６−Ａに規定の測定方法を示す
説明図である。FIG. 1 is an explanatory diagram showing a measurement method specified in NFPA standard 56-A.
【図２】ＮＦＰＡ規格５６−Ａに規定のＮＦＰＡ電極の
構造を示す説明図である。FIG. 2 is an explanatory diagram showing a structure of an NFPA electrode specified in NFPA standard 56-A.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ // Ｃ０４Ｂ 111:94 ──────────────────────────────────────────────────の Continued on front page (51) Int.Cl. 6 Identification code FI // C04B 111: 94
Claims (4)
ン５〜５５重量部および／またはステンレス系充填剤１
〜５重量部を含有することを特徴とする導電性タイル用
接着剤。1 to 5 parts by weight of acicular titanium oxide and / or stainless filler 1 based on 100 parts by weight of resin
An adhesive for a conductive tile, which comprises about 5 parts by weight.
載の導電性タイル用接着剤。2. The adhesive for a conductive tile according to claim 1, wherein the resin is an epoxy resin.
〜１０重量部含有する請求項１または２記載の導電性タ
イル用接着剤。3. A colorant 5 based on 100 parts by weight of the resin.
The adhesive for a conductive tile according to claim 1, wherein the adhesive is contained in an amount of 10 to 10 parts by weight.
イル用接着剤を用いて導電性タイルを床面に接着したこ
とを特徴とする導電性床。4. A conductive floor, wherein a conductive tile is adhered to a floor surface using the conductive tile adhesive according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15235997A JPH10338855A (en) | 1997-06-10 | 1997-06-10 | Adhesive for conductive tile and conductive floor prepared by using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15235997A JPH10338855A (en) | 1997-06-10 | 1997-06-10 | Adhesive for conductive tile and conductive floor prepared by using the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH10338855A true JPH10338855A (en) | 1998-12-22 |
Family
ID=15538828
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15235997A Pending JPH10338855A (en) | 1997-06-10 | 1997-06-10 | Adhesive for conductive tile and conductive floor prepared by using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH10338855A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002026908A1 (en) * | 2000-09-28 | 2002-04-04 | Henkel Kommanditgesellschaft Auf Aktien | Adhesives having barrier properties |
| JP2012107383A (en) * | 2010-11-15 | 2012-06-07 | Sumitomo Rubber Ind Ltd | Antistatic poured flooring |
| JP2014234612A (en) * | 2013-05-31 | 2014-12-15 | 清水建設株式会社 | Antistatic structure construction method of double floor |
-
1997
- 1997-06-10 JP JP15235997A patent/JPH10338855A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002026908A1 (en) * | 2000-09-28 | 2002-04-04 | Henkel Kommanditgesellschaft Auf Aktien | Adhesives having barrier properties |
| JP2012107383A (en) * | 2010-11-15 | 2012-06-07 | Sumitomo Rubber Ind Ltd | Antistatic poured flooring |
| JP2014234612A (en) * | 2013-05-31 | 2014-12-15 | 清水建設株式会社 | Antistatic structure construction method of double floor |
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