JPH10334971A - Conductive adhesive tape and its manufacture - Google Patents

Conductive adhesive tape and its manufacture

Info

Publication number
JPH10334971A
JPH10334971A JP15914897A JP15914897A JPH10334971A JP H10334971 A JPH10334971 A JP H10334971A JP 15914897 A JP15914897 A JP 15914897A JP 15914897 A JP15914897 A JP 15914897A JP H10334971 A JPH10334971 A JP H10334971A
Authority
JP
Japan
Prior art keywords
conductive
adhesive
adhesive tape
stripe
streak
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15914897A
Other languages
Japanese (ja)
Inventor
Yoshiji Hasegawa
美次 長谷川
Kazunari Shibata
和成 柴田
Hideyuki Okada
秀之 岡田
Kunihiko Kaida
邦彦 海田
Naoki Matsuoka
直樹 松岡
Hirotaka Sato
博隆 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP15914897A priority Critical patent/JPH10334971A/en
Publication of JPH10334971A publication Critical patent/JPH10334971A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/09Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits

Landscapes

  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide an adhesive tape in which strong pressure-sensitive adhesion and low resistant continuity are ensured under a high pressurizing force by alternately juxtaposing and integrating a plurality of stripe conductive parts and stripe adhesive parts on one surface or both surfaces of a support base. SOLUTION: Stripe conductive parts 2 and stripe adhesive parts 3 are alternately juxtaposed on one surface or both surfaces of a support base 1. The stripe conductive parts 2 are formed by multiple applications of a conductive paste consisting of a mixture of a metal powder with a resin, and the stripe adhesive parts 3 are formed by multiple applications of an adhesive solution. This adhesive tape is manufactured by mounting a circular disc in which a plurality of adhesive sheets and conductive sheets are laminated and integrated on a lathe, rotating it, and continuously cutting the disc from the circumferential side with a flat bite in a fixed thickness. In order to prevent the adhesion of the adhesive sheet to the bite, it is effective to perform cutting while cooling with dry ice or liquid nitrogen. The conductive adhesive tape is usable in a wide range of fields because of its single-action property of conduction and connection and thin form.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は接地等の電気的導通
に使用される導電性接着テ−プに関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conductive adhesive tape used for electrical conduction such as grounding.

【0002】[0002]

【従来の技術】電気的導通、例えば、プリント配線基板
の接地、電子機器のシ−ルドケ−スの接地、TVブラウ
ン管の接地に使用される導電性接着テ−プとして、金属
粒体を混合した接着剤を導電性テ−プの片面に設けたも
のは、被導通部位と導電性テ−プとの間を、被導通部位
と接着剤層中の金属粒体との相互接触→接着剤層中の金
属粒体間の相互接触→接着剤層中の金属粒体と導電性テ
−プとの相互接触で電気的導通を図っているが、金属粒
体の表面に付着した水分やガスが、当該導電性接着テ−
プの保存あるいは使用中に揮発若しくはガス化され、導
電性粒体相互の接触が弱められて抵抗値が増加する畏れ
があり、電気的導通性の不安定性が懸念される。
2. Description of the Related Art Metal particles are mixed as a conductive adhesive tape used for electrical continuity, for example, grounding of a printed circuit board, grounding of a shield case of electronic equipment, and grounding of a TV cathode ray tube. In the case where the adhesive is provided on one side of the conductive tape, the contact between the conductive portion and the metal particles in the adhesive layer is established between the conductive portion and the conductive tape → the adhesive layer. Mutual contact between metal particles inside → Electrical conductivity is achieved by mutual contact between the metal particles in the adhesive layer and the conductive tape, but moisture or gas adhering to the surface of the metal particles , The conductive adhesive tape
During storage or use of the lamp, it may be volatilized or gasified, the contact between the conductive particles may be weakened, and the resistance value may increase.

【0003】かかる接着剤層中の金属粒体相互間の接触
に依存せずに電気的導通を可能とする導電性接着テ−プ
としては、金属箔の片面に粘着剤層を設け、エンボス成
形により金属箔を部分的に粘着剤層表面に露出させ、こ
の露出金属箔部分を被導通部位に接触させると共に粘着
剤層において粘着固定するもの、また、片面粘着テ−プ
上に複数本の帯条導体を相互間に間隔を隔てて並設する
と共に導体間に粘着剤層を表出させ、この並設導体を被
導通部位に接触させると共に粘着剤層表出部分において
粘着固定するもの(例えば、特開昭63−94700
号)、また、図に示すように複数本の平行導体を熱可塑
性接着剤層中に埋設し、加熱・加圧によって導体を被導
通部位に接触させると共に熱可塑性接着剤の溶融・凝固
で固定するもの(例えば、特開平1−195607号)
等が公知である。
As a conductive adhesive tape which enables electrical conduction without depending on contact between metal particles in such an adhesive layer, an adhesive layer is provided on one surface of a metal foil and embossed. A metal foil is partially exposed to the surface of the pressure-sensitive adhesive layer, and the exposed metal foil portion is brought into contact with a conductive part and is adhesively fixed in the pressure-sensitive adhesive layer. Also, a plurality of bands are provided on a single-sided adhesive tape. Strip conductors are arranged side by side with a space between them, an adhesive layer is exposed between the conductors, and the juxtaposed conductors are brought into contact with a portion to be electrically connected and are adhesively fixed at an exposed portion of the adhesive layer (for example, JP-A-63-94700
No.) Also, as shown in the figure, a plurality of parallel conductors are embedded in the thermoplastic adhesive layer, and the conductors are brought into contact with the conductive parts by heating and pressing, and are fixed by melting and solidifying the thermoplastic adhesive. (For example, JP-A-1-195607)
Etc. are known.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記エ
ンボス式の導電性接着テ−プにおいては、金属箔(通常
200μm以下の厚み)の突部が中空構造であって圧潰
され易く、粘着剤の感圧接着性を効果的に発揮させるた
めに加圧力を高くすると、突部が圧潰されてしまい、充
分に強固な粘着固定が望めない。また、上記帯条導体並
設式の導電性接着テ−プにおいては、導体厚みが厚くな
ると(200μm近い厚み)、導体表面と粘着剤層表出
面との段差が大となって安定な粘着固定を保証し難く、
他方、導体厚みを薄くすると、強固な粘着固定が期待で
きても、導通抵抗の増加が避けられない。また、上記熱
可塑性接着剤層式の導電性接着テ−プにおいては、導体
と被導通部位との間に接着剤膜が介在し易く、低抵抗で
の電気的導通が望めない。本発明の目的は、高い加圧力
のもとでの強固な感圧性接着及び低抵抗導通を保証でき
る導電性接着テ−プを提供することにある。
However, in the above-mentioned embossed conductive adhesive tape, the protrusion of the metal foil (usually 200 μm or less in thickness) has a hollow structure, and is easily crushed, so that the feeling of the pressure-sensitive adhesive is not good. If the pressing force is increased in order to effectively exert the pressure-bonding property, the protrusion is crushed, and it is not possible to expect a sufficiently strong adhesive fixing. Further, in the conductive adhesive tape of the above-mentioned strip conductor juxtaposition type, when the thickness of the conductor is large (thickness of about 200 μm), the step between the conductor surface and the surface of the pressure-sensitive adhesive layer becomes large, and the adhesive is stably fixed. Difficult to guarantee,
On the other hand, when the conductor thickness is reduced, an increase in conduction resistance is inevitable even if strong adhesive fixing can be expected. Further, in the above-mentioned conductive adhesive tape of the thermoplastic adhesive layer type, an adhesive film is easily interposed between a conductor and a portion to be connected, and electrical conduction with low resistance cannot be expected. SUMMARY OF THE INVENTION An object of the present invention is to provide a conductive adhesive tape capable of guaranteeing a strong pressure-sensitive adhesive under a high pressure and a low resistance conduction.

【0005】[0005]

【課題を解決するための手段】本願の請求項1に係る導
電性接着テ−プは、支持基材の片面または両面に、複数
本の筋状導電部と筋状接着部とが交互に並設されている
ことを特徴とする構成である。本願の請求項3に係る導
電性接着テ−プは、複数本の筋状導電部と筋状接着部と
が交互に並設一体化されていることを特徴とする構成で
あり、その製造方法は、複数枚の接着性シ−トと導電性
シ−トとを積層一体化してなる円形ディスクを回転させ
て外周側から連続的に一定厚みで切削することを特徴と
する構成である。
According to a first aspect of the present invention, there is provided a conductive adhesive tape having a plurality of strip-like conductive portions and a strip-like adhesive portion alternately arranged on one or both sides of a supporting base material. It is a configuration characterized by being provided. A conductive adhesive tape according to a third aspect of the present invention is characterized in that a plurality of streak-like conductive portions and streak-like adhesive portions are alternately juxtaposed and integrated, and a manufacturing method thereof. Is characterized in that a circular disc formed by laminating and integrating a plurality of adhesive sheets and conductive sheets is rotated and continuously cut to a constant thickness from the outer peripheral side.

【0006】[0006]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1は請求項1に係る発
明の実施例を示している。図1において、1は支持基材
である。2,…及び3,…は支持基材1の片面に交互に
並設した筋状導電部及び筋状粘着部であり、筋状導電部
2は導電ペ−スト(銀粉、ニッケル粉、銅粉等の金属粉
と樹脂の溶剤溶液との混合物)の多本塗工により、筋状
粘着部3は粘着剤溶液の多本塗工により形成することが
できる。図1において、aは筋状導電部2の巾を、bは
筋状粘着部3の巾を、pは並設ピッチをそれぞれ示して
いる。
Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of the present invention. In FIG. 1, 1 is a supporting substrate. Reference numerals 2,... And 3,... Denote streak-like conductive portions and streak-like adhesive portions alternately arranged on one side of the support substrate 1, and streak-like conductive portions 2 are made of conductive paste (silver powder, nickel powder, copper powder). The streak-shaped adhesive portion 3 can be formed by multiple application of a pressure-sensitive adhesive solution. In FIG. 1, a indicates the width of the streak-like conductive portion 2, b indicates the width of the streak-like adhesive portion 3, and p indicates the parallel pitch.

【0007】この多本塗工には、複数本のノズルを並設
した注射針型吐出装置を二台、ノズルの位置が交互にな
るように配設し、これらの吐出装置下に支持基材を走行
させ、この走行支持基材上に一方の吐出装置のノズルか
ら導電ペ−ストを巾a、ピッチpの多本平行筋状に吐出
させ、他方の吐出装置のノズルから粘着剤溶液を導電ペ
−スト筋間に巾bで多本平行筋状に吐出させ、次いで、
乾燥させる方法、Tダイの出口ギャップ部に櫛状のシム
を組み込んだTダイコ−タ−を二台、シムの仕切口の位
置が交互になるように配設し、これらのTダイコ−タ−
のダイ出口の下に支持基材を走行させ、この走行支持基
材上に一方のTダイコ−タ−のダイ出口から導電ペ−ス
トを巾a、ピッチpの多本平行筋状に吐出させ、他方の
Tダイコ−タ−のダイ出口から粘着剤溶液を導電ペ−ス
ト筋間に巾bで多本平行筋状に吐出させ、次いで、乾燥
させる方法等を使用できる。
[0007] In this multi-coating, two injection needle type discharge devices having a plurality of nozzles arranged side by side are arranged so that the positions of the nozzles are alternately arranged. And a conductive paste is discharged from the nozzle of one of the discharge devices in a multi-parallel streak having a width a and a pitch p on the traveling support base material, and the adhesive solution is discharged from the nozzle of the other discharge device. Discharge in the form of multiple parallel streaks with width b between the paste streaks,
Drying method, two T-die coaters having a comb-like shim incorporated in the exit gap of the T-die are arranged so that the positions of the shim partitions are alternately arranged.
A conductive paste is discharged from the die exit of one T-die coater onto the traveling support substrate in the form of multiple parallel stripes having a width a and a pitch p. A method of discharging the pressure-sensitive adhesive solution from the die outlet of the other T-die coater in a multi-parallel streak shape with a width b between the conductive paste streaks and then drying can be used.

【0008】図2の(イ)は上記実施例の導電性接着テ
−プの使用状態を示す図面、図2の(ロ)は図2の
(イ)におけるロ−ロ断面図であり、加圧により筋状粘
着部3,…を被導通部位X(Y)に感圧接着させて筋状
導電部2,…を部位X(Y)に接触させてある。この場
合、加圧力を大としても、エンボス突起の場合とは異な
り、導電部材が圧潰するようなことがない。従って、加
圧力を大として筋状粘着部と各被導通部位X,Yとを充
分な感圧接着力で固着でき、筋状接着部を各部位X,Y
に強固に接触固定できる。
FIG. 2A is a drawing showing the state of use of the conductive adhesive tape of the above embodiment, and FIG. 2B is a cross-sectional view taken along the line in FIG. The streaky conductive portions 2,... Are brought into contact with the portion X (Y) by pressure-sensitively bonding the streak-like adhesive portions 3,. In this case, even if the pressing force is large, unlike the case of the embossed projection, the conductive member does not collapse. Therefore, by applying a large pressure, the streak-like adhesive portion and each of the connected portions X, Y can be fixed with a sufficient pressure-sensitive adhesive force, and the streak-like adhesive portion can be fixed to each of the portions X, Y
Can be firmly contacted and fixed.

【0009】上記において、粘着固定力を可及的に大き
くするために、筋状粘着部の巾bを筋状導電部の巾aよ
りも大きくすることが好ましい。上記電気的導通経路の
抵抗値は、支持基材1が絶縁体の場合、被導通部位X
(Y)と筋状導電部2,…との接触抵抗と筋状導電部
2,…の長手方向抵抗値とで与えられる。この抵抗値よ
りも更に抵抗値を低くする場合は、支持基材1に導電性
の支持基材が用いられる。
In the above, in order to increase the adhesive fixing force as much as possible, it is preferable that the width b of the streak-like adhesive portion is larger than the width a of the streak-like conductive portion. When the supporting base material 1 is an insulator, the resistance value of the electric conduction path is the connected portion X.
Are provided by the contact resistance between (Y) and the streak-like conductive portions 2, and the longitudinal resistance value of the streak-like conductive portions 2,. If the resistance value is to be lower than this resistance value, a conductive support substrate is used as the support substrate 1.

【0010】この絶縁性支持基材には、プラスチックフ
ィルム(例えば、ポリエステルフィルム)、プラスチッ
ク不織布または織布を使用でき、導電性支持基材には、
金属箔、金属化プラスチックフィルムや不織布(金属蒸
着プラスチックフィルム、金属メッキプラスチックフィ
ルムまたは不織布若しくは織物、例えば、無電解ニッケ
ルめっきポリエステルサテン織物、金属箔ラミネ−トプ
ラスチックフィルム等)、金属繊維織布、金属繊維を混
紡または混織したプラスチック不織布または織布等を使
用できる。上記筋状導電部のみで電気的導通のコンダク
タンスの条件が充足される場合、支持基材に絶縁性支持
基材を使用できることは、既述した通りであるが、この
場合、図3に示すように、筋状導電部2と筋状粘着部3
とを強固に一体化して支持基材を省略することもでき
る。
A plastic film (for example, a polyester film), a plastic non-woven fabric or a woven fabric can be used for the insulating support substrate.
Metal foil, metalized plastic film or non-woven fabric (metal-deposited plastic film, metal-plated plastic film or non-woven fabric or woven fabric, for example, electroless nickel-plated polyester satin woven fabric, metal foil laminated plastic film, etc.), metal fiber woven fabric, metal Plastic nonwoven fabric or woven fabric in which fibers are blended or blended can be used. When the condition of the conductance of the electrical conduction is satisfied only with the above-mentioned streaked conductive portion, as described above, it is possible to use the insulating supporting base material as the supporting base material. In this case, as shown in FIG. The streak-like conductive part 2 and the streak-like adhesive part 3
Can be firmly integrated to omit the support base material.

【0011】図3に示す、導電性接着テ−プを製造する
には、図4に示す複数枚の粘着剤シ−ト3と導電性シ−
ト2とを積層一体化してなる円形ディスクを旋盤に取り
付けて回転させ、平バイトで外周側から連続的に一定厚
みで切削していき、この間、粘着剤シ−トのバイトへの
付着を防止するために、ドライアイスや液体窒素で冷却
しつつ切削することが有効である。上記導電性シ−トに
は、アルミ箔、銅箔、鉄箔、黄銅箔、ニッケル箔等の使
用も可能であるが、鉛箔、はんだ箔(鉛−錫合金箔)、
金属ペ−ストのキャスティングシ−ト(例えば、銀ペ−
スト、銅ペ−スト、ニッケルペ−ストをシリコ−ン剥離
剤処理したポリエステルフィルム上で塗布乾燥したも
の)等の使用が切削性に優れ、好ましい。
To manufacture the conductive adhesive tape shown in FIG. 3, a plurality of adhesive sheets 3 and a conductive sheet shown in FIG.
A circular disc made by laminating and integrating the tape 2 is mounted on a lathe and rotated, and continuously cut with a flat bite from the outer circumference to a constant thickness. During this time, adhesion of the adhesive sheet to the bite is prevented. For this purpose, it is effective to perform cutting while cooling with dry ice or liquid nitrogen. Aluminum foil, copper foil, iron foil, brass foil, nickel foil and the like can be used for the conductive sheet, but lead foil, solder foil (lead-tin alloy foil),
Casting sheet of metal paste (for example, silver paste)
Or a polyester paste obtained by applying a paste, a copper paste or a nickel paste on a polyester film treated with a silicone release agent) is excellent in machinability and is preferred.

【0012】上記実施形態においては、筋状接着部に筋
状粘着部を使用しているが、加熱接着型の筋状接着部を
使用することもできる。上記実施形態においては、支持
基材の片面のみに筋状導電部及び筋状接着部を並設して
いるが、両面に並設することもでき、この場合、筋状導
電部または/及び筋状接着部の材質、巾、または厚みの
少なくとも何れかを両面間で異ならせることもできる。
上記導電性接着テ−プの各部の通常の寸法は、通常、筋
状導電部または筋状接着部の厚みが20〜100μm、
筋状導電部の巾が30〜300μm、筋状接着部の巾が
50〜500、支持基材の厚みが10〜1000μmと
される。なお、本発明に係る導電性接着テ−プは、広巾
のシ−トも包含し、このシ−トの切断によってテ−プと
することもできる。
In the above embodiment, the streak-like adhesive portion is used as the streak-like adhesive portion. However, a heat-bonding type streak-like adhesive portion may be used. In the above embodiment, the streak-like conductive portion and the streak-like adhesive portion are provided side by side only on one side of the support base material. However, the streak-like conductive portion and / or streak can also be provided on both sides. At least one of the material, width, and thickness of the shape-bonded portion may be different between both surfaces.
The normal size of each part of the conductive adhesive tape is usually such that the thickness of the streaky conductive part or the streaky adhesive part is 20 to 100 μm,
The width of the streak-like conductive portion is 30 to 300 μm, the width of the streak bonding portion is 50 to 500, and the thickness of the supporting base material is 10 to 1000 μm. The conductive adhesive tape according to the present invention also includes a wide sheet, and the tape can be formed by cutting the sheet.

【0013】本発明に係る導電性接着テ−プは、導通連
結のワンタッチ性、薄型のために、広い分野で使用で
き、例えば、電磁波シ−ルドや静電気対策のための接
地、小型・薄型電子部品の電極と回路基板のランド間の
導通等に使用できる。
The conductive adhesive tape according to the present invention can be used in a wide range of fields because of the one-touch property of conductive connection and thinness. For example, grounding for electromagnetic wave shielding and measures against static electricity, and small and thin electronic devices. It can be used for conduction between electrodes of components and lands on a circuit board.

【0014】[0014]

【実施例】【Example】

〔実施例1〕厚さ38μmのポリエステルフィルムの片
面に第1のTダイコ−タ−で、アクリル系粘着剤を巾4
mm、ピッチ5mmで塗布し、巾1mmの筋状未塗布部
分に銀ペ−スト(神東塗料株式会社製、商品名シントロ
ン導電性インクK−3080)を第2のTダイコ−タ−
で塗布し、更に乾燥して筋状導電部及び筋状接着部の厚
みが50μmの導電性接着テ−プを得た。 〔実施例2〕厚さ25μmのポリエステルフィルムに厚
み18μmの銅箔をラミネ−トした複合シ−トを支持基
材として使用し、銅箔上に筋状導電部及び筋状接着部を
形成した以外、実施例1に同じとした。 〔実施例3〕厚さ100μmのはんだ箔に厚さ500μ
mのアクリル系粘着剤フィルムを張り合わせ、外径10
0mm、内径30mmのド−ナツ型に切り抜き、これを
25枚積層し、この積層体の中心孔にφ30mmの心棒
を通し、ナットで締め付けた。この締め付け積層体を旋
盤に取付け、ドライアイスメタノ−ル冷媒で冷却しなが
ら、平バイトで厚み100μmの連続帯に削り出して導
電性接着テ−プを得た(筋状導電部の巾は100μm、
筋状粘着部の巾は500μm)。
Example 1 An acrylic pressure-sensitive adhesive having a width of 4 μm was applied to one side of a 38 μm-thick polyester film using a first T-die coater.
mm and a pitch of 5 mm, and a silver paste (Shintron conductive ink K-3080, trade name, manufactured by Shinto Paint Co., Ltd.) is applied to the uncoated portion having a width of 1 mm on the second T-die coater.
And then dried to obtain a conductive adhesive tape having a streak-like conductive portion and a streak-like adhesive portion having a thickness of 50 μm. Example 2 A composite sheet in which a 18 μm-thick copper foil was laminated on a 25 μm-thick polyester film was used as a support base material, and a streak-like conductive portion and a streak-like bond portion were formed on the copper foil. Other than the above, it was the same as Example 1. Example 3 500 μm thick solder foil having a thickness of 100 μm
m acrylic adhesive film, outer diameter 10
A cutout was cut out into a donut shape having a diameter of 0 mm and an inner diameter of 30 mm. Twenty-five of these were laminated, and a mandrel having a diameter of 30 mm was passed through the center hole of the laminate, and tightened with a nut. The tightened laminate was mounted on a lathe and cut into a continuous band having a thickness of 100 μm with a flat cutting tool while cooling with a dry ice methanol refrigerant to obtain a conductive adhesive tape (the width of the streaky conductive portion was 100 μm). ,
The width of the streaky adhesive portion is 500 μm).

【0015】〔比較例〕厚さ38μmの銅箔の片面に厚
さアクリル系粘着剤層を設け、銅箔に高さ40μm、相
互間隔5mmの突部をエンボッシングにより形成して銅
箔をその各突部においてアクリル系粘着剤層面に表出さ
せて導電性接着テ−プを得た。これらの実施例品及び比
較例品のそれぞれにつき(試料数はそれぞれ10箇)、
巾5mm、長さ25mmの銅箔電極を距離50mm隔て
て設けたアクリル樹脂板(厚さ2mm)の電極間に巾1
0mmの導電性接着テ−プを電極を越えて貼付け、貼付
け直後の抵抗値と50℃,90RHの恒温恒湿槽に96
時間放置後の抵抗値の比(%)を測定したところ、実施
例のものでは、全て150%以下であり、極めて安定な
コンダクタンスであった。これに対し、比較例のもので
は、150%を越え500%に達したものもあり、コン
ダクタンスが不安定であった。
Comparative Example An acrylic pressure-sensitive adhesive layer was provided on one side of a copper foil having a thickness of 38 μm, and a projection having a height of 40 μm and a spacing of 5 mm was formed on the copper foil by embossing to form a copper foil. The conductive adhesive tape was obtained by exposing the protrusions on the surface of the acrylic pressure-sensitive adhesive layer. For each of these examples and comparative examples (10 samples each),
A width of 1 mm is placed between electrodes of an acrylic resin plate (2 mm thick) in which copper foil electrodes having a width of 5 mm and a length of 25 mm are provided at a distance of 50 mm.
A 0 mm conductive adhesive tape is pasted over the electrode, and the resistance value immediately after pasting and 96 hours in a constant temperature and humidity chamber of 50 ° C. and 90 RH.
When the ratio (%) of the resistance value after standing for a time was measured, in the case of the examples, all were 150% or less, and the conductance was extremely stable. On the other hand, in the case of the comparative example, there was a case where the conductivity exceeded 150% and reached 500%, and the conductance was unstable.

【0016】[0016]

【発明の効果】本発明に係る導電性接着テ−プは上述し
た通りの構成であり、感圧接着力を大きくするために加
圧力を高くしても、被導通部位に接触された筋状導電部
を圧潰されることなく安定に保持できるから、加圧力を
大にして強固に接着固定できる。また、筋状導電部より
も筋状接着部を多くして接着固定力の増強を図っても、
支持基材を導電性にすることにより電気的導通の低抵抗
を保証できる。従って、本発明によれば、優れた電気的
導通性と強固な接着固定性を保証できる導電性接着テ−
プを提供できる。
The conductive adhesive tape according to the present invention has the structure as described above. Even if the pressing force is increased in order to increase the pressure-sensitive adhesive force, the conductive tape in contact with the portion to be electrically connected can be used. Since the portion can be stably held without being crushed, the pressure can be increased and the adhesive can be firmly fixed. In addition, even if the number of streak-like adhesive portions is larger than that of streak-like conductive portions to enhance the adhesive fixing force,
By making the supporting base material conductive, a low resistance of electrical conduction can be guaranteed. Therefore, according to the present invention, a conductive adhesive tape that can guarantee excellent electrical conductivity and strong adhesive fixation.
Can be provided.

【図面の簡単な説明】[Brief description of the drawings]

【図1】請求項1に係る導電性接着テ−プを示す図面で
ある。
FIG. 1 is a drawing showing a conductive adhesive tape according to claim 1;

【図2】本発明に係る導電性接着テ−プの使用状態を示
す図面である。
FIG. 2 is a view showing a use state of a conductive adhesive tape according to the present invention.

【図3】請求項3に係る導電性接着テ−プを示す図面で
ある。
FIG. 3 is a view showing a conductive adhesive tape according to claim 3;

【図4】請求項4に係る導電性接着テ−プの製造方法に
おいて使用する円形ディスクを示す図面である。
FIG. 4 is a view showing a circular disk used in the method for manufacturing a conductive adhesive tape according to claim 4;

【符号の説明】[Explanation of symbols]

1 支持基材 2 筋状導電部 3 筋状接着部 DESCRIPTION OF SYMBOLS 1 Support base material 2 Streaked conductive part 3 Streaked adhesion part

───────────────────────────────────────────────────── フロントページの続き (72)発明者 海田 邦彦 大阪府茨木市下穂積1丁目1番2号 日東 電工株式会社内 (72)発明者 松岡 直樹 大阪府茨木市下穂積1丁目1番2号 日東 電工株式会社内 (72)発明者 佐藤 博隆 大阪府茨木市下穂積1丁目1番2号 日東 電工株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Kunihiko Kaita, Inventor 1-11-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation (72) Naoki Matsuoka 1-1-1-2 Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation (72) Inventor Hirotaka Sato 1-2-1, Shimohozumi, Ibaraki-shi, Osaka Nitto Denko Corporation

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】支持基材の片面または両面に、複数本の筋
状導電部と筋状接着部とが交互に並設されていることを
特徴とする導電性接着テ−プ。
1. A conductive adhesive tape, wherein a plurality of streaky conductive portions and streak bonded portions are alternately arranged on one or both surfaces of a supporting base material.
【請求項2】支持基材が導電性基材である請求項1記載
の導電性接着テ−プ。
2. The conductive adhesive tape according to claim 1, wherein the supporting substrate is a conductive substrate.
【請求項3】複数本の筋状導電部と筋状接着部とが交互
に並設一体化されていることを特徴とする導電性接着テ
−プ。
3. A conductive adhesive tape, wherein a plurality of streak conductive portions and streak adhesive portions are alternately arranged side by side and integrated.
【請求項4】複数枚の接着性シ−トと導電性シ−トとを
積層一体化してなる円形ディスクを回転させて外周側か
ら連続的に一定厚みで切削することを特徴とする導電性
接着テ−プの製造方法。
4. A conductive material characterized in that a circular disk formed by laminating and integrating a plurality of adhesive sheets and conductive sheets is continuously cut from an outer peripheral side at a constant thickness. A method for producing an adhesive tape.
JP15914897A 1997-06-02 1997-06-02 Conductive adhesive tape and its manufacture Pending JPH10334971A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15914897A JPH10334971A (en) 1997-06-02 1997-06-02 Conductive adhesive tape and its manufacture

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15914897A JPH10334971A (en) 1997-06-02 1997-06-02 Conductive adhesive tape and its manufacture

Publications (1)

Publication Number Publication Date
JPH10334971A true JPH10334971A (en) 1998-12-18

Family

ID=15687315

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15914897A Pending JPH10334971A (en) 1997-06-02 1997-06-02 Conductive adhesive tape and its manufacture

Country Status (1)

Country Link
JP (1) JPH10334971A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007056778A1 (en) 2007-11-23 2009-05-28 Lohmann Gmbh & Co. Kg Manufacturing a combination bonding device, comprises mounting geometrical recesses in defined dimensions and distances in double-sided self-adhesive device and producing article covered with release liner filled with filling adhesive

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102007056778A1 (en) 2007-11-23 2009-05-28 Lohmann Gmbh & Co. Kg Manufacturing a combination bonding device, comprises mounting geometrical recesses in defined dimensions and distances in double-sided self-adhesive device and producing article covered with release liner filled with filling adhesive

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