JPH10326572A - Manufacture of plasma display panel - Google Patents
Manufacture of plasma display panelInfo
- Publication number
- JPH10326572A JPH10326572A JP9136965A JP13696597A JPH10326572A JP H10326572 A JPH10326572 A JP H10326572A JP 9136965 A JP9136965 A JP 9136965A JP 13696597 A JP13696597 A JP 13696597A JP H10326572 A JPH10326572 A JP H10326572A
- Authority
- JP
- Japan
- Prior art keywords
- plasma display
- display panel
- sealing
- sealed
- glass substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイパネル(以下、PDPという)の製造方法に関する
ものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a plasma display panel (hereinafter, referred to as PDP).
【0002】[0002]
【従来の技術】PDPの製造方法として種々の方法が提
案されているが、その1つとして、図6,7に示すよう
に、前面ガラス基板1と背面ガラス基板2との対向面に
従来同様、電極(図示せず)および隔壁2aを設け、両
ガラス基板1,2のうち、たとえば背面ガラス基板2の
前記対向面の外周部に低融点ガラス等のシール用封着材
4aをディスペンサー等で塗布し、さらにその上にスペ
ーサ用封着材4bを所定間隔にて設けたのち乾燥し、こ
の背面ガラス基板2と前面ガラス基板1をクランプ金具
5にて固定してPDP組立体Tとする。そして、このP
DP組立体Tを密閉炉内に装入して300〜400℃に
加熱するとともに炉内を排気することで、同時に両ガラ
ス基板1,2の脱ガスを行なう。この場合、炉の昇温速
度は3〜15℃/分、排気は10-6〜10-7Torr程
度とする。前記のようにして、炉内を所定真空度として
炉内排気と両ガラス基板1,2からの脱ガスが完了する
と、炉内に、たとえば、ネオンガス等の放電ガスを供給
(所期の封入ガス圧を得るのに必要な量)することで、
ガラス基板間に放電ガスを導入する。その後、さらに炉
内温度を封着材4a,4bの軟化温度である400〜5
00℃に上昇させて前記封着材を軟化させて封着処理し
て両ガラス基板1,2内に放電ガスを封入することで、
PDPとするものである。2. Description of the Related Art Various methods have been proposed for manufacturing a PDP. One of the methods is as shown in FIGS. 6 and 7, where a front glass substrate 1 and a rear glass substrate 2 are opposed to each other. , An electrode (not shown) and a partition wall 2a, and a sealing material 4a such as a low-melting glass or the like, which is made of, for example, low melting point glass, is provided on the outer peripheral portion of the opposite surface of the rear glass substrate 2 by using a dispenser or the like. After coating, a sealing material for spacers 4b is provided thereon at a predetermined interval and then dried, and the rear glass substrate 2 and the front glass substrate 1 are fixed with clamps 5 to form a PDP assembly T. And this P
By loading the DP assembly T into a closed furnace and heating it to 300 to 400 ° C. and evacuating the furnace, the two glass substrates 1 and 2 are simultaneously degassed. In this case, the heating rate of the furnace is 3 to 15 ° C./min, and the exhaust is about 10 −6 to 10 −7 Torr. When the inside of the furnace is exhausted to a predetermined degree of vacuum and the degassing from the glass substrates 1 and 2 is completed as described above, a discharge gas such as a neon gas is supplied into the furnace (for example, the desired sealed gas The amount needed to obtain pressure)
A discharge gas is introduced between the glass substrates. Thereafter, the furnace temperature is further increased to 400 to 5 which is the softening temperature of the sealing materials 4a and 4b.
By raising the temperature to 00 ° C. to soften the sealing material, sealing and sealing the discharge gas in both glass substrates 1 and 2,
PDP.
【0003】[0003]
【発明が解決しようとする課題】前記方法でPDPを製
造したところ、PDP内の放電ガスの封入ガス圧に±1
0%以上のバラツキがあり、種々支障を来すことが判明
した。そこで、本発明者らは、その原因につき検討した
ところ、下記理由によることを知見した。すなわち、前
記両ガラス基板1,2はその外縁部に設けたスペーサ用
封着材4bにより内外が連通状態であることから、炉内
温度の上昇につれて封着材4a,4bが軟化し、封着材
4a,4bが両ガラス基板1,2の対向外縁部を封止す
る瞬間におけるPDPの内外の圧力は同一である。この
時の両ガラス基板1,2間の隙間Dは、封着材4a,4
bの塗布状態により決定される。その後、炉内温度をさ
らに上昇させると封着材4a,4bの軟化がさらに進行
するとともに、クランプ金具5による押圧力により両ガ
ラス基板1,2が封着され、両ガラス基板1,2間の距
離が所期の隙間d(封着完了時の封着材4の厚み)とな
る。つまり、前述のように、両ガラス基板1,2の外縁
部が封止された後、その間隙は所定値まで減少する(D
→d)ため、PDP内の封入ガス圧P1′は両ガラス基
板1,2の外縁部内の面積をS、放電ガス供給完了時の
炉内圧をP1とすると、P1×D×S=P1′×d×S
∴ P1′=P1(D/d) となる。ここで、D=2
00μ、d=150μ、P1=500Torr とする
と、P1′=667Torr となり、PDP内の封入
ガス圧が大きく変化する。When a PDP is manufactured by the above method, the gas pressure of the discharge gas in the PDP is ± 1.
It was found that there was variation of 0% or more, which caused various problems. Then, the present inventors examined the cause and found that it was due to the following reason. That is, since the inside and outside of the glass substrates 1 and 2 are in communication with each other by the spacer sealing material 4b provided at the outer edge thereof, the sealing materials 4a and 4b soften as the temperature in the furnace increases, and the sealing is performed. The pressures inside and outside the PDP at the moment when the members 4a and 4b seal the opposing outer edges of the glass substrates 1 and 2 are the same. The gap D between the two glass substrates 1 and 2 at this time is
It is determined by the application state of b. Thereafter, when the temperature in the furnace is further increased, the softening of the sealing materials 4a and 4b further progresses, and the two glass substrates 1 and 2 are sealed by the pressing force of the clamp 5 so that the gap between the two glass substrates 1 and 2 is reduced. The distance becomes an expected gap d (the thickness of the sealing material 4 at the time of completing the sealing). That is, as described above, after the outer edges of both glass substrates 1 and 2 are sealed, the gap decreases to a predetermined value (D
→ d) Therefore, the filling gas pressure P 1 ′ in the PDP is P 1 × D × S = S, where S is the area within the outer edges of both glass substrates 1 and 2 and P 1 is the furnace pressure when discharge gas supply is completed. P 1 ′ × d × S
∴P 1 ′ = P 1 (D / d). Where D = 2
If 00 μ, d = 150 μ, and P 1 = 500 Torr, P 1 ′ = 667 Torr, and the pressure of the gas sealed in the PDP changes greatly.
【0004】また、封着材4a,4bは前述のようにデ
ィスペンサー等で形成されるが、その量および形状を完
全に同一にすることは不可能であるから、両ガラス基板
1,2が封止する瞬間の隙間Dを正確に制御することが
できない。このため、封着材4a,4bによる両ガラス
基板1,2の封止開始時からの押込量が一定とならない
ため、予め押込量に見合ったガス圧力を導入してPDP
内の封入ガス圧を一定にすることができないことに起因
することを知見した。したがって、本発明は、封着材の
形成状態に関係なく、常に、PDP内の放電ガスの封入
ガス圧を一定とすることのできるPDPの製造方法を提
供することを第1目的とする。また、前記方法を実施す
るにあたり、ゲッタ材を活性化するゲッタ付きPDPの
製造方法を提供することを第2目的とする。The sealing materials 4a and 4b are formed by a dispenser or the like as described above, but it is impossible to make the amounts and shapes completely identical. The gap D at the moment of stopping cannot be accurately controlled. For this reason, the pressing amount from the start of sealing the glass substrates 1 and 2 with the sealing materials 4a and 4b is not constant, so that a gas pressure appropriate for the pressing amount is introduced in advance to the PDP.
It has been found that this is due to the fact that the sealed gas pressure cannot be kept constant. Accordingly, it is a first object of the present invention to provide a method of manufacturing a PDP capable of always keeping the gas pressure of the discharge gas in the PDP constant irrespective of the state of formation of the sealing material. It is a second object of the present invention to provide a method of manufacturing a gettered PDP for activating a getter material when implementing the above method.
【0005】[0005]
【課題を解決するための手段】本発明は、前記目的を達
成するために、前面ガラス基板と背面ガラス基板とから
なるプラズマディスプレイパネル組立体を密閉空間に位
置させて、当該空間を真空排気したのち放電ガスを前記
空間に供給し、その後、前記プラズマディスプレイパネ
ル組立体を封着するプラズマディスプレイパネルの製造
方法において、前記ガラス基板の一方に通気孔を設けた
ものを使用してプラズマディスプレイパネル組立体を封
着したのち、前記通気孔を封止するものである。また、
前記通気孔を介してゲッタ材をプラズマディスプレイパ
ネル組立体内に位置させて封着したのち、前記通気孔を
封止するものである。According to the present invention, in order to achieve the above object, a plasma display panel assembly comprising a front glass substrate and a rear glass substrate is located in a closed space, and the space is evacuated. Thereafter, a discharge gas is supplied to the space, and then the plasma display panel assembly is sealed. In the method for manufacturing a plasma display panel, a plasma display panel assembly is provided using one of the glass substrates provided with a vent hole. After sealing the three-dimensional object, the air hole is sealed. Also,
After the getter material is positioned and sealed in the plasma display panel assembly through the air hole, the air hole is sealed.
【0006】[0006]
【発明の実施の形態】つぎに、本発明の実施の態様につ
いて図にもとづいて説明する。本発明の第1の実施の形
態は、前記前面ガラス基板1あるいは背面ガラス基板2
のいずれか一方のガラス基板に通気孔3を設けたものを
使用し、この両ガラス基板1,2からなるPDP組立体
Tを封着したのち、前記通気孔3を封止するようにした
ものである。Next, an embodiment of the present invention will be described with reference to the drawings. In the first embodiment of the present invention, the front glass substrate 1 or the rear glass substrate 2
Using a glass substrate provided with a vent hole 3 on one of the glass substrates, sealing the PDP assembly T composed of the two glass substrates 1 and 2, and then sealing the vent hole 3 It is.
【0007】すなわち、図1に示すように、たとえば、
背面ガラス基板2のシール用封着材塗布部よりやや内方
に通気孔3を設け、この通気孔3を囲むように、低融点
ガラスからなる最終封着材6を位置させる。この最終封
着材6は前記シール用、スペース用封着材4a,4bよ
り軟化点が高い材料により成型したもので、図2
(A),(B)に示すようにC形状や側壁に溝を形成し
たリング形状をし、前者の開口、後者の溝をガス流通孔
7としたものである。表面ガラス基板1と背面ガラス基
板2とは、背面ガラス基板2の外縁部にシール用、スペ
ース用封着材4a,4bを塗布して乾燥・仮焼成した
後、クランプ金具5により背面ガラス基板2を上側とし
て組付けてPDP組立体Tとする。このPDP組立体T
の内外は連通状態となっている。なお、シール用、スペ
ース用封着材4a,4bとしては、たとえば日本電気硝
子(株)製LS−0118…軟化点390℃、最終封着
材6としては、たとえば同社製LS−0206…軟化点
410℃などが使用できる。That is, as shown in FIG.
An air hole 3 is provided slightly inside the sealing material application portion of the rear glass substrate 2, and a final sealing material 6 made of low melting glass is positioned so as to surround the air hole 3. This final sealing material 6 is made of a material having a higher softening point than the sealing and space sealing materials 4a and 4b.
As shown in (A) and (B), it has a C shape or a ring shape in which a groove is formed in a side wall, and the former opening and the latter groove are gas flow holes 7. The front glass substrate 1 and the rear glass substrate 2 are coated with sealing and space sealing materials 4a and 4b on the outer edge of the rear glass substrate 2 and dried and calcined. To the PDP assembly T. This PDP assembly T
Inside and outside are in communication. The sealing materials 4a and 4b for sealing and space are, for example, LS-0118 (softening point: 390 ° C., manufactured by NEC Corporation), and the final sealing material 6 is, for example, LS-0206 (softening point, manufactured by Nippon Glass). 410 ° C or the like can be used.
【0008】ついで、前記最終封着材6上にシールガラ
ス板8を載置するとともに、背面ガラス基板2上にステ
ンレス鋼等からなる組付治具9を載置し、この組付治具
9との間に介在したスプリング11により前記シールガ
ラス板8を最終封着材6に圧着した状態とする。そし
て、密閉炉内に装入して図3のヒートカーブにしたがっ
て、340〜370℃に加熱するとともに炉内を排気す
ることで、同時に両ガラス基板1,2の脱ガスを行な
う。この場合、炉の昇温速度は約3℃/分、排気は10
-6〜10-7Torr程度である。そして、前記340〜
370℃で一定時間均熱して前記両ガラス基板1,2の
脱ガスを確実に行なう。前記のようにして、炉内を所定
真空度とし炉内排気と両ガラス基板1,2からの脱ガス
が完了すると、炉内を410〜470℃に再昇温する。Next, a sealing glass plate 8 is placed on the final sealing material 6 and an assembling jig 9 made of stainless steel or the like is placed on the back glass substrate 2. The seal glass plate 8 is brought into pressure contact with the final sealing material 6 by a spring 11 interposed therebetween. Then, the two glass substrates 1 and 2 are simultaneously degassed by being charged into a closed furnace and heated to 340 to 370 ° C. and evacuated according to the heat curve of FIG. In this case, the heating rate of the furnace is about 3 ° C./min, and the exhaust rate is 10
About -6 to 10 -7 Torr. And said 340
The glass substrates 1 and 2 are surely degassed by heating at 370 ° C. for a certain time. As described above, when the inside of the furnace is set to a predetermined vacuum degree and the inside of the furnace and the degassing from both glass substrates 1 and 2 are completed, the inside of the furnace is heated to 410 to 470 ° C again.
【0009】一方、炉内空間に、たとえば、ネオンガス
等の放電ガスを前記均熱中の後半(脱ガスの完了時点)
で導入する。この放電ガスは、加熱されて温度が高いた
め、PDPの常温における所定圧力を保持する必要上、
たとえば450℃においては常温時の所定圧力(放電ガ
スの封入ガス圧)の約2.4倍の圧力とする必要があ
る。On the other hand, a discharge gas such as a neon gas is supplied into the furnace space in the latter half of the soaking (at the completion of degassing).
Introduce. Since this discharge gas is heated and has a high temperature, it is necessary to maintain a predetermined pressure at normal temperature of the PDP.
For example, at 450 ° C., the pressure needs to be about 2.4 times the predetermined pressure (normal gas pressure of the discharge gas) at normal temperature.
【0010】ところで、前記封着材4a,4bは図3の
A点にて軟化を開始して両ガラス基板1,2の外縁部は
封止される。この瞬間の両ガラス基板1,2内の圧力P
1と炉内圧P2とは同じである(P1=P2)。その後、炉
内温度の昇温により前記封着材4a,4bはさらに軟化
するとともに、クランプ金具5により押圧され、B点で
両ガラス基板1,2間の隙間が減少する(Dからd)。
この際、前記最終封着材6は軟化点が封着材4a,4b
より高いため非軟化状態であるから、前記両ガラス基板
1,2間の隙間がDからdへと減少して両ガラス基板
1,2間の内圧が大になろうとしても最終封着材6のガ
ス流通孔7、組付治具9の通気孔10から両ガラス基板
1,2間の圧力が炉内へ逃げて同圧に維持される(P1
=P2)。By the way, the sealing materials 4a and 4b start to soften at a point A in FIG. 3 and the outer edges of both glass substrates 1 and 2 are sealed. At this moment, the pressure P in both glass substrates 1 and 2
1 and the furnace pressure P 2 are the same (P 1 = P 2 ). After that, the sealing materials 4a and 4b are further softened by the rise in the furnace temperature, and are pressed by the clamp 5 so that the gap between the glass substrates 1 and 2 is reduced at the point B (from D to d).
At this time, the final sealing material 6 has a softening point of the sealing materials 4a, 4b.
Since it is in a non-softened state because it is higher, even if the gap between the two glass substrates 1 and 2 decreases from D to d and the internal pressure between the two glass substrates 1 and 2 becomes large, the final sealing material 6 The pressure between the glass substrates 1 and 2 escapes from the gas flow hole 7 and the ventilation hole 10 of the assembling jig 9 into the furnace and is maintained at the same pressure (P 1).
= P 2).
【0011】その後、C点において、前記最終封着材6
が軟化し、前記シールガラス板8はスプリング11の押
圧力で通気孔3を封止することになる。なお、この場合
においても最終封着材6は軟化してガス流通孔7を閉鎖
した後、さらに軟化して押圧されるため、若干ガラス基
板1,2内の圧力は大となるが、その容積変化は全体か
らみれば極めて小さく無視することができる。つまり、
放電ガスは炉内圧P2とほぼ同一の状態で両ガラス基板
1,2間に封入される。前記のようにしてガラス基板
1,2間に放電ガスが封入されると、約3.5℃/分の
冷却速度で冷却して所定のPDPとする。Then, at point C, the final sealing material 6
Is softened, and the sealing glass plate 8 seals the ventilation hole 3 with the pressing force of the spring 11. In this case as well, since the final sealing material 6 is softened and closed after closing the gas flow holes 7, it is further softened and pressed, so that the pressure in the glass substrates 1 and 2 is slightly increased. The change is very small and can be ignored in the whole. That is,
The discharge gas is sealed between the two glass substrates 1 and 2 in substantially the same state as the furnace pressure P2. When the discharge gas is sealed between the glass substrates 1 and 2 as described above, a predetermined PDP is obtained by cooling at a cooling rate of about 3.5 ° C./min.
【0012】前記のガス導入例は340〜370℃の脱
ガス均熱後に発光ガスを導入した例であるが、下記方法
をとってもよい。340〜370℃での真空脱ガス後、
真空排気をそのまま続行しつつ炉を昇温させ、基板シー
ル材4a,4bの軟化開始温度Aと最終シール材6の封
止温度Cの温度範囲で放電ガスを密閉炉内にガスを導入
する。この方法では、炉内に導入された放電ガスは、組
付治具9の通気孔10、最終封着材6のガス流通孔7か
らPDP内に侵入する。The above gas introduction example is an example in which the luminescent gas is introduced after degassing and soaking at 340 to 370 ° C., but the following method may be adopted. After vacuum degassing at 340-370 ° C,
The furnace is heated while vacuum evacuation is continued, and discharge gas is introduced into the closed furnace within a temperature range of the softening start temperature A of the substrate sealing materials 4a and 4b and the sealing temperature C of the final sealing material 6. In this method, the discharge gas introduced into the furnace enters the PDP through the ventilation holes 10 of the assembling jig 9 and the gas flow holes 7 of the final sealing material 6.
【0013】前記PDP内への封入ガス(放電ガス)は
出来るだけ不純物(N2,O2,H2,CO,CO2等)が
少ないことが望ましい。このため、図4に示すように、
PDP内にゲッタ材を設けて前記不純物を除去する方法
がある。この場合、前記通気孔3をゲッタルームの一部
として利用するとともに、前記封着材4a,4bの封着
温度をゲッタ材12の活性化処理温度に利用することが
できる。すなわち、PDP組立体Tを構成する過程にお
いて、ゲッタ材(たとえば、サエス ゲッターズ ジャ
パン(株)製Pt707…活性化温度400〜500
℃)12を背面ガラス基板2に設けた通気孔3内に位置
するようにしてPDP組立体Tを構成し、前述のヒート
カーブにより封着処理を行なえば、最終封着温度(41
0〜470℃)において前記ゲッタ12は活性化され、
PDP内の放電ガス中の不純ガスを吸着することにな
る。なお、最終封着材6は、図5に示すように、シール
用封着材6aとスペース用封着材6bで構成されてい
る。It is desirable that the gas (discharge gas) filled in the PDP has as few impurities (N 2 , O 2 , H 2 , CO, CO 2, etc.) as possible. For this reason, as shown in FIG.
There is a method of removing the impurities by providing a getter material in the PDP. In this case, the ventilation hole 3 can be used as a part of the getter room, and the sealing temperature of the sealing materials 4 a and 4 b can be used as the activation processing temperature of the getter material 12. That is, in the process of forming the PDP assembly T, a getter material (for example, Pt707 manufactured by SAES Getters Japan KK) having an activation temperature of 400 to 500
C) 12 is located in the air hole 3 provided in the rear glass substrate 2 to form the PDP assembly T, and if the sealing process is performed by the above-described heat curve, the final sealing temperature (41)
0-470 ° C.), the getter 12 is activated,
Impurity gas in the discharge gas in the PDP will be adsorbed. As shown in FIG. 5, the final sealing material 6 includes a sealing sealing material 6a and a space sealing material 6b.
【0014】PDP組立体Tにおける両ガラス基板1,
2の隙間形成は、前記実施形態に限らず、実質的に隙間
が形成されるのであれば、他の方法を採用してもよい。The two glass substrates 1 in the PDP assembly T
The formation of the gap 2 is not limited to the above-described embodiment, and another method may be adopted as long as the gap is substantially formed.
【0015】[0015]
【発明の効果】以上の説明で明らかなように、請求項1
の発明によれば、前面ガラス基板と背面ガラス基板とか
らなるプラズマディスプレイパネル組立体を密閉空間に
位置させて、当該空間を真空排気したのち放電ガスを前
記空間に供給し、その後、前記プラズマディスプレイパ
ネル組立体を封着するプラズマディスプレイパネルの製
造方法において、前記ガラス基板の一方に通気孔を設け
たものを使用してプラズマディスプレイパネル組立体を
封着したのち、前記通気孔を封止するようにしたから、
つまり、両ガラス基板が完全に封着されたのちに通気孔
が封止されるため、PDP内の放電ガス圧は炉内に供給
される放電ガス圧により制御でき、放電ガス圧のほぼ均
一なPDPとすることができる。また、請求項2の発明
によれば、前記通気孔を介してゲッタ材をプラズマディ
スプレイパネル組立体内に位置させて封着したのち、前
記通気孔を封止するようにしたから通気孔をゲッタルー
ムとして利用できるとともに、通気孔の封止温度をゲッ
タの活性化温度に利用することができるという効果を奏
する。As is apparent from the above description, claim 1
According to the invention, a plasma display panel assembly including a front glass substrate and a rear glass substrate is positioned in a closed space, and after evacuating the space, supplying a discharge gas to the space, and thereafter, the plasma display In a method of manufacturing a plasma display panel for sealing a panel assembly, the plasma display panel assembly is sealed using one of the glass substrates provided with a vent, and then the vent is sealed. Because
That is, since the air holes are sealed after both glass substrates are completely sealed, the discharge gas pressure in the PDP can be controlled by the discharge gas pressure supplied into the furnace, and the discharge gas pressure is substantially uniform. It can be a PDP. According to the second aspect of the present invention, the getter material is positioned in the plasma display panel assembly via the air hole and sealed, and then the air hole is sealed. In addition to this, there is an effect that the sealing temperature of the ventilation hole can be used as the activation temperature of the getter.
【図1】 本発明のプラズマディスプレイパネルの製造
に適用する組立体の一部断面図。FIG. 1 is a partial cross-sectional view of an assembly applied to manufacture of a plasma display panel according to the present invention.
【図2】 (A),(B)は最終封着材の斜視図。FIGS. 2A and 2B are perspective views of a final sealing material.
【図3】 ヒートカーブ。FIG. 3 is a heat curve.
【図4】 他の組立体の断面図。FIG. 4 is a sectional view of another assembly.
【図5】 図4のV−V平面図。FIG. 5 is a VV plan view of FIG. 4;
【図6】 (A),(B)はガラス基板上への封着材の
塗布方法を示す図。FIGS. 6A and 6B are diagrams showing a method of applying a sealing material onto a glass substrate.
【図7】 従来のプラズマディスプレイパネルの製造に
適用される組立体の一部断面図で、左半分は封着後、右
半分は封着前を示す。FIG. 7 is a partial cross-sectional view of an assembly applied to manufacture a conventional plasma display panel, in which the left half shows after sealing and the right half shows before sealing.
1…前面ガラス基板、2…背面ガラス基板、3…通気
孔、4a,4b…封着材、5…クリップ金具、6…最終
封着材、8…シールガラス板、T…プラズマディスプレ
イパネル組立体。DESCRIPTION OF SYMBOLS 1 ... Front glass substrate, 2 ... Back glass substrate, 3 ... Vent hole, 4a, 4b ... Sealing material, 5 ... Clip metal fitting, 6 ... Final sealing material, 8 ... Seal glass plate, T ... Plasma display panel assembly .
フロントページの続き (51)Int.Cl.6 識別記号 FI H01J 17/22 H01J 17/22 Continued on the front page (51) Int.Cl. 6 Identification code FI H01J 17/22 H01J 17/22
Claims (2)
なるプラズマディスプレイパネル組立体を密閉空間に位
置させて、当該空間を真空排気したのち放電ガスを前記
空間に供給し、その後、前記プラズマディスプレイパネ
ル組立体を封着するプラズマディスプレイパネルの製造
方法において、 前記ガラス基板の一方に通気孔を設けたものを使用して
プラズマディスプレイパネル組立体を封着したのち、前
記通気孔を封止することを特徴とするプラズマディスプ
レイパネルの製造方法。1. A plasma display panel assembly comprising a front glass substrate and a rear glass substrate is located in a closed space, and after evacuating the space, supplying a discharge gas to the space. A method for manufacturing a plasma display panel for sealing an assembly, comprising: sealing a plasma display panel assembly using a glass substrate provided with a vent on one side thereof; and sealing the vent. A method for manufacturing a plasma display panel.
ディスプレイパネル組立体内に位置させて封着したの
ち、前記通気孔を封止することを特徴とする前記請求項
1に記載のプラズマディスプレイパネルの製造方法。2. The plasma display panel according to claim 1, wherein the getter material is positioned in the plasma display panel assembly via the air hole and sealed, and then the air hole is sealed. Manufacturing method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9136965A JPH10326572A (en) | 1997-05-27 | 1997-05-27 | Manufacture of plasma display panel |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9136965A JPH10326572A (en) | 1997-05-27 | 1997-05-27 | Manufacture of plasma display panel |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH10326572A true JPH10326572A (en) | 1998-12-08 |
Family
ID=15187632
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9136965A Pending JPH10326572A (en) | 1997-05-27 | 1997-05-27 | Manufacture of plasma display panel |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH10326572A (en) |
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000074100A1 (en) * | 1999-05-28 | 2000-12-07 | Matsushita Electric Industrial Co., Ltd. | Production method for plasma display panel excellent in luminous characteristics |
WO2001075260A1 (en) * | 2000-04-04 | 2001-10-11 | Guardian Industries Corporation | Vacuum ig unit with seal for pump-out aperture |
WO2003056598A1 (en) * | 2001-12-25 | 2003-07-10 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and its manufacturing method |
KR100442891B1 (en) * | 1999-08-05 | 2004-08-02 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | Gas discharge lamp and method for the production thereof |
US6809476B2 (en) | 2000-11-29 | 2004-10-26 | Lg Electronics Inc. | Plasma display panel and method for fabricating the same |
WO2004102607A1 (en) * | 2003-05-19 | 2004-11-25 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel |
CN1323416C (en) * | 2003-01-08 | 2007-06-27 | 中国科学院长春光学精密机械与物理研究所 | Sealing process of plate glass vacuum display device |
EP1870922A2 (en) * | 2006-06-23 | 2007-12-26 | Samsung SDI Co., Ltd. | Plasma display panel |
WO2010061418A1 (en) * | 2008-11-25 | 2010-06-03 | 日立プラズマディスプレイ株式会社 | Plasma display panel |
-
1997
- 1997-05-27 JP JP9136965A patent/JPH10326572A/en active Pending
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2000074100A1 (en) * | 1999-05-28 | 2000-12-07 | Matsushita Electric Industrial Co., Ltd. | Production method for plasma display panel excellent in luminous characteristics |
CN100380559C (en) * | 1999-05-28 | 2008-04-09 | 松下电器产业株式会社 | Production method for plasma display panel excellent in luminous characteristics |
US6817917B1 (en) | 1999-05-28 | 2004-11-16 | Matsushita Electric Industrial Co., Ltd. | Manufacturing method for a plasma display panel with superior luminescence |
KR100442891B1 (en) * | 1999-08-05 | 2004-08-02 | 파텐트-트로이한트-게젤샤프트 퓌어 엘렉트리쉐 글뤼람펜 엠베하 | Gas discharge lamp and method for the production thereof |
WO2001075260A1 (en) * | 2000-04-04 | 2001-10-11 | Guardian Industries Corporation | Vacuum ig unit with seal for pump-out aperture |
US6506272B1 (en) | 2000-04-04 | 2003-01-14 | Guardian Industries Corp. | Vacuum IG unit with seal for pump-out aperture |
US6809476B2 (en) | 2000-11-29 | 2004-10-26 | Lg Electronics Inc. | Plasma display panel and method for fabricating the same |
US7037156B2 (en) | 2001-12-25 | 2006-05-02 | Matsushita Electric Industrial Co., Ltd. | Method of manufacturing a plasma display panel with adsorbing an impurity gas |
US7175493B2 (en) | 2001-12-25 | 2007-02-13 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and its manufacturing method |
CN1324630C (en) * | 2001-12-25 | 2007-07-04 | 松下电器产业株式会社 | Plasma display panel and mfg method thereof |
KR100742061B1 (en) * | 2001-12-25 | 2007-07-23 | 마쯔시다덴기산교 가부시키가이샤 | Plasma display panel and its manufacturing method |
WO2003056598A1 (en) * | 2001-12-25 | 2003-07-10 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel and its manufacturing method |
CN1323416C (en) * | 2003-01-08 | 2007-06-27 | 中国科学院长春光学精密机械与物理研究所 | Sealing process of plate glass vacuum display device |
WO2004102607A1 (en) * | 2003-05-19 | 2004-11-25 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel |
US7304431B2 (en) | 2003-05-19 | 2007-12-04 | Matsushita Electric Industrial Co., Ltd. | Plasma display panel |
EP1870922A2 (en) * | 2006-06-23 | 2007-12-26 | Samsung SDI Co., Ltd. | Plasma display panel |
EP1870922A3 (en) * | 2006-06-23 | 2009-12-23 | Samsung SDI Co., Ltd. | Plasma display panel |
WO2010061418A1 (en) * | 2008-11-25 | 2010-06-03 | 日立プラズマディスプレイ株式会社 | Plasma display panel |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6827623B2 (en) | Manufacturing method of plasma display panels | |
US5688708A (en) | Method of making an ultra-high vacuum field emission display | |
JP3883809B2 (en) | Method and apparatus for depressurizing a glass chamber | |
JP2002515392A (en) | Seal material and method for forming seal material | |
JP3554432B2 (en) | Method for manufacturing plasma display panel | |
JPH10326572A (en) | Manufacture of plasma display panel | |
JPH1179768A (en) | Treatment of glass panel | |
WO2020026624A1 (en) | Method for producing glass panel unit | |
JP3440906B2 (en) | Apparatus and method for manufacturing plasma display panel | |
JPH05234512A (en) | Manufacture of gas electric discharge display panel | |
KR100727735B1 (en) | Method and device for producing gas electric discharge panels | |
JP3618177B2 (en) | Method for manufacturing plasma display panel | |
JP3615335B2 (en) | Exhaust and sealing furnace for plasma display panel | |
JPH03230447A (en) | Manufacture of plasma display panel | |
JP3538129B2 (en) | Plasma display panel | |
KR100603271B1 (en) | Method for injecting the plasma discharge gas into the apparatus of plasma display panel | |
JPH03254042A (en) | Manufacture of discharge container | |
JPH06196094A (en) | Manufacture of vacuum display device | |
JP2001313343A (en) | Airtight container and its manufacturing method | |
US4119378A (en) | Segmented gas discharge display panel device and method of manufacturing same | |
JP2002134019A (en) | Manufacturing method and manufacturing apparatus for plasma display panel and plasma display panel manufactured by using them | |
JP3253505B2 (en) | Manufacturing method of liquid crystal display element | |
KR100502697B1 (en) | a vacuum ventilation method for fabricating Plasma Display Panel | |
KR100694500B1 (en) | Method for drying frit glass applied on glass and flat panel displays manufactured by using the same | |
JPH10223143A (en) | Planar luminous element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040122 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040830 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040907 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20050208 |