JPH1032514A - High frequency electronic equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily manufacture a high frequency electronic equipment without changing a conventional line by parting a signal cable so as to separately providing first and second soldering lands and making it possible to connect a conductive part or an amplifier between the first and second soldering lands so as to make a common basic device kind of two kinds for a strong electric field and a weak electric field. SOLUTION: The distribution part 41 of a front end is separately provided with a soldering land 43 connected to the output terminal 36 of an antenna input filter 34 through a wiring pattern 42 and a soldering land 45 connected to the input terminal 37 of a distributor 35 of the antenna input filter 34 through a wiring pattern 44. The soldering lands 43 and 45 are provided closely capable of connecting with a so called chip component. In addition holes 46 and 47 for respective leading terminal insertion are provided with in the soldering lands 43 and 45. Then at the time of manufacturing a front end for the strong electric field, the conductive part is fixed between the soldering lands 43 and 45.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency electronic device such as an RF front end (hereinafter simply referred to as a front end) incorporated in a television (hereinafter simply referred to as a TV), a video tape recorder (hereinafter simply referred to as a VTR) or the like.

[0002]

2. Description of the Related Art Conventional high-frequency electronic equipment, for example, VTR
The configuration of the front end used in the first embodiment will be described with reference to FIGS. Figure 8 shows the VT using the front end
FIG. 9 is a block diagram of R, FIG. 9 is a layout diagram of each of the front-end circuit units, and FIG. 10 is a circuit diagram of a distribution unit which is one of the front-end circuit units.

[0003] First, in FIG. 8, a TV signal received by an antenna 1 is guided to an antenna input terminal 3 of a VTR 2 and input to a distribution unit 5 of a front end 4. One of the TV signals distributed by the distributor 5 is input to the tuner 7 via the output line 6. The TV signal frequency-converted to the intermediate frequency by the tuner unit 7 is input to the recording unit 9 via the subsequent demodulation unit 8 and is recorded. The other TV signal from the distribution unit 5 is input to the switching unit 11 via the output line 10.

On the other hand, a video signal or the like from the reproduction unit 12 is converted into an RF signal by the modulation unit 13 and input to the switching unit 11 via the output line 14. The switching unit 11 outputs the RF signal from the modulation unit 13 to the TV output terminal 15 at the time of reproduction, and views the reproduced image on a television (not shown). At this time, the TV signal from the output line 10 is not output to the TV output terminal 15.

[0005] As shown in FIG. 9, the front end 4 includes a case 21 made of a metal plate and an antenna input terminal 3 (FIG. 8).
And an output connector 23 serving as a TV output terminal 15 (FIG. 8).
And a plurality of compartments 25 to 28 divided by. The compartment 25 accommodates the distribution unit 5, the compartment 26 accommodates the tuner 7, the compartment 27 accommodates the demodulation unit 8, and the compartment 28 accommodates the switching unit 11 and the modulation unit 13. Each of these circuit units, namely, the distribution unit 5, tuner unit 7, demodulation unit 8,
The switching unit 11 and the modulation unit 13 are usually arranged on one printed circuit board.

The input connector 22 and the output connector 23 are attached to the short side plate 29 of the case 21. Also, external terminal groups 31 to 3 for inputting and outputting power and signals supplied to each circuit portion from one of the long side plates 30 adjacent to the short side plate 29.
3 are protruding. The distribution unit 5, the switching unit 11, and the modulation unit 13 are disposed in compartments 25 and 28 along the short side plate 29 at positions corresponding to the input connector 22 and the output connector 23, respectively. The external terminal group 31 is attached to a printed circuit board in a compartment where the switching unit 11 and the modulation unit 13 are provided.

The distribution unit 5 provided in the compartment 25 is shown in FIG.
As shown in the figure, the antenna input filter 34 and the distributor 35 are provided, and the output terminal 36 of the antenna input filter 34 and the input terminal 37 of the distributor 35 are connected by a signal line 38. The antenna input filter 34 is mainly for removing external interference signals existing in the intermediate frequency band of the television. The distributor 35 divides the input signal into two and outputs the signal to output terminals 39 and 40. The distributor 35 is
Generally, sufficient isolation is secured between the output terminals 39 and 40. The distributed signals output to the output terminals 39 and 40 are theoretically 3 dB relative to the input signal.
Attenuates, but in fact, more.

[0008]

With the spread of TVs, VTRs, and the like, customer demands for products have recently been diversified, and in particular, there are many demands for improvement in reception quality deterioration due to a weak electric field. On the other hand, as shown in FIG.
The content is viewed on a television (not shown) via the front end 4 of R2. For this reason, a signal attenuated by 3 dB is received as compared with the case where the television is directly connected to the antenna 1, the reception quality is reduced, and there is an increasing demand for improvement of the reception quality. Similarly, when recording with the VTR 2, the tuner unit 7 of the front end 4 is 3 dB.
Receiving the attenuated signal, the recording quality is reduced, and there is a demand for improved reception quality.

On the other hand, to meet such a demand, T
V and VTR manufacturers will prepare models (sets) corresponding to the strength of the received electric field. However, preparing models exclusively for the strong electric field and for the weak electric field will increase the number of basic models. Production management costs will increase. Accordingly, it is an object of the present invention to provide a high-frequency electronic device that can respond to the above demands and can respond to the strength of a received electric field by using the same basic model.

Another object of the present invention is to provide a high-frequency electronic device capable of suppressing production management costs by using a conventional production line as it is.

[0011]

According to the present invention, a signal line for transmitting a signal received at an antenna input terminal to a subsequent circuit is divided and connected to the antenna input terminal. A first soldering land and a second soldering land connected to the input side of the subsequent circuit are separately provided on a first printed circuit board, and between the first and second soldering lands. A conductive part or an amplifier can be connected.

The circuit in the latter stage is a distributor, and a separate soldering land is provided on the input side of the distributor.

Further, the amplifier is formed on a second printed circuit board, and input and output lead terminals of the amplifier are protruded from the second printed circuit board, and the input lead terminal is connected to the first soldering board. The output lead terminals were connected to the lands, respectively, to the second soldering lands.

Further, the first printed circuit board is housed in at least one of compartments for dividing the inside of the metal case into a plurality of sections, and the second printed board is stored in the one compartment in the first printed board. Was arranged facing.

Further, the first printed circuit board has a wiring pattern including the first and second soldering lands, and the second printed circuit board has a wiring pattern forming the amplifier. One printed circuit board and the second printed circuit board are opposed to each other such that the wiring pattern surface of the first printed circuit board and the wiring pattern surface of the second printed circuit board face outward in the case. did.

Further, the second printed circuit board has an extending portion extending to another compartment adjacent to the one compartment, and a power supply terminal for supplying a voltage to the amplifier to the extending portion. A power supply wiring pattern is provided, and the power supply terminal is attached to the first printed circuit board in the adjacent other compartment and near the external terminal protruding from the case, via the first printed circuit board. To the external terminal.

Also, a bypass circuit is provided in the amplifier,
When the supply of the voltage to the external terminal is stopped, a reception signal from the antenna input terminal is input to the subsequent circuit via the bypass circuit.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the present invention is applied to a front end used for a VTR will be described with reference to FIGS. 1 is an explanatory view for explaining the concept of the high-frequency electronic device of the present invention, FIG. 2 is a perspective view of a conductive component used in the high-frequency electronic device of the present invention, and FIG. 3 is a perspective view of a conductive component used in the electronic device of the present invention. FIG. 4 is a perspective view of an amplifier used in the high-frequency electronic device of the present invention. FIG. 5 is a circuit diagram of an amplifier used in the high-frequency electronic device of the present invention. FIG. 6 is a perspective view illustrating an attached state of the amplifier used in the present invention. FIG. 7 is a cross-sectional view of a main part taken along line AA of FIG. 6 in the present invention.

The distribution unit 41 of the front end to which the present invention is applied divides the signal line 38 connecting the antenna input filter 34 and the distributor 35 in the conventional distribution unit 5,
As shown in FIG. 1, a soldering land 43 connected to an output end 36 of the antenna input filter 34 via a wiring pattern 42, and a wiring pattern 44 to an input end 37 of a distributor 35 at a stage subsequent to the antenna input filter 34. It is provided separately from the soldering lands 45 connected via the same. The solder lands 43 and 45 are provided so close to each other that they can be connected by so-called chip components. Further, through holes 46 and 47 for inserting lead terminals are formed in the soldering lands 43 and 45, respectively. This distribution unit 41
As shown in FIGS. 5 and 6, the tuner unit 7, demodulation unit 8, switching unit 11, and modulation unit 13, which are other circuit units, are incorporated in the same printed circuit board (hereinafter, simply referred to as a main substrate) 48, and the case 21 It is stored in.

The soldering lands 43, 45
As shown in FIG. 2 or FIG. 3, conductive parts such as a so-called 0 ohm chip part (a chip part having a resistance value of 0 ohm) 49 or a jumper lead 50 for directly conducting the soldering lands 43 and 45 are provided. Or, FIG.
The small board (hereinafter, referred to as a sub-board) 51 incorporating an amplifier as shown in FIG.

The two-ohm chip component 49 shown in FIG. 2 has two electrodes 52 and 53 conducting, and can be mounted on a printed circuit board and used like general circuit components such as chip resistors and chip capacitors. In addition, the jumper lead 50 shown in FIG. 3 may be formed by, for example, cutting a conductive wire to a size similar to a chip component.

The sub-substrate 51 shown in FIG. 4 has a substantially L-shape including a wide portion 54 and a narrow portion 55 extending from one end of the wide portion 54. An amplifier 56 is configured at 54. The wiring pattern is formed on the upper surface side of the sub-board 51 in FIG. 4, and a chip component 57 constituting the amplifier 56 is mounted. A lead terminal 58 serving as an input terminal and a lead terminal 59 serving as an output terminal of the amplifier 56 are provided so as to protrude toward the lower surface of the substrate. On the other hand, in the narrow portion 55, a lead terminal 60 for supplying a power supply voltage to the amplifier 56 and a wiring pattern 61 serving as a power supply voltage supply line (83 in FIG. 5) connected to the lead terminal 60 are provided. . The lead terminal 60 is provided on the tip side of the narrow portion 55 so as to protrude from the lower surface of the substrate.

When a front end for a strong electric field is manufactured, at the time of mounting the components of the distribution unit 41, the tuner unit 7, the demodulation unit 8, the switching unit 11, and the modulation unit 13 to the main board 48, FIG. Alternatively, the conductive component 4 shown in FIG.
9 or 50 is attached between the soldering lands 43 and 45. By doing so, the conventional front end manufacturing process can be applied as it is.

On the other hand, when manufacturing a front end for a weak electric field, first, each circuit section, that is, the distribution section 41, the tuner section 7, the demodulation section 8, The components of the switching unit 11 and the modulation unit 13 are mounted. Then, after the main board 48 is assembled in the case 21, the sub-board 51 of FIG. 4 prepared in a separate process is opposed to the main board 48 housed in the case 21, and input / output lead terminals 58, 59 are provided. To the distribution unit 4 in FIG.
It is connected to the soldering lands 43, 45 while being inserted into the through holes 46, 47.

Next, the circuit of the amplifier 56 incorporated in the sub-board 51 of FIG. 4 will be described with reference to FIG. Amplifier 5
Reference numeral 6 is composed of two circuits, an amplification circuit 71 and a bypass circuit 72. The bypass circuit 72 includes switch diodes 73 and 74 connected in series to the input / output terminals of the amplifier circuit 71.
Are connected in parallel to the amplifier circuit 71 via the. A bipolar transistor (hereinafter simply referred to as a transistor) 75 is used for the amplifier circuit 71. The received signal input to the input terminal 76 is amplified by the amplifier circuit 71 and output to the output terminal 77.
Or the bypass circuit 7 without being amplified
2 so as to be output to the output terminal 77 via the output terminal 2. The amplifier circuit 71 is subjected to negative feedback from the collector to the base of the transistor 75 by a resistor 78 and an inductance 79. The bypass circuit 72 includes an FET 80,
81 and a switch circuit composed of FETs 80 and 81.
Are connected to each other. Also, the power supply terminal 8
2. The voltage supplied to the amplifier circuit 71 via the power supply voltage supply line 83 is also applied to the switch diodes 73 and 74.

Switching between the amplification circuit 71 and the bypass circuit 72 is performed by switch diodes 73 and 74. That is, when a voltage is applied to the power supply terminal 82,
The transistor 75 of the amplifier circuit 71 is set so that a predetermined base bias voltage required for amplification is applied. At this time, the voltage is applied to the FETs 80 and 81 of the bypass circuit 72 by turning on the switch diodes 73 and 74. In this state, the gate bias resistors 84 to 87 are set so that the FETs 80 and 81 are in a pinch-off state. Is set. Therefore, the received signal input to the input terminal 76 is amplified by the amplifier circuit 71 without passing through the bypass circuit 72 and output to the output terminal 77.

On the other hand, when no voltage is applied to the power supply terminal 82, no voltage is applied to the transistor 75 of the amplifying circuit 71, the switch diodes 73 and 74 are turned off, and the FETs 80 and 81 of the bypass circuit 72 are connected to the gate. The source has the same potential and the drain. A conduction state is established between the sources. Accordingly, the received signal input to the input terminal 76 is cut off by the amplifier circuit 71 and output to the output terminal 77 via the bypass circuit 72. Therefore, if this amplifier 56 is incorporated in the front end 4, it can be used for a weak electric field and a strong electric field depending on whether or not a voltage is applied to the power supply terminal 82. The two diodes 88, 89 inserted in parallel back on the input terminal 76 side are protection diodes for preventing the entry of a shock wave induced from a lightning strike or the like.

The input terminal 76, output terminal 77, and power supply terminal 82 are respectively the lead terminals 58, 59, and 60 in FIG.
It is connected to the.

Next, according to the present invention, the amplifier 56
The state in which the sub-board 51 of FIG. 4 configured as described above is attached to the case 21 forming the front end 4 will be described with reference to FIGS. First, as shown in FIG. 6, the distribution unit 41, the tuner unit 7, the demodulation unit 8, the switching unit 11,
The main board 48 on which the modulation section 13 is provided is housed under the case 21 (FIG. 7). At this time, the surface of the wiring pattern on which the soldering lands 45 and 46 of the distribution unit 41 are provided is on the lower side (FIG. 7) so as to face outward of the case 21. The distribution unit 41 is stored in the partition 25, the tuner 7 is stored in the partition 26, the demodulator 8 is stored in the partition 27, and the switching unit 11 and the modulator 13 are stored in the partition 28. On the other hand, the sub-substrate 51 is opposed to the partition chamber 25 in which the distributing section 41 of the case 21 is stored, and the partition chamber 28 in which the switching section 11 and the modulation section 13 are stored, at an interval above the main board 48 at an interval. (FIG. 7). In this case, the sub substrate 5
The one wide portion 54 is arranged in the compartment 25, and the narrow portion 55 is arranged in the compartment 28. Further, soldering lands 43 and 45 shown in FIG. 1 are formed in the distribution section 41 of the main board 48 corresponding to the positions of the lead terminals 58 and 59 provided on the wide section 54 of the sub board 51. Further, the modulation section 13 of the main board 48 is
The modulation portion 13 has a soldering land 90 corresponding to the lead terminal 60 of the sub-substrate 51. The lead terminals 58, 59, 60 of the sub-board 51 are connected to the through holes 4 formed in the soldering lands 43, 45 of the main board 48.
6, and are soldered. Similarly, the lead terminals 60 are inserted into through holes (not shown) formed in the soldering lands 90 and are connected by soldering.

The long side plate 30 of the case 21 has a cutout 91 on the side where the main board 48 is stored (lower side in FIG. 6).
92, 93 are formed, and these notches 91, 92, 93
From the terminal groups 31, 3 attached to the main board 48
Reference numerals 2 and 33 project outside the case 21. One of the terminals 31 is connected to a lead terminal 60 for supplying power supply voltage via a soldering land 90 of the main board 48. This soldering land 90 is connected to the lead terminal 60.
In the vicinity of.

The main board 48 and the sub-board 51 are attached to the case 21 so that the wiring pattern surfaces face outward. By doing so, the sub-board 51
Lead terminals 58, 59 and 60 are easily connected to the soldering lands 43, 45 and 90 of the main board 48 by soldering.

Although the embodiments described so far have been described using the unitized RF front end housed in a metal case, the present invention is not limited to this.
For example, the tuner unit 7, the demodulation unit 8 and the like are not unitized, and the present invention can be applied to all receivers in which these circuit units are directly incorporated.

[0033]

As described above, according to the present invention, the first and second soldering lands are provided separately by dividing the signal line. Since a conductive part or amplifier can be connected to
Two types of common basic models, one for a strong electric field and one for a weak electric field, can be used, and high-frequency electronic equipment can be easily manufactured without changing a conventional manufacturing line.

Further, since the latter circuit is a distributor, a signal line is separated on the input side of the distributor and a conductive part or an amplifier is connected, so that NF is not deteriorated. Also, a TV connected via a VTR and a V
The amplified reception signal can be output to both the recording units of the TR.

Further, since the amplifier is formed on the second printed circuit board, only this amplifier can be manufactured in a separate process, so that the manufacturing control can be easily performed. Since the input and output lead terminals of the amplifier are provided in a protruding manner, when assembling a high-frequency electronic device using this amplifier, the assembling becomes easy and the overall manufacturing cost can be reduced.

Further, the first printed circuit board is housed in one of the compartments for dividing the inside of the metal case into a plurality of sections, and the second printed board is stored in the first printed board in the one compartment. Since they are arranged to face each other, the conventional case can be used as it is without enlarging the outer shape of the case of the high-frequency electronic device, and the cost of parts, assembly and management can be reduced.

Further, the first printed board and the second printed board are separated from each other by the wiring pattern surface of the first printed board and the wiring pattern surface of the second printed board inside the case. Since the first printed circuit board is attached to the second printed circuit board, the second printed circuit board is easily soldered when mounted on the first printed circuit board, and has excellent assemblability.

Further, the second printed circuit board is provided with an extending portion extending to another compartment adjacent to the one compartment, and a power supply terminal for supplying a voltage to the amplifier is provided in the extending portion. A power supply wiring pattern is provided, and in the vicinity of an external terminal protruding from the case while being attached to the first printed circuit board in the adjacent other compartment, the power supply terminal is connected via the first printed circuit board. Connected to the external terminals, the second printed circuit board is mounted over the two compartments, so that the mounting state is stabilized, and the first printed circuit board is provided with extra power for supplying power to the amplifier. Since it is not necessary to provide a wiring pattern, it is not necessary to enlarge the first printed circuit board.

Also, a bypass circuit is provided in the amplifier,
When the supply of voltage to the external terminal is stopped, a signal received from the antenna input terminal is input to the subsequent circuit via the bypass circuit, so that the high-frequency electronic device manufactured for a strong electric field is used. However, it is possible to cope with two types, one for a strong electric field and the other for a weak electric field, and the convenience of the high-frequency electronic device is enhanced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram for explaining the concept of a high-frequency electronic device of the present invention.

FIG. 2 is a perspective view of a conductive component used in the high-frequency electronic device of the present invention.

FIG. 3 is a perspective view of a conductive component used in the high-frequency electronic device of the present invention.

FIG. 4 is a perspective view of an amplifier used in the high-frequency electronic device of the present invention.

FIG. 5 is a circuit diagram of an amplifier used in the high-frequency electronic device of the present invention.

FIG. 6 is a perspective view illustrating an attached state of an amplifier used in the high-frequency electronic device of the present invention.

FIG. 7 is a sectional view of an essential part taken along the line AA of FIG. 6 in the present invention.

FIG. 8 is a block diagram of a VTR using a conventional front end.

FIG. 9 is a layout diagram of each circuit section of a conventional front end.

FIG. 10 is a circuit diagram of a conventional front end distribution unit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Antenna 2 VTR 3 Antenna input terminal 4 Front end 5.41 Distribution part 6.10.14 Output line 7 Tuner part 8 Demodulation part 9 Recording part 11 Switching part 12 Reproduction part 13 Modulation part 15 TV output terminal 21 Case 22 Input connector Reference Signs List 23 output connector 24 shield plate 25.26.27.28 compartment 29 short side plate 30 long side plate 31.1.33 terminal group 34 antenna input filter 35 distributor 36.39.40 output line 37 input line 38 signal line 42. 44.61 Wiring pattern 43.45.90 Soldering land 46.47 Through hole 48 Main board 490 Ohm chip part 50 Jumper lead 51 Sub board 52.53 Electrode 54 Wide part 55 Narrow part 56 Amplifier 57 Chip part 58. 59.60 Lead terminal 71 Amplifying circuit 72 Away path circuit 73.74 switching diode 75 transistor 76 input terminal 77 output terminal 78.84.85.86.87 resistor 79 inductance 91.92.93 cutting 80.81 FET 82 source terminal 83 power supply voltage supply terminal 88.89 diode

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Yusho Onishi 1-7 Yukitani Otsukacho, Ota-ku, Tokyo Alps Electric Co., Ltd. (72) Inventor Akira Kawamura 1-7 Yukitani Otsukacho, Ota-ku, Tokyo Inside Alps Electric Co., Ltd. (72) Inventor Yoshihiro Sato Inside Alps Electric Co., Ltd. 1-7, Otsuka-cho, Yukitani, Ota-ku, Tokyo

Claims (7)

[Claims] A signal line for transmitting a signal received at an antenna input terminal to a subsequent circuit is divided and connected to a first soldering land connected to the antenna input terminal and an input side of the latter circuit. And a second soldering land provided separately on the first printed circuit board, and a conductive component or an amplifier can be connected between the first and second soldering lands. machine. 2. The high-frequency electronic device according to claim 1, wherein the subsequent circuit is a distributor. 3. The amplifier is configured on a second printed circuit board, and input and output lead terminals of the amplifier are protruded on the second printed circuit board, and the input lead terminal is connected to the first solder. 2. The high-frequency electronic device according to claim 1, wherein the output lead terminals are connected to the mounting lands, respectively. 4. The first printed circuit board is housed in at least one of compartments for dividing the inside of a metal case into a plurality of compartments.
The high-frequency electronic device according to claim 2, wherein the second printed circuit board is disposed to face the first printed circuit board in the one compartment. 5. The first printed circuit board has a wiring pattern including the first and second soldering lands, the second printed circuit board has a wiring pattern forming the amplifier, and One printed circuit board and the second printed circuit board are opposed to each other such that the wiring pattern surface of the first printed circuit board and the wiring pattern surface of the second printed circuit board face outward in the case. 4. The high-frequency electronic device according to claim 3, wherein: 6. A power supply terminal for providing a voltage to the amplifier on the second printed circuit board, the extended portion extending to another compartment adjacent to the one compartment. A power supply wiring pattern is provided, and the power supply terminal is attached to the first printed circuit board in the adjacent other compartment and near the external terminal protruding from the case, via the first printed circuit board. 5. The high-frequency electronic device according to claim 3, wherein the high-frequency electronic device is connected to the external terminal. 7. A bypass circuit is provided in said amplifier, and when a voltage supply to said external terminal is stopped, a reception signal from said antenna input terminal is inputted to said subsequent circuit via said bypass circuit. The high-frequency electronic device according to claim 5, wherein: