JPH11331015A - Module component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide the module component whose productivity is enhanced without deterioration in a radiation characteristic due to a local oscillation circuit and an isolation characteristic or the like due to a reception circuit and a transmission circuit even in the case of adopting the module component that is a composite of the reception circuit, the transmission circuit and the local oscillation circuit or the like to enhance further miniaturization, convenience and productivity for a mobile communication terminal or the like. SOLUTION: Relating to the module component having a reception circuit, a transmission circuit and a local oscillation circuit, a voltage controlled oscillator module 4 consisting of a 2nd printed circuit board 5 and a 1st shield member 6 is mounted on a 1st printed circuit board 2 and a 2nd shield member 3 that covers the reception circuit, the transmission circuit and the local oscillation circuit is mounted on the 1st printed circuit board 2 so as to improve a radiation characteristic due to the local oscillation circuit and an isolation characteristic between the reception circuit and the transmission circuit and also to enhance the productivity of the module component.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a module component mainly used for a wireless communication device.

[0002]

2. Description of the Related Art In recent years, with the rapid spread of mobile communication terminals, voltage-controlled oscillator modules, power amplifier modules, and the like have been used for reasons such as miniaturization, convenience, and improvement in productivity. The module parts of the single function block are mounted.

[0003]

SUMMARY OF THE INVENTION In order to further reduce the size, convenience and productivity of a mobile communication terminal, a module component combining a receiving circuit, a transmitting circuit, a local oscillation circuit and the like is employed. In this case, the radiation characteristics due to the local oscillation circuit, the isolation characteristics between the reception circuit and the transmission circuit, and the like deteriorate.

Therefore, the present invention provides a receiving circuit, a transmitting circuit,
Even when a module component that combines a local oscillation circuit and the like is adopted, there is no deterioration in radiation characteristics and isolation characteristics between the reception circuit and the transmission circuit due to the local oscillation circuit,
Moreover, it is an object of the present invention to provide a module component capable of improving the productivity of the module component.

[0005]

In a module component having a receiving circuit, a transmitting circuit, and a local oscillation circuit, all or a part of the local oscillation circuit is replaced with a first component of the module component.
Forming all or part of the local oscillation circuit mounted on the second substrate different from the second substrate, and mounting the local oscillation circuit mounted on the second substrate on the first substrate. By having the first shield member covering all or a part of the local oscillation circuit formed thereon, it is possible to improve the radiation characteristics caused by the local oscillation circuit and the isolation characteristics between the reception circuit and the transmission circuit, Moreover, it is possible to improve the productivity of module components.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention according to claim 1 of the present invention is directed to a module part having one or both of a reception circuit and a transmission circuit and a local oscillation circuit, wherein all or a part of the local oscillation circuit is used. The module component is formed on a second substrate different from the first substrate, and all or a part of the local oscillation circuit mounted on the second substrate is mounted on the first substrate. It is a module component characterized by being able to individually manage all or a part of the characteristics of the local oscillation circuit formed on the second substrate, and any one of the reception circuit and the transmission circuit or Both have the effect of enabling the improvement of the productivity of the module component having the local oscillation circuit.

According to a second aspect of the present invention, there is provided the module component according to the first aspect, further comprising a first shield member that covers all or a part of the local oscillation circuit formed on the second substrate. It is possible to suppress the radiation to the peripheral electric circuit from all or a part of the local oscillation circuit formed on the second substrate, and to block the influence of the radiation from the peripheral electric circuit. This has the effect that the local oscillation circuit can be operated stably.

According to a third aspect of the present invention, the second shield member covering the circuit formed on the first substrate is electrically connected to the first shield member.
The module component according to claim 1, wherein the connection between the ground of the circuit formed on the first substrate and the ground of all or a part of the local oscillation circuit formed on the second substrate can be strengthened. It has the effect of enhancing the isolation between module components and peripheral circuits and reducing the amount of radiation.

According to a fourth aspect of the present invention, there is provided the module component according to the second aspect, wherein a local oscillation circuit is arranged between the receiving circuit and the transmitting circuit. Has the effect of enabling reinforcement.

According to a fifth aspect of the present invention, a ground terminal of a filter included in a receiving circuit or a transmitting circuit or a shield member of the filter and a second shield member covering a circuit formed on a first substrate are provided. Claim 1 electrically connected
The filter component according to any one of claims 1 to 3, which has an effect that the ground connection of the filter can be strengthened, and the frequency characteristics and attenuation of the filter can be stabilized.

According to a sixth aspect of the present invention, in a module component having one or both of a reception circuit and a transmission circuit, and a local oscillation circuit, a third shield member covering the reception circuit and covering the transmission circuit are provided. A module component having a fourth shield member and a fifth shield member covering the local oscillation circuit, wherein the module component enhances isolation between the reception circuit, the transmission circuit, and the local oscillation circuit. It has the effect of being able to.

Hereinafter, an embodiment of the present invention will be described with reference to FIGS. (Embodiment 1) FIG. 1 is a perspective view showing a configuration of a module component according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view of the module component according to the embodiment, and FIG. FIG. 3 is a circuit layout diagram of module components.

In FIG. 1, reference numeral 1 denotes a module component main body, in which a grounding portion of a first substrate 2 and a second shield member 3 are electrically connected, and a grounding portion of a second substrate 5 and a first portion.
Of the voltage-controlled oscillator module 4 to which the shield member 6 is electrically connected.

Next, the internal connection state will be described with reference to the cross-sectional view of the module component in the embodiment of FIG.

In FIG. 2, the upper surface of a ceramic package SAW filter 7 in which the first shield member 6 of the voltage controlled oscillator module 4 disposed on the first substrate and the upper surface used for the transmission circuit are grounded is connected. , And the projection 8 of the second shield member.

The internal circuit arrangement will be described with reference to the circuit arrangement diagram of the module components in the embodiment shown in FIG.

In FIG. 3, reference numeral 9 denotes a transmission circuit including the SAW filter 7, reference numeral 10 denotes a reception circuit, reference numeral 11 denotes a local oscillation circuit including the voltage controlled oscillator module 4, and the transmission circuit 9 and the reception circuit 10 It is arranged so as to sandwich it.

In the module component configured as described above, the voltage-controlled oscillator module 4 is formed as a separate module component, so that the characteristics and yield of the voltage-controlled oscillator can be individually managed, and the production of the module component can be performed. To improve the performance.

The voltage controlled oscillator module 4 has a first
From the voltage controlled oscillator module 4 formed on the second substrate,
It is possible to suppress the radiation to the peripheral electric circuit, and to block the influence of the radiation from the peripheral electric circuit, and to operate the local oscillation circuit stably.

Further, by bringing the second shield member 3 and the first shield member 6 into direct contact with each other, the circuit formed on the first substrate 2 is grounded and the second shield member 6 is formed on the second substrate 5. The ground connection of the voltage-controlled oscillator can be strengthened, the isolation between the module components and peripheral circuits can be enhanced, the amount of radiation can be reduced, and the local oscillation circuit 11 can be arranged between the transmission circuit 9 and the reception circuit 10. Is disposed, the isolation between the transmission circuit 9 and the reception circuit 10 can be further enhanced, and the grounding portion on the upper surface of the SAW filter 7 included in the transmission circuit 9 and the second shield member are brought into direct contact. Accordingly, the ground connection of the SAW filter 7 can be strengthened, and the frequency characteristics and the attenuation of the SAW filter 7 can be stabilized.

The first shield member 6 or SA
In the present embodiment, the W filter 7 and the second shield member 3 are connected directly, but the same effect can be obtained by connecting not directly but via a conductive material such as solder.

When a shield mechanism is provided on a mounting board of a terminal having the module component mounted thereon, the second shield member 3 may not be necessary, and a lighter module component can be formed. At the same time, a part of the member of the shield mechanism and the upper surface of the SAW filter 7 or the first
It is also possible to improve the radiation characteristics and the isolation characteristics and to stabilize the frequency characteristics and the attenuation characteristics of the SAW filter 7 by making direct contact with the shield member 6 described above.

Furthermore, in this module component, the height of the module component main body 1 can be kept low by opening the portion of the second shield member 3 located in the upper surface direction of the voltage controlled oscillator module 4. It has become.

(Embodiment 2) FIG. 4 is a perspective view showing the structure of a module component according to a second embodiment of the present invention.
FIG. 5 is a cross-sectional view of the module component according to the embodiment.

In FIG. 4, the module component body 1
A third shield member 12 for covering the first substrate 2, a receiving circuit disposed on the first substrate 2, and a fourth shield member for covering the transmitting circuit disposed on the first substrate 2 13
And a fifth shield member 14 that covers the local oscillation circuit arranged on the first substrate 2.

Next, the internal connection state will be described with reference to the cross-sectional view of the module component in the embodiment of FIG.
In FIG. 5, a third shield member 12, a fourth shield member 13, and a fifth shield member 15 have a plurality of protrusions provided on each shield member and a plurality of protrusions provided on a first substrate. The through holes 15 or a plurality of end face electrodes 16 formed by cutting the through holes are fixed by inserting and soldering.

In the module component configured as described above, the transmission circuit, the reception circuit, and the local oscillation circuit are shielded by individual shield members, respectively, so that the isolation characteristics between the circuits can be improved and the local oscillation can be improved. The radiation characteristics from the circuits can be improved, and the ground connection of each circuit is further strengthened, so that each circuit can operate stably.

[0028]

According to the present invention, when this module component in which a receiving circuit, a transmitting circuit, a local oscillation circuit, etc. are combined is employed, deterioration of radiation characteristics and isolation characteristics between the receiving circuit and the transmitting circuit due to the local oscillation circuit. In addition, the productivity of module parts can be improved, and there is an effect that the miniaturization and high performance of the mobile terminal can be easily achieved.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a configuration of a module component according to a first embodiment of the present invention.

FIG. 2 is a sectional view of the module component according to the embodiment.

FIG. 3 is a circuit layout diagram of module components according to the embodiment.

FIG. 4 is a perspective view showing a configuration of a module component according to a second embodiment of the present invention.

FIG. 5 is a sectional view of the module component according to the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Module component main body 2 1st board 3 2nd shield member 4 Voltage control oscillator module 5 2nd board 6 1st shield member 7 SAW filter 8 Projection part of 2nd shield member 9 Transmitting circuit 10 Receiving circuit 11 Local oscillation circuit 12 Third shield member 13 Fourth shield member 14 Fifth shield member 15 Through hole 16 End electrode

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Tadayuki Ikeda 1006 Kadoma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd.

Claims (6)

[Claims] 1. A module component having one or both of a reception circuit and a transmission circuit, and a local oscillation circuit, wherein all or part of the local oscillation circuit is different from a first substrate of the module component. Formed on the second
A module component, wherein all or a part of the local oscillation circuit mounted on the substrate is mounted on the first substrate. 2. The module component according to claim 1, further comprising a first shield member that covers all or a part of the local oscillation circuit formed on the second substrate. 3. The module component according to claim 2, wherein a second shield member for covering a circuit formed on the first substrate and the first shield member are electrically connected. 4. The module component according to claim 2, wherein a local oscillation circuit is arranged between the reception circuit and the transmission circuit. 5. A grounding terminal of a filter included in a reception circuit or a transmission circuit or a shield member of the filter and a second shield member covering a circuit formed on a first substrate. The module part according to 1. 6. A module component having one or both of a reception circuit and a transmission circuit, and a module component having a local oscillation circuit, wherein a third shield member covering the reception circuit, a fourth shield member covering the transmission circuit, and A module component having a fifth shield member for covering a local oscillation circuit.