JPH10324577A5 - - Google Patents

Info

Publication number
JPH10324577A5
JPH10324577A5 JP1997247258A JP24725897A JPH10324577A5 JP H10324577 A5 JPH10324577 A5 JP H10324577A5 JP 1997247258 A JP1997247258 A JP 1997247258A JP 24725897 A JP24725897 A JP 24725897A JP H10324577 A5 JPH10324577 A5 JP H10324577A5
Authority
JP
Japan
Prior art keywords
ceramic
bonding
weight
polyvinyl alcohol
water
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997247258A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10324577A (ja
JP3953151B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP24725897A priority Critical patent/JP3953151B2/ja
Priority claimed from JP24725897A external-priority patent/JP3953151B2/ja
Publication of JPH10324577A publication Critical patent/JPH10324577A/ja
Publication of JPH10324577A5 publication Critical patent/JPH10324577A5/ja
Application granted granted Critical
Publication of JP3953151B2 publication Critical patent/JP3953151B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP24725897A 1997-03-24 1997-09-11 セラミックス接着用組成物および接着方法 Expired - Lifetime JP3953151B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24725897A JP3953151B2 (ja) 1997-03-24 1997-09-11 セラミックス接着用組成物および接着方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP8882697 1997-03-24
JP9-88826 1997-03-24
JP24725897A JP3953151B2 (ja) 1997-03-24 1997-09-11 セラミックス接着用組成物および接着方法

Publications (3)

Publication Number Publication Date
JPH10324577A JPH10324577A (ja) 1998-12-08
JPH10324577A5 true JPH10324577A5 (OSRAM) 2005-05-26
JP3953151B2 JP3953151B2 (ja) 2007-08-08

Family

ID=26430168

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24725897A Expired - Lifetime JP3953151B2 (ja) 1997-03-24 1997-09-11 セラミックス接着用組成物および接着方法

Country Status (1)

Country Link
JP (1) JP3953151B2 (OSRAM)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4641605B2 (ja) * 2000-09-27 2011-03-02 イビデン株式会社 接着剤、セラミック構造体及びその製造方法
CN100334177C (zh) * 2004-11-16 2007-08-29 张国栋 无醛水溶性胶粘剂
WO2019216358A1 (ja) * 2018-05-08 2019-11-14 積水フーラー株式会社 合成樹脂組成物、耐火材料、シーリング材、接着剤及び目地構造

Similar Documents

Publication Publication Date Title
ATE27258T1 (de) Hochfeste, waermebestaendige verbundstoffe, bestehend aus einer magnesiumaluminosilicatglaskeramikmatrixund siliciumcarbidfasern.
EP1074653A3 (en) High performance insulations and methods of manufacturing the same
DE3772087D1 (de) Schnellkupplung fuer rohre, pfaehle und aehnliches.
DE3768417D1 (de) Keramische mehrschichtplatte fuer kupferschaltung.
JPH10324577A5 (OSRAM)
CN213805846U (zh) 一种基于四边形的建筑伸缩机构
SE8803557L (sv) Konstruktion och element fungerande som vaermeackumulator, vaermeutvaexlare och vaermeradiator, dess anvaendning och foerfarande foer dess framstaellning
JPS5594976A (en) Adhesive and monolithic structure
DK1294574T3 (da) Forbedret indbindingselement
ATE272102T1 (de) Sol-gel aluminiumoxid-schleifmittel
JPS61134597A (ja) 熱交換エレメントの製法
CN207110113U (zh) 一种装配式建筑墙体防裂缝结构
JP2000509064A5 (OSRAM)
JP2001145812A5 (OSRAM)
ATE49584T1 (de) Platte aus anorganischem material, verfahren zu ihrer herstellung sowie eine verwendung dieser platte.
NO994815L (no) Skjöte-anordning
IT8424012A0 (it) Impianto mobile per togliere e immettere perlite espansa o simili materiali termoisolanti.
JPS53119938A (en) Method of adhesion
CN207484873U (zh) 方便锚固的保温饰面板
JPH0131690Y2 (OSRAM)
CN207062186U (zh) 一种新型胶带
JPS6164908A (ja) 防音壁体
OUANEZAR ACOUSTIC EMISSION STUDY OF THE THERMAL SHOCK RESISTANCE AND THERMAL FATIGUE OF CERAMIC MATERIALS
IT8421054V0 (it) Manufatto appropriato all'isolamento termico ed acustico trovante applicazioni particolarmente adatte in edilizia.
WILLMANN PARAMETERS FOR THE DESIGN OF CERAMIC STRUCTURAL COMPONENTS